nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A constitutive single crystal model for the silicon mechanical behavior: Applications to the stress induced by silicided lines and STI in MOS technologies
|
Cacho, F. |
|
2007 |
76-77 |
2-3 |
p. 161-167 7 p. |
artikel |
2 |
4947375 Addressing of redundant columns and rows of an integrated circuit memory
|
Gaultier, JeanMarie |
|
1991 |
76-77 |
2-3 |
p. x-xi nvt p. |
artikel |
3 |
Advanced numerical prototyping methods in modern engineering applications – Optimisation for micro-electronic package reliability
|
Wymysłowski, A. |
|
2007 |
76-77 |
2-3 |
p. 280-289 10 p. |
artikel |
4 |
Advanced structural similarity rules for the BGA package family
|
van Driel, W.D. |
|
2007 |
76-77 |
2-3 |
p. 205-214 10 p. |
artikel |
5 |
A method for evaluation of number class intervals of histogram
|
Brkić, D.M. |
|
1991 |
76-77 |
2-3 |
p. 245-248 4 p. |
artikel |
6 |
An algorithm to solve integer programming problems: An efficient tool for reliability design
|
Misra, Krishna B. |
|
1991 |
76-77 |
2-3 |
p. 285-294 10 p. |
artikel |
7 |
Analysis of a complex system composed of two sub-systems with their standbys
|
Gupta, Rakesh |
|
1991 |
76-77 |
2-3 |
p. 453-463 11 p. |
artikel |
8 |
Analysis of Cu/low-k bond pad delamination by using a novel failure index
|
van Gils, M.A.J. |
|
2007 |
76-77 |
2-3 |
p. 179-186 8 p. |
artikel |
9 |
Analysis of d.c. and a.c. anomalous latch-up effects in commercial CMOS integrated circuits
|
Zanoni, Enrico |
|
1991 |
76-77 |
2-3 |
p. 249-254 6 p. |
artikel |
10 |
Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly
|
Van Steenberge, Nele |
|
2007 |
76-77 |
2-3 |
p. 215-222 8 p. |
artikel |
11 |
An efficient approach for multiple criteria redundancy optimization problems
|
Misra, Krishna B. |
|
1991 |
76-77 |
2-3 |
p. 303-321 19 p. |
artikel |
12 |
A new two-dimensional threshold voltage model for cylindrical, fully-depleted, surrounding-gate (SG) MOSFETs
|
Chiang, T.K. |
|
2007 |
76-77 |
2-3 |
p. 379-383 5 p. |
artikel |
13 |
4907931 Apparatus for handling semiconductor wafers
|
Mallory, ChesterL |
|
1991 |
76-77 |
2-3 |
p. i- 1 p. |
artikel |
14 |
4931726 Apparatus for testing semiconductor device
|
Kasukabe, Susumu |
|
1991 |
76-77 |
2-3 |
p. vii- 1 p. |
artikel |
15 |
4900948 Apparatus providing signals for burn-in of integrated circuits
|
Hamilton, Harold |
|
1991 |
76-77 |
2-3 |
p. i- 1 p. |
artikel |
16 |
Application of an efficient search technique for optimal design of a computer communication network
|
Sharma, Usha |
|
1991 |
76-77 |
2-3 |
p. 337-341 5 p. |
artikel |
17 |
Application of simulation-based decision making in product development of an RF module
|
Lindgren, Mats |
|
2007 |
76-77 |
2-3 |
p. 302-309 8 p. |
artikel |
18 |
Applications of a search algorithm to reliability design problems
|
Misra, Krishna B. |
|
1991 |
76-77 |
2-3 |
p. 295-301 7 p. |
artikel |
19 |
A practical method of binomial reliability assessment
|
Wang, Hong-Zhou |
|
1991 |
76-77 |
2-3 |
p. 255-256 2 p. |
artikel |
20 |
A stuck fault model for dynamic CMOS combinational circuits
|
Ismaeel, Asad A. |
|
1991 |
76-77 |
2-3 |
p. 407-427 21 p. |
artikel |
21 |
A threshold-voltage model of SiGe-channel pMOSFET without Si cap layer
|
Zou, X. |
|
2007 |
