| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Aluminum conductor failure by mass transport
|
|
|
1970
|
9 |
1 |
p. 15-
1 p.
|
artikel
|
| 2 |
Analysis of failures in spacecraft and aircraft components
|
|
|
1970
|
9 |
1 |
p. 15-
1 p.
|
artikel
|
| 3 |
Apparatus for controlled electron beam co-deposition of alloy films
|
|
|
1970
|
9 |
1 |
p. 24-
1 p.
|
artikel
|
| 4 |
Application of the scanning electron microscope to semiconductors
|
|
|
1970
|
9 |
1 |
p. 21-
1 p.
|
artikel
|
| 5 |
Approximate solutions for a coupled pair of microstrip lines in microwave integrated circuits
|
|
|
1970
|
9 |
1 |
p. 20-21
2 p.
|
artikel
|
| 6 |
Approximate system availability models
|
|
|
1970
|
9 |
1 |
p. 16-
1 p.
|
artikel
|
| 7 |
A survey of chip joining techniques
|
|
|
1970
|
9 |
1 |
p. 18-
1 p.
|
artikel
|
| 8 |
A thick-film resistor glaze of precision properties
|
|
|
1970
|
9 |
1 |
p. 23-
1 p.
|
artikel
|
| 9 |
A thin-film resistance element, tailored by thermal oxidation
|
|
|
1970
|
9 |
1 |
p. 23-
1 p.
|
artikel
|
| 10 |
Calculation of the Required Number of Spare Parts
|
Tomášek, K.F.
|
|
1970
|
9 |
1 |
p. 77-78
2 p.
|
artikel
|
| 11 |
Calendar of International Conferences, Symposia, Lectures and Meetings of Interest
|
|
|
1970
|
9 |
1 |
p. 7-9
3 p.
|
artikel
|
| 12 |
Causal approach to reliability
|
|
|
1970
|
9 |
1 |
p. 13-
1 p.
|
artikel
|
| 13 |
Compatibility of glassy materials for monolithic packaging
|
|
|
1970
|
9 |
1 |
p. 19-
1 p.
|
artikel
|
| 14 |
Complementary MOS field-effect transistors on high-resistivity silicon substrates
|
|
|
1970
|
9 |
1 |
p. 21-22
2 p.
|
artikel
|
| 15 |
Component properties of co-sputtered Ta-Al alloy films
|
|
|
1970
|
9 |
1 |
p. 23-
1 p.
|
artikel
|
| 16 |
Cost of reliability improvement
|
|
|
1970
|
9 |
1 |
p. 14-
1 p.
|
artikel
|
| 17 |
Courses in microelectronics and reliability
|
|
|
1970
|
9 |
1 |
p. 3-6
4 p.
|
artikel
|
| 18 |
Crossovers for interconnections on substrates
|
|
|
1970
|
9 |
1 |
p. 19-
1 p.
|
artikel
|
| 19 |
Distributed redundancy in two-layer threshold logic networks
|
|
|
1970
|
9 |
1 |
p. 17-
1 p.
|
artikel
|
| 20 |
Editor Board
|
|
|
1970
|
9 |
1 |
p. IFC-
1 p.
|
artikel
|
| 21 |
Efficient photoemission from GaAs epitaxial layers
|
|
|
1970
|
9 |
1 |
p. 21-
1 p.
|
artikel
|
| 22 |
Electron beam exposure system for integrated circuits
|
|
|
1970
|
9 |
1 |
p. 24-
1 p.
|
artikel
|
| 23 |
Electron-beam testing: gentle and fast
|
|
|
1970
|
9 |
1 |
p. 24-
1 p.
|
artikel
|
| 24 |
Electroreflectance of impurities in GaAs: manganese, silicon and cadmium
|
|
|
1970
|
9 |
1 |
p. 22-
1 p.
|
artikel
|
| 25 |
Engineer and manufacturer against problems brought by technology of electronic circuits
|
|
|
1970
|
9 |
1 |
p. 17-
1 p.
|
artikel
|
| 26 |
Environmental testing—the key to high reliability
|
|
|
1970
|
9 |
1 |
p. 16-
1 p.
|
artikel
|
| 27 |
Failure analysis of semiconductor integrated circuits
|
|
|
1970
|
9 |
1 |
p. 14-
1 p.
|
artikel
|
| 28 |
Failure mode due to corrosion
|
|
|
1970
|
9 |
1 |
p. 14-
1 p.
