| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Compliance analysis of multi-path fan-shaped interconnects
|
Chen, Wei
|
|
2013
|
53 |
7 |
p. 964-974
11 p.
|
artikel
|
| 2 |
Could electronics reliability be predicted, quantified and assured?
|
Suhir, Ephraim
|
|
2013
|
53 |
7 |
p. 925-936
12 p.
|
artikel
|
| 3 |
DSP based fuzzy and conventional overcurrent relay controller comparisons
|
Goh, Yin Lee
|
|
2013
|
53 |
7 |
p. 1029-1035
7 p.
|
artikel
|
| 4 |
Dynamic voltage and frequency scaling algorithm for fault-tolerant real-time systems
|
Djosic, Sandra
|
|
2013
|
53 |
7 |
p. 1036-1042
7 p.
|
artikel
|
| 5 |
Efficient multi-level modeling technique for determining effective board drop reliability of PCB assembly
|
Yang, Fan
|
|
2013
|
53 |
7 |
p. 975-984
10 p.
|
artikel
|
| 6 |
Fracture analysis on die attach adhesives for stacked packages based on in-situ testing and cohesive zone model
|
Ren, Huai-Hui
|
|
2013
|
53 |
7 |
p. 1021-1028
8 p.
|
artikel
|
| 7 |
Hot hole-induced device degradation by drain junction reverse current
|
Kim, K.S.
|
|
2013
|
53 |
7 |
p. 947-951
5 p.
|
artikel
|
| 8 |
Influence of copper diffusion on the shape of whiskers grown on bright tin layers
|
Horváth, Barbara
|
|
2013
|
53 |
7 |
p. 1009-1020
12 p.
|
artikel
|
| 9 |
Inside front cover - Editorial board
|
|
|
2013
|
53 |
7 |
p. IFC-
1 p.
|
artikel
|
| 10 |
Novel ESD protection solution for single-ended mixer in GaAs pHEMT technology
|
Cui, Qiang
|
|
2013
|
53 |
7 |
p. 952-955
4 p.
|
artikel
|
| 11 |
Refined NBTI characterization of arbitrarily stressed PMOS devices at ultra-low and unique temperatures
|
Aichinger, Thomas
|
|
2013
|
53 |
7 |
p. 937-946
10 p.
|
artikel
|
| 12 |
Reliability of a stretchable interconnect utilizing terminated, in-plane meandered copper conductor
|
Jablonski, M.
|
|
2013
|
53 |
7 |
p. 956-963
8 p.
|
artikel
|
| 13 |
Role of impact ultrasound on bond strength and Al pad splash in Cu wire bonding
|
Rezvani, A.
|
|
2013
|
53 |
7 |
p. 1002-1008
7 p.
|
artikel
|
| 14 |
Thermodynamic study on the corrosion mechanism of copper wire bonding
|
Zeng, Yingzhi
|
|
2013
|
53 |
7 |
p. 985-1001
17 p.
|
artikel
|
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