| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A cautionary tale about Weibull analysis
|
|
|
1997
|
37 |
8 |
p. 1281-
1 p.
|
artikel
|
| 2 |
A clustered yield model for SMT boards and MCM's
|
|
|
1997
|
37 |
8 |
p. 1284-1285
2 p.
|
artikel
|
| 3 |
A cost analysis study for testability purposes on silicon active substrates
|
|
|
1997
|
37 |
8 |
p. 1288-1289
2 p.
|
artikel
|
| 4 |
A fault-tolerant communications switch prototype
|
Loh, Peter K.K.
|
|
1997
|
37 |
8 |
p. 1193-1196
4 p.
|
artikel
|
| 5 |
All opportunity-triggered replacement policy for multiple-unit systems
|
|
|
1997
|
37 |
8 |
p. 1287-
1 p.
|
artikel
|
| 6 |
Analysis of a two-unit system with connecting and disconnecting effect
|
Goel, C.K.
|
|
1997
|
37 |
8 |
p. 1271-1274
4 p.
|
artikel
|
| 7 |
An empirical model for enhancement-induced defect activity in software
|
|
|
1997
|
37 |
8 |
p. 1278-
1 p.
|
artikel
|
| 8 |
An experimental study of popcorning in plastic encapsulated microcircuits
|
|
|
1997
|
37 |
8 |
p. 1288-
1 p.
|
artikel
|
| 9 |
An inventory control model with gamma distribution
|
Yeh, Quey-Jen
|
|
1997
|
37 |
8 |
p. 1197-1201
5 p.
|
artikel
|
| 10 |
Application of direct strain measurement of fatigue studies in surface solder joints
|
|
|
1997
|
37 |
8 |
p. 1276-
1 p.
|
artikel
|
| 11 |
Application of ring oscillators to characterize transmission lines in VLSI circuits
|
|
|
1997
|
37 |
8 |
p. 1284-
1 p.
|
artikel
|
| 12 |
A real-time clustering microchip neural engine
|
|
|
1997
|
37 |
8 |
p. 1285-
1 p.
|
artikel
|
| 13 |
A silicon-on-silicon field programmable multichip model (FPMCM)—integrating FPGA and MCM technologies
|
|
|
1997
|
37 |
8 |
p. 1285-
1 p.
|
artikel
|
| 14 |
Automated X-ray inspection of chip-to-chip interconnections of Si-on-Si MCM's
|
|
|
1997
|
37 |
8 |
p. 1288-
1 p.
|
artikel
|
| 15 |
Bayesian inference for partially accelerated life tests using Gibbs sampling
|
Madi, Mohamed T.
|
|
1997
|
37 |
8 |
p. 1165-1168
4 p.
|
artikel
|
| 16 |
Bootstrap prediction intervals for the birnbaum-saunders distribution
|
Lu, Ming-Che
|
|
1997
|
37 |
8 |
p. 1213-1216
4 p.
|
artikel
|
| 17 |
Bounds for reliability of k-within connected-(r, s)-out-of-(m, n) failure systems
|
Makri, F.S.
|
|
1997
|
37 |
8 |
p. 1217-1224
8 p.
|
artikel
|
| 18 |
Calendar of forthcoming events
|
|
|
1997
|
37 |
8 |
p. 1293-1299
7 p.
|
artikel
|
| 19 |
Characteristics and potential application of polyimide-core bump to flip chip
|
|
|
1997
|
37 |
8 |
p. 1286-
1 p.
|
artikel
|
| 20 |
Characterization of a small peripheral array package
|
|
|
1997
|
37 |
8 |
p. 1288-
1 p.
|
artikel
|
| 21 |
Commercial-components initiative: ground benign systems—plastic encapsulated microcircuits
|
|
|
1997
|
37 |
8 |
p. 1282-
1 p.
|
artikel
|
| 22 |
Connecting parametric ageing to catastrophic failure through thermodynamics
|
|
|
1997
|
37 |
8 |
p. 1286-1287
2 p.
|
artikel
|
| 23 |
Continuous state reliability analysis
|
|
|
1997
|
37 |
8 |
p. 1280-1281
2 p.
|
artikel
|
| 24 |
Correlation of SiO2 lifetimes from constant and ramped voltage measurements
|
|
|
1997
|
37 |
8 |
p. 1279-
1 p.
|
artikel
|
| 25 |
Corrosion and adhesion of multilayer pad structures for packaging applications
|
|
|
1997
|
37 |
8 |
p. 1283-
1 p.
