| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A beam-lead substrate package for a six-stage TTL shift register
|
Bachner, F.
|
|
1969
|
8 |
4 |
p. 307-308
2 p.
|
artikel
|
| 2 |
Abrupt p-n junctions at arbitrary levels
|
|
|
1969
|
8 |
4 |
p. 298-
1 p.
|
artikel
|
| 3 |
Advanced missile models and methods for availability prediction
|
|
|
1969
|
8 |
4 |
p. 291-
1 p.
|
artikel
|
| 4 |
A generalized reliability function for systems of parallel components
|
|
|
1969
|
8 |
4 |
p. 288-
1 p.
|
artikel
|
| 5 |
A high voltage thin-film transistor
|
|
|
1969
|
8 |
4 |
p. 302-
1 p.
|
artikel
|
| 6 |
A low cost master pattern and screen making technique
|
|
|
1969
|
8 |
4 |
p. 296-
1 p.
|
artikel
|
| 7 |
A mass spectrometry study of the evaporation and pyrolysis of polytetrafluorethylene
|
|
|
1969
|
8 |
4 |
p. 300-
1 p.
|
artikel
|
| 8 |
A multilayer interconnexion system with gold beam leads
|
Gelsing, R.J.
|
|
1969
|
8 |
4 |
p. 325-328
4 p.
|
artikel
|
| 9 |
Analysis tools for microminiaturized circuits
|
|
|
1969
|
8 |
4 |
p. 293-
1 p.
|
artikel
|
| 10 |
An IC medium-power voltage regulator
|
|
|
1969
|
8 |
4 |
p. 297-
1 p.
|
artikel
|
| 11 |
Announcement
|
|
|
1969
|
8 |
4 |
p. 277-
1 p.
|
artikel
|
| 12 |
An overview of electronic part failure analysis experience
|
|
|
1969
|
8 |
4 |
p. 287-
1 p.
|
artikel
|
| 13 |
A radio frequency sputtering system with non-grounded electrodes for the deposition of metals
|
|
|
1969
|
8 |
4 |
p. 300-
1 p.
|
artikel
|
| 14 |
A review of integrated circuits in thin-film hybrid technique for digital applications
|
|
|
1969
|
8 |
4 |
p. 300-
1 p.
|
artikel
|
| 15 |
A sinusoidal voltage-controlled oscillator for integrated circuits
|
|
|
1969
|
8 |
4 |
p. 297-
1 p.
|
artikel
|
| 16 |
A technique for determining the life capability of individual semiconductors
|
|
|
1969
|
8 |
4 |
p. 290-
1 p.
|
artikel
|
| 17 |
A universal DTL series of medium switching speed in thin-film hybrid technique
|
|
|
1969
|
8 |
4 |
p. 300-
1 p.
|
artikel
|
| 18 |
A universal series of high switching speed in thin-film hybrid technique
|
|
|
1969
|
8 |
4 |
p. 301-
1 p.
|
artikel
|
| 19 |
Automatic design of masks: The DESMAG programme
|
|
|
1969
|
8 |
4 |
p. 293-
1 p.
|
artikel
|
| 20 |
Automatic IC dynamic testers
|
|
|
1969
|
8 |
4 |
p. 297-298
2 p.
|
artikel
|
| 21 |
Automatic plotting of masks for hybrid integrated circuits
|
|
|
1969
|
8 |
4 |
p. 294-
1 p.
|
artikel
|
| 22 |
Automatic testing of electronic equipment
|
|
|
1969
|
8 |
4 |
p. 292-
1 p.
|
artikel
|
| 23 |
Boundary conditions for the space-charge region of a p-n junction
|
|
|
1969
|
8 |
4 |
p. 298-
1 p.
|
artikel
|
| 24 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1969
|
8 |
4 |
p. 279-280
2 p.
|
artikel
|
| 25 |
Call for papers
|
|
|
1969
|
8 |
4 |
p. 278-
1 p.
|
artikel
|
| 26 |
Ceramic capacitors for hybrid integrated circuits
|
|
|
1969
|
8 |
4 |
p. 296-
1 p.
|
artikel
|
| 27 |
Component testing—fresh look
|
|
|
1969
|
8 |
4 |
p. 286-287
2 p.
