| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Advanced electrical and stability characterization of untrimmed and variously trimmed thick-film and LTCC resistors
|
Dziedzic, Andrzej
|
|
2006
|
88-90 |
2-4 |
p. 352-359
8 p.
|
artikel
|
| 2 |
A methodology for the calculation of stress migration in die-level interconnects
|
Dauksher, W.
|
|
2006
|
88-90 |
2-4 |
p. 616-625
10 p.
|
artikel
|
| 3 |
An investigation into the effects of probing and wire bonding stress on the reliability of BOAC
|
Chen, K.M.
|
|
2006
|
88-90 |
2-4 |
p. 335-342
8 p.
|
artikel
|
| 4 |
An optical characterization technique for hygroscopic expansion of polymers and plastic packages
|
Su, Fei
|
|
2006
|
88-90 |
2-4 |
p. 600-609
10 p.
|
artikel
|
| 5 |
A numerical failure analysis on lead breakage issues of ultra fine pitch flip chip-on-flex and tape carrier packages during chip/film assembly process
|
Jang, Changsoo
|
|
2006
|
88-90 |
2-4 |
p. 487-495
9 p.
|
artikel
|
| 6 |
An unusual mechanical failure mode in gold ballbonds at 50μm pitch due to degradation at the Au–Au4Al interface during ageing in air at 175°C
|
Breach, C.D.
|
|
2006
|
88-90 |
2-4 |
p. 543-557
15 p.
|
artikel
|
| 7 |
Bondability window and power input for wire bonding
|
Han, Lei
|
|
2006
|
88-90 |
2-4 |
p. 610-615
6 p.
|
artikel
|
| 8 |
Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study
|
Kwon, Woon-Seong
|
|
2006
|
88-90 |
2-4 |
p. 589-599
11 p.
|
artikel
|
| 9 |
Determination of the thermal conductivity of composite low-k dielectrics for advanced interconnect structures
|
Chen, F.
|
|
2006
|
88-90 |
2-4 |
p. 232-243
12 p.
|
artikel
|
| 10 |
Effect of wire diameter on the thermosonic bond reliability
|
Murali, Sarangapani
|
|
2006
|
88-90 |
2-4 |
p. 467-475
9 p.
|
artikel
|
| 11 |
Effects of hot carriers in offset gated polysilicon thin-film transistors
|
Hatzopoulos, A.T.
|
|
2006
|
88-90 |
2-4 |
p. 311-316
6 p.
|
artikel
|
| 12 |
Effects of process conditions on reliability, microstructure evolution and failure modes of SnAgCu solder joints
|
Arulvanan, Periannan
|
|
2006
|
88-90 |
2-4 |
p. 432-439
8 p.
|
artikel
|
| 13 |
Electromigration of Cu/low dielectric constant interconnects
|
Hu, C.-K.
|
|
2006
|
88-90 |
2-4 |
p. 213-231
19 p.
|
artikel
|
| 14 |
Electrostatic discharge protection scheme without leakage current path for CMOS IC operating in power-down-mode condition on a system board
|
Lin, Kun-Hsien
|
|
2006
|
88-90 |
2-4 |
p. 301-310
10 p.
|
artikel
|
| 15 |
Evaluation of displacement rate effect in shear test of Sn–3Ag–0.5Cu solder bump for flip chip application
|
Kim, Jong-Woong
|
|
2006
|
88-90 |
2-4 |
p. 535-542
8 p.
|
artikel
|
| 16 |
Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn–3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip
|
Peng, Chih-Tang
|
|
2006
|
88-90 |
2-4 |
p. 523-534
12 p.
|
artikel
|
| 17 |
Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition
|
Lai, Yi-Shao
|
|
2006
|
88-90 |
2-4 |
p. 645-650
6 p.
|
artikel
|
| 18 |
Hot-carrier reliability of submicron NMOSFETs and integrated NMOS low noise amplifiers
|
Naseh, Sasan
|
|
2006
|
88-90 |
2-4 |
p. 201-212
12 p.
|
artikel
|
| 19 |
Impact of the number of chips on the reliability of the solder balls for wire-bonded stacked-chip ball grid array packages
|
Jen, Yi-Ming
|
|
2006
|
88-90 |
2-4 |
p. 386-399
14 p.
|
artikel
|
| 20 |
Lead-free 0201 manufacturing, assembly and reliability test results
|
Ramkumar, S. Manian
|
|
2006
|
88-90 |
2-4 |
p. 244-262
19 p.
|
artikel
|
| 21 |
Low temperature electrical measurements of silicon bipolar monolithic microwave integrated circuit (MMIC) amplifiers
|
Keimasi, Mohammadreza
|
|
2006
|
88-90 |
2-4 |
p. 326-334
9 p.
|
artikel
|
| 22 |
Modeling and simulation for a drop-impact analysis of multi-layered printed circuit boards
|
Wang, Yuqi
|
|
2006
|
88-90 |
2-4 |
p. 558-573
16 p.
|
artikel
|
| 23 |
Moisture induced degradation of multilayer ceramic capacitors
|
Donahoe, Daniel N.
|
|
2006
|
88-90 |
2-4 |
p. 400-408
9 p.
