| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A Bayesian reliability growth model
|
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|
1969
|
8 |
3 |
p. 253-
1 p.
|
artikel
|
| 2 |
A ceramic based thin film system for low cost production of modules
|
|
|
1969
|
8 |
3 |
p. 261-
1 p.
|
artikel
|
| 3 |
Adhesive strength of evaporated gold films on glass substrate
|
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|
1969
|
8 |
3 |
p. 262-
1 p.
|
artikel
|
| 4 |
Aging characteristics of tantalum nitride thin film resistors
|
|
|
1969
|
8 |
3 |
p. 251-
1 p.
|
artikel
|
| 5 |
A high precision alignment device
|
|
|
1969
|
8 |
3 |
p. 256-
1 p.
|
artikel
|
| 6 |
All-IC hybrid computer eliminates the patchwork from programming
|
|
|
1969
|
8 |
3 |
p. 258-
1 p.
|
artikel
|
| 7 |
A method for estimated errors in system reliability prediction
|
|
|
1969
|
8 |
3 |
p. 253-
1 p.
|
artikel
|
| 8 |
A microwave integrated transistor amplifier and the high-frequency limit of transistors
|
|
|
1969
|
8 |
3 |
p. 258-
1 p.
|
artikel
|
| 9 |
A procedure for generating test sequences to detect sequential circuit failures
|
|
|
1969
|
8 |
3 |
p. 252-
1 p.
|
artikel
|
| 10 |
A process control specification for integrated circuits
|
|
|
1969
|
8 |
3 |
p. 249-
1 p.
|
artikel
|
| 11 |
A simple guide to the general assessment of MTBF
|
Deakin, C.G.
|
|
1969
|
8 |
3 |
p. 189-203
15 p.
|
artikel
|
| 12 |
Assuring integrated circuit reliability during production
|
|
|
1969
|
8 |
3 |
p. 249-
1 p.
|
artikel
|
| 13 |
Automatic test equipment
|
|
|
1969
|
8 |
3 |
p. 247-
1 p.
|
artikel
|
| 14 |
A versatile manufacturing method for the production of complex hybrid microelectronics assemblies
|
|
|
1969
|
8 |
3 |
p. 256-257
2 p.
|
artikel
|
| 15 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1969
|
8 |
3 |
p. 263-265
3 p.
|
artikel
|
| 16 |
Comparison of bipolar and MOS integrated circuits
|
|
|
1969
|
8 |
3 |
p. 255-
1 p.
|
artikel
|
| 17 |
Comparison of predicted and demonstrated reliability and maintainability figures
|
|
|
1969
|
8 |
3 |
p. 252-
1 p.
|
artikel
|
| 18 |
Computer aided integrated circuit design
|
|
|
1969
|
8 |
3 |
p. 257-
1 p.
|
artikel
|
| 19 |
Computer aided layout of microcircuits
|
|
|
1969
|
8 |
3 |
p. 255-
1 p.
|
artikel
|
| 20 |
Computer's aid for integrated circuit mask production
|
|
|
1969
|
8 |
3 |
p. 256-
1 p.
|
artikel
|
| 21 |
Courses in microelectronics and reliability
|
|
|
1969
|
8 |
3 |
p. 181-183
3 p.
|
artikel
|
| 22 |
Current-voltage and current-temperature characteristics of alloyed pGe-nSi heterojunctions
|
|
|
1969
|
8 |
3 |
p. 260-
1 p.
|
artikel
|
| 23 |
Design and applications of metal oxide silicon array integrated circuits (Mosaics's) to data handling systems
|
|
|
1969
|
8 |
3 |
p. 257-
1 p.
|
artikel
|
| 24 |
Economical reliability program design
|
|
|
1969
|
8 |
3 |
p. 247-
1 p.
|
artikel
|
| 25 |
Editorial
|
Dummer, G.W.A.
|
|
1969
|
8 |
3 |
p. 173-
1 p.
|
artikel
|
| 26 |
Effects of nuclear radiation on a high reliability silicon power diode I-Change in I–V design characteristics
|
|
|
1969
|
8 |
3 |
p. 248-
1 p.