|
artikel
|
| 28 |
Computer redundancy: Design, performance and future
|
|
|
1969
|
8 |
4 |
p. 292-
1 p.
|
artikel
|
| 29 |
Control of electromigration in aluminium interconnections
|
|
|
1969
|
8 |
4 |
p. 295-
1 p.
|
artikel
|
| 30 |
Control of temperature coefficient of resistance by reactive sputtering of tantalum with nitrogen and oxygen simultaneously
|
|
|
1969
|
8 |
4 |
p. 301-302
2 p.
|
artikel
|
| 31 |
Courses in microelectronics and reliability
|
|
|
1969
|
8 |
4 |
p. 271-274
4 p.
|
artikel
|
| 32 |
Design considerations for radio frequency sputtering equipment and impedance matching networks
|
|
|
1969
|
8 |
4 |
p. 301-
1 p.
|
artikel
|
| 33 |
Distribution of sodium in silicon nitride
|
|
|
1969
|
8 |
4 |
p. 298-
1 p.
|
artikel
|
| 34 |
Donor concentration dependence of electron-phonon scattering in antimony-doped germanium
|
|
|
1969
|
8 |
4 |
p. 298-
1 p.
|
artikel
|
| 35 |
Editorial
|
|
|
1969
|
8 |
4 |
p. 269-270
2 p.
|
artikel
|
| 36 |
Effects of assembly error on product acceptability and reliability
|
|
|
1969
|
8 |
4 |
p. 291-
1 p.
|
artikel
|
| 37 |
Electrical properties of diffused zinc on SiO2-Si MOS structures
|
|
|
1969
|
8 |
4 |
p. 298-
1 p.
|
artikel
|
| 38 |
Electron microbeam testing of integrated circuits
|
|
|
1969
|
8 |
4 |
p. 302-303
2 p.
|
artikel
|
| 39 |
Eliminate power transistor second breakdown failures
|
|
|
1969
|
8 |
4 |
p. 287-
1 p.
|
artikel
|
| 40 |
Environmental and reliability demonstration testing
|
|
|
1969
|
8 |
4 |
p. 292-293
2 p.
|
artikel
|
| 41 |
Evaporated silicon thin-film transistors
|
|
|
1969
|
8 |
4 |
p. 296-
1 p.
|
artikel
|
| 42 |
Evaporation processes by laser beams
|
|
|
1969
|
8 |
4 |
p. 303-
1 p.
|
artikel
|
| 43 |
Factors affecting solder wetting and resistance drift in thick film circuits
|
|
|
1969
|
8 |
4 |
p. 301-
1 p.
|
artikel
|
| 44 |
Failure analysis: its role in screening decisions
|
|
|
1969
|
8 |
4 |
p. 289-290
2 p.
|
artikel
|
| 45 |
Failure analysis: key to more reliable semiconductors
|
|
|
1969
|
8 |
4 |
p. 288-
1 p.
|
artikel
|
| 46 |
Gas chromatographic detection of leaks in microelectronic packages
|
Nelson, K.H.
|
|
1969
|
8 |
4 |
p. 313-318
6 p.
|
artikel
|
| 47 |
High-frequency hybrid filters
|
|
|
1969
|
8 |
4 |
p. 293-
1 p.
|
artikel
|
| 48 |
High performance reduction lenses for microelectronic circuit fabrication
|
|
|
1969
|
8 |
4 |
p. 295-
1 p.
|
artikel
|
| 49 |
Improved tantalum chip capacitors for hybrid circuits
|
|
|
1969
|
8 |
4 |
p. 297-
1 p.
|
artikel
|
| 50 |
Incentive contracting—its impact on system engineering and reliability
|
|
|
1969
|
8 |
4 |
p. 291-
1 p.
|
artikel
|
| 51 |
Infrared evaluation of multilayer boards
|
|
|
1969
|
8 |
4 |
p. 290-
1 p.
|
artikel
|
| 52 |
In-process measurement of structural defects in silicon by X-ray topography
|
|
|
1969
|
8 |
4 |
p. 289-
1 p.
