| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A bakeable vacuum evaporator for the deposition of large area thin-film circuits
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|
1969
|
8 |
1 |
p. 71-
1 p.
|
artikel
|
| 2 |
Advances in doped oxides as diffusion sources
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1969
|
8 |
1 |
p. 68-
1 p.
|
artikel
|
| 3 |
Advances in silicon epitaxial technology
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|
1969
|
8 |
1 |
p. 68-
1 p.
|
artikel
|
| 4 |
An analysis of the vacuum sealing process between turned surfaces
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1969
|
8 |
1 |
p. 69-
1 p.
|
artikel
|
| 5 |
An integrated A.M. radio
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|
1969
|
8 |
1 |
p. 75-76
2 p.
|
artikel
|
| 6 |
An integrated circuit time code generator
|
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1969
|
8 |
1 |
p. 75-
1 p.
|
artikel
|
| 7 |
An introduction to analogue techniques in MOST integrated circuits
|
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|
1969
|
8 |
1 |
p. 64-
1 p.
|
artikel
|
| 8 |
A precision measurement of film thicknesses
|
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|
1969
|
8 |
1 |
p. 70-
1 p.
|
artikel
|
| 9 |
A radio frequency dielectric sputtering system with non-grounded electrodes
|
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|
1969
|
8 |
1 |
p. 73-74
2 p.
|
artikel
|
| 10 |
A transformerless modulator suitable for integrated circuits
|
Bozic, S.M.
|
|
1969
|
8 |
1 |
p. 9-12
4 p.
|
artikel
|
| 11 |
A two-dimensional mathematical analysis of the diffused semiconductor resistor
|
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|
1969
|
8 |
1 |
p. 67-
1 p.
|
artikel
|
| 12 |
Avoiding IC system design pitfalls
|
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|
1969
|
8 |
1 |
p. 64-65
2 p.
|
artikel
|
| 13 |
Boost reliability in your op-amp circuit. Build in redundancy and get automatic compensation for internal failures
|
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|
1969
|
8 |
1 |
p. 63-
1 p.
|
artikel
|
| 14 |
Build a linear-IC phase-locked loop
|
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|
1969
|
8 |
1 |
p. 76-
1 p.
|
artikel
|
| 15 |
Choosing contact materials
|
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|
1969
|
8 |
1 |
p. 61-62
2 p.
|
artikel
|
| 16 |
Comparison of some physical properties of resistance—heat and electron-gun evaporated SiO films
|
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|
1969
|
8 |
1 |
p. 71-
1 p.
|
artikel
|
| 17 |
Computer generates thin-film circuit masks
|
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|
1969
|
8 |
1 |
p. 77-
1 p.
|
artikel
|
| 18 |
Cut down on power transistor failures
|
|
|
1969
|
8 |
1 |
p. 61-
1 p.
|
artikel
|
| 19 |
Design i-f stages with monolithic ICs
|
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|
1969
|
8 |
1 |
p. 77-
1 p.
|
artikel
|
| 20 |
Development and application of thin-film techniques
|
|
|
1969
|
8 |
1 |
p. 72-
1 p.
|
artikel
|
| 21 |
Device failure analysis by scanning electron microscopy
|
Thornton, P.R.
|
|
1969
|
8 |
1 |
p. 33-42
10 p.
|
artikel
|
| 22 |
Digital applications of MOS integrated circuits
|
|
|
1969
|
8 |
1 |
p. 76-
1 p.
|
artikel
|
| 23 |
DIPLOG. A new range of thick-film hybrid integrated circuits
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|
|
1969
|
8 |
1 |
p. 75-
1 p.
|
artikel
|
| 24 |
Dodge transducer failures with a RAMP. This highly reliable op amp automatically corrects for the failure of one or more of its redundant inputs
|
|
|
1969
|
8 |
1 |
p. 63-
1 p.
|
artikel
|
| 25 |
Dynamic IC testing made easy
|
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|
1969
|
8 |
1 |
p. 63-
1 p.
