| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A fritless copper conductor system for power electronic applications
|
Reicher, Roland
|
|
2001
|
41 |
4 |
p. 491-498
8 p.
|
artikel
|
| 2 |
Calender
|
|
|
2001
|
41 |
4 |
p. I-VI
nvt p.
|
artikel
|
| 3 |
Determination of trap cross-section in a-Si:H p-i-n diodes parameters using simulation and parameter extraction
|
Estrada, Magali
|
|
2001
|
41 |
4 |
p. 605-610
6 p.
|
artikel
|
| 4 |
Development of chip-on-flex using SBB flip-chip technology
|
Kumano, Yutaka
|
|
2001
|
41 |
4 |
p. 525-530
6 p.
|
artikel
|
| 5 |
Effects of base layer thickness on reliability of CVD Si3N4 stack gate dielectrics
|
Eriguchi, Koji
|
|
2001
|
41 |
4 |
p. 587-595
9 p.
|
artikel
|
| 6 |
Finite element simulation of thermal fatigue in multilayer structures: thermal and mechanical approach
|
Rodriguez, M.P
|
|
2001
|
41 |
4 |
p. 517-523
7 p.
|
artikel
|
| 7 |
In memory of D. Stewart Peck
|
Stojadinovic, Ninoslav D
|
|
2001
|
41 |
4 |
p. 481-
1 p.
|
artikel
|
| 8 |
Investigation of stress in shallow trench isolation using UV micro-Raman spectroscopy
|
Dombrowski, K.F.
|
|
2001
|
41 |
4 |
p. 511-515
5 p.
|
artikel
|
| 9 |
Laser processing for microelectronics packaging applications
|
Illyefalvi-Vitéz, Zsolt
|
|
2001
|
41 |
4 |
p. 563-570
8 p.
|
artikel
|
| 10 |
Low frequency noise in thin gate oxide MOSFETs
|
Kolarova, R.
|
|
2001
|
41 |
4 |
p. 579-585
7 p.
|
artikel
|
| 11 |
Low-frequency noise of thick-film resistors as quality and reliability indicator
|
Rocak, Dubravka
|
|
2001
|
41 |
4 |
p. 531-542
12 p.
|
artikel
|
| 12 |
New assembling technique for BGA packages without thermal processes
|
Videkov, Valentin
|
|
2001
|
41 |
4 |
p. 611-615
5 p.
|
artikel
|
| 13 |
Optimal Reliability Design: Fundamentals and Applications; Way Kuo, Rajendra Prasad, Frank A. Tillman, Ching-Lai Mwang. Cambridge University Press, Cambridge, 2001, 389+XXI pp. ISBN: 0-521-78127-2 (hardbound)
|
Jevtić, Milan
|
|
2001
|
41 |
4 |
p. 623-624
2 p.
|
artikel
|
| 14 |
Progress in device isolation technology
|
Schwalke, Udo
|
|
2001
|
41 |
4 |
p. 483-490
8 p.
|
artikel
|
| 15 |
Reliability of k-out-of-n nonrepairable systems with nonindependent components subjected to common shocks
|
Sarhan, A.M.
|
|
2001
|
41 |
4 |
p. 617-621
5 p.
|
artikel
|
| 16 |
Reliability studies of two flip-chip BGA packages using power cycling test
|
Qi, Quan
|
|
2001
|
41 |
4 |
p. 553-562
10 p.
|
artikel
|
| 17 |
Soft breakdown and hard breakdown in ultra-thin oxides
|
Pompl, T.
|
|
2001
|
41 |
4 |
p. 543-551
9 p.
|
artikel
|
| 18 |
Stress effects of epoxy adhesives on ceramic substrates and magnetics
|
Swanson, Dale W
|
|
2001
|
41 |
4 |
p. 499-510
12 p.
|
artikel
|
| 19 |
Study on the degradation induced by donor interface state in deep-sub-micron grooved-gate P-channel MOSFET’s
|
Ren, Hongxia
|
|
2001
|
41 |
4 |
p. 597-604
8 p.
|
artikel
|
| 20 |
Thermal modeling of single event burnout failure in semiconductor power devices
|
Walker, D.G.
|
|
2001
|
41 |
4 |
p. 571-578
8 p.
|
artikel
|
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