| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
A two-layer high density printed circuit board and its reliability
|
Zhang, S.
|
|
1999
|
39 |
9 |
p. 1337-1341
5 p.
|
article
|
| 2 |
Board level reliability assessment of chip scale packages
|
Wang, Z.P
|
|
1999
|
39 |
9 |
p. 1351-1356
6 p.
|
article
|
| 3 |
Characterization of chip scale packaging materials
|
Amagai, Masazumi
|
|
1999
|
39 |
9 |
p. 1365-1377
13 p.
|
article
|
| 4 |
1/f noise due to temperature fluctuations in heat conduction in bipolar transistors
|
Forbes, L
|
|
1999
|
39 |
9 |
p. 1357-1364
8 p.
|
article
|
| 5 |
Functional AlGaAs/GaAs heterostructure-emitter bipolar transistor with a pseudomorphic InGaAs/GaAs quantum-well base
|
Tsai, Jung-Hui
|
|
1999
|
39 |
9 |
p. 1379-1387
9 p.
|
article
|
| 6 |
Irregular effect of chloride impurities on migration failure reliability: contradictions or understandable?
|
Harsányi, Gábor
|
|
1999
|
39 |
9 |
p. 1407-1411
5 p.
|
article
|
| 7 |
Maximum likelihood predictive densities for the inverse Gaussian distribution with applications to reliability and lifetime predictions
|
Yang, Zhenlin
|
|
1999
|
39 |
9 |
p. 1413-1421
9 p.
|
article
|
| 8 |
On the time-dependent degradation of LDD n-MOSFETs under hot-carrier stress
|
Ang, D.S
|
|
1999
|
39 |
9 |
p. 1311-1322
12 p.
|
article
|
| 9 |
Single chip bumping and reliability for flip chip processes
|
Klein, M.
|
|
1999
|
39 |
9 |
p. 1389-1397
9 p.
|
article
|
| 10 |
Thermally stimulated current in SiO2
|
Fleetwood, D.M
|
|
1999
|
39 |
9 |
p. 1323-1336
14 p.
|
article
|
| 11 |
Thermal management of power electronics modules packaged by a stacked-plate technique
|
Haque, Shatil
|
|
1999
|
39 |
9 |
p. 1343-1349
7 p.
|
article
|
| 12 |
Transition of MCM-C applications to MCM-L using rigid flex substrates
|
Keating, James
|
|
1999
|
39 |
9 |
p. 1399-1406
8 p.
|
article
|
Journal description