| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Analysis of electrical parameters of InGaN-based LED packages with aging
|
Jayawardena, Asiri
|
|
2016
|
66 |
C |
p. 22-31
10 p.
|
artikel
|
| 2 |
Analytical parameter extraction for NBTI reaction diffusion and trapping/detrapping models
|
Wang, YanLing
|
|
2016
|
66 |
C |
p. 10-15
6 p.
|
artikel
|
| 3 |
Characteristics of ESD protection devices operated under elevated temperatures
|
Liang, Wei
|
|
2016
|
66 |
C |
p. 46-51
6 p.
|
artikel
|
| 4 |
Correlation of carbon doping variations with the vertical breakdown of GaN-on-Si for power electronics
|
Knetzger, Michael
|
|
2016
|
66 |
C |
p. 16-21
6 p.
|
artikel
|
| 5 |
Developing a Simplified Analytical Thermal Model of Multi-chip Power Module
|
Bouguezzi, Sihem
|
|
2016
|
66 |
C |
p. 64-77
14 p.
|
artikel
|
| 6 |
Dielectric charging induced drift in micro device reliability-a review
|
Zhou, Wu
|
|
2016
|
66 |
C |
p. 1-9
9 p.
|
artikel
|
| 7 |
Editorial Board
|
|
|
2016
|
66 |
C |
p. IFC-
1 p.
|
artikel
|
| 8 |
Effect of thermocapillary action in the underfill encapsulation of multi-stack ball grid array
|
Ng, Fei Chong
|
|
2016
|
66 |
C |
p. 143-160
18 p.
|
artikel
|
| 9 |
Evaluation and modeling of adhesion layer in shock-protection structure for MEMS accelerometer
|
Yamane, Daisuke
|
|
2016
|
66 |
C |
p. 78-84
7 p.
|
artikel
|
| 10 |
Free convective heat transfer coefficient for high powered and tilted QFN64 electronic device
|
Baïri, A.
|
|
2016
|
66 |
C |
p. 85-91
7 p.
|
artikel
|
| 11 |
High cycle fatigue behaviour and generalized fatigue model development of lead-free solder alloy based on local stress approach
|
Thambi, J.
|
|
2016
|
66 |
C |
p. 98-105
8 p.
|
artikel
|
| 12 |
Ku band damage characteristics of GaAs pHEMT induced by a front-door coupling microwave pulse
|
Liu, Yang
|
|
2016
|
66 |
C |
p. 32-37
6 p.
|
artikel
|
| 13 |
Measurement of underfill interfacial and bulk fracture toughness in flip-chip packages
|
Swaminathan, Shrikant
|
|
2016
|
66 |
C |
p. 161-172
12 p.
|
artikel
|
| 14 |
Mechanical behavior and fatigue life estimation on fretting wear for micro-rectangular electrical connector
|
Huang, Bo
|
|
2016
|
66 |
C |
p. 106-112
7 p.
|
artikel
|
| 15 |
Microstructure and reliability of hybrid interconnects by Au stud bump with Sn-0.7Cu solder for flip chip power device packaging
|
Ji, Hongjun
|
|
2016
|
66 |
C |
p. 134-142
9 p.
|
artikel
|
| 16 |
New fast turn-on speed SCR device for electrostatic discharge protection
|
Liao, Changjun
|
|
2016
|
66 |
C |
p. 38-45
8 p.
|
artikel
|
| 17 |
Risk assessment of the crack propagation and delamination of the Cu-to-Cu direct bonded (CuDB) interface
|
Park, Ah-Young
|
|
2016
|
66 |
C |
p. 113-121
9 p.
|
artikel
|
| 18 |
Solder fatigue failures in a new designed power module under Power Cycling
|
Durand, C.
|
|
2016
|
66 |
C |
p. 122-133
12 p.
|
artikel
|
| 19 |
The coupled effects of salt-spray corrosion, electrical current and mechanical load on the electrical and fatigue properties of COG assembly
|
Li, Fan
|
|
2016
|
66 |
C |
p. 92-97
6 p.
|
artikel
|
| 20 |
The effect of electro-thermal parameters on IGBT junction temperature with the aging of module
|
Li, Lingling
|
|
2016
|
66 |
C |
p. 58-63
6 p.
|
artikel
|
| 21 |
Towards an efficient SEU effects emulation on SRAM-based FPGAs
|
Souari, Anis
|
|
2016
|
66 |
C |
p. 173-182
10 p.
|
artikel
|
| 22 |
Transient dual interface measurement of junction-to-case thermal resistance in AlGaN/GaN HEMT utilizing an improved infrared microscope
|
Zhai, Yuwei
|
|
2016
|
66 |
C |
p. 52-57
6 p.
|
artikel
|
Tijdschrift beschrijving