| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
Accelerated assessment of fine-grain AVF in NoC using a Multi-Cell Upsets considered fault injection
|
Jiao, Jiajia
|
|
2014
|
54 |
11 |
p. 2629-2640
12 p.
|
article
|
| 2 |
Adaptive static and dynamic noise margin improvement in minimum-sized 6T-SRAM cells
|
Alorda, Bartomeu
|
|
2014
|
54 |
11 |
p. 2613-2620
8 p.
|
article
|
| 3 |
Aging characteristics of ZnO–PrO1.83-based semiconducting varistors for surge protection reliability
|
Nahm, Choon-W.
|
|
2014
|
54 |
11 |
p. 2417-2422
6 p.
|
article
|
| 4 |
Analysis of Cu-wire pull and shear test failure modes under ageing cycles and finite element modelling of Si-crack propagation
|
Mazzei, S.
|
|
2014
|
54 |
11 |
p. 2501-2512
12 p.
|
article
|
| 5 |
A physical model and analysis for whisker growth caused by chemical intermetallic reaction
|
Qiang, Lei
|
|
2014
|
54 |
11 |
p. 2494-2500
7 p.
|
article
|
| 6 |
A study on IGBT junction temperature (Tj) online estimation using gate-emitter voltage (Vge) at turn-off
|
Sundaramoorthy, V.K.
|
|
2014
|
54 |
11 |
p. 2423-2431
9 p.
|
article
|
| 7 |
A study on the electrical characteristics of InGaZnO thin-film transistor with HfLaO gate dielectric annealed in different gases
|
Qian, L.X.
|
|
2014
|
54 |
11 |
p. 2396-2400
5 p.
|
article
|
| 8 |
Bimodal and monomodal diamond particle effect on the thermal properties of diamond-particle-dispersed Al–matrix composite fabricated by SPS
|
Mizuuchi, Kiyoshi
|
|
2014
|
54 |
11 |
p. 2463-2470
8 p.
|
article
|
| 9 |
Charge-trapping characteristics of BaTiO3 with and without nitridation for nonvolatile memory applications
|
Huang, X.D.
|
|
2014
|
54 |
11 |
p. 2388-2391
4 p.
|
article
|
| 10 |
Circuit simulation of workload-dependent RTN and BTI based on trap kinetics
|
Camargo, V.V.A.
|
|
2014
|
54 |
11 |
p. 2364-2370
7 p.
|
article
|
| 11 |
Comparison of WTi and WTi(N) as diffusion barriers for Al and Cu metallization on Si with respect to thermal stability and diffusion behavior of Ti
|
Fugger, M.
|
|
2014
|
54 |
11 |
p. 2487-2493
7 p.
|
article
|
| 12 |
Defect and microstructural evolution in thermally cycled Cu through-silicon vias
|
Marro, James
|
|
2014
|
54 |
11 |
p. 2586-2593
8 p.
|
article
|
| 13 |
Delay and crosstalk reliability issues in mixed MWCNT bundle interconnects
|
Majumder, Manoj Kumar
|
|
2014
|
54 |
11 |
p. 2570-2577
8 p.
|
article
|
| 14 |
Design of vertical fin arrays with heat pipes used for high-power light-emitting diodes
|
Ye, Huaiyu
|
|
2014
|
54 |
11 |
p. 2448-2455
8 p.
|
article
|
| 15 |
Effect of trace platinum additions on the interfacial morphology of Sn–3.8Ag–0.7Cu alloy aged for long hours
|
Wong, Karen M.C.
|
|
2014
|
54 |
11 |
p. 2536-2541
6 p.
|
article
|
| 16 |
Electrical Overstress of Integrated Circuits
|
Kaschani, K.T.
|
|
2014
|
54 |
11 |
p. 2410-2416
7 p.
|
article
|
| 17 |
Evaluating the radiation sensitivity of GPGPU caches: New algorithms and experimental results
|
Sabena, D.
|
|
2014
|
54 |
11 |
p. 2621-2628
8 p.
|
article
|
| 18 |
Fabrication and advanced electrical and stability characterization of laser-shaped thick-film and LTCC microresistors for high temperature applications
|
Nowak, Damian
|
|
2014
|
54 |
11 |
p. 2641-2644
4 p.
|
article
|
| 19 |
Inside front cover - Editorial board
|
|
|
2014
|
54 |
11 |
p. IFC-
1 p.
|
article
|
| 20 |
Investigation of Bulk and DTMOS triple-gate devices under 60 MeV proton irradiation
|
Andrade, Maria Glória Caño de
|
|
2014
|
54 |
11 |
p. 2349-2354
6 p.
|
article
|
| 21 |
Investigation of electromigration reliability of redistribution lines in wafer-level chip-scale packages
|
Kao, Chin-Li
|
|
2014
|
54 |
11 |
p. 2471-2478
8 p.
|
article
|
| 22 |
Investigation on thermal fatigue of SnAgCu, Sn100C, and SnPbAg solder joints in varying temperature environments
|
Johansson, Jonas
|
|
2014
|
54 |
11 |
p. 2523-2535
13 p.