|
artikel
|
| 26 |
C-V characterization of MOS capacitors in SOI structures
|
|
|
1997
|
37 |
8 |
p. 1275-1276
2 p.
|
artikel
|
| 27 |
Decision theory in maintenance strategy of standby system with gamma-distribution repair-time
|
|
|
1997
|
37 |
8 |
p. 1281-
1 p.
|
artikel
|
| 28 |
Depth profile analysis of porous Si film by ERDA using a ΔE - E detector telescope
|
|
|
1997
|
37 |
8 |
p. 1289-
1 p.
|
artikel
|
| 29 |
Design of a low-cost wire bond tape ball grid array package
|
|
|
1997
|
37 |
8 |
p. 1288-
1 p.
|
artikel
|
| 30 |
Developing reliable software
|
|
|
1997
|
37 |
8 |
p. 1275-
1 p.
|
artikel
|
| 31 |
Developing reusable modeling capabilities for simulating high volume electronics manufacturing systems
|
|
|
1997
|
37 |
8 |
p. 1287-1288
2 p.
|
artikel
|
| 32 |
Dielectric breakdown I: a review of oxide breakdown
|
|
|
1997
|
37 |
8 |
p. 1276-
1 p.
|
artikel
|
| 33 |
Dielectric breakdown II: related projects at the University of twente
|
|
|
1997
|
37 |
8 |
p. 1277-
1 p.
|
artikel
|
| 34 |
Domination of k-out-of-n systems
|
|
|
1997
|
37 |
8 |
p. 1277-
1 p.
|
artikel
|
| 35 |
Dynamic reliability analysis of coherent multistate system
|
|
|
1997
|
37 |
8 |
p. 1279-
1 p.
|
artikel
|
| 36 |
Effect of PCB finish on the reliability and wettability of ball grid array packages
|
|
|
1997
|
37 |
8 |
p. 1283-
1 p.
|
artikel
|
| 37 |
Electrical measurement of silicon film and oxide thicknesses in partially depleted SOI technologies
|
|
|
1997
|
37 |
8 |
p. 1289-
1 p.
|
artikel
|
| 38 |
Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines
|
|
|
1997
|
37 |
8 |
p. 1290-
1 p.
|
artikel
|
| 39 |
Electromigration: the time bomb in deep-submicron ICs
|
|
|
1997
|
37 |
8 |
p. 1275-
1 p.
|
artikel
|
| 40 |
Estimating the cumulativenance strategy of standby system with gamma-distribution repair-time
|
|
|
1997
|
37 |
8 |
p. 1281-
1 p.
|
artikel
|
| 41 |
Estimation of the degradation of InGaN/AlGaN blue light-emitting diodes
|
Yanagisawa, Takeshi
|
|
1997
|
37 |
8 |
p. 1239-1241
3 p.
|
artikel
|
| 42 |
Evaluation methods of ion migration by dew condensation cycle test—part 2
|
|
|
1997
|
37 |
8 |
p. 1287-
1 p.
|
artikel
|
| 43 |
Experimental characterization of simultaneous switching noise for multichip modules
|
|
|
1997
|
37 |
8 |
p. 1288-
1 p.
|
artikel
|
| 44 |
Fatigue life studies on defect-free solder joints fabricated from modified reflow soldering
|
|
|
1997
|
37 |
8 |
p. 1276-1277
2 p.
|
artikel
|
| 45 |
Fault location in multi-modular redundant systems
|
Noore, A.
|
|
1997
|
37 |
8 |
p. 1267-1269
3 p.
|
artikel
|
| 46 |
Fault severity models for fault-correction activity
|
|
|
1997
|
37 |
8 |
p. 1277-1278
2 p.
|
artikel
|
| 47 |
Fault tree analysis and binary decision diagrams
|
|
|
1997
|
37 |
8 |
p. 1281-1282
2 p.
|
artikel
|
| 48 |
Forced convection air-cooling of a commercial electronic chassis: and experimental and computational case study
|
|
|
1997
|
37 |
8 |
p. 1287-
1 p.
|
artikel
|
| 49 |
Fuzzy logic based network reliability evaluation
|
Nahman, J.
|
|
1997
|
37 |
8 |
p. 1161-1164
4 p.
|
artikel
|
| 50 |
IC technology and ASIC design for the Cray J90 supercomputer
|
|
|
1997
|
37 |
8 |
p. 1287-
1 p.