|
artikel
|
| 26 |
Editorial Board
|
|
|
1969
|
8 |
1 |
p. IFC-
1 p.
|
artikel
|
| 27 |
Epitaxial GaAs films deposited by vacuum evaporation
|
|
|
1969
|
8 |
1 |
p. 72-
1 p.
|
artikel
|
| 28 |
Estimating IC reliability—a suggested mathematical model
|
|
|
1969
|
8 |
1 |
p. 62-
1 p.
|
artikel
|
| 29 |
Estimating the optimum position for restoring organs in non-cascaded redundant networks
|
Repton, C.S.
|
|
1969
|
8 |
1 |
p. 23-31
9 p.
|
artikel
|
| 30 |
Fabrication of ultrathin films
|
|
|
1969
|
8 |
1 |
p. 72-
1 p.
|
artikel
|
| 31 |
Functional tantalum thin-film resistive networks and decoders
|
|
|
1969
|
8 |
1 |
p. 71-
1 p.
|
artikel
|
| 32 |
Getting beneath the surface of multilayer integrated circuits
|
|
|
1969
|
8 |
1 |
p. 65-
1 p.
|
artikel
|
| 33 |
Glaze resistors with ruthenium dioxide
|
|
|
1969
|
8 |
1 |
p. 75-
1 p.
|
artikel
|
| 34 |
Gyrator and state-variable results for linear integrated circuits
|
|
|
1969
|
8 |
1 |
p. 75-
1 p.
|
artikel
|
| 35 |
High stability thick-film resistors for commercial applications
|
|
|
1969
|
8 |
1 |
p. 74-
1 p.
|
artikel
|
| 36 |
IC failure analysis by scanning electron microscopy
|
|
|
1969
|
8 |
1 |
p. 62-
1 p.
|
artikel
|
| 37 |
IC processing: healthy, still growing
|
|
|
1969
|
8 |
1 |
p. 66-
1 p.
|
artikel
|
| 38 |
Improvement and its results of the metallic surface finishing for the lead wires used in electronic components
|
|
|
1969
|
8 |
1 |
p. 62-
1 p.
|
artikel
|
| 39 |
Increasing automobile component reliability
|
|
|
1969
|
8 |
1 |
p. 61-
1 p.
|
artikel
|
| 40 |
Influence of dielectric films on the resistance of vacuum-deposited chromium films
|
|
|
1969
|
8 |
1 |
p. 72-
1 p.
|
artikel
|
| 41 |
Integrated circuit applications
|
|
|
1969
|
8 |
1 |
p. 64-
1 p.
|
artikel
|
| 42 |
Integrated electronics
|
|
|
1969
|
8 |
1 |
p. 65-
1 p.
|
artikel
|
| 43 |
Linear ICs for broadcast receivers
|
|
|
1969
|
8 |
1 |
p. 76-
1 p.
|
artikel
|
| 44 |
Load capacity of thick-film resistors
|
|
|
1969
|
8 |
1 |
p. 75-
1 p.
|
artikel
|
| 45 |
Maintaining accurate temperature profiles in the semiconductor diffusion process
|
|
|
1969
|
8 |
1 |
p. 68-
1 p.
|
artikel
|
| 46 |
Making integrated electronics technology work
|
|
|
1969
|
8 |
1 |
p. 65-
1 p.
|
artikel
|
| 47 |
Manufacturing the plastic dual in-line integrated circuit
|
|
|
1969
|
8 |
1 |
p. 67-
1 p.
|
artikel
|
| 48 |
Mask-making and computers
|
|
|
1969
|
8 |
1 |
p. 66-
1 p.
|
artikel
|
| 49 |
Materials for thick-film technology—state of the art
|
|
|
1969
|
8 |
1 |
p. 74-
1 p.
|
artikel
|
| 50 |
Mechanical and electrical properties of epitaxial silicon films on spinel
|
|
|
1969
|
8 |
1 |
p. 67-68
2 p.
