| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A computer model for integrated circuit transistors including substrate interactions
|
|
|
1969
|
8 |
2 |
p. 150-151
2 p.
|
artikel
|
| 2 |
Active and passive components for attachment to thick film circuits
|
|
|
1969
|
8 |
2 |
p. 155-
1 p.
|
artikel
|
| 3 |
A digital thin-film deposition rate meter
|
|
|
1969
|
8 |
2 |
p. 153-154
2 p.
|
artikel
|
| 4 |
Advances in diffusion furnaces for processing large diameter wafers
|
|
|
1969
|
8 |
2 |
p. 150-
1 p.
|
artikel
|
| 5 |
A high precision alignment device
|
|
|
1969
|
8 |
2 |
p. 159-
1 p.
|
artikel
|
| 6 |
A monolithic integrated sound IF amplifier for TV sets
|
|
|
1969
|
8 |
2 |
p. 157-
1 p.
|
artikel
|
| 7 |
A multi-layer thick film interconnection system
|
|
|
1969
|
8 |
2 |
p. 155-
1 p.
|
artikel
|
| 8 |
An automatic test set for measuring dopant concentration profiles in epitaxial films
|
|
|
1969
|
8 |
2 |
p. 151-
1 p.
|
artikel
|
| 9 |
An Electronic Design special report—Testing
|
|
|
1969
|
8 |
2 |
p. 148-
1 p.
|
artikel
|
| 10 |
Announcements
|
|
|
1969
|
8 |
2 |
p. 161-167
7 p.
|
artikel
|
| 11 |
Application of laser beams to integrated circuits
|
|
|
1969
|
8 |
2 |
p. 160-
1 p.
|
artikel
|
| 12 |
Assembling beam-lead sealed-junction integrated-circuit packages
|
|
|
1969
|
8 |
2 |
p. 158-
1 p.
|
artikel
|
| 13 |
Automatic Testing of electronic equipment
|
|
|
1969
|
8 |
2 |
p. 147-167
21 p.
|
artikel
|
| 14 |
Automation and motor function routines for mask-making
|
|
|
1969
|
8 |
2 |
p. 159-
1 p.
|
artikel
|
| 15 |
Capacitors compatible with thick film circuit technology
|
|
|
1969
|
8 |
2 |
p. 156-
1 p.
|
artikel
|
| 16 |
Chrome photoplates can improve both mask and device yields
|
|
|
1969
|
8 |
2 |
p. 159-
1 p.
|
artikel
|
| 17 |
Computer aids for responsible engineer for the reliability of a system
|
|
|
1969
|
8 |
2 |
p. 169-171
3 p.
|
artikel
|
| 18 |
Conferences, symposia, lectures and meetings of interest
|
|
|
1969
|
8 |
2 |
p. 169-171
3 p.
|
artikel
|
| 19 |
Contamination problems in the semiconductor industry
|
|
|
1969
|
8 |
2 |
p. 149-150
2 p.
|
artikel
|
| 20 |
Cutting of thin carbon films with a CO2-gas laser—II Experiments on cylindrical bodies
|
De Jong, M.
|
|
1969
|
8 |
2 |
p. 89-96
8 p.
|
artikel
|
| 21 |
Cutting of thin carbon films with a CO2-gas laser—I Theoretical considerations and experiments on flat plates
|
Siekman, J.G.
|
|
1969
|
8 |
2 |
p. 85-88
4 p.
|
artikel
|
| 22 |
Depletion layer and capacitance calculations for gaussian diffused junctions
|
|
|
1969
|
8 |
2 |
p. 151-
1 p.
|
artikel
|
| 23 |
Design and fabrication of a thin-film starvation amplifier
|
|
|
1969
|
8 |
2 |
p. 154-
1 p.
|
artikel
|
| 24 |
Die Bonding principles and considerations
|
|
|
1969
|
8 |
2 |
p. 158-
1 p.
|
artikel
|
| 25 |
Diffusion of boron in silicon
|
|
|
1969
|
8 |
2 |
p. 150-
1 p.
|
artikel
|
| 26 |
Direct exposure of photoresist by projection
|
|
|
1969
|
8 |
2 |
p. 159-
1 p.
|
artikel
|
| 27 |
Doping solids with ions
|
|
|
1969
|
8 |
2 |
p. 160-
1 p.
|
artikel
|
| 28 |
Editorial
|
Dummer, G.W.A.
|
|
1969
|
8 |
2 |
p. 79-
1 p.
|
artikel
|
| 29 |
Electron beam exposure system for integrated circuits
|
Tarui, Y.
|
|
1969
|
8 |
2 |
p. 101-104
4 p.
|
artikel
|
| 30 |
Epitaxial growth and growth defects
|
|
|
1969
|
8 |
2 |
p. 152-
1 p.