|
artikel
|
| 24 |
[No title]
|
Stojcev, Mile
|
|
2006
|
88-90 |
2-4 |
p. 653-654
2 p.
|
artikel
|
| 25 |
[No title]
|
Stojcev, Mile
|
|
2006
|
88-90 |
2-4 |
p. 651-652
2 p.
|
artikel
|
| 26 |
Numerical analysis of a double avalanche region IMPATT diode on the basis of nonlinear model
|
Zemliak, Alexander M.
|
|
2006
|
88-90 |
2-4 |
p. 293-300
8 p.
|
artikel
|
| 27 |
Optical source reliability in recent optical fiber transmission systems and consumer electronics
|
Fukuda, Mitsuo
|
|
2006
|
88-90 |
2-4 |
p. 263-269
7 p.
|
artikel
|
| 28 |
Oxidation of copper pads and its influence on the quality of Au/Cu bonds during thermosonic wire bonding process
|
Chuang, Cheng-Li
|
|
2006
|
88-90 |
2-4 |
p. 449-458
10 p.
|
artikel
|
| 29 |
Processability and reliability of epoxy adhesive used in microelectronic devices linked to effects of degree of cure and damp heat aging
|
Park, Jongwoo
|
|
2006
|
88-90 |
2-4 |
p. 503-511
9 p.
|
artikel
|
| 30 |
Reliability study of underfill/chip interface under accelerated temperature cycling (ATC) loading
|
Zhang, Y.L.
|
|
2006
|
88-90 |
2-4 |
p. 409-420
12 p.
|
artikel
|
| 31 |
Report on 4H–SiC JTE Schottky diodes
|
Chen, L.
|
|
2006
|
88-90 |
2-4 |
p. 637-640
4 p.
|
artikel
|
| 32 |
Residual compression in area array packages induced by underfill shrinkage
|
Larson, Michael C.
|
|
2006
|
88-90 |
2-4 |
p. 496-502
7 p.
|
artikel
|
| 33 |
Simplified quantitative stress-induced leakage current (SILC) model for MOS devices
|
Ossaimee, M.
|
|
2006
|
88-90 |
2-4 |
p. 287-292
6 p.
|
artikel
|
| 34 |
Single event burnout in power diodes: Mechanisms and models
|
Albadri, A.M.
|
|
2006
|
88-90 |
2-4 |
p. 317-325
9 p.
|
artikel
|
| 35 |
Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages
|
Yang, Se Young
|
|
2006
|
88-90 |
2-4 |
p. 512-522
11 p.
|
artikel
|
| 36 |
Support excitation scheme for transient analysis of JEDEC board-level drop test
|
Yeh, Chang-Lin
|
|
2006
|
88-90 |
2-4 |
p. 626-636
11 p.
|
artikel
|
| 37 |
Temperature compensation of piezoresistive micro-machined porous silicon pressure sensor by ANN
|
Pramanik, C.
|
|
2006
|
88-90 |
2-4 |
p. 343-351
9 p.
|
artikel
|
| 38 |
Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints
|
Qi, Yan
|
|
2006
|
88-90 |
2-4 |
p. 574-588
15 p.
|
artikel
|
| 39 |
The negative bias temperature instability in MOS devices: A review
|
Stathis, J.H.
|
|
2006
|
88-90 |
2-4 |
p. 270-286
17 p.
|
artikel
|
| 40 |
Thermal analysis of bond layer influence on performance of an all-active vertically coupled, microring resonating laser
|
Fleischer, A.S.
|
|
2006
|
88-90 |
2-4 |
p. 421-431
11 p.
|
artikel
|
| 41 |
Thermal deformation measurements and predictions of MAP–BGA electronic packages
|
Tsai, M.Y.
|
|
2006
|
88-90 |
2-4 |
p. 476-486
11 p.
|
artikel
|
| 42 |
Thermal performance impacts of heat spreading lids on flip chip packages: With and without heat sinks
|
Wakil, Jamil
|
|
2006
|
88-90 |
2-4 |
p. 380-385
6 p.
|
artikel
|
| 43 |
Thermal resistance analysis and validation of flip chip PBGA packages
|
Chen, Kuo-Ming
|
|
2006
|
88-90 |
2-4 |
p. 440-448
9 p.
|
artikel
|
| 44 |
The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition
|
Arshad, Mohd Khairuddin Md
|
|
2006
|
88-90 |
2-4 |
p. 367-379
13 p.
|
artikel
|
| 45 |
Use of high temperature operating life data to mitigate risks in long-duration space applications that deploy commercial-grade plastic encapsulated semiconductor devices
|
Ganesan, Sanka
|
|
2006
|
88-90 |
2-4 |
p. 360-366
7 p.
|
artikel
|
| 46 |
Vibration fatigue reliability of BGA-IC package with Pb-free solder and Pb–Sn solder
|
Kim, YoungBae
|
|
2006
|
88-90 |
2-4 |
p. 459-466
8 p.
|
artikel
|
| 47 |
X-ray ion mobility spectrometer
|
Pershenkov, V.S.
|
|
2006
|
88-90 |
2-4 |
p. 641-644
4 p.
|
artikel
|
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