|
artikel
|
| 51 |
Microwave ICs—I. New problems, but newer solutions
|
|
|
1969
|
8 |
1 |
p. 65-
1 p.
|
artikel
|
| 52 |
Microwave integrated circuit applications to radar systems
|
|
|
1969
|
8 |
1 |
p. 64-
1 p.
|
artikel
|
| 53 |
On the magnetic properties of sputtered NiFe films
|
|
|
1969
|
8 |
1 |
p. 70-
1 p.
|
artikel
|
| 54 |
On the measurement of impurity atom distributions in silicon by the differential capacitance technique
|
|
|
1969
|
8 |
1 |
p. 68-
1 p.
|
artikel
|
| 55 |
Phase-shift corrections in determining the thicknesses of transparent films on reflective substrates
|
|
|
1969
|
8 |
1 |
p. 69-
1 p.
|
artikel
|
| 56 |
Polymer dielectric films
|
|
|
1969
|
8 |
1 |
p. 72-
1 p.
|
artikel
|
| 57 |
Power supplies for ICs
|
|
|
1969
|
8 |
1 |
p. 66-
1 p.
|
artikel
|
| 58 |
Practical considerations of system design with bipolar digital integrated circuits
|
Jones, W.G.T.
|
|
1969
|
8 |
1 |
p. 1-8
8 p.
|
artikel
|
| 59 |
Preparation and study of thin semiconductors films realized by vacuum evaporation, on flexible substrates
|
|
|
1969
|
8 |
1 |
p. 71-
1 p.
|
artikel
|
| 60 |
Preparation of indium antimonide films
|
|
|
1969
|
8 |
1 |
p. 67-
1 p.
|
artikel
|
| 61 |
Pressure control in vacuum deposition processes
|
|
|
1969
|
8 |
1 |
p. 69-70
2 p.
|
artikel
|
| 62 |
Printing of thick-film microcircuits
|
|
|
1969
|
8 |
1 |
p. 74-
1 p.
|
artikel
|
| 63 |
Programming and graphics support for infrared thermal plotters
|
|
|
1969
|
8 |
1 |
p. 63-64
2 p.
|
artikel
|
| 64 |
Quantum theory of perpendicular electrical conductivity in a thin metallic film
|
|
|
1969
|
8 |
1 |
p. 72-
1 p.
|
artikel
|
| 65 |
Re-emission coefficients of Si and SiO2 films deposited through rf and d.c. sputtering
|
|
|
1969
|
8 |
1 |
p. 73-
1 p.
|
artikel
|
| 66 |
Reliability of printed wiring boards with plated-through-hole connections
|
|
|
1969
|
8 |
1 |
p. 62-
1 p.
|
artikel
|
| 67 |
Repairability of printed wiring boards containing microelectronic devices
|
|
|
1969
|
8 |
1 |
p. 63-
1 p.
|
artikel
|
| 68 |
Silane: Review and applications
|
|
|
1969
|
8 |
1 |
p. 68-
1 p.
|
artikel
|
| 69 |
Solid logic technology computer circuits — Billion hour reliability data
|
Platz, E.F.
|
|
1969
|
8 |
1 |
p. 55-56
2 p.
|
artikel
|
| 70 |
Some applications of monolithic circuits in telemetry
|
|
|
1969
|
8 |
1 |
p. 75-
1 p.
|
artikel
|
| 71 |
Some magnetic properties of vacuum-deposited coupled films
|
|
|
1969
|
8 |
1 |
p. 71-
1 p.
|
artikel
|
| 72 |
Sputtering—III. Its technology applications
|
|
|
1969
|
8 |
1 |
p. 73-
1 p.
|
artikel
|
| 73 |
Sputtering—II. Its technology applications
|
|
|
1969
|
8 |
1 |
p. 73-
1 p.
