| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A low-noise, process-variation-tolerant double-gate FinFET based sense amplifier
|
Rathod, S.S.
|
|
2011
|
51 |
4 |
p. 773-780
8 p.
|
artikel
|
| 2 |
Assessing the risk of “Kirkendall voiding” in Cu3Sn
|
Borgesen, Peter
|
|
2011
|
51 |
4 |
p. 837-846
10 p.
|
artikel
|
| 3 |
A synthesis methodology for AMS/RF circuit reliability: Application to a DCO design
|
Ferreira, Pietro Maris
|
|
2011
|
51 |
4 |
p. 765-772
8 p.
|
artikel
|
| 4 |
Control of droplet formation for low viscosity fluid by double waveforms applied to a piezoelectric inkjet nozzle
|
Shin, Pyungho
|
|
2011
|
51 |
4 |
p. 797-804
8 p.
|
artikel
|
| 5 |
Development of a mathematical model for thermal-compression bonding of the COG packaging process using NCA
|
Chang, Ching-Ho
|
|
2011
|
51 |
4 |
p. 860-865
6 p.
|
artikel
|
| 6 |
Dispersion, hybrid interconnection and heat dissipation properties of functionalized carbon nanotubes in epoxy composites for electrically conductive adhesives (ECAs)
|
Kwon, Yumi
|
|
2011
|
51 |
4 |
p. 812-818
7 p.
|
artikel
|
| 7 |
Effect of Ag on oxidation of Cu-base leadframe
|
Gen, Wenyan
|
|
2011
|
51 |
4 |
p. 866-870
5 p.
|
artikel
|
| 8 |
Effects of La2O3 incorporation in HfO2 gated nMOSFETs on low-frequency noise
|
Zade, D.
|
|
2011
|
51 |
4 |
p. 746-750
5 p.
|
artikel
|
| 9 |
Electrical characterization of single cell in microfluidic device
|
Jao, Jen-Yu
|
|
2011
|
51 |
4 |
p. 781-789
9 p.
|
artikel
|
| 10 |
Exact analytical model of single electron transistor for practical IC design
|
Hasaneen, El-Sayed A.M.
|
|
2011
|
51 |
4 |
p. 733-745
13 p.
|
artikel
|
| 11 |
Fixed-point multiplication: A probabilistic bit-pattern view
|
Ahmadi, A.
|
|
2011
|
51 |
4 |
p. 790-796
7 p.
|
artikel
|
| 12 |
Gate-controlled field-effect diodes and silicon-controlled rectifier for charged-device model ESD protection in advanced SOI technology
|
Cao, Shuqing
|
|
2011
|
51 |
4 |
p. 756-764
9 p.
|
artikel
|
| 13 |
Highly reliable, fine pitch chip on glass (COG) joints fabricated using Sn/Cu bumps and non-conductive adhesives
|
Kim, Byeung-Gee
|
|
2011
|
51 |
4 |
p. 851-859
9 p.
|
artikel
|
| 14 |
Inside front cover - Editorial board
|
|
|
2011
|
51 |
4 |
p. IFC-
1 p.
|
artikel
|
| 15 |
Mechanical and wetting properties of epoxy resins: Amine-containing epoxy-terminated siloxane oligomer with or without reductant
|
Kwon, Yumi
|
|
2011
|
51 |
4 |
p. 819-825
7 p.
|
artikel
|
| 16 |
Scaling the bulk-driven MOSFET into deca-nanometer bulk CMOS processes
|
Urban, Christopher
|
|
2011
|
51 |
4 |
p. 727-732
6 p.
|
artikel
|
| 17 |
Structuration of the low temperature co-fired ceramics (LTCC) using novel sacrificial graphite paste with PVA–propylene glycol–glycerol–water vehicle
|
Malecha, Karol
|
|
2011
|
51 |
4 |
p. 805-811
7 p.
|
artikel
|
| 18 |
Study of hafnium oxide deposited using Dense Plasma Focus machine for film structure and electrical properties as a MOS device
|
Srivastava, A.
|
|
2011
|
51 |
4 |
p. 751-755
5 p.
|
artikel
|
| 19 |
Study of metal adhesion on porous low-k dielectric using telephone cord buckling
|
He, M.
|
|
2011
|
51 |
4 |
p. 847-850
4 p.
|
artikel
|
| 20 |
Thermal–mechanical optimization of a novel nanocomposite-film typed flip chip technology
|
Cheng, Hsien-Chie
|
|
2011
|
51 |
4 |
p. 826-836
11 p.
|
artikel
|
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