| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
A dynamic synchronization method to realize soft defect localization applied on digital and mixed-mode analog ICs in failure analysis
|
Wu, Chunlei
|
|
2014
|
54 |
5 |
p. 993-999
7 p.
|
article
|
| 2 |
A fast, flexible, and easy-to-develop FPGA-based fault injection technique
|
Ebrahimi, Mojtaba
|
|
2014
|
54 |
5 |
p. 1000-1008
9 p.
|
article
|
| 3 |
Algorithm transformation methods to reduce the overhead of software-based fault tolerance techniques
|
Azambuja, José Rodrigo
|
|
2014
|
54 |
5 |
p. 1050-1055
6 p.
|
article
|
| 4 |
A novel hetero-junction Tunnel-FET using Semiconducting silicide–Silicon contact and its scalability
|
Wu, Yan
|
|
2014
|
54 |
5 |
p. 899-904
6 p.
|
article
|
| 5 |
A study of ageing effect at elevated temperature of flexible silicon diodes integrated using conductive adhesives
|
Heath, Cory D.
|
|
2014
|
54 |
5 |
p. 956-959
4 p.
|
article
|
| 6 |
BIST architecture for oscillation test of analog ICs and investigation of test hardware influence
|
Arbet, D.
|
|
2014
|
54 |
5 |
p. 985-992
8 p.
|
article
|
| 7 |
CEDAR: Modeling impact of component error derating and read frequency on system-level vulnerability in high-performance processors
|
Asadi, Hossein
|
|
2014
|
54 |
5 |
p. 1009-1021
13 p.
|
article
|
| 8 |
Characterization of MIS structures and PTFTs using TiOx deposited by spin-coating
|
Meneses, C.
|
|
2014
|
54 |
5 |
p. 893-898
6 p.
|
article
|
| 9 |
Damage threshold determination and non-destructive identification of possible failure sites in PIN limiter
|
Tan, Cher Ming
|
|
2014
|
54 |
5 |
p. 960-964
5 p.
|
article
|
| 10 |
Effect of gate barrier and channel buffer layer on electric properties and transparence of the a-IGZO thin film transistor
|
Lin, Cheng-I
|
|
2014
|
54 |
5 |
p. 905-910
6 p.
|
article
|
| 11 |
Effect of temperature on the electrophysical properties of Si–polymer composite varistors
|
Ghafouri, M.
|
|
2014
|
54 |
5 |
p. 965-971
7 p.
|
article
|
| 12 |
Effects of the intermetallic compound microstructure on the tensile behavior of Sn3.0Ag0.5Cu/Cu solder joint under various strain rates
|
An, Tong
|
|
2014
|
54 |
5 |
p. 932-938
7 p.
|
article
|
| 13 |
Evaluation of Level of Confidence and Optimization of Roll-back Recovery with Checkpointing for Real-Time Systems
|
Nikolov, Dimitar
|
|
2014
|
54 |
5 |
p. 1022-1049
28 p.
|
article
|
| 14 |
Experimental and numerical approach on junction temperature of high-power LED
|
Liu, Dongjing
|
|
2014
|
54 |
5 |
p. 926-931
6 p.
|
article
|
| 15 |
Experimental evaluation of SnAgCu solder joint reliability in 100-μm pitch flip-chip assemblies
|
Tian, Ye
|
|
2014
|
54 |
5 |
p. 939-944
6 p.
|
article
|
| 16 |
Facile chemical method of etching polyimide films for failure analysis (FA) applications and its etching mechanism studies
|
Liu, Chien-Pan
|
|
2014
|
54 |
5 |
p. 911-920
10 p.
|
article
|
| 17 |
Growth mechanism of intermetallic compounds and damping properties of Sn–Ag–Cu-1wt% nano-ZrO2 composite solders
|
Gain, Asit Kumar
|
|
2014
|
54 |
5 |
p. 945-955
11 p.
|
article
|
| 18 |
High-κ dielectric breakdown in nanoscale logic devices – Scientific insight and technology impact
|
Raghavan, Nagarajan
|
|
2014
|
54 |
5 |
p. 847-860
14 p.
|
article
|
| 19 |
Inside front cover - Editorial board
|
|
|
2014
|
54 |
5 |
p. IFC-
1 p.
|
article
|
| 20 |
Investigation of interface, shallow and deep oxide traps under NBTI stress using charge pumping technique
|
Tahi, Hakim
|
|
2014
|
54 |
5 |
p. 882-888
7 p.
|
article
|
| 21 |
Liquid crystal electrography: Electric field mapping and detection of peak electric field strength in AlGaN/GaN high electron mobility transistors
|
Möreke, Janina
|
|
2014
|
54 |
5 |
p. 921-925
5 p.
|
article
|
| 22 |
Parameter estimation of the electrothermal model of the ferromagnetic core
|
Górecki, Krzysztof
|
|
2014
|
54 |
5 |
p. 978-984
7 p.
|
article
|
| 23 |
Recovery and universality in NBTI
|
Yonamoto, Yoshiki
|
|
2014
|
54 |
5 |
p. 889-892
4 p.
|
article
|
| 24 |
Thermal stress in through-silicon-vias: Theory-of-elasticity approach
|
Suhir, E.
|
|
2014
|
54 |
5 |
p. 972-977
6 p.
|
article
|
| 25 |
Tunnel FET technology: A reliability perspective
|
Datta, Suman
|
|
2014
|
54 |
5 |
p. 861-874
14 p.
|
article
|
| 26 |
Wafer-level hermetic MEMS packaging by anodic bonding and its reliability issues
|
Tanaka, Shuji
|
|
2014
|
54 |
5 |
p. 875-881
7 p.
|
article
|
Journal description