|
artikel
|
| 74 |
Sputtering—I. Its technology application
|
|
|
1969
|
8 |
1 |
p. 73-
1 p.
|
artikel
|
| 75 |
Sputtering of insulators in a RF discharge
|
|
|
1969
|
8 |
1 |
p. 70-71
2 p.
|
artikel
|
| 76 |
Summary of methods to determine thickness of thin films—I
|
|
|
1969
|
8 |
1 |
p. 72-
1 p.
|
artikel
|
| 77 |
Surface barriers on layer semiconductors GaSe
|
|
|
1969
|
8 |
1 |
p. 68-
1 p.
|
artikel
|
| 78 |
Switching phenomena in titanium oxide thin films
|
|
|
1969
|
8 |
1 |
p. 73-
1 p.
|
artikel
|
| 79 |
Temperature coefficient of resistivity of silicon and germanium near room temperature
|
|
|
1969
|
8 |
1 |
p. 67-
1 p.
|
artikel
|
| 80 |
Tetrode sputtering system—its performance and applications for the deposition of tantalum, silica and alumina thin films
|
|
|
1969
|
8 |
1 |
p. 69-
1 p.
|
artikel
|
| 81 |
TFT instability and stabilization techniques
|
|
|
1969
|
8 |
1 |
p. 73-
1 p.
|
artikel
|
| 82 |
The application of solid state and microwave integrated circuit technologies to phased array radars
|
|
|
1969
|
8 |
1 |
p. 76-77
2 p.
|
artikel
|
| 83 |
The effect of transistor collector design on operating voltage and second breakdown
|
|
|
1969
|
8 |
1 |
p. 61-
1 p.
|
artikel
|
| 84 |
The epitaxial growth of zinc sulphide on silicon by vacuum evaporation
|
|
|
1969
|
8 |
1 |
p. 74-
1 p.
|
artikel
|
| 85 |
The failure mode and lifetime of static contacts
|
|
|
1969
|
8 |
1 |
p. 61-
1 p.
|
artikel
|
| 86 |
The process steps for integrated circuits and their relation to customer requirements
|
|
|
1969
|
8 |
1 |
p. 64-
1 p.
|
artikel
|
| 87 |
The qualification of electronic components for use in space
|
Reid, R.A.
|
|
1969
|
8 |
1 |
p. 13-21
9 p.
|
artikel
|
| 88 |
The quest for a telegraph relay of greater reliability
|
|
|
1969
|
8 |
1 |
p. 61-
1 p.
|
artikel
|
| 89 |
The reliability of microwave radio-relay systems
|
|
|
1969
|
8 |
1 |
p. 64-
1 p.
|
artikel
|
| 90 |
Thermal degradation of polyethylene and polytetrafluorethylene during vacuum evaporation
|
|
|
1969
|
8 |
1 |
p. 70-
1 p.
|
artikel
|
| 91 |
The sputtering of nickel-chromium alloys
|
|
|
1969
|
8 |
1 |
p. 73-
1 p.
|
artikel
|
| 92 |
The use of metal oxide silicon transistors in computer circuits
|
|
|
1969
|
8 |
1 |
p. 76-
1 p.
|
artikel
|
| 93 |
Thick-film hybrid design—the right way
|
|
|
1969
|
8 |
1 |
p. 74-
1 p.
|
artikel
|
| 94 |
Thin-film CdS-CdTe heterojunction diodes
|
|
|
1969
|
8 |
1 |
p. 66-
1 p.
|
artikel
|
| 95 |
Thin-film conductors and insulators
|
|
|
1969
|
8 |
1 |
p. 70-
1 p.
|
artikel
|
| 96 |
Tooling and part handling systems for thick-film microcircuits
|
|
|
1969
|
8 |
1 |
p. 74-
1 p.
|
artikel
|
| 97 |
Visual inspection of ICs boosts reliability at little cost
|
|
|
1969
|
8 |
1 |
p. 62-63
2 p.
|
artikel
|
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