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                             21 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 Degradation of high power single emitter laser modules using nanosilver paste in continuous pulse conditions Yan, Haidong
2015
55 12PA p. 2532-2541
10 p.
artikel
2 Dependence of overcurrent failure modes of IGBT modules on interconnect technologies Yaqub, Imran
2015
55 12PA p. 2596-2605
10 p.
artikel
3 Design and process related MIM cap reliability improvement Parke, Justin
2015
55 12PA p. 2516-2521
6 p.
artikel
4 Editorial Ersland, Peter
2015
55 12PA p. 2483-
1 p.
artikel
5 Editorial Board 2015
55 12PA p. IFC-
1 p.
artikel
6 Electrical characteristics and reliability performance of IGBT power device packaging by chip embedding technology Chang, Tao-Chih
2015
55 12PA p. 2582-2588
7 p.
artikel
7 Electromigration behavior in Cu/Ni–P/Sn–Cu based joint system with low current density Kadoguchi, Takuya
2015
55 12PA p. 2554-2559
6 p.
artikel
8 Fast atom bombardment onto vertically aligned multi-walled carbon nanotube bumps to achieve low interconnect resistance with Au layer Fujino, Masahisa
2015
55 12PA p. 2560-2564
5 p.
artikel
9 Impression creep behavior of Zn–4Al–3Mg–xSn high-temperature lead-free solders Mahmudi, R.
2015
55 12PA p. 2542-2548
7 p.
artikel
10 Improved surface morphology of a Ti/Al/Ni/Au ohmic contact for AlGaN/GaN heterostructure by Al2O3 particles Lim, Jin Hong
2015
55 12PA p. 2565-2568
4 p.
artikel
11 Mechanical design and analysis of direct-plated-copper aluminum nitride substrates for enhancing thermal reliability Tsai, M.Y.
2015
55 12PA p. 2589-2595
7 p.
artikel
12 Operating channel temperature in GaN HEMTs: DC versus RF accelerated life testing Pomeroy, J.W.
2015
55 12PA p. 2505-2510
6 p.
artikel
13 Power electronics packaging Suganuma, Katsuaki
2015
55 12PA p. 2523-
1 p.
artikel
14 Preparation and thermal properties of the graphene–polyolefin adhesive composites: Application in thermal interface materials Cui, Tengfei
2015
55 12PA p. 2569-2574
6 p.
artikel
15 Scaling DC lifetests on GaN HEMT to RF conditions Paine, Bruce M.
2015
55 12PA p. 2499-2504
6 p.
artikel
16 Setting stress conditions that qualify application expectations Roesch, William J.
2015
55 12PA p. 2484-2492
9 p.
artikel
17 Study of Al−Cu compounds as soldering bond pad for high-power device packaging Liu, Wei Chih
2015
55 12PA p. 2549-2553
5 p.
artikel
18 Study of hot electrons in AlGaN/GaN HEMTs under RF Class B and Class J operation using electroluminescence Brazzini, Tommaso
2015
55 12PA p. 2493-2498
6 p.
artikel
19 Study on high temperature bonding reliability of sintered nano-silver joint on bare copper plate Zhao, Su-Yan
2015
55 12PA p. 2524-2531
8 p.
artikel
20 Temperature, humidity, and bias acceleration model for a GaAs pHEMT process Drandova, Gergana I.
2015
55 12PA p. 2511-2515
5 p.
artikel
21 Thermal characterization system for transient thermal impedance measurement and power cycling of IGBT modules Zheng, Hanguang
2015
55 12PA p. 2575-2581
7 p.
artikel
                             21 gevonden resultaten
 
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