76-77 |
2-3 |
p. 391-394 4 p. |
artikel |
22 |
4947545 Automated burn-in system
|
Gussman, Robert |
|
1991 |
76-77 |
2-3 |
p. xi- 1 p. |
artikel |
23 |
Availability and frequency of failures of a system in the presence of chance common-cause shock failures
|
Madhusudana Verma, S. |
|
1991 |
76-77 |
2-3 |
p. 265-269 5 p. |
artikel |
24 |
Bibliography on electrical conduction in thick film resistors
|
Dziedzic, Andrzej |
|
1991 |
76-77 |
2-3 |
p. 549-558 10 p. |
artikel |
25 |
4949341 Built-in self test method for application specific integrated circuit libraries
|
Lopez, David |
|
1991 |
76-77 |
2-3 |
p. xi- 1 p. |
artikel |
26 |
4926117 Burn-in board having discrete test capability
|
Nevill, LelandR |
|
1991 |
76-77 |
2-3 |
p. vi- 1 p. |
artikel |
27 |
Carbon/polyesterimide thick-film resistive composites – Experimental characterization and theoretical analysis of physicochemical, electrical and stability properties
|
Dziedzic, Andrzej |
|
2007 |
76-77 |
2-3 |
p. 354-362 9 p. |
artikel |
28 |
CHE failure in a two-unit standby system with slow switch, repair and post repair
|
Goel, L.R. |
|
1991 |
76-77 |
2-3 |
p. 219-222 4 p. |
artikel |
29 |
Correlation between chemistry of polymer building blocks and microelectronics reliability
|
Bressers, H.J.L. |
|
2007 |
76-77 |
2-3 |
p. 290-294 5 p. |
artikel |
30 |
Cost analysis of a one-unit repairable system subject to on-line preventive maintenance and/or repair
|
Gopalan, M.N. |
|
1991 |
76-77 |
2-3 |
p. 223-228 6 p. |
artikel |
31 |
Creep of thermally aged SnAgCu-solder joints
|
Wiese, S. |
|
2007 |
76-77 |
2-3 |
p. 223-232 10 p. |
artikel |
32 |
4929889 Data path chip test architecture
|
Seiler, LarryD |
|
1991 |
76-77 |
2-3 |
p. vii- 1 p. |
artikel |
33 |
Dependability evaluation of Altera FPGA-based embedded systems subjected to SEUs
|
Zarandi, Hamid R. |
|
2007 |
76-77 |
2-3 |
p. 461-470 10 p. |
artikel |
34 |
Design of reconfigurable fault-tolerant VLSI/WSI processor array structures
|
Noore, A. |
|
1991 |
76-77 |
2-3 |
p. 481-489 9 p. |
artikel |
35 |
Dynamic responses and solder joint reliability under board level drop test
|
Luan, Jing-en |
|
2007 |
76-77 |
2-3 |
p. 450-460 11 p. |
artikel |
36 |
Dynamic void formation in a DD-copper-structure with different metallization geometry
|
Weide-Zaage, Kirsten |
|
2007 |
76-77 |
2-3 |
p. 319-325 7 p. |
artikel |
37 |
Effect of different temperature cycling profiles on the crack initiation and propagation of Sn–3.5Ag wave soldered solder joints
|
Andersson, C. |
|
2007 |
76-77 |
2-3 |
p. 266-272 7 p. |
artikel |
38 |
Effect of filler concentration of rubbery shear and bulk modulus of molding compounds
|
Yang, D.G. |
|
2007 |
76-77 |
2-3 |
p. 233-239 7 p. |
artikel |
39 |
Effect of stress voltages on voltage acceleration and lifetime projections for ultra-thin gate oxides
|
Abadeer, W.W. |
|
2007 |
76-77 |
2-3 |
p. 395-400 6 p. |
artikel |
40 |
4932028 Error log system for self-testing in very large scale integrated circuit (VLSI) units
|
Katircioglu, Haluk |
|
1991 |
76-77 |
2-3 |
p. viii- 1 p. |
artikel |
41 |
Evidence that N2O is a stronger oxidizing agent than O2 for both Ta2O5 and bare Si below 1000°C and temperature for minimum low-K interfacial oxide for high-K dielectric on Si
|
Lau, W.S. |
|
2007 |