|
artikel
|
| 29 |
Fault isolation in conventional linear systems: a progress report
|
|
|
1970
|
9 |
1 |
p. 17-
1 p.
|
artikel
|
| 30 |
Filter building blocks using tantalum and silicon integrated circuits
|
|
|
1970
|
9 |
1 |
p. 19-20
2 p.
|
artikel
|
| 31 |
Flip-chip microcircuit bonding systems
|
|
|
1970
|
9 |
1 |
p. 18-
1 p.
|
artikel
|
| 32 |
Fluorescence thermography and current crowding in high-frequency transistor switches
|
Chudobiak, W.J.
|
|
1970
|
9 |
1 |
p. 75-76
2 p.
|
artikel
|
| 33 |
“μ-FOLD”TM: a packaging technique for LSI and hybrid MSI asemblies
|
|
|
1970
|
9 |
1 |
p. 18-19
2 p.
|
artikel
|
| 34 |
Four-phase logic circuits using integrated MOS transistors
|
|
|
1970
|
9 |
1 |
p. 20-
1 p.
|
artikel
|
| 35 |
HF and VHF inductorless filters for microelectronic systems
|
|
|
1970
|
9 |
1 |
p. 17-
1 p.
|
artikel
|
| 36 |
Integrated aluminium connections
|
|
|
1970
|
9 |
1 |
p. 19-
1 p.
|
artikel
|
| 37 |
Integrated Intravenous Pressure Transducer
|
Edelman, H.C.M.
|
|
1970
|
9 |
1 |
p. 79-80
2 p.
|
artikel
|
| 38 |
Interconnections for microcircuits—I
|
|
|
1970
|
9 |
1 |
p. 17-18
2 p.
|
artikel
|
| 39 |
Interconnection techniques for multilayer hybrid microcircuit packages
|
|
|
1970
|
9 |
1 |
p. 18-
1 p.
|
artikel
|
| 40 |
Laser adjustable resistors for precision monolithic circuits
|
|
|
1970
|
9 |
1 |
p. 24-
1 p.
|
artikel
|
| 41 |
Letter to the editor
|
Kemény, A.P.
|
|
1970
|
9 |
1 |
p. 73-
1 p.
|
artikel
|
| 42 |
Living with a thick-film resistor ink series
|
|
|
1970
|
9 |
1 |
p. 22-
1 p.
|
artikel
|
| 43 |
Macro assembly-complex multi-chip LSI
|
|
|
1970
|
9 |
1 |
p. 20-
1 p.
|
artikel
|
| 44 |
Microcircuit reliability and the equipment manufacturer
|
|
|
1970
|
9 |
1 |
p. 15-
1 p.
|
artikel
|
| 45 |
Microminiature microwave integrated receivers
|
|
|
1970
|
9 |
1 |
p. 20-
1 p.
|
artikel
|
| 46 |
Multilayer alumina circuit boards
|
|
|
1970
|
9 |
1 |
p. 20-
1 p.
|
artikel
|
| 47 |
Observations on epitaxial gallium arsenide varactor diodes using the scanning electron microscope
|
Gratze, S.C.
|
|
1970
|
9 |
1 |
p. 71-
1 p.
|
artikel
|
| 48 |
Optimizing cyclic fatigue life of controlled collapse chip joints
|
|
|
1970
|
9 |
1 |
p. 18-
1 p.
|
artikel
|
| 49 |
Overseas AUTOVON maintainability field trial
|
Elias, N.J.
|
|
1970
|
9 |
1 |
p. 51-58
8 p.
|
artikel
|
| 50 |
Papers to be published in future issues
|
|
|
1970
|
9 |
1 |
p. 26-
1 p.
|
artikel
|
| 51 |
Precision of advance reliability calculations
|
|
|
1970
|
9 |
1 |
p. 14-
1 p.
|
artikel
|
| 52 |
Precision of reliability estimations
|
Grange, J.M.
|
|
1970
|
9 |
1 |
p. 59-69
11 p.
|
artikel
|
| 53 |
Precision testing of thin-film resistors
|
|
|
1970
|
9 |
1 |
p. 16-
1 p.
|
artikel
|
| 54 |
Probers in automatic IC testers
|
|
|
1970
|
9 |
1 |
p. 21-
1 p.