|
artikel
|
| 31 |
Fabrication of printed circuit boards for use with integrated circuit packages
|
|
|
1969
|
8 |
2 |
p. 158-
1 p.
|
artikel
|
| 32 |
Glass-ceramics for the coating and bonding of silicon semiconductor material
|
McMillan, P.W.
|
|
1969
|
8 |
2 |
p. 105-111
7 p.
|
artikel
|
| 33 |
Hall effect put in IC
|
|
|
1969
|
8 |
2 |
p. 158-
1 p.
|
artikel
|
| 34 |
Hermetic seals by thick-film techniques
|
|
|
1969
|
8 |
2 |
p. 154-
1 p.
|
artikel
|
| 35 |
High-density soldered interconnections
|
|
|
1969
|
8 |
2 |
p. 158-
1 p.
|
artikel
|
| 36 |
High “Q” silicon monoxide thin-film chip capacitors for hybrid microelectronics
|
|
|
1969
|
8 |
2 |
p. 153-
1 p.
|
artikel
|
| 37 |
High-resolution positive resists for electron-beam exposure
|
|
|
1969
|
8 |
2 |
p. 160-
1 p.
|
artikel
|
| 38 |
High voltage gates developed for airborne systems
|
|
|
1969
|
8 |
2 |
p. 158-
1 p.
|
artikel
|
| 39 |
Hybrid thin film micro-electronics—A quick and flexible method of micro-circuit construction
|
|
|
1969
|
8 |
2 |
p. 152-153
2 p.
|
artikel
|
| 40 |
Infrared microradiometry—precision and accuracy considerations applicable to micro-circuit temperature measurements
|
|
|
1969
|
8 |
2 |
p. 148-
1 p.
|
artikel
|
| 41 |
In search of a lasting bond
|
|
|
1969
|
8 |
2 |
p. 158-
1 p.
|
artikel
|
| 42 |
Know your thin-film materials
|
|
|
1969
|
8 |
2 |
p. 153-
1 p.
|
artikel
|
| 43 |
Large-capacity semiconductor memory
|
|
|
1969
|
8 |
2 |
p. 157-
1 p.
|
artikel
|
| 44 |
Laser precision adjustment of cermet resistors in production
|
|
|
1969
|
8 |
2 |
p. 160-
1 p.
|
artikel
|
| 45 |
Life testing of semiconductor rectifiers with energy sparing synthetic circuits
|
Kemény, A.P.
|
|
1969
|
8 |
2 |
p. 113-116
4 p.
|
artikel
|
| 46 |
Linear integrated circuits in communication systems
|
|
|
1969
|
8 |
2 |
p. 157-
1 p.
|
artikel
|
| 47 |
Lots of radio on just one IC
|
|
|
1969
|
8 |
2 |
p. 157-
1 p.
|
artikel
|
| 48 |
Low energy sputtering of tantalum thin-film microcircuits
|
|
|
1969
|
8 |
2 |
p. 153-
1 p.
|
artikel
|
| 49 |
LSI and computer design
|
|
|
1969
|
8 |
2 |
p. 148-
1 p.
|
artikel
|
| 50 |
Mask manufacture for integrated circuits
|
|
|
1969
|
8 |
2 |
p. 159-
1 p.
|
artikel
|
| 51 |
Measurement electronics for the three-point probe
|
|
|
1969
|
8 |
2 |
p. 152-
1 p.
|
artikel
|
| 52 |
Method for determining total burn-in dissipation in a diode
|
Bottaro, D.
|
|
1969
|
8 |
2 |
p. 121-132
12 p.
|
artikel
|
| 53 |
Methods of preparing thin films
|
|
|
1969
|
8 |
2 |
p. 154-
1 p.
|
artikel
|
| 54 |
Multiple lead reflow soldering
|
|
|
1969
|
8 |
2 |
p. 159-
1 p.
|
artikel
|
| 55 |
Noise susceptibility of integrated circuits in digital systems
|
|
|
1969
|
8 |
2 |
p. 157-
1 p.
|
artikel
|
| 56 |
Nondestructive thickness measurement of thin films on microstructures
|
|
|
1969
|
8 |
2 |
p. 154-
1 p.
|
artikel
|
| 57 |
On the measurement of impurity atom distributions in silicon by the differential capacitance technique
|
|
|
1969
|
8 |
2 |
p. 150-
1 p.
|
artikel
|
| 58 |
Oriented growth of semiconductors—VI. Stacking disorder in epitaxial indium phosphide
|
|
|
1969
|
8 |
2 |
p. 150-
1 p.
|
artikel
|
| 59 |
Process analysis of mask making
|
|
|
1969
|
8 |
2 |
p. 159-
1 p.
|
artikel
|
| 60 |
Processing ceramics to give suitable substrate characteristics
|
|
|
1969
|
8 |
2 |
p. 155-
1 p.
