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101 results found

no	title	author	magazine	year	volume	issue	page(s)	type
1	A comparative glossary of semiconductor devices			1968	7	2	p. 163- 1 p.	article
2	Advances in the thick-film compositions	Hille-Dahl, W.A.		1968	7	2	p. 113-116 4 p.	article
3	A high-performance lateral geometry transistor for complementary integrated circuits			1968	7	2	p. 172- 1 p.	article
4	Alumina substrates for thick-film circuits	Waterfield, B.C.		1968	7	2	p. 117-119 3 p.	article
5	A new thermocompression bonder			1968	7	2	p. 170-171 2 p.	article
6	An integrated 4GHz balanced transistor amplifier			1968	7	2	p. 171- 1 p.	article
7	Anisotropy in layers of anodic oxides of tantalum and titanium			1968	7	2	p. 167- 1 p.	article
8	Anisotropy of hot electrons in high resistivity silicon—Preliminary results			1968	7	2	p. 166- 1 p.	article
9	Application of quantum defect techniques to photoionization of impurities in semiconductors			1968	7	2	p. 160- 1 p.	article
10	A practical tantalum thin-film single-sideband demodulator using RC time-varying and active networks			1968	7	2	p. 171-172 2 p.	article
11	Aspects of using infrared for electronic circuit diagnosis			1968	7	2	p. 161-162 2 p.	article
12	A survey of epitaxial growth processes and equipment			1968	7	2	p. 166- 1 p.	article
13	A thin-film facility for electrical engineering research			1968	7	2	p. 168- 1 p.	article
14	Automatic control and monitoring system for thin-film deposition			1968	7	2	p. 169- 1 p.	article
15	Automation of micromodule circuit fabrication and testing			1968	7	2	p. 166- 1 p.	article
16	A variable-ratio frequency divider using micrologic elements			1968	7	2	p. 172- 1 p.	article
17	Batch packaging speeds system assemblies of ICs			1968	7	2	p. 170- 1 p.	article
18	Comparison of screen-printed with vacuum-deposited film resistors under thermal cycling environment	Mead, M.R.		1968	7	2	p. 145-146 2 p.	article
19	Computer-aided design for integrated circuits			1968	7	2	p. 172- 1 p.	article
20	Computer control of the manufacture of electron beam processed microelectronic modules			1968	7	2	p. 173- 1 p.	article
21	Concerning the nature and the characteristics of thin dielectric layers prepared by the anodic oxidisation of titanium, tantalum and niobium			1968	7	2	p. 167- 1 p.	article
22	Control factors in the manufacture of thick-film circuits	Russell, R.F.		1968	7	2	p. 121-122 2 p.	article
23	Dependence of hole velocity upon electric field and hole density for p-type silicon			1968	7	2	p. 167- 1 p.	article
24	Deposition of ferrite films by sputtering in a glow discharge			1968	7	2	p. 168- 1 p.	article
25	Deposition of silicon dioxide films by the reaction of SiCl4 or SiHCl3 with water vapour			1968	7	2	p. 169- 1 p.	article
26	Design and control of a high precision electron beam machine			1968	7	2	p. 173- 1 p.	article
27	Design for maintainability with particular reference to domestic radio and television receivers			1968	7	2	p. 161- 1 p.	article
28	Destructive reverse breakdown in large area phosphorus diffused high voltage silicon n+p junctions			1968	7	2	p. 160- 1 p.	article
29	Detecting metal particles in semiconductor device housings			1968	7	2	p. 160- 1 p.	article
30	Developing the quality assurance requirements for a custom thin-film circuit program			1968	7	2	p. 162- 1 p.	article
31	Diborane for boron diffusion into silicon			1968	7	2	p. 165- 1 p.	article
32	Dielectrically isolated silicon with a sharp impurity gradient			1968	7	2	p. 165- 1 p.	article
33	Dynamic mechanism reliability by Monte Carlo methods			1968	7	2	p. 161- 1 p.	article
34	Effective mass and intrinsic concentration in silicon			1968	7	2	p. 166- 1 p.	article
35	Effect of diffused oxygen and gold on surface properties of oxidized silicon			1968	7	2	p. 164-165 2 p.	article
36	Effects of ionizing radiation on oxidized silicon surfaces and planar devices			1968	7	2	p. 165- 1 p.	article
37	Electrical contacts: research and reliability			1968	7	2	p. 159- 1 p.	article
38	Electron beam heating of a thin film on a highly conducting substrate			1968	7	2	p. 173- 1 p.	article
39	Electron beam induced potential contrast on unbiased planar transistors			1968	7	2	p. 173- 1 p.	article
40	Electron beam welding in the manufacture of electronic components			1968	7	2	p. 174- 1 p.	article
41	Estimation of temperature rise in electron beam heating of thin films			1968	7	2	p. 174- 1 p.	article
42	Evaporated silicon thin-film transistors			1968	7	2	p. 169-170 2 p.	article
43	First unofficial thick-film symposium			1968	7	2	p. 111- 1 p.	article
44	IC trends in the U.S.A.			1968	7	2	p. 162- 1 p.	article
45	Infrared evaluation of microweld quality			1968	7	2	p. 159- 1 p.	article
46	Integrated circuit design analysis by digital computer			1968	7	2	p. 171- 1 p.	article
47	Integrated circuit reliability			1968	7	2	p. 161- 1 p.	article
48	Integrated-circuit reliability: myth or fact?			1968	7	2	p. 162- 1 p.	article
49	Integrated electronics—II. Design ingenuity is the key to success			1968	7	2	p. 163- 1 p.	article
50	Integrated electronics—III. Hybrid technology wins a foothold			1968	7	2	p. 163- 1 p.	article
