no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
1 |
Adhesion improvement of silicon/underfill/polyimide interfaces by UV/ozone treatment and sol–gel derived hybrid layers
|
Kim, Sanwi |
|
2014 |
54 |
4 |
p. 833-839 7 p. |
article |
2 |
An approach to adjust the board-level drop test conditions to improve the correlation with product-level drop impact
|
Mattila, T.T. |
|
2014 |
54 |
4 |
p. 785-795 11 p. |
article |
3 |
A time error model for time-based PWM pixel with correlated double sample in the circumstance of nonlinear response
|
Xu, Jiangtao |
|
2014 |
54 |
4 |
p. 755-763 9 p. |
article |
4 |
Characterization of interface state density of three-dimensional Si nanostructure by charge pumping measurement
|
Dou, Chunmeng |
|
2014 |
54 |
4 |
p. 725-729 5 p. |
article |
5 |
Determination of energy and spatial distribution of oxide border traps in In0.53Ga0.47As MOS capacitors from capacitance–voltage characteristics measured at various temperatures
|
Dou, Chunmeng |
|
2014 |
54 |
4 |
p. 746-754 9 p. |
article |
6 |
Electromigration challenges for advanced on-chip Cu interconnects
|
Li, Baozhen |
|
2014 |
54 |
4 |
p. 712-724 13 p. |
article |
7 |
Evolution of oxide charge trapping under bias temperature stressing
|
Ang, D.S. |
|
2014 |
54 |
4 |
p. 663-681 19 p. |
article |
8 |
Fatigue and resistance analysis of COG modules using electro-mechanical coupling method
|
Gao, Hong |
|
2014 |
54 |
4 |
p. 816-824 9 p. |
article |
9 |
High performance of CNT-interconnects by the multi-layer structure
|
Chiu, Wei-Chih |
|
2014 |
54 |
4 |
p. 778-784 7 p. |
article |
10 |
2015 IEEE Aerospace Conference
|
|
|
2014 |
54 |
4 |
p. iii- 1 p. |
article |
11 |
Influence of solder bump arrangements on molded IC encapsulation
|
Khor, C.Y. |
|
2014 |
54 |
4 |
p. 796-807 12 p. |
article |
12 |
Inside front cover - Editorial board
|
|
|
2014 |
54 |
4 |
p. IFC- 1 p. |
article |
13 |
Modelling RTN and BTI in nanoscale MOSFETs from device to circuit: A review
|
Gerrer, L. |
|
2014 |
54 |
4 |
p. 682-697 16 p. |
article |
14 |
Numerical analysis of thermo-mechanical and mobility effects for 28nm node and beyond: Comparison and design consequences over bumping technologies
|
Fiori, Vincent |
|
2014 |
54 |
4 |
p. 764-772 9 p. |
article |
15 |
Particle on Bump (POB) technique for ultra-fine pitch chip on glass (COG) applications by conductive particles and adhesives
|
Jia, Lei |
|
2014 |
54 |
4 |
p. 825-832 8 p. |
article |
16 |
Reliability of washable wearable screen printed UHF RFID tags
|
Virkki, J. |
|
2014 |
54 |
4 |
p. 840-846 7 p. |
article |
17 |
SET and noise fault tolerant circuit design techniques: Application to 7nm FinFET
|
Calomarde, A. |
|
2014 |
54 |
4 |
p. 738-745 8 p. |
article |
18 |
Single-trap-induced random telegraph noise for FinFET, Si/Ge Nanowire FET, Tunnel FET, SRAM and logic circuits
|
Fan, Ming-Long |
|
2014 |
54 |
4 |
p. 698-711 14 p. |
article |
19 |
Total ionizing dose effect in 0.2μm PDSOI NMOSFETs with shallow trench isolation
|
Peng, Chao |
|
2014 |
54 |
4 |
p. 730-737 8 p. |
article |
20 |
Using active thermography for defects inspection of flip chip
|
Xu, Zhensong |
|
2014 |
54 |
4 |
p. 808-815 8 p. |
article |
21 |
Void control during plating process and thermal annealing of through-mask electroplated copper interconnects
|
Zhu, Chunsheng |
|
2014 |
54 |
4 |
p. 773-777 5 p. |
article |