76-77 |
2-3 |
p. 429-433 5 p. |
artikel |
42 |
Examination of degradation mechanism due to negative bias temperature stress from a perspective of hole energy for accurate lifetime prediction
|
Watanabe, Kazufumi |
|
2007 |
76-77 |
2-3 |
p. 409-418 10 p. |
artikel |
43 |
Excess noise as an indicator of digital integrated circuit reliability
|
Jones, B.K. |
|
1991 |
76-77 |
2-3 |
p. 351-361 11 p. |
artikel |
44 |
Experimental and numerical investigations on delayed short-circuit failure mode of single chip IGBT devices
|
Khatir, Z. |
|
2007 |
76-77 |
2-3 |
p. 422-428 7 p. |
artikel |
45 |
Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept
|
Roellig, Mike |
|
2007 |
76-77 |
2-3 |
p. 187-195 9 p. |
artikel |
46 |
FEM-based method to determine mechanical stress evolution during process flow in microelectronics, application to stress–voiding
|
Orain, S. |
|
2007 |
76-77 |
2-3 |
p. 295-301 7 p. |
artikel |
47 |
4937655 Film segment having integrated circuit chip bonded thereto and fixture therefor
|
Miyazaki, Tatsuya |
|
1991 |
76-77 |
2-3 |
p. ix- 1 p. |
artikel |
48 |
4920785 Hermeticity testing method and system
|
Etess, Edward |
|
1991 |
76-77 |
2-3 |
p. v- 1 p. |
artikel |
49 |
Influence of substrate thickness on thermal impedance of microelectronic structures
|
Vermeersch, B. |
|
2007 |
76-77 |
2-3 |
p. 437-443 7 p. |
artikel |
50 |
Inkjettable conductive adhesive for use in microelectronics and microsystems technology
|
Kolbe, Jana |
|
2007 |
76-77 |
2-3 |
p. 331-334 4 p. |
artikel |
51 |
4918377 Integrated circuit reliability testing
|
Buehler, MartinG |
|
1991 |
76-77 |
2-3 |
p. iv- 1 p. |
artikel |
52 |
4918379 Integrated monolithic circuit having a test bus
|
Jongepier, Abraham |
|
1991 |
76-77 |
2-3 |
p. iv- 1 p. |
artikel |
53 |
4937659 Interconnection system for integrated circuit chips
|
Chall, Louis |
|
1991 |
76-77 |
2-3 |
p. ix-x nvt p. |
artikel |
54 |
4918335 Interconnection system for integrated circuit chips
|
Chall, LouisE |
|
1991 |
76-77 |
2-3 |
p. iii-iv nvt p. |
artikel |
55 |
Investigation of environmental reliability of optical polymer waveguides embedded on printed circuit boards
|
Immonen, Marika P. |
|
2007 |
76-77 |
2-3 |
p. 363-371 9 p. |
artikel |
56 |
Investigations of the influence of dicing techniques on the strength properties of thin silicon
|
Schoenfelder, Stephan |
|
2007 |
76-77 |
2-3 |
p. 168-178 11 p. |
artikel |
57 |
Isotropic conductive adhesives: Future trends, possibilities and risks
|
Morris, James E. |
|
2007 |
76-77 |
2-3 |
p. 328-330 3 p. |
artikel |
58 |
4920445 Junction-breakdown protection semiconductor device
|
Jun, DongSoo |
|
1991 |
76-77 |
2-3 |
p. v- 1 p. |
artikel |
59 |
4949157 Large scale integrated circuit
|
Minami, Eiichi |
|
1991 |
76-77 |
2-3 |
p. xi- 1 p. |
artikel |
60 |
4937475 Laser programmable integrated circuit
|
Matthew Rhodes, F |
|
1991 |
76-77 |
2-3 |
p. ix- 1 p. |
artikel |
61 |
Local area network implementation of petri net reachability analysis
|
Anneberg, L. |
|
1991 |
76-77 |
2-3 |
p. 491-499 9 p. |
artikel |
62 |
Low-distortion 4th order programmable Butterworth filter
|
Teresa Sanz, M. |
|
2007 |
76-77 |
2-3 |
p. 471-476 6 p. |
artikel |
63 |
Low voltage stress induced leakage current and time to breakdown in ultra-thin (1.2–2.3nm) oxides