|
artikel
|
| 51 |
Improved yield and performance of ball-grid array packages: design and processing guidelines for uniform and nonuniform arrays
|
|
|
1997
|
37 |
8 |
p. 1283-
1 p.
|
artikel
|
| 52 |
Inferring coverage probabilities by optimum 3-stage sampling
|
|
|
1997
|
37 |
8 |
p. 1280-
1 p.
|
artikel
|
| 53 |
Interconnect fabrication processes and the development of low-cost wiring for CMOS products
|
|
|
1997
|
37 |
8 |
p. 1285-
1 p.
|
artikel
|
| 54 |
Ion implantation and secondary ion mass spectrometry of compound semiconductors
|
|
|
1997
|
37 |
8 |
p. 1290-
1 p.
|
artikel
|
| 55 |
Low-temperature chemical vapour deposition processes and dielectrics for microelectronic circuit manufacturing at IBM
|
|
|
1997
|
37 |
8 |
p. 1285-1286
2 p.
|
artikel
|
| 56 |
Low-temperature impurity breakdown in semiconductors: an approach towards efficient device simulation
|
|
|
1997
|
37 |
8 |
p. 1289-1290
2 p.
|
artikel
|
| 57 |
Marked graphs and hamiltonian graphs
|
Thirusangu, K.
|
|
1997
|
37 |
8 |
p. 1243-1250
8 p.
|
artikel
|
| 58 |
Millimeter-wave monolithic integrated circuit interconnects using electromagnetic field coupling
|
|
|
1997
|
37 |
8 |
p. 1282-
1 p.
|
artikel
|
| 59 |
Modeling and analysis of multichip module power supply planes
|
|
|
1997
|
37 |
8 |
p. 1283-1284
2 p.
|
artikel
|
| 60 |
Modeling narrow-channel effect in VLSI MESA-isolated SOI MOS devices using a quasi-two-dimensional approach
|
|
|
1997
|
37 |
8 |
p. 1290-
1 p.
|
artikel
|
| 61 |
New approximation for parameters of normal distribution using type II-censored sampling
|
Sultan, A.M.
|
|
1997
|
37 |
8 |
p. 1169-1171
3 p.
|
artikel
|
| 62 |
New nanometer manipulators for surface research
|
|
|
1997
|
37 |
8 |
p. 1290-
1 p.
|
artikel
|
| 63 |
Numerical methods for reliability evaluation of Markov closed fault-tolerant systems
|
|
|
1997
|
37 |
8 |
p. 1279-
1 p.
|
artikel
|
| 64 |
On a two-dissimilar-unit system with three modes and random check
|
Baohe, Su
|
|
1997
|
37 |
8 |
p. 1233-1238
6 p.
|
artikel
|
| 65 |
Optimal configuration of reduntant real-time systems in the face of correlated failure
|
|
|
1997
|
37 |
8 |
p. 1281-
1 p.
|
artikel
|
| 66 |
Optimal test-times for intermittent faults
|
|
|
1997
|
37 |
8 |
p. 1277-
1 p.
|
artikel
|
| 67 |
Periodic boundary conditions for the numerical analysis of semiconductor devices
|
|
|
1997
|
37 |
8 |
p. 1289-
1 p.
|
artikel
|
| 68 |
Phenomenon of resist debris formation in electron-beam lithography and its possible application
|
|
|
1997
|
37 |
8 |
p. 1290-1291
2 p.
|
artikel
|
| 69 |
Plastic packaging is highly reliable
|
|
|
1997
|
37 |
8 |
p. 1286-
1 p.
|
artikel
|
| 70 |
Prediction of equilibrium shapes and pedestal heights to solder joints for leadless chip components
|
|
|
1997
|
37 |
8 |
p. 1276-
1 p.
|
artikel
|
| 71 |
Reinforcing effect of coverlayers on the fatigue life of copper-kapton flex cables
|
|
|
1997
|
37 |
8 |
p. 1276-
1 p.
|
artikel
|
| 72 |
Reliability analysis of a M1 x1 /Mx2/G1, G21 Queueing system with a repairable service station
|
Yue, Dequan
|
|
1997
|
37 |
8 |
p. 1225-1231
7 p.
|
artikel
|
| 73 |
Reliability analysis of software with JUSE-RASI
|
|
|
1997
|
37 |
8 |
p. 1278-1279
2 p.
|
artikel
|
| 74 |
Reliability and availability analysis of two-unit warm standby microcomputer systems with self-reset function and repair facility
|
Tan, Zhi-Bin
|
|
1997
|
37 |
8 |
p. 1251-1253
3 p.
