nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
An accurate MOSFET aging model for 28nm integrated circuit simulation
|
Tudor, Bogdan |
|
2012 |
52 |
8 |
p. 1565-1570 6 p. |
artikel |
2 |
A novel gate-suppression technique for ESD protection
|
Miao, Meng |
|
2012 |
52 |
8 |
p. 1598-1601 4 p. |
artikel |
3 |
A novel power-clamp assisted complementary MOSFET for robust ESD protection
|
Wu, Jian |
|
2012 |
52 |
8 |
p. 1593-1597 5 p. |
artikel |
4 |
Applications of finite element methods for reliability study of ULSI interconnections
|
Tan, Cher Ming |
|
2012 |
52 |
8 |
p. 1539-1545 7 p. |
artikel |
5 |
A study on MIS Schottky diode based hydrogen sensor using La2O3 as gate insulator
|
Chen, Gang |
|
2012 |
52 |
8 |
p. 1660-1664 5 p. |
artikel |
6 |
Characterization of the viscoelastic properties of an epoxy molding compound during cure
|
Sadeghinia, M. |
|
2012 |
52 |
8 |
p. 1711-1718 8 p. |
artikel |
7 |
Charge storage and data retention characteristics of forming gas-annealed Gd2O3-nanocrystal nonvolatile memory cell
|
Wang, Jer-Chyi |
|
2012 |
52 |
8 |
p. 1627-1631 5 p. |
artikel |
8 |
Comparative analysis of yield optimized pulsed flip-flops
|
Lanuzza, Marco |
|
2012 |
52 |
8 |
p. 1679-1689 11 p. |
artikel |
9 |
Crystal size and direction dependence of the elastic properties of Cu3Sn through molecular dynamics simulation and nanoindentation testing
|
Chen, Wen-Hwa |
|
2012 |
52 |
8 |
p. 1699-1710 12 p. |
artikel |
10 |
Degradation behaviors of GaN light-emitting diodes under high-temperature and high-current stressing
|
Liu, J. |
|
2012 |
52 |
8 |
p. 1636-1639 4 p. |
artikel |
11 |
Effect of IC layout on the reliability of CMOS amplifiers
|
He, Feifei |
|
2012 |
52 |
8 |
p. 1575-1580 6 p. |
artikel |
12 |
Efficiently analyzing the impact of aging effects on large integrated circuits
|
Lorenz, Dominik |
|
2012 |
52 |
8 |
p. 1546-1552 7 p. |
artikel |
13 |
Ensuring accuracy in optical and electrical measurement of ultra-bright LEDs during reliability test
|
Chen, Sihan Joseph |
|
2012 |
52 |
8 |
p. 1632-1635 4 p. |
artikel |
14 |
Experimental characterization and modelling of electromigration lifetime under unipolar pulsed current stress
|
Lim, Meng Keong |
|
2012 |
52 |
8 |
p. 1553-1558 6 p. |
artikel |
15 |
Fault detection in resistive ladder network with minimal measurements
|
Shashank, S.B. |
|
2012 |
52 |
8 |
p. 1586-1592 7 p. |
artikel |
16 |
Fluid–solid coupling thermo-mechanical analysis of high power LED package during thermal shock testing
|
Chen, Zhaohui |
|
2012 |
52 |
8 |
p. 1726-1734 9 p. |
artikel |
17 |
ICMAT 2011 – Reliability and variability of semiconductor devices and ICs
|
Asenov, Asen |
|
2012 |
52 |
8 |
p. 1531- 1 p. |
artikel |
18 |
Immunity against temperature variability and bias point invariability in double gate tunnel field effect transistor
|
Narang, Rakhi |
|
2012 |
52 |
8 |
p. 1617-1620 4 p. |
artikel |
19 |
Impacts of NBTI/PBTI on performance of domino logic circuits with high-k metal-gate devices in nanoscale CMOS
|
Houshmand Kaffashian, Masaoud |
|
2012 |
52 |
8 |
p. 1655-1659 5 p. |
artikel |
20 |
Improving the electrical characteristics of MOS transistors with CeO2/La2O3 stacked gate dielectric
|
Yang, B.L. |
|
2012 |
52 |
8 |
p. 1613-1616 4 p. |
artikel |
21 |
Including spatial correlations of channel length and threshold voltage variation in circuit simulations
|
Watts, Josef |
|
2012 |
52 |
8 |
p. 1571-1574 4 p. |
artikel |
22 |
Influence of multi-finger layout on the subthreshold behavior of nanometer MOS transistors
|
Siu, S.-L. |
|
2012 |
52 |
8 |
p. 1606-1609 4 p. |
artikel |
23 |
Inside front cover - Editorial board
|
|
|
2012 |
52 |
8 |
p. IFC- 1 p. |
artikel |
24 |
Interconnect reliability dependence on fast diffusivity paths
|
Ceric, Hajdin |
|
2012 |
52 |
8 |
p. 1532-1538 7 p. |
artikel |
25 |
Investigation of ESD protection strategy in high voltage Bipolar–CMOS–DMOS process
|
Ma, Fei |
|
2012 |
52 |
8 |
p. 1640-1644 5 p. |
artikel |
26 |
Modeling of terminal ring structures for high-voltage power MOSFETs
|
Tam, Wing-Shan |
|
2012 |
52 |
8 |
p. 1645-1650 6 p. |
artikel |
27 |
Modular sensor chip design for package stress evaluation and reliability characterisation
|
Trigg, A.D. |
|
2012 |
52 |
8 |
p. 1581-1585 5 p. |
artikel |
28 |
[No title]
|
Williard, Nicholas |
|
2012 |
52 |
8 |
p. 1749- 1 p. |
artikel |
29 |
Optimizing the fabrication process for high performance graphene field effect transistors
|
Wang, Yanjie |
|
2012 |
52 |
8 |
p. 1602-1605 4 p. |
artikel |
30 |
pH sensing reliability of flexible ITO/PET electrodes on EGFETs prepared by a roll-to-roll process
|
Lue, Cheng-En |
|
2012 |
52 |
8 |
p. 1651-1654 4 p. |
artikel |
31 |
Preliminary assessment of the stability of thin- and polymer thick-film resistors embedded into printed wiring boards
|
Stęplewski, Wojciech |
|
2012 |
52 |
8 |
p. 1719-1725 7 p. |
artikel |
32 |
Reliability issues in GaN-based light-emitting diodes: Effect of dc and PWM stress
|
Meneghini, M. |
|
2012 |
52 |
8 |
p. 1621-1626 6 p. |
artikel |
33 |
Reliability optimization of analog integrated circuits considering the trade-off between lifetime and area
|
Pan, Xin |
|
2012 |
52 |
8 |
p. 1559-1564 6 p. |
artikel |
34 |
Simulation study of Insulated Shallow Extension Silicon On Nothing (ISESON) MOSFET for high temperature applications
|
Kumari, Vandana |
|
2012 |
52 |
8 |
p. 1610-1612 3 p. |
artikel |
35 |
Synthesis and characterization of sub-micron sized copper–ruthenium–tantalum composites for interconnection application
|
Sule, R. |
|
2012 |
52 |
8 |
p. 1690-1698 9 p. |
artikel |
36 |
System-level design optimization of reliable and low power multiprocessor system-on-chip
|
Shafik, Rishad A. |
|
2012 |
52 |
8 |
p. 1735-1748 14 p. |
artikel |
37 |
Thermal fatigue life estimation and delamination mechanics studies of multilayered MEMS structures
|
Maligno, A.R. |
|
2012 |
52 |
8 |
p. 1665-1678 14 p. |
artikel |