|
Petit, C. |
|
2007 |
76-77 |
2-3 |
p. 401-408 8 p. |
artikel |
64 |
4930439 Mask-repairing device
|
Sato, Mitsuyoshi |
|
1991 |
76-77 |
2-3 |
p. vii- 1 p. |
artikel |
65 |
4927505 Metallization scheme providing adhesion and barrier properties
|
Sharma, RavinderK |
|
1991 |
76-77 |
2-3 |
p. vi- 1 p. |
artikel |
66 |
4937826 Method and apparatus for sensing defects in integrated circuit elements
|
Gheewala, TusharR |
|
1991 |
76-77 |
2-3 |
p. x- 1 p. |
artikel |
67 |
4947105 Method and circuit for testing integrated circuit modules
|
Unger, Bernhard |
|
1991 |
76-77 |
2-3 |
p. x- 1 p. |
artikel |
68 |
4937203 Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer
|
Eichelberger, CharlesW |
|
1991 |
76-77 |
2-3 |
p. ix- 1 p. |
artikel |
69 |
4918385 Method and process for testing the reliability of integrated circuit (IC) chipsand novel IC circuitry for accomplishing same
|
Shreeve, RobertW |
|
1991 |
76-77 |
2-3 |
p. iv-v nvt p. |
artikel |
70 |
4917466 Method for electrically connecting IC chips, a resinous bump-forming composition used therein and a liquid-crystal display unit electrically connected thereby
|
Nakamura, Akio |
|
1991 |
76-77 |
2-3 |
p. iii- 1 p. |
artikel |
71 |
4933860 Method for fabricating a radio frequency integrated circuit and product formed thereby
|
Liu, LouisC |
|
1991 |
76-77 |
2-3 |
p. viii- 1 p. |
artikel |
72 |
4935378 Method for manufacturing a semiconductor device having more than two conductive layers
|
Mori, Seiichi |
|
1991 |
76-77 |
2-3 |
p. viii- 1 p. |
artikel |
73 |
4933042 Method for packaging integrated circuit chips employing a polymer film overlay layer
|
Eichelberger, CharlesW |
|
1991 |
76-77 |
2-3 |
p. viii- 1 p. |
artikel |
74 |
4924589 Method of making and testing an integrated circuit
|
Leedy, GlennJ |
|
1991 |
76-77 |
2-3 |
p. vi- 1 p. |
artikel |
75 |
4952272 Method of manufacturing probing head for testing equipment of semiconductor large scale integrated circuits
|
Okino, Hironobu |
|
1991 |
76-77 |
2-3 |
p. xiii- 1 p. |
artikel |
76 |
4912052 Method of testing semiconductor elements
|
Miyoshi, Motosuke |
|
1991 |
76-77 |
2-3 |
p. ii- 1 p. |
artikel |
77 |
Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques
|
Gonda, V. |
|
2007 |
76-77 |
2-3 |
p. 248-251 4 p. |
artikel |
78 |
4930101 Microprocessor controlled meter package for a printer
|
Wong, YuenW |
|
1991 |
76-77 |
2-3 |
p. vii- 1 p. |
artikel |
79 |
Monte Carlo simulation for improving electromigration lifetime by balancing temperature and structural gradients
|
Gui, X. |
|
1991 |
76-77 |
2-3 |
p. 389-400 12 p. |
artikel |
80 |
Multicriteria optimization for combined reliability and redundancy allocation in systems employing mixed redundancies
|
Misra, Krishna B. |
|
1991 |
76-77 |
2-3 |
p. 323-335 13 p. |
artikel |
81 |
4912399 Multiple lead probe for integrated circuits in wafer form
|
Greub, HansJ |
|
1991 |
76-77 |
2-3 |
p. ii-iii nvt p. |
artikel |
82 |
New definitions of basic R&M terms
|
Badenius, Duncan |
|
1991 |
76-77 |
2-3 |
p. 525-535 11 p. |
artikel |
83 |
Novel shear tools for viscoelastic characterization of packaging polymers
|
van’t Hof, C. |
|
2007 |
76-77 |
2-3 |
p. 240-247 8 p. |
artikel |
84 |
Numerical approach to characterization of thermally conductive adhesives