|
artikel
|
| 27 |
Epitaxial processing and equipment
|
|
|
1969
|
8 |
3 |
p. 259-
1 p.
|
artikel
|
| 28 |
Fault indicators and the unavailability of redundant circuits
|
Repton, C.S.
|
|
1969
|
8 |
3 |
p. 215-234
20 p.
|
artikel
|
| 29 |
Four point mercury contact probe for electrical resistivity measurements of thin films
|
|
|
1969
|
8 |
3 |
p. 262-
1 p.
|
artikel
|
| 30 |
Germanium IC's point the way towards picosecond computers
|
|
|
1969
|
8 |
3 |
p. 261-
1 p.
|
artikel
|
| 31 |
Getter-ion pumps of the magnetron type and an attempted interpretation of the discharge mechanism
|
|
|
1969
|
8 |
3 |
p. 262-
1 p.
|
artikel
|
| 32 |
Handling and bonding of beam-lead sealed-junction integrated circuits
|
|
|
1969
|
8 |
3 |
p. 259-260
2 p.
|
artikel
|
| 33 |
High-precision alignment device
|
|
|
1969
|
8 |
3 |
p. 255-
1 p.
|
artikel
|
| 34 |
High reliability screening of semiconductor and integrated circuit devices
|
|
|
1969
|
8 |
3 |
p. 251-
1 p.
|
artikel
|
| 35 |
How reliable are plastic encapsulated semiconductors?
|
|
|
1969
|
8 |
3 |
p. 248-
1 p.
|
artikel
|
| 36 |
Integrated color televison receiver
|
|
|
1969
|
8 |
3 |
p. 259-
1 p.
|
artikel
|
| 37 |
Is reliability necessary?
|
|
|
1969
|
8 |
3 |
p. 247-248
2 p.
|
artikel
|
| 38 |
Low-density tantalum
|
|
|
1969
|
8 |
3 |
p. 262-
1 p.
|
artikel
|
| 39 |
Maintainability demonstration procedure and data
|
|
|
1969
|
8 |
3 |
p. 253-
1 p.
|
artikel
|
| 40 |
Measuring microbond integrity with an infrared microradiometer
|
|
|
1969
|
8 |
3 |
p. 248-249
2 p.
|
artikel
|
| 41 |
Metallization, dicing and circuit assembly
|
|
|
1969
|
8 |
3 |
p. 260-
1 p.
|
artikel
|
| 42 |
Microcircuits and their applications
|
G.W.A.D.,
|
|
1969
|
8 |
3 |
p. 243-
1 p.
|
artikel
|
| 43 |
Microelectronic device data handbook
|
|
|
1969
|
8 |
3 |
p. 254-
1 p.
|
artikel
|
| 44 |
Micropower error-correcting redundant circuit design
|
|
|
1969
|
8 |
3 |
p. 251-
1 p.
|
artikel
|
| 45 |
Mikroelektronik 3
|
G.W.A.D,
|
|
1969
|
8 |
3 |
p. 243-
1 p.
|
artikel
|
| 46 |
Monolithic circuit test standards
|
|
|
1969
|
8 |
3 |
p. 254-
1 p.
|
artikel
|
| 47 |
MOST capacitor memory
|
|
|
1969
|
8 |
3 |
p. 258-
1 p.
|
artikel
|
| 48 |
New developments in interconnection for hybrid microelectronics
|
|
|
1969
|
8 |
3 |
p. 257-
1 p.
|
artikel
|
| 49 |
Noise figure of the diode-stabilized linear integrated devices
|
Bozic, S.M.
|
|
1969
|
8 |
3 |
p. 237-238
2 p.
|
artikel
|
| 50 |
Non-ohmic microwave conductivity in semiconductor posts
|
|
|
1969
|
8 |
3 |
p. 261-
1 p.
|
artikel
|
| 51 |
Normalized thermionic-field (T-F) emission in metal-semiconductor (Schottky) barriers
|
|
|
1969
|
8 |
3 |
p. 260-261
2 p.
