| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A quantitative method of reliability estimation for surface mount solder joints based on heating factor Q η
|
Tao, Bo
|
|
2006
|
46 |
5-6 |
p. 864-872
9 p.
|
artikel
|
| 2 |
A reliability-driven placement procedure based on thermal-force model
|
Lee, Jing
|
|
2006
|
46 |
5-6 |
p. 973-983
11 p.
|
artikel
|
| 3 |
CFCET: A hardware-based control flow checking technique in COTS processors using execution tracing
|
Rajabzadeh, Amir
|
|
2006
|
46 |
5-6 |
p. 959-972
14 p.
|
artikel
|
| 4 |
Characterisation of the Al2O3 films deposited by ultrasonic spray pyrolysis and atomic layer deposition methods for passivation of 4H–SiC devices
|
Wolborski, Maciej
|
|
2006
|
46 |
5-6 |
p. 743-755
13 p.
|
artikel
|
| 5 |
Characteristics of current crowding in flip-chip solder bumps
|
Lai, Yi-Shao
|
|
2006
|
46 |
5-6 |
p. 915-922
8 p.
|
artikel
|
| 6 |
Comparative studies of Pt and Ir schottky contacts on undoped Al0.36Ga0.64N
|
Guhel, Y.
|
|
2006
|
46 |
5-6 |
p. 786-793
8 p.
|
artikel
|
| 7 |
Critical dimension control in photolithography based on the yield by a simulation program
|
Kang, H.Y.
|
|
2006
|
46 |
5-6 |
p. 1006-1012
7 p.
|
artikel
|
| 8 |
Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging
|
Pan, M.Y.
|
|
2006
|
46 |
5-6 |
p. 763-767
5 p.
|
artikel
|
| 9 |
Distributed collaborative design of IP components in the TRMS environment
|
Siekierska, K.
|
|
2006
|
46 |
5-6 |
p. 1019-1024
6 p.
|
artikel
|
| 10 |
Effect of wafer thinning methods towards fracture strength and topography of silicon die
|
Jiun, Hoh Huey
|
|
2006
|
46 |
5-6 |
p. 836-845
10 p.
|
artikel
|
| 11 |
Effects of different bonding parameters on the electrical performance and peeling strengths of ACF interconnection
|
Chen, Xu
|
|
2006
|
46 |
5-6 |
p. 774-785
12 p.
|
artikel
|
| 12 |
ESD protection solutions for high voltage technologies
|
Keppens, Bart
|
|
2006
|
46 |
5-6 |
p. 677-688
12 p.
|
artikel
|
| 13 |
Experimental study on the thermo-mechanical effects of underfill and low-CTE substrate in a flip-chip device
|
Morita, Yasuyuki
|
|
2006
|
46 |
5-6 |
p. 923-929
7 p.
|
artikel
|
| 14 |
Feasibility study of the application of voltage contrast to printed circuit board
|
Tan, Cher Ming
|
|
2006
|
46 |
5-6 |
p. 939-948
10 p.
|
artikel
|
| 15 |
Gate oxide failures due to anomalous stress from HBM ESD testers
|
Duvvury, Charvaka
|
|
2006
|
46 |
5-6 |
p. 656-665
10 p.
|
artikel
|
| 16 |
High temperature reliability and interfacial reaction of eutectic Sn–0.7Cu/Ni solder joints during isothermal aging
|
Yoon, Jeong-Won
|
|
2006
|
46 |
5-6 |
p. 905-914
10 p.
|
artikel
|
| 17 |
Implementation of plug-and-play ESD protection in 5.5GHz 90nm RF CMOS LNAs—Concepts, constraints and solutions
|
Thijs, S.
|
|
2006
|
46 |
5-6 |
p. 702-712
11 p.
|
artikel
|
| 18 |
Improvement in high-temperature degradation by isotropic conductive adhesives including Ag–Sn alloy fillers
|
Yamashita, M.
|
|
2006
|
46 |
5-6 |
p. 850-858
9 p.
|
artikel
|
| 19 |
Integrated CMOS GSM baseband channel selecting filters realized using switched capacitor finite impulse response technique
|
Dąbrowski, A.
|
|
2006
|
46 |
5-6 |
p. 949-958
10 p.
|
artikel
|
| 20 |
Interfacial thermal stresses in solder joints of leadless chip resistors
|
Ghorbani, H.R.
|
|
2006
|
46 |
5-6 |
p. 873-884
12 p.