|
Fałat, Tomasz |
|
2007 |
76-77 |
2-3 |
p. 342-346 5 p. |
artikel |
85 |
Numerical modeling of warpage induced in QFN array molding process
|
Yang, D.G. |
|
2007 |
76-77 |
2-3 |
p. 310-318 9 p. |
artikel |
86 |
On multivariate generalized logistic distribution
|
Ragab, Aisha |
|
1991 |
76-77 |
2-3 |
p. 511-519 9 p. |
artikel |
87 |
On the difference between thermal cycling and thermal shock testing for board level reliability of soldered interconnections
|
de Vries, J.W.C. |
|
2007 |
76-77 |
2-3 |
p. 444-449 6 p. |
artikel |
88 |
On the effect of power-line disturbances on microcomputer performance
|
Roda, Valentin Obac |
|
1991 |
76-77 |
2-3 |
p. 229-235 7 p. |
artikel |
89 |
4952057 Optical fiber backscatter signature generator (OFBSG)
|
Kamikawa, Neil |
|
1991 |
76-77 |
2-3 |
p. xii-xiii nvt p. |
artikel |
90 |
Optimal replacement of a system with imperfect repair
|
Makiš, Viliam |
|
1991 |
76-77 |
2-3 |
p. 381-388 8 p. |
artikel |
91 |
Optimization of test parallelism with limited hardware overhead
|
Feng, Sheng |
|
1991 |
76-77 |
2-3 |
p. 271-276 6 p. |
artikel |
92 |
Optimizing the thermalsonic bonding process for thick film hybrid IC by the Taguchi Method
|
Yann-Chyn, Jeng |
|
1991 |
76-77 |
2-3 |
p. 501-510 10 p. |
artikel |
93 |
Organic thin film transistors with HfO2 high-k gate dielectric grown by anodic oxidation or deposited by sol–gel
|
Tardy, J. |
|
2007 |
76-77 |
2-3 |
p. 372-377 6 p. |
artikel |
94 |
Performance trends of Si-based RF transistors
|
Schwierz, F. |
|
2007 |
76-77 |
2-3 |
p. 384-390 7 p. |
artikel |
95 |
Physicochemical investigations and nonstandard electrical measurements of inks and thick films—Bibliography
|
Dziedzic, Andrzej |
|
1991 |
76-77 |
2-3 |
p. 537-548 12 p. |
artikel |
96 |
Polytronic 2005
|
Dziedzic, Andrzej |
|
2007 |
76-77 |
2-3 |
p. 327- 1 p. |
artikel |
97 |
Pre-emptive repeat priority repairs and failure of non-failed component during system failure of a complex system
|
Singh, I.P. |
|
1991 |
76-77 |
2-3 |
p. 261-264 4 p. |
artikel |
98 |
Problems of PCB microvias filling by conductive paste
|
Kisiel, Ryszard |
|
2007 |
76-77 |
2-3 |
p. 335-341 7 p. |
artikel |
99 |
4945302 Process and a circuit board for performing tests during burn-in of integrated semi-conductor circuits
|
Janum, ViggoK |
|
1991 |
76-77 |
2-3 |
p. x- 1 p. |
artikel |
100 |
4950498 Process for repairing pattern film
|
Kaito, Takashi |
|
1991 |
76-77 |
2-3 |
p. xi-xii nvt p. |
artikel |
101 |
4914814 Process of fabricating a circuit package
|
Behun, JohnR |
|
1991 |
76-77 |
2-3 |
p. iii- 1 p. |
artikel |
102 |
Regression models for estimating survival of patients with non-Hodgkin's Lymphoma
|
Alidrisi, Mustafa |
|
1991 |
76-77 |
2-3 |
p. 473-480 8 p. |
artikel |
103 |
Reliability analysis of a human operator under several levels of stress
|
Who Kee Chung, |
|
1991 |
76-77 |
2-3 |
p. 367-370 4 p. |
artikel |
104 |
Reliability analysis of a non-identical unit parallel system with common-cause failures
|
Dhillon, B.S. |
|
1991 |
76-77 |
2-3 |
p. 429-441 13 p. |
artikel |
105 |
Reliability analysis of a series repairable system with multiple failures
|
Chung, Who Kee |
|
1991 |
76-77 |
2-3 |
p. 371-373 3 p. |
artikel |
106 |
Reliability analysis of a series system with repair
