| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
ACF-COG interconnection conductivity inspection system using conductive area
|
Sheng, Xinjun
|
|
2013
|
53 |
4 |
p. 622-628
7 p.
|
artikel
|
| 2 |
A highly reliable NBTI Resilient 6T SRAM cell
|
Singh, Jawar
|
|
2013
|
53 |
4 |
p. 565-572
8 p.
|
artikel
|
| 3 |
An analytical approach to calculate effective channel length in graphene nanoribbon field effect transistors
|
Ghadiry, M.
|
|
2013
|
53 |
4 |
p. 540-543
4 p.
|
artikel
|
| 4 |
An analytical two dimensional subthreshold behavior model to study the nanoscale GCGS DG Si MOSFET including interfacial trap effects
|
Bentrcia, T.
|
|
2013
|
53 |
4 |
p. 520-527
8 p.
|
artikel
|
| 5 |
A new MagFET-based integrated current sensor highly immune to EMI
|
Aiello, Orazio
|
|
2013
|
53 |
4 |
p. 573-581
9 p.
|
artikel
|
| 6 |
A new procedure for eliminating the geometric component from charge pumping: Application for NBTI and radiation issues
|
Tahi, Hakim
|
|
2013
|
53 |
4 |
p. 513-519
7 p.
|
artikel
|
| 7 |
Cohesive fracture mechanics based numerical analysis to BGA packaging and lead free solders under drop impact
|
Yao, Yao
|
|
2013
|
53 |
4 |
p. 629-637
9 p.
|
artikel
|
| 8 |
Correlation between P3HT inter-chain structure and J sc of P3HT:PC[70]BM blends for solar cells
|
Balderrama, V.S.
|
|
2013
|
53 |
4 |
p. 560-564
5 p.
|
artikel
|
| 9 |
Design and simulation of hybrid CMOS–SET circuits
|
Jana, Anindya
|
|
2013
|
53 |
4 |
p. 592-599
8 p.
|
artikel
|
| 10 |
Design and simulation of MOSCNT with band engineered source and drain regions
|
Moghadam, Narjes
|
|
2013
|
53 |
4 |
p. 533-539
7 p.
|
artikel
|
| 11 |
Evaluation of temperature distribution of LED module
|
Fu, Han-Kuei
|
|
2013
|
53 |
4 |
p. 554-559
6 p.
|
artikel
|
| 12 |
Experimental and numerical evaluation of interfacial adhesion on Cu/SiN in LSI interconnect structures
|
Omiya, Masaki
|
|
2013
|
53 |
4 |
p. 612-621
10 p.
|
artikel
|
| 13 |
Experimental study of bump void formation according to process conditions
|
Na, Seong-Hun
|
|
2013
|
53 |
4 |
p. 638-644
7 p.
|
artikel
|
| 14 |
FSI implications of EMC rheological properties to 3D IC with TSV structures during plastic encapsulation process
|
Ong, Ernest E.S.
|
|
2013
|
53 |
4 |
p. 600-611
12 p.
|
artikel
|
| 15 |
Inside front cover - Editorial board
|
|
|
2013
|
53 |
4 |
p. IFC-
1 p.
|
artikel
|
| 16 |
In situ high temperature creep deformation of micro-structure with metal film wire on flexible membrane using geometric phase analysis
|
Wang, Qinghua
|
|
2013
|
53 |
4 |
p. 652-657
6 p.
|
artikel
|
| 17 |
Multi-level storage in a nano-floating gate MOS capacitor using a stepped control oxide
|
Seo, Jun-Hyuk
|
|
2013
|
53 |
4 |
p. 528-532
5 p.
|
artikel
|
| 18 |
Optimum control of microprocessor throughput under thermal and energy saving constraints
|
Gołda, Adam T.
|
|
2013
|
53 |
4 |
p. 582-591
10 p.
|
artikel
|
| 19 |
Ratcheting behavior of sandwiched assembly joined by sintered nanosilver for power electronics packaging
|
Chen, Gang
|
|
2013
|
53 |
4 |
p. 645-651
7 p.
|
artikel
|
| 20 |
Thermal uniformity of packaging multiple light-emitting diodes embedded in aluminum-core printed circuit boards
|
Long, Xing-Ming
|
|
2013
|
53 |
4 |
p. 544-553
10 p.
|
artikel
|
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