|
artikel
|
| 21 |
Introduction to special section on selected papers from EOS/ESD Symposium 2004
|
Iyer, Natarajan Mahadeva
|
|
2006
|
46 |
5-6 |
p. 655-
1 p.
|
artikel
|
| 22 |
Investigation of increased performance of close series stacked tube axial fans due to inclusion of diffuser element
|
Jilesen, J.
|
|
2006
|
46 |
5-6 |
p. 984-993
10 p.
|
artikel
|
| 23 |
Investigation of the influence of thermal treatment on interconnect-barrier interfaces in copper metallization systems
|
Aubel, Oliver
|
|
2006
|
46 |
5-6 |
p. 768-773
6 p.
|
artikel
|
| 24 |
Isothermal aging effects on the microstructure and solder bump shear strength of eutectic Sn37Pb and Sn3.5Ag solders
|
Chen, W.-M.
|
|
2006
|
46 |
5-6 |
p. 896-904
9 p.
|
artikel
|
| 25 |
Life margin assessment with Physics of Failure Tools application to BGA packages
|
Foucher, B.
|
|
2006
|
46 |
5-6 |
p. 1013-1018
6 p.
|
artikel
|
| 26 |
Nano-mechanical electro-thermal probe array used for high-density storage based on NEMS technology
|
Yang, Zunxian
|
|
2006
|
46 |
5-6 |
p. 805-810
6 p.
|
artikel
|
| 27 |
New insights into board level drop impact
|
Wong, E.H.
|
|
2006
|
46 |
5-6 |
p. 930-938
9 p.
|
artikel
|
| 28 |
[No title]
|
Stojcev, Mile
|
|
2006
|
46 |
5-6 |
p. 1025-1026
2 p.
|
artikel
|
| 29 |
On solution schemes for time-independent thermomechanical analysis for structures containing polymeric materials
|
Lai, Yi-Shao
|
|
2006
|
46 |
5-6 |
p. 859-863
5 p.
|
artikel
|
| 30 |
Physical fundamentals of external transient latch-up and corrective actions
|
Domański, K.
|
|
2006
|
46 |
5-6 |
p. 689-701
13 p.
|
artikel
|
| 31 |
Reliability and performance limitations in SiC power devices
|
Singh, Ranbir
|
|
2006
|
46 |
5-6 |
p. 713-730
18 p.
|
artikel
|
| 32 |
Resolution improvement of acoustic microimaging by continuous wavelet transform for semiconductor inspection
|
Zhang, Guang-Ming
|
|
2006
|
46 |
5-6 |
p. 811-821
11 p.
|
artikel
|
| 33 |
Statistical analysis of tin whisker growth
|
Fang, Tong
|
|
2006
|
46 |
5-6 |
p. 846-849
4 p.
|
artikel
|
| 34 |
Stress analysis and bending tests for GaAs wafers
|
Dreyer, W.
|
|
2006
|
46 |
5-6 |
p. 822-835
14 p.
|
artikel
|
| 35 |
Study of CDM specific effects for a smart power input protection structure
|
Etherton, M.
|
|
2006
|
46 |
5-6 |
p. 666-676
11 p.
|
artikel
|
| 36 |
Study of RF N− LDMOS critical electrical parameter drifts after a thermal and electrical ageing in pulsed RF
|
Maanane, H.
|
|
2006
|
46 |
5-6 |
p. 994-1000
7 p.
|
artikel
|
| 37 |
Study of the power capability of LDMOS and the improved methods
|
Sun, Zhilin
|
|
2006
|
46 |
5-6 |
p. 1001-1005
5 p.
|
artikel
|
| 38 |
The effect of die attach voiding on the thermal resistance of chip level packages
|
Fleischer, Amy S.
|
|
2006
|
46 |
5-6 |
p. 794-804
11 p.
|
artikel
|
| 39 |
Transient fracturing of solder joints subjected to displacement-controlled impact loads
|
Yeh, Chang-Lin
|
|
2006
|
46 |
5-6 |
p. 885-895
11 p.
|
artikel
|
| 40 |
Understanding threshold voltage in undoped-body MOSFETs: An appraisal of various criteria
|
Sánchez, F.J. Garcı́a
|
|
2006
|
46 |
5-6 |
p. 731-742
12 p.
|
artikel
|
| 41 |
Vertically high-density interconnection for mobile application
|
Katahira, Takayoshi
|
|
2006
|
46 |
5-6 |
p. 756-762
7 p.
|
artikel
|
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