| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A closed-form trapped-charge-included drain current compact model for amorphous oxide semiconductor thin-film transistors
|
Yu, Fei
|
|
2018
|
76-77 |
P2 |
p. 307-312
|
artikel
|
| 2 |
A critical analysis of the bulk current injection immunity test based on common-mode and differential-mode
|
Tan, Ligang
|
|
2018
|
76-77 |
P2 |
p. 188-193
|
artikel
|
| 3 |
An artificial neural network approach for wafer dicing saw quality prediction
|
Su, Te-Jen
|
|
2018
|
76-77 |
P2 |
p. 257-261
|
artikel
|
| 4 |
Angular dependency on heavy-ion-induced single-event multiple transients (SEMT) in 65 nm twin-well and triple-well CMOS technology
|
Zhang, Jizuo
|
|
2018
|
76-77 |
P2 |
p. 278-282
|
artikel
|
| 5 |
A novel single-event-hardened charge pump using cascode voltage switch logic gates
|
Yang, Zhizhan
|
|
2018
|
76-77 |
P2 |
p. 269-277
|
artikel
|
| 6 |
A theoretical model for calculating the effects of carrier heating with nonequilibrium hot phonons on semiconductor devices and the current-voltage relations
|
Tsai, Chin-Yi
|
|
2018
|
76-77 |
P2 |
p. 335-343
|
artikel
|
| 7 |
Behavior of Au and Pd and the effects of these metals on IMCs in Pd-Au-coated copper wire
|
Park, Hyun-Woong
|
|
2018
|
76-77 |
P2 |
p. 283-290
|
artikel
|
| 8 |
Charge transport model to predict dielectric breakdown as a function of voltage, temperature, and thickness
|
Ogden, Sean P.
|
|
2018
|
76-77 |
P2 |
p. 232-242
|
artikel
|
| 9 |
Editorial Board
|
|
|
2018
|
76-77 |
P2 |
p. ii
|
artikel
|
| 10 |
Evaluation of statistical variability and parametric sensitivity of non-uniformly doped Junctionless FinFET
|
Kaundal, Shalu
|
|
2018
|
76-77 |
P2 |
p. 298-305
|
artikel
|
| 11 |
Experimental determination of the Young's modulus of copper and solder materials for electronic packaging
|
Kraemer, F.
|
|
2018
|
76-77 |
P2 |
p. 251-256
|
artikel
|
| 12 |
Failure mechanisms of solder interconnects under current stressing in advanced electronic packages: An update on the effect of alternating current (AC) stressing
|
Zhu, Ze
|
|
2018
|
76-77 |
P2 |
p. 179-182
|
artikel
|
| 13 |
Failure study of Sn37Pb PBGA solder joints using temperature cycling, random vibration and combined temperature cycling and random vibration tests
|
An, Tong
|
|
2018
|
76-77 |
P2 |
p. 213-226
|
artikel
|
| 14 |
Hopping conduction distance of bipolar switching GdOx resistance random access memory thin films devices modified by different constant compliance current
|
Chen, Kai-Huang
|
|
2018
|
76-77 |
P2 |
p. 330-334
|
artikel
|
| 15 |
Impact of finger numbers on the performance of proton-radiated SiGe power HBTs at room and cryogenic temperatures
|
Zhao, Zheng
|
|
2018
|
76-77 |
P2 |
p. 194-200
|
artikel
|
| 16 |
Influence of multi-walled carbon nanotube (MWCNT) concentration on the thermo-mechanical reliability properties of solderable anisotropic conductive adhesives (SACAs)
|
Yim, Byung-Seung
|
|
2018
|
76-77 |
P2 |
p. 201-212
|
artikel
|
| 17 |
Infrared response of vanadium oxide (VOx)/SiNx/reduced graphene oxide (rGO) composite microbolometer
|
Wu, Zheng-Yuan
|
|
2018
|
76-77 |
P2 |
p. 313-318
|
artikel
|
| 18 |
Investigation of DNA sequencing droplet trajectory observation and analysis
|
Liou, Jian-Chiun
|
|
2018
|
76-77 |
P2 |
p. 243-250
|
artikel
|
| 19 |
Normalized differential conductance to study current conduction mechanisms in MOS structures
|
Nouibat, T.H.
|
|
2018
|
76-77 |
P2 |
p. 183-187
|
artikel
|
| 20 |
Pentacene bottom-contact thin film transistors with solution-processed BZT gate dielectrics
|
Chou, Dei-Wei
|
|
2018
|
76-77 |
P2 |
p. 323-329
|
artikel
|
| 21 |
Proton-induced displacement damage in ZnO thin film transistors: Impact of damage location
|
Yapabandara, Kosala
|
|
2018
|
76-77 |
P2 |
p. 262-268
|
artikel
|
| 22 |
SiO2 tunneling and Si3N4/HfO2 trapping layers formed with low temperature processes on gate-all-around junctionless charge-trapping flash memory devices
|
Fang, Hsin-Kai
|
|
2018
|
76-77 |
P2 |
p. 319-322
|
artikel
|
| 23 |
Thermal performance analysis of GaN nanowire and fin-shaped power transistors based on self-consistent electrothermal simulations
|
Kamrani, Hamed
|
|
2018
|
76-77 |
P2 |
p. 227-231
|
artikel
|
| 24 |
Transistor open-circuit fault diagnosis in two-level three-phase inverter based on similarity measurement
|
Hang, Cuicui
|
|
2018
|
76-77 |
P2 |
p. 291-297
|
artikel
|
| 25 |
Wide Bandgap Materials for Semiconductor Devices
|
Lee, Kuan-Wei
|
|
2018
|
76-77 |
P2 |
p. 306
|
artikel
|
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