|
Who Kee Chung, |
|
1991 |
76-77 |
2-3 |
p. 363-365 3 p. |
artikel |
107 |
Reliability analysis of a system with a human operator and subject to two failure modes
|
Kumar, Ashok |
|
1991 |
76-77 |
2-3 |
p. 277-283 7 p. |
artikel |
108 |
Reliability assessment of computer systems design
|
Bastos Martini, M.R. |
|
1991 |
76-77 |
2-3 |
p. 237-244 8 p. |
artikel |
109 |
Reliability assessment of the metallized film capacitors from degradation data
|
Zhao, Jianyin |
|
2007 |
76-77 |
2-3 |
p. 434-436 3 p. |
artikel |
110 |
Reliability measures for fail safe computer-based systems
|
Zhou, Zhibang |
|
1991 |
76-77 |
2-3 |
p. 401-406 6 p. |
artikel |
111 |
Reliability model of cold standby systems with built-in-test
|
Shao, Jiajun |
|
1991 |
76-77 |
2-3 |
p. 443-451 9 p. |
artikel |
112 |
Reliability of SnPb and Pb-free flip–chips under different test conditions
|
Spraul, M. |
|
2007 |
76-77 |
2-3 |
p. 252-258 7 p. |
artikel |
113 |
Reliability study of ultrathin oxide films subject to irradiation-then-stress treatment using conductive atomic force microscopy
|
Wu, You-Lin |
|
2007 |
76-77 |
2-3 |
p. 419-421 3 p. |
artikel |
114 |
Repair body cost minimization with unreliable Markovian restoration
|
Martynenko, Oleg |
|
1991 |
76-77 |
2-3 |
p. 343-349 7 p. |
artikel |
115 |
4951122 Resin-encapsulated semiconductor device
|
Tsubosaki, Kunihiro |
|
1991 |
76-77 |
2-3 |
p. xii- 1 p. |
artikel |
116 |
Revised test that a distribution is new better than used
|
Green, Jack R. |
|
1991 |
76-77 |
2-3 |
p. 521-524 4 p. |
artikel |
117 |
4908226 Selective area nucleation and growth method for metal chemical vapor deposition using focused ion beams
|
Kubena, Randall |
|
1991 |
76-77 |
2-3 |
p. i-ii nvt p. |
artikel |
118 |
4908690 Semiconductor integrated circuit device with high reliability wiring layers
|
Hata, Masayuk |
|
1991 |
76-77 |
2-3 |
p. ii- 1 p. |
artikel |
119 |
4910735 Semiconductor integrated circuit with self-testing
|
Yamashita, Koichi |
|
1991 |
76-77 |
2-3 |
p. ii- 1 p. |
artikel |
120 |
4951253 Semiconductor memory system
|
Sahara, Hirosh |
|
1991 |
76-77 |
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4929081 System for detecting defects in a regularly arranged pattern such as an integrated circuit or the like
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Yamamoto, Yoko |
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1991 |
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4922134 Testable redundancy decoder of an integrated semiconductor memory
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Hoffmann, Kurt |
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76-77 |
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Chall, Louis |
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1991 |
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126 |
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Pfaff, WayneK |
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76-77 |
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The Sherif-Dear simple (SDS) Theorem in number theory
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Three-server bulk service queue with service interruptions and exponential repairs
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