|
artikel
|
| 53 |
Inspection of periodic patterns with intensity spatial filters
|
|
|
1969
|
8 |
4 |
p. 293-
1 p.
|
artikel
|
| 54 |
Interconnecting reliability
|
|
|
1969
|
8 |
4 |
p. 287-
1 p.
|
artikel
|
| 55 |
Kinetics and mechanism of thermal oxidation of silicon with special emphasis on impurity effects
|
|
|
1969
|
8 |
4 |
p. 298-299
2 p.
|
artikel
|
| 56 |
Measurement of human errors with existing data
|
|
|
1969
|
8 |
4 |
p. 285-
1 p.
|
artikel
|
| 57 |
Medium and large-scale integration of bipolar circuits
|
|
|
1969
|
8 |
4 |
p. 295-
1 p.
|
artikel
|
| 58 |
Microcircuit testing: Matching the value with the cost
|
|
|
1969
|
8 |
4 |
p. 288-
1 p.
|
artikel
|
| 59 |
Minority carrier injection of metal-silicon contacts
|
|
|
1969
|
8 |
4 |
p. 299-
1 p.
|
artikel
|
| 60 |
Monolithic MOS-bipolar audio amplifiers
|
|
|
1969
|
8 |
4 |
p. 296-
1 p.
|
artikel
|
| 61 |
Multielement self-scanned mosaic sensors
|
|
|
1969
|
8 |
4 |
p. 296-297
2 p.
|
artikel
|
| 62 |
New etchant puts dielectric isolation in the groove
|
|
|
1969
|
8 |
4 |
p. 294-
1 p.
|
artikel
|
| 63 |
One nanosecond current mode logic circuits: A by-product of evolutionary LSI technology
|
|
|
1969
|
8 |
4 |
p. 294-
1 p.
|
artikel
|
| 64 |
Packaging and cooling problems associated with microelectronics equipment
|
Honnor, F.
|
|
1969
|
8 |
4 |
p. 331-337
7 p.
|
artikel
|
| 65 |
Papers to be published in future issues
|
|
|
1969
|
8 |
4 |
p. 306-
1 p.
|
artikel
|
| 66 |
Parametric study of temperature distributions in chips joined by controlled chip collapse techniques
|
|
|
1969
|
8 |
4 |
p. 296-
1 p.
|
artikel
|
| 67 |
Physical limitations of MOS structures
|
|
|
1969
|
8 |
4 |
p. 299-
1 p.
|
artikel
|
| 68 |
Physics of control of electronic devices
|
|
|
1969
|
8 |
4 |
p. 290-
1 p.
|
artikel
|
| 69 |
Practical integrated circuits
|
G.W.A.D.,
|
|
1969
|
8 |
4 |
p. 305-
1 p.
|
artikel
|
| 70 |
Practical reliability
|
|
|
1969
|
8 |
4 |
p. 286-
1 p.
|
artikel
|
| 71 |
Practical reliability. Vol. I. Parameter variations analysis
|
|
|
1969
|
8 |
4 |
p. 287-288
2 p.
|
artikel
|
| 72 |
Precision resistance networks in thin-film technique
|
|
|
1969
|
8 |
4 |
p. 302-
1 p.
|
artikel
|
| 73 |
Prefailure analysis—enhances product reliability
|
|
|
1969
|
8 |
4 |
p. 289-
1 p.
|
artikel
|
| 74 |
Quality and reliability
|
|
|
1969
|
8 |
4 |
p. 286-
1 p.
|
artikel
|
| 75 |
Recent patents in microelectronics
|
|
|
1969
|
8 |
4 |
p. 281-283
3 p.
|
artikel
|
| 76 |
Recombinations via defects in degenerate semiconductors
|
|
|
1969
|
8 |
4 |
p. 297-
1 p.
|
artikel
|
| 77 |
Reliability of beam-lead sealed-junction devices
|
|
|
1969
|
8 |
4 |
p. 289-
1 p.
|
artikel
|
| 78 |
Reliability of ECG instrumentation in a hospital
|
|
|
1969
|
8 |
4 |
p. 292-
1 p.
|
artikel
|
| 79 |
Reliability of epoxy transistors
|
|
|
1969
|
8 |
4 |
p. 290-
1 p.