|
artikel
|
| 52 |
Operational system effectiveness study a layman's approach
|
|
|
1969
|
8 |
3 |
p. 253-
1 p.
|
artikel
|
| 53 |
Packaging and reliability in integrated circuits
|
|
|
1969
|
8 |
3 |
p. 250-
1 p.
|
artikel
|
| 54 |
Papers to be published in future issues
|
|
|
1969
|
8 |
3 |
p. 267-
1 p.
|
artikel
|
| 55 |
Particulate contamination of vacuum-evaporated films
|
Buck, R.H.
|
|
1969
|
8 |
3 |
p. 235-236
2 p.
|
artikel
|
| 56 |
Physical analysis of stress testing for failure of electronic components
|
|
|
1969
|
8 |
3 |
p. 250-
1 p.
|
artikel
|
| 57 |
Power supplies for ICs
|
|
|
1969
|
8 |
3 |
p. 258-
1 p.
|
artikel
|
| 58 |
Practical aspects of electronic instruments—cost, reliability, and maintenance
|
|
|
1969
|
8 |
3 |
p. 251-252
2 p.
|
artikel
|
| 59 |
Preliminary analysis of radio component reliability
|
|
|
1969
|
8 |
3 |
p. 249-250
2 p.
|
artikel
|
| 60 |
Preparation of high purity silicon
|
|
|
1969
|
8 |
3 |
p. 261-
1 p.
|
artikel
|
| 61 |
Probabilistic reliability: An engineering approach
|
|
|
1969
|
8 |
3 |
p. 246-
1 p.
|
artikel
|
| 62 |
Pseudopotential impurity theory and covalent bonding in semiconductors
|
|
|
1969
|
8 |
3 |
p. 260-
1 p.
|
artikel
|
| 63 |
Recent patents in microelectronics
|
|
|
1969
|
8 |
3 |
p. 179-180
2 p.
|
artikel
|
| 64 |
Relay failure analysis techniques
|
|
|
1969
|
8 |
3 |
p. 250-
1 p.
|
artikel
|
| 65 |
Reliability methodology
|
|
|
1969
|
8 |
3 |
p. 245-
1 p.
|
artikel
|
| 66 |
Reliability of electrodeposited cylindrical permalloy films
|
|
|
1969
|
8 |
3 |
p. 249-
1 p.
|
artikel
|
| 67 |
Reliability Physics
|
|
|
1969
|
8 |
3 |
p. 245-
1 p.
|
artikel
|
| 68 |
Reliability tasks vs. product reliability
|
|
|
1969
|
8 |
3 |
p. 247-
1 p.
|
artikel
|
| 69 |
Reliable control systems Part 1. Upgrading instrument performance
|
|
|
1969
|
8 |
3 |
p. 252-
1 p.
|
artikel
|
| 70 |
Reliable soldering of printed circuit boards
|
|
|
1969
|
8 |
3 |
p. 249-
1 p.
|
artikel
|
| 71 |
Reports of conferences, symposia, lectures and meetings of interest
|
|
|
1969
|
8 |
3 |
p. 175-178
4 p.
|
artikel
|
| 72 |
R-F sputtering processes
|
|
|
1969
|
8 |
3 |
p. 262-
1 p.
|
artikel
|
| 73 |
Schottky diodes speed up digital IC's
|
|
|
1969
|
8 |
3 |
p. 261-
1 p.
|
artikel
|
| 74 |
Semiconductor memories
|
|
|
1969
|
8 |
3 |
p. 259-
1 p.
|
artikel
|
| 75 |
Sense and nonsense in electronic reliability engineering
|
|
|
1969
|
8 |
3 |
p. 247-
1 p.
|
artikel
|
| 76 |
Sequential reliability assurance in finite lots
|
|
|
1969
|
8 |
3 |
p. 245-
1 p.
|
artikel
|
| 77 |
Some investigation of failure mechanism in thin film resistors
|
|
|
1969
|
8 |
3 |
p. 248-
1 p.