|
article
|
| 23 |
Long-term NBTI degradation under real-use conditions in IBM microprocessors
|
Lu, Pong-Fei
|
|
2014
|
54 |
11 |
p. 2371-2377
7 p.
|
article
|
| 24 |
Maximum entropy fracture model and its use for predicting cyclic hysteresis in Sn3.8Ag0.7Cu and Sn3.0Ag0.5 solder alloys
|
Tucker, J.P.
|
|
2014
|
54 |
11 |
p. 2513-2522
10 p.
|
article
|
| 25 |
Mechanism of anomalous recovery in advanced SiGe bipolar transistors after low dose rate irradiation for very high total doses
|
Pershenkov, V.S.
|
|
2014
|
54 |
11 |
p. 2360-2363
4 p.
|
article
|
| 26 |
Microstructure, electric flame-off (EFO) characteristics and tensile properties of silver–lanthanum alloy wire
|
Hsueh, Hao-Wen
|
|
2014
|
54 |
11 |
p. 2564-2569
6 p.
|
article
|
| 27 |
New insight on negative bias temperature instability degradation with drain bias of 28nm High-K Metal Gate p-MOSFET devices
|
Liao, Miao
|
|
2014
|
54 |
11 |
p. 2378-2382
5 p.
|
article
|
| 28 |
Off-state breakdown and leakage current transport analysis of AlGaN/GaN high electron mobility transistors
|
Xu, Weizong
|
|
2014
|
54 |
11 |
p. 2406-2409
4 p.
|
article
|
| 29 |
Optimized parallel decoding of difference set codes for high speed memories
|
Demirci, Mustafa
|
|
2014
|
54 |
11 |
p. 2645-2648
4 p.
|
article
|
| 30 |
Reliability and optical properties of LED lens plates under high temperature stress
|
Yazdan Mehr, M.
|
|
2014
|
54 |
11 |
p. 2440-2447
8 p.
|
article
|
| 31 |
Robust FinFET SRAM design based on dynamic back-gate voltage adjustment
|
Ebrahimi, Behzad
|
|
2014
|
54 |
11 |
p. 2604-2612
9 p.
|
article
|
| 32 |
Study of a dipping method for flip-chip flux coating
|
Wei, Zhang
|
|
2014
|
54 |
11 |
p. 2479-2486
8 p.
|
article
|
| 33 |
Study of bending reliability and electrical properties of platinum lines on flexible polyimide substrates
|
Molina-Lopez, F.
|
|
2014
|
54 |
11 |
p. 2542-2549
8 p.
|
article
|
| 34 |
Study of free air ball formation in Ag–8Au–3Pd alloy wire bonding
|
Guo, Rui
|
|
2014
|
54 |
11 |
p. 2550-2554
5 p.
|
article
|
| 35 |
Texture of electrodeposited tin layers and its influence on their corrosion behavior
|
Eckold, P.
|
|
2014
|
54 |
11 |
p. 2578-2585
8 p.
|
article
|
| 36 |
Three-step concept (TSC) in modeling microelectronics reliability (MR): Boltzmann–Arrhenius–Zhurkov (BAZ) probabilistic physics-of-failure equation sandwiched between two statistical models
|
Suhir, E.
|
|
2014
|
54 |
11 |
p. 2594-2603
10 p.
|
article
|
| 37 |
Threshold voltage instability of nanoscale charge trapping non-volatile memory at steady phase
|
Lee, Meng Chuan
|
|
2014
|
54 |
11 |
p. 2392-2395
4 p.
|
article
|
| 38 |
Total-ionizing-dose effects and reliability of carbon nanotube FET devices
|
Zhang, Cher Xuan
|
|
2014
|
54 |
11 |
p. 2355-2359
5 p.
|
article
|
| 39 |
Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters
|
Lim, Adeline B.Y.
|
|
2014
|
54 |
11 |
p. 2555-2563
9 p.
|
article
|
| 40 |
Universal mechanisms of Al metallization ageing in power MOSFET devices
|
Martineau, Donatien
|
|
2014
|
54 |
11 |
p. 2432-2439
8 p.
|
article
|
| 41 |
Voltage dependent degradation of HfSiON/SiO2 nMOSFETs under positive bias temperature instability
|
Kim, Cheolgyu
|
|
2014
|
54 |
11 |
p. 2383-2387
5 p.
|
article
|
| 42 |
Water absorption characterisation, electrical reliability and mechanical testing of a submerged laminated a-Si thin film photovoltaic (PV) cells
|
Trapani, Kim
|
|
2014
|
54 |
11 |
p. 2456-2462
7 p.
|
article
|
| 43 |
ZrO2 insulator modified by a thin Al2O3 film to enhance the performance of InGaZnO thin-film transistor
|
Ding, Xingwei
|
|
2014
|
54 |
11 |
p. 2401-2405
5 p.
|
article
|
Journal description