|
artikel
|
| 75 |
Reliability approximation of a Markov queueing system with server breakdown and repair
|
Li, Quan-Lin
|
|
1997
|
37 |
8 |
p. 1203-1212
10 p.
|
artikel
|
| 76 |
Reliability design of current stress in LSI interconnects using the estimation of failure rate due to electromigration
|
Hiraoka, Kazunori
|
|
1997
|
37 |
8 |
p. 1185-1191
7 p.
|
artikel
|
| 77 |
Reliability evaluation of process models
|
|
|
1997
|
37 |
8 |
p. 1280-
1 p.
|
artikel
|
| 78 |
Reliability models of a class of self-healing rings
|
Lee, John
|
|
1997
|
37 |
8 |
p. 1179-1183
5 p.
|
artikel
|
| 79 |
Reliability of a two-way circular consecutively connected system with multistate components
|
Malinowski, Jacek
|
|
1997
|
37 |
8 |
p. 1255-1258
4 p.
|
artikel
|
| 80 |
Reliability prediction using nondestructive accelerated-degradation data: case study on power supplies
|
|
|
1997
|
37 |
8 |
p. 1277-
1 p.
|
artikel
|
| 81 |
Sheet resistance adn layout effects in accelerated tests for dielectric reliability evaluation
|
|
|
1997
|
37 |
8 |
p. 1276-
1 p.
|
artikel
|
| 82 |
Silicides and local interconnections for high-performance VLSI applications
|
|
|
1997
|
37 |
8 |
p. 1284-
1 p.
|
artikel
|
| 83 |
Silicon micromachining technique for fabricating high temperature superconducting microbolometers
|
|
|
1997
|
37 |
8 |
p. 1282-
1 p.
|
artikel
|
| 84 |
Silicon oxide conductivity of hydrogen ion implanted polysilicon thin film transistors
|
|
|
1997
|
37 |
8 |
p. 1290-
1 p.
|
artikel
|
| 85 |
Simulating IC reliability with emphasis on process-flaw related early failures
|
|
|
1997
|
37 |
8 |
p. 1284-
1 p.
|
artikel
|
| 86 |
Single-electron trapping in sub-μm sized MOSFETs
|
|
|
1997
|
37 |
8 |
p. 1289-
1 p.
|
artikel
|
| 87 |
Small pulsed electron-ion sources for radiation technologies and surface modification of materials
|
|
|
1997
|
37 |
8 |
p. 1290-
1 p.
|
artikel
|
| 88 |
SOI (Silicon-on-insulator)—materials and devices
|
|
|
1997
|
37 |
8 |
p. 1290-
1 p.
|
artikel
|
| 89 |
Suggested procedure for preventive maintenance policy
|
El-Damcese, M.A.
|
|
1997
|
37 |
8 |
p. 1173-1177
5 p.
|
artikel
|
| 90 |
The evolution of interconnection technology at IBM
|
|
|
1997
|
37 |
8 |
p. 1282-1283
2 p.
|
artikel
|
| 91 |
The low-frequency noise behaviour of silicon-on-insulator technologies
|
|
|
1997
|
37 |
8 |
p. 1289-
1 p.
|
artikel
|
| 92 |
Three-phase queueing servicing system with renewable servers
|
Metwally, S.A.
|
|
1997
|
37 |
8 |
p. 1259-1266
8 p.
|
artikel
|
| 93 |
Time dependent dielectric breakdown characteristics of MOS capacitors with Si-implanted SiO2
|
|
|
1997
|
37 |
8 |
p. 1277-
1 p.
|
artikel
|
| 94 |
Tutorial: Electrolytic models for metallic electromigration failure mechanisms
|
|
|
1997
|
37 |
8 |
p. 1284-
1 p.
|
artikel
|
| 95 |
Use of failure-intensity models in the software-validation phase for telecommunications
|
|
|
1997
|
37 |
8 |
p. 1280-
1 p.
|
artikel
|
| 96 |
Using system reliability to determine supportability turnaround time at a repair depot
|
|
|
1997
|
37 |
8 |
p. 1280-
1 p.
|
artikel
|
| 97 |
VLSI on-chip interconnection performance simulations and measurements
|
|
|
1997
|
37 |
8 |
p. 1283-
1 p.
|
artikel
|
| 98 |
Weibull component reliability-prediction in the presence of masked data
|
|
|
1997
|
37 |
8 |
p. 1278-
1 p.
|
artikel
|
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