|
artikel
|
| 80 |
Reliability—110 years of increasing complexity and value
|
|
|
1969
|
8 |
4 |
p. 286-
1 p.
|
artikel
|
| 81 |
Reproducibility of precision nichrome thin-film resistors
|
|
|
1969
|
8 |
4 |
p. 302-
1 p.
|
artikel
|
| 82 |
Scanning of integrated arrays
|
|
|
1969
|
8 |
4 |
p. 295-
1 p.
|
artikel
|
| 83 |
Silicon and gallium arsenide field-effect transistors with Schottky-barrier gate
|
|
|
1969
|
8 |
4 |
p. 297-
1 p.
|
artikel
|
| 84 |
Surface-charge induced failures observed on MOS integrated circuits
|
Forsythe, D.D.
|
|
1969
|
8 |
4 |
p. 339-340
2 p.
|
artikel
|
| 85 |
Survey of reliability and maintainability demonstration techniques
|
|
|
1969
|
8 |
4 |
p. 285-
1 p.
|
artikel
|
| 86 |
Survey of reliability prediction techniques
|
|
|
1969
|
8 |
4 |
p. 286-
1 p.
|
artikel
|
| 87 |
System analysis via probability diagrams
|
|
|
1969
|
8 |
4 |
p. 291-292
2 p.
|
artikel
|
| 88 |
Systems design and complex integrated circuits
|
|
|
1969
|
8 |
4 |
p. 294-295
2 p.
|
artikel
|
| 89 |
Temperature: its measurement and control in semiconductor production
|
|
|
1969
|
8 |
4 |
p. 297-
1 p.
|
artikel
|
| 90 |
The determination of residual photoresist on silicon using radiotracer iodine-131
|
|
|
1969
|
8 |
4 |
p. 294-
1 p.
|
artikel
|
| 91 |
The determination of the distribution of imperfections in semiconductors and its connection with the synthesis and analysis of semiconductor properties
|
|
|
1969
|
8 |
4 |
p. 299-
1 p.
|
artikel
|
| 92 |
The emitter-base barrier-layer capacity in microelectronic circuits
|
|
|
1969
|
8 |
4 |
p. 296-
1 p.
|
artikel
|
| 93 |
The need to teach reliability
|
|
|
1969
|
8 |
4 |
p. 286-
1 p.
|
artikel
|
| 94 |
Thermal analysis of substrates and integrated circuits
|
|
|
1969
|
8 |
4 |
p. 293-
1 p.
|
artikel
|
| 95 |
The role of reliability and quality assurance in advanced systems
|
|
|
1969
|
8 |
4 |
p. 291-
1 p.
|
artikel
|
| 96 |
The role of reliability and quality assurance in program management
|
|
|
1969
|
8 |
4 |
p. 286-
1 p.
|
artikel
|
| 97 |
The significance of the zone melting theory for the electron beam multi-chamber furnace
|
|
|
1969
|
8 |
4 |
p. 302-
1 p.
|
artikel
|
| 98 |
Thick film circuit boards for interconnection of silicon integrated devices
|
|
|
1969
|
8 |
4 |
p. 301-
1 p.
|
artikel
|
| 99 |
Thin films of refractory metals by sputtering with inductive plasma
|
|
|
1969
|
8 |
4 |
p. 300-
1 p.
|
artikel
|
| 100 |
University of Birmingham Department of Engineering Production
|
|
|
1969
|
8 |
4 |
p. 275-
1 p.
|
artikel
|
| 101 |
Use of metal masks to improve the printing of thick film geometries
|
|
|
1969
|
8 |
4 |
p. 295-
1 p.
|
artikel
|
| 102 |
Utilisation des ferrites et grenats en microelectronique hyperfrequence
|
Letron, Y.
|
|
1969
|
8 |
4 |
p. 319-320
2 p.
|
artikel
|
| 103 |
Why relays fail: Playing safe can be dangerous
|
|
|
1969
|
8 |
4 |
p. 287-
1 p.
|
artikel
|
| 104 |
Zeeman perturbations on shallow acceptor states in germanium
|
|
|
1969
|
8 |
4 |
p. 299-
1 p.
|
artikel
|
Tijdschrift beschrijving