nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A comparative study of charge pumping circuits for flash memory applications
|
Wong, O.Y. |
|
2012 |
52 |
4 |
p. 670-687 18 p. |
artikel |
2 |
Advances in non-volatile memory technology
|
Wong, Hei |
|
2012 |
52 |
4 |
p. 611-612 2 p. |
artikel |
3 |
Analysis of thermal characteristics and mechanism of degradation of flip-chip high power LEDs
|
Wang, Chien-Ping |
|
2012 |
52 |
4 |
p. 698-703 6 p. |
artikel |
4 |
A novel decapsulation technique for failure analysis of epoxy molded IC packages with Cu wire bonds
|
Liu, Chien-Pan |
|
2012 |
52 |
4 |
p. 725-734 10 p. |
artikel |
5 |
Application of flexible printed circuit board (FPCB) in personal computer motherboards: Focusing on mechanical performance
|
Leong, W.C. |
|
2012 |
52 |
4 |
p. 744-756 13 p. |
artikel |
6 |
Characterization of fatigued Al lines by means of SThM and XRD: Analysis using fast Fourier transform
|
Szeloch, R.F. |
|
2012 |
52 |
4 |
p. 711-717 7 p. |
artikel |
7 |
Chip warpage model for reliability prediction of delamination failures
|
Yang, Se Young |
|
2012 |
52 |
4 |
p. 718-724 7 p. |
artikel |
8 |
Doped Ta2O5 and mixed HfO2–Ta2O5 films for dynamic memories applications at the nanoscale
|
Atanassova, E. |
|
2012 |
52 |
4 |
p. 642-650 9 p. |
artikel |
9 |
Efficient statistical capacitance extraction of nanometer interconnects considering the on-chip line edge roughness
|
Yu, Wenjian |
|
2012 |
52 |
4 |
p. 704-710 7 p. |
artikel |
10 |
Emerging memory technologies: Trends, challenges, and modeling methods
|
Makarov, A. |
|
2012 |
52 |
4 |
p. 628-634 7 p. |
artikel |
11 |
Failure mechanism of FBGA solder joints in memory module subjected to harmonic excitation
|
Cinar, Yusuf |
|
2012 |
52 |
4 |
p. 735-743 9 p. |
artikel |
12 |
Gadolinium-based metal oxide for nonvolatile memory applications
|
Wang, Jer-Chyi |
|
2012 |
52 |
4 |
p. 635-641 7 p. |
artikel |
13 |
Inside front cover - Editorial board
|
|
|
2012 |
52 |
4 |
p. IFC- 1 p. |
artikel |
14 |
NAND flash memory technology utilizing fringing electric field
|
Lee, Jong-Ho |
|
2012 |
52 |
4 |
p. 662-669 8 p. |
artikel |
15 |
Perspective of flash memory realized on vertical Si nanowires
|
Yu, HongYu |
|
2012 |
52 |
4 |
p. 651-661 11 p. |
artikel |
16 |
Realizing high breakdown voltage for a novel interface charges islands structure based on partial-SOI substrate
|
Hu, Shengdong |
|
2012 |
52 |
4 |
p. 692-697 6 p. |
artikel |
17 |
Resistive switching behavior of a CeO2 based ReRAM cell incorporated with Si buffer layer
|
Dou, C. |
|
2012 |
52 |
4 |
p. 688-691 4 p. |
artikel |
18 |
Spin-transfer torque RAM technology: Review and prospect
|
Kawahara, T. |
|
2012 |
52 |
4 |
p. 613-627 15 p. |
artikel |
19 |
The influence of ferroelectric–electrode interface layer on the electrical characteristics of negative-capacitance ferroelectric double-gate field-effect transistors
|
Xiao, Yongguang |
|
2012 |
52 |
4 |
p. 757-760 4 p. |
artikel |