|
artikel
|
| 55 |
Progress in on-line control by computer
|
|
|
1970
|
9 |
1 |
p. 16-
1 p.
|
artikel
|
| 56 |
Quality standards for large-scale integration [LSI]
|
|
|
1970
|
9 |
1 |
p. 16-
1 p.
|
artikel
|
| 57 |
Recent United Kingdom patents in microelectronics
|
|
|
1970
|
9 |
1 |
p. 11-12
2 p.
|
artikel
|
| 58 |
Reliability management simulation exercise
|
|
|
1970
|
9 |
1 |
p. 14-
1 p.
|
artikel
|
| 59 |
Reliability of a special class of redundant systems
|
|
|
1970
|
9 |
1 |
p. 17-
1 p.
|
artikel
|
| 60 |
SC reliability: manufacturers hold the key
|
|
|
1970
|
9 |
1 |
p. 13-
1 p.
|
artikel
|
| 61 |
Solid-state displays compatible with integrated circuits
|
Borden, Howard C.
|
|
1970
|
9 |
1 |
p. 35-36
2 p.
|
artikel
|
| 62 |
Strategy and tactics for integrated electronics
|
|
|
1970
|
9 |
1 |
p. 18-
1 p.
|
artikel
|
| 63 |
Suggested improvements for maintainability demonstrations
|
|
|
1970
|
9 |
1 |
p. 16-
1 p.
|
artikel
|
| 64 |
Systems effectiveness
|
Reiche, H.
|
|
1970
|
9 |
1 |
p. 1-
1 p.
|
artikel
|
| 65 |
Testing linear integrated circuits
|
|
|
1970
|
9 |
1 |
p. 19-
1 p.
|
artikel
|
| 66 |
The approach to system effectiveness studies in the Canadian Department of National Defence
|
Reiche, H.
|
|
1970
|
9 |
1 |
p. 27-34
8 p.
|
artikel
|
| 67 |
The Arcnet programme and its applications from the point of view of reliability
|
|
|
1970
|
9 |
1 |
p. 13-
1 p.
|
artikel
|
| 68 |
The designer/maintainer interface in the Royal Navy
|
|
|
1970
|
9 |
1 |
p. 17-
1 p.
|
artikel
|
| 69 |
The electrical properties of dislocations in silicon—II. The effects on conductivity
|
|
|
1970
|
9 |
1 |
p. 21-
1 p.
|
artikel
|
| 70 |
The properties of thick-film inductors
|
|
|
1970
|
9 |
1 |
p. 24-
1 p.
|
artikel
|
| 71 |
Thermal analysis of microcircuits: a state of the art review
|
|
|
1970
|
9 |
1 |
p. 15-
1 p.
|
artikel
|
| 72 |
Thick-film RF circuitry
|
|
|
1970
|
9 |
1 |
p. 23-
1 p.
|
artikel
|
| 73 |
Thin film dielectric properties of RF sputtered oxides
|
|
|
1970
|
9 |
1 |
p. 22-23
2 p.
|
artikel
|
| 74 |
Traité de fiabilité
|
G.W.A.D,
|
|
1970
|
9 |
1 |
p. 25-
1 p.
|
artikel
|
| 75 |
Transition metal oxide thin-film microelectronic components
|
|
|
1970
|
9 |
1 |
p. 24-
1 p.
|
artikel
|
| 76 |
Troubleshooting the multilayer printed wiring board plating process
|
|
|
1970
|
9 |
1 |
p. 15-
1 p.
|
artikel
|
| 77 |
Ultrasonic bonding of integrated circuits to thick-film pedestals on ceramic substrates
|
|
|
1970
|
9 |
1 |
p. 23-
1 p.
|
artikel
|
| 78 |
Use of process control data in acceptance procedures for high reliability components
|
|
|
1970
|
9 |
1 |
p. 14-
1 p.
|
artikel
|
| 79 |
User guidelines for removal of microcircuits from equipment
|
|
|
1970
|
9 |
1 |
p. 45-49
5 p.
|
artikel
|
| 80 |
Vibrational absorption of carbon and carbon-oxygen complexes in silicon
|
|
|
1970
|
9 |
1 |
p. 22-
1 p.
|
artikel
|
| 81 |
Zero bias anomalies in metal-semiconductor tunnel junctions
|
|
|
1970
|
9 |
1 |
p. 22-
1 p.
|
artikel
|
Tijdschrift beschrijving