|
artikel
|
| 61 |
Quality control in the manufacture of printed wiring boards—some detailed test methods
|
|
|
1969
|
8 |
2 |
p. 135-141
7 p.
|
artikel
|
| 62 |
Recent advances in thick film resistive materials
|
|
|
1969
|
8 |
2 |
p. 155-
1 p.
|
artikel
|
| 63 |
Refractory materials
|
|
|
1969
|
8 |
2 |
p. 151-
1 p.
|
artikel
|
| 64 |
Refractory metal silicon device technology
|
|
|
1969
|
8 |
2 |
p. 152-
1 p.
|
artikel
|
| 65 |
Reliability testing during development
|
Cole, W.P.
|
|
1969
|
8 |
2 |
p. 81-84
4 p.
|
artikel
|
| 66 |
Resistive properties of indium and indium-gallium contacts to CdS
|
|
|
1969
|
8 |
2 |
p. 149-
1 p.
|
artikel
|
| 67 |
Rival preleading schemes head for a market showdown
|
|
|
1969
|
8 |
2 |
p. 159-
1 p.
|
artikel
|
| 68 |
Ruthenium resistor glazes for thick film circuits
|
|
|
1969
|
8 |
2 |
p. 156-
1 p.
|
artikel
|
| 69 |
Semiconductor compounds
|
|
|
1969
|
8 |
2 |
p. 151-
1 p.
|
artikel
|
| 70 |
Silicon planar transistors and diodes for deep water submarine cable repeaters
|
Groocock, J.M.
|
|
1969
|
8 |
2 |
p. 97-99
3 p.
|
artikel
|
| 71 |
Simplified X-ray examination of solid state devices
|
|
|
1969
|
8 |
2 |
p. 143-144
2 p.
|
artikel
|
| 72 |
Special equipment for i.c. production
|
|
|
1969
|
8 |
2 |
p. 159-160
2 p.
|
artikel
|
| 73 |
Status of diffusion data in binary compound semiconductors
|
|
|
1969
|
8 |
2 |
p. 152-
1 p.
|
artikel
|
| 74 |
Tantalum films form reliable low cost circuits
|
|
|
1969
|
8 |
2 |
p. 152-
1 p.
|
artikel
|
| 75 |
Technology of ion implantation
|
|
|
1969
|
8 |
2 |
p. 160-
1 p.
|
artikel
|
| 76 |
Temperature and current distribution in an avalanching p-n junction
|
|
|
1969
|
8 |
2 |
p. 149-
1 p.
|
artikel
|
| 77 |
The computer as an aid to the system reliability engineer
|
Grange, J.M.
|
|
1969
|
8 |
2 |
p. 117-119
3 p.
|
artikel
|
| 78 |
The crystal structure of semiconductors
|
|
|
1969
|
8 |
2 |
p. 151-
1 p.
|
artikel
|
| 79 |
The design, construction and performance of thick film cermet trimming potentiometers
|
|
|
1969
|
8 |
2 |
p. 157-
1 p.
|
artikel
|
| 80 |
The development of glaze capacitors for thick film circuits
|
|
|
1969
|
8 |
2 |
p. 156-
1 p.
|
artikel
|
| 81 |
The manufacture of electrical components in thin film technique
|
|
|
1969
|
8 |
2 |
p. 154-
1 p.
|
artikel
|
| 82 |
The metal oxide silicon transistor and its advantages in micro-circuit technology
|
|
|
1969
|
8 |
2 |
p. 148-149
2 p.
|
artikel
|
| 83 |
The need to teach reliability
|
|
|
1969
|
8 |
2 |
p. 133-
1 p.
|
artikel
|
| 84 |
The pulsed gas laser and its application to microcircuit fabrication
|
|
|
1969
|
8 |
2 |
p. 160-
1 p.
|
artikel
|
| 85 |
Thick films headed for wide use in the 1970s
|
|
|
1969
|
8 |
2 |
p. 155-
1 p.
|
artikel
|
| 86 |
Thick films in automotive equipment
|
|
|
1969
|
8 |
2 |
p. 156-
1 p.
|
artikel
|
| 87 |
Thickness fluctuations and electric field penetration in thin metal-insulator-metal structures
|
|
|
1969
|
8 |
2 |
p. 154-
1 p.
|
artikel
|
| 88 |
Thin film resistor materials and characteristics
|
|
|
1969
|
8 |
2 |
p. 153-
1 p.
|
artikel
|
| 89 |
Understand thin-film circuit design
|
|
|
1969
|
8 |
2 |
p. 153-
1 p.
|
artikel
|
| 90 |
X-ray diffraction topography of germanium wafers
|
|
|
1969
|
8 |
2 |
p. 145-
1 p.
|
artikel
|
| 91 |
Zum Einbau von Kohlenstoff bei der Herstellung von Reinstsilicium
|
|
|
1969
|
8 |
2 |
p. 149-
1 p.
|
artikel
|
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