51	Integrated electronics—II. Power grab by linear ICs			1968	7	2	p. 164- 1 p.	article
52	Integrated electronics—I. Linear ICs: Part 2. Heart of the matter			1968	7	2	p. 164- 1 p.	article
53	Integrated electronics—I. Scrambling for linear IC business			1968	7	2	p. 163- 1 p.	article
54	Integrated electronics: Microwave IC's come of age			1968	7	2	p. 163-164 2 p.	article
55	Interconnection and packaging of microelectronics			1968	7	2	p. 171- 1 p.	article
56	Interconnexions for semiconductor integrated circuits used in digital systems	Bingham, K.C.		1968	7	2	p. 155-156 2 p.	article
57	Ion implantation as a production technique			1968	7	2	p. 173-174 2 p.	article
58	Large-scale integration: A complex array of problems			1968	7	2	p. 163- 1 p.	article
59	Laser beams and integrated circuits			1968	7	2	p. 163- 1 p.	article
60	Low energy sputtering of resistive films			1968	7	2	p. 170- 1 p.	article
61	LSI—Today and tomorrow			1968	7	2	p. 163- 1 p.	article
62	Major causes of equipment unreliability			1968	7	2	p. 161- 1 p.	article
63	Making microcircuits			1968	7	2	p. 163- 1 p.	article
64	Measurement of diffusion-induced strains at metal bond interfaces			1968	7	2	p. 166- 1 p.	article
65	Measurement of film thickness			1968	7	2	p. 168- 1 p.	article
66	Measurement of the microwave properties of substrate-supported semiconducting films			1968	7	2	p. 168- 1 p.	article
67	Memory on a chip: a step toward large-scale integration			1968	7	2	p. 172- 1 p.	article
68	Microscopy for semiconductors			1968	7	2	p. 162- 1 p.	article
69	Monolithic IC techniques produce first all-silicon X-band switch			1968	7	2	p. 172- 1 p.	article
70	MOS transistors integrated circuits			1968	7	2	p. 165-166 2 p.	article
71	Plated through holes: a reliability assessment			1968	7	2	p. 159-160 2 p.	article
72	Preparation of GaAs surfaces for epitaxial deposition			1968	7	2	p. 166- 1 p.	article
73	Printing variables and their effects on thick films	Finch, R.G.		1968	7	2	p. 127-130 4 p.	article
74	Quality failure cost analysis			1968	7	2	p. 162- 1 p.	article
75	RC active filters realized with operational integrated amplifiers			1968	7	2	p. 172- 1 p.	article
76	Reliability and drift behavior of resistors (Part 3)			1968	7	2	p. 159- 1 p.	article
77	Reliability and stability of miniature polystyrene capacitors			1968	7	2	p. 159- 1 p.	article
78	Reliability of a domestic wireless receiver			1968	7	2	p. 162- 1 p.	article
79	Screen printed capacitor dielectrics	Hoffman, L.C.		1968	7	2	p. 131-134 4 p.	article
80	Second-breakdown tests for germanium-transistor reliability			1968	7	2	p. 159- 1 p.	article
81	Semiconductor films			1968	7	2	p. 169- 1 p.	article
82	Silicon diode breakdown in the transition range between avalanche effect and field emission			1968	7	2	p. 160- 1 p.	article
83	Single crystal InSb thin films by electron beam re-crystallization			1968	7	2	p. 174- 1 p.	article
84	Slip and bowing control by advanced etching techniques			1968	7	2	p. 164- 1 p.	article
85	Some practical considerations in the fabrication of printed glaze resistors and circuits			1968	7	2	p. 169- 1 p.	article
86	Structural and electrical properties of electron beam zone recrystallized indium antimonide thin films			1968	7	2	p. 173- 1 p.	article
87	The electron beam fabrication of small geometry transistors			1968	7	2	p. 174- 1 p.	article
88	The electron beam scanlaser: Theoretical and operational studies			1968	7	2	p. 174- 1 p.	article
89	The interconnexion challenge			1968	7	2	p. 163- 1 p.	article
90	The measurement of protective film thickness on silicon wafers by reflectance spectrophotometry			1968	7	2	p. 167- 1 p.	article
91	The preparation and application of tantalum thin-film passive components			1968	7	2	p. 170- 1 p.	article
92	The Si-SiO2 interface—Electrical properties as determined by the metal-insulator-silicon-conductance technique			1968	7	2	p. 164- 1 p.	article
93	The structure and sintering of polycrystalline evaporated metal films			1968	7	2	p. 168- 1 p.	article
94	The study of surface properties of thin Ge films using a piezoelectric mass detector			1968	7	2	p. 168- 1 p.	article
95	The substitution of semiconductor circuits for inductances			1968	7	2	p. 164- 1 p.	article
96	Thin-film magnetoresistive devices			1968	7	2	p. 168-169 2 p.	article
97	Two statistical evaluation criteria for predicting performance of microelectronic circuits			1968	7	2	p. 171- 1 p.	article
98	Variables affecting uniformity in the screen process printing of printed and fired-on films and the development of a squeegee design for improving uniformity	Hughes Jr., Daniel C.		1968	7	2	p. 137-143 7 p.	article
99	Welding electronic devices by ultrasonics			1968	7	2	p. 171- 1 p.	article
100	Zener and avalanche breakdown in silicon alloyed p−n junctions—I. Analysis of reverse characteristics			1968	7	2	p. 160- 1 p.	article
101	Zener and avalanche breakdown in silicon alloyed p−n junctions—II. Effect of temperature on the reverse characteristics and criteria for distinguishing between the two breakdown mechanisms			1968	7	2	p. 161- 1 p.	article

101 results found

Koninklijke Bibliotheek - National Library of the Netherlands