| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending
|
Xu, Leon
|
|
2004
|
44 |
12 |
p. 1977-1983
7 p.
|
artikel
|
| 2 |
Author index for Volume 44
|
|
|
2004
|
44 |
12 |
p. 2049-2054
6 p.
|
artikel
|
| 3 |
Board level solder joint reliability analysis and optimization of pyramidal stacked die BGA packages
|
Tee, Tong Yan
|
|
2004
|
44 |
12 |
p. 1957-1965
9 p.
|
artikel
|
| 4 |
Characterization and FE analysis on the shear test of electronic materials
|
Gonzalez, M.
|
|
2004
|
44 |
12 |
p. 1915-1921
7 p.
|
artikel
|
| 5 |
CMOS Telecom Data converters; Angel Rodriguez-Vazquez, Fernando Medeiro, Edmond Janssens, editors. Kluwer Academic Publishers, Boston; 2003. Hardcover, 588pp, plus XXXIII, 128 euro. ISBN 1-4020-7546-4
|
Stojcev, Mile
|
|
2004
|
44 |
12 |
p. 2029-2030
2 p.
|
artikel
|
| 6 |
Contents of Volume 44
|
|
|
2004
|
44 |
12 |
p. 2035-2048
14 p.
|
artikel
|
| 7 |
Design and control of RF power amplifier; Alireza Shirvani, Bruce Wooley. Kluwer Academic Publishers, Boston; 2003. Hardcover, pp. 149, plus XVI, 127 euro. ISBN 1-4020-7562-6
|
Stojcev, Mile
|
|
2004
|
44 |
12 |
p. 2031-2032
2 p.
|
artikel
|
| 8 |
Finite element simulation of package stress in transfer molded MEMS pressure sensors
|
Krondorfer, Rudolf
|
|
2004
|
44 |
12 |
p. 1995-2002
8 p.
|
artikel
|
| 9 |
Low-voltage CMOS log companding analog design; Francisco Sera-Graells, Andoracion Rueda, Jose L. Huertas. Kluwer Academic Publishers, Boston; 2003. Hardcover, pp. 192, plus XXV, 117 euro. ISBN 1-4020-7445-X
|
Stojcev, Mile
|
|
2004
|
44 |
12 |
p. 2033-2034
2 p.
|
artikel
|
| 10 |
Microstructure and creep behaviour of eutectic SnAg and SnAgCu solders
|
Wiese, S.
|
|
2004
|
44 |
12 |
p. 1923-1931
9 p.
|
artikel
|
| 11 |
Morphology changes in solder joints––experimental evidence and physical understanding
|
Müller, W.H.
|
|
2004
|
44 |
12 |
p. 1901-1914
14 p.
|
artikel
|
| 12 |
Multi-physics modeling in virtual prototyping of electronic packages––combined thermal, thermo-mechanical and vapor pressure modeling
|
Fan, X.J.
|
|
2004
|
44 |
12 |
p. 1967-1976
10 p.
|
artikel
|
| 13 |
Package and solder joint reliability analysed by FEM simulation and experiments
|
Vandevelde, Bart
|
|
2004
|
44 |
12 |
p. 1891-1892
2 p.
|
artikel
|
| 14 |
Parametric FE-approach to flip-chip reliability under various loading conditions
|
Wunderle, B.
|
|
2004
|
44 |
12 |
p. 1933-1945
13 p.
|
artikel
|
| 15 |
Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach
|
Yang, D.G.
|
|
2004
|
44 |
12 |
p. 1947-1955
9 p.
|
artikel
|
| 16 |
Prediction of crack growth in IC passivation layers
|
He, Y.T.
|
|
2004
|
44 |
12 |
p. 2003-2009
7 p.
|
artikel
|
| 17 |
Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods
|
van Driel, W.D.
|
|
2004
|
44 |
12 |
p. 2019-2027
9 p.
|
artikel
|
| 18 |
Prediction of thermo-mechanical integrity of wafer backend processes
|
Gonda, V.
|
|
2004
|
44 |
12 |
p. 2011-2017
7 p.
|
artikel
|
| 19 |
Residual stresses in microelectronics induced by thermoset packaging materials during cure
|
Meuwissen, Marcel H.H.
|
|
2004
|
44 |
12 |
p. 1985-1994
10 p.
|
artikel
|
| 20 |
Time-independent elastic–plastic behaviour of solder materials
|
Wiese, S.
|
|
2004
|
44 |
12 |
p. 1893-1900
8 p.
|
artikel
|
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