|
artikel
|
| 78 |
Some new integrated circuits for computers and desk calculators
|
|
|
1969
|
8 |
3 |
p. 258-
1 p.
|
artikel
|
| 79 |
Stress strength models—A solution to accelerated life testing
|
|
|
1969
|
8 |
3 |
p. 248-
1 p.
|
artikel
|
| 80 |
Study of metal transfer between reed contacts
|
Davies, T.A.
|
|
1969
|
8 |
3 |
p. 205-206
2 p.
|
artikel
|
| 81 |
System cost effectiveness—the end of the first era
|
|
|
1969
|
8 |
3 |
p. 253-254
2 p.
|
artikel
|
| 82 |
System reliability in telephone switching equipment
|
Ronayne, J.P.
|
|
1969
|
8 |
3 |
p. 239-242
4 p.
|
artikel
|
| 83 |
Testing high reliability relays by use of automatic equipment
|
|
|
1969
|
8 |
3 |
p. 250-
1 p.
|
artikel
|
| 84 |
The application of a computer in the design and manufacture of photolithographic masks for LSI interconnection patterns
|
|
|
1969
|
8 |
3 |
p. 256-
1 p.
|
artikel
|
| 85 |
The contribution of standardization to the reliability of electronic equipment
|
Kersey, R.W.
|
|
1969
|
8 |
3 |
p. 185-187
3 p.
|
artikel
|
| 86 |
The deposition of tantalum from the vapour-gas phase
|
|
|
1969
|
8 |
3 |
p. 261-
1 p.
|
artikel
|
| 87 |
The development of large-scale integration
|
|
|
1969
|
8 |
3 |
p. 254-
1 p.
|
artikel
|
| 88 |
The economics of micropacking
|
|
|
1969
|
8 |
3 |
p. 254-
1 p.
|
artikel
|
| 89 |
The ever increasing complexity of integrated circuits
|
|
|
1969
|
8 |
3 |
p. 254-
1 p.
|
artikel
|
| 90 |
The Methods of reliability
|
|
|
1969
|
8 |
3 |
p. 246-
1 p.
|
artikel
|
| 91 |
The physics of thin film deposition
|
|
|
1969
|
8 |
3 |
p. 261-262
2 p.
|
artikel
|
| 92 |
The reliability-design engineer relationship
|
|
|
1969
|
8 |
3 |
p. 246-
1 p.
|
artikel
|
| 93 |
The reliability of screened metal film resistors
|
|
|
1969
|
8 |
3 |
p. 251-
1 p.
|
artikel
|
| 94 |
Thermal considerations for hybrid microcircuit packages and assemblies with high power dissipations
|
|
|
1969
|
8 |
3 |
p. 255-
1 p.
|
artikel
|
| 95 |
The ultrasonic bonding of silicon integrated circuit chips
|
|
|
1969
|
8 |
3 |
p. 256-
1 p.
|
artikel
|
| 96 |
The use of simple hybrid integrated circuit methods as a research tool
|
|
|
1969
|
8 |
3 |
p. 254-255
2 p.
|
artikel
|
| 97 |
Thin-film transistors
|
|
|
1969
|
8 |
3 |
p. 262-
1 p.
|
artikel
|
| 98 |
Using cost data to optimize reliability
|
|
|
1969
|
8 |
3 |
p. 246-
1 p.
|
artikel
|
| 99 |
Variable magnitude capacitors and resistors
|
Schaudinischky, L.
|
|
1969
|
8 |
3 |
p. 211-212
2 p.
|
artikel
|
| 100 |
Wanted—Realistic Alternatives to MIL-STD-781
|
|
|
1969
|
8 |
3 |
p. 246-
1 p.
|
artikel
|
| 101 |
Will radiation wreck your IC design?
|
|
|
1969
|
8 |
3 |
p. 254-
1 p.
|
artikel
|
| 102 |
X-Ray vidicon analysis of electronic components
|
|
|
1969
|
8 |
3 |
p. 251-
1 p.
|
artikel
|
| 103 |
7 years of OAO
|
|
|
1969
|
8 |
3 |
p. 252-
1 p.
|
artikel
|
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