| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A changing paradigm in quality
|
|
|
1997
|
37 |
3 |
p. 529-
1 p.
|
artikel
|
| 2 |
A combined fuzzy-logic and physics-of-failure approach to reliability prediction
|
|
|
1997
|
37 |
3 |
p. 529-
1 p.
|
artikel
|
| 3 |
A correlation study between different types of CDM testers and ‘real’ manufacturing in-line leakage failure
|
|
|
1997
|
37 |
3 |
p. 532-
1 p.
|
artikel
|
| 4 |
A design of experiment analysis of serial EEPROM endurance
|
Wilkie, D.
|
|
1997
|
37 |
3 |
p. 487-491
5 p.
|
artikel
|
| 5 |
A device life cycle analysis of the WSI associative string processor
|
|
|
1997
|
37 |
3 |
p. 533-
1 p.
|
artikel
|
| 6 |
Advanced hand calculations for fault tree analysis and synthesis
|
Schneeweiss, Winfrid G.
|
|
1997
|
37 |
3 |
p. 403-415
13 p.
|
artikel
|
| 7 |
Advanced low-cost bare-DIE packaging technology for liquid crystal displays
|
|
|
1997
|
37 |
3 |
p. 540-
1 p.
|
artikel
|
| 8 |
A maintenance model for two-unit redundant system
|
Lam, Yeh
|
|
1997
|
37 |
3 |
p. 497-504
8 p.
|
artikel
|
| 9 |
A method for determining the fast neutral portion of ion beams
|
|
|
1997
|
37 |
3 |
p. 544-
1 p.
|
artikel
|
| 10 |
A methodology and design tools to support system-level VLSI design
|
|
|
1997
|
37 |
3 |
p. 535-
1 p.
|
artikel
|
| 11 |
Analysis of screening data by using Weibull distribution
|
|
|
1997
|
37 |
3 |
p. 535-
1 p.
|
artikel
|
| 12 |
An empirical model for early resistance changes due to electromigration
|
|
|
1997
|
37 |
3 |
p. 543-
1 p.
|
artikel
|
| 13 |
A new formula and an algorithm for reliability analysis of networks
|
Zhao, Lian-Chang
|
|
1997
|
37 |
3 |
p. 511-518
8 p.
|
artikel
|
| 14 |
A new gate current measurement technique for the characterization of hot-carrier induced degradation in MOSFETs
|
|
|
1997
|
37 |
3 |
p. 544-
1 p.
|
artikel
|
| 15 |
An inspection model with generally distributed restoration and repair times
|
Fung, James
|
|
1997
|
37 |
3 |
p. 381-389
9 p.
|
artikel
|
| 16 |
Approaches to electronic miniaturization
|
|
|
1997
|
37 |
3 |
p. 540-
1 p.
|
artikel
|
| 17 |
A shear-based optimization of adhesive thickness for die bonding
|
|
|
1997
|
37 |
3 |
p. 539-
1 p.
|
artikel
|
| 18 |
A simple technique for obtaining the MTBF of complex systems through numerical integration of the reliability function
|
Burns, R.J.
|
|
1997
|
37 |
3 |
p. 397-401
5 p.
|
artikel
|
| 19 |
A study of polyimide adhesion to epoxy resin in PFP using multivariate analysis of XPS spectra
|
|
|
1997
|
37 |
3 |
p. 539-
1 p.
|
artikel
|
| 20 |
A study of technical terms of failure and fuzzy set theory
|
|
|
1997
|
37 |
3 |
p. 535-
1 p.
|
artikel
|
| 21 |
A study on a method of testing ion migration
|
|
|
1997
|
37 |
3 |
p. 545-
1 p.
|
artikel
|
| 22 |
A symbolic reliability of multiple path required system with three states
|
In-Kyeong Choi,
|
|
1997
|
37 |
3 |
p. 429-435
7 p.
|
artikel
|
| 23 |
A system approach to reliability and life-cycle cost of process safety-systems
|
|
|
1997
|
37 |
3 |
p. 533-
1 p.
|
artikel
|
| 24 |
A test chip design for detecting thin-film cracking in integrated circuits
|
|
|
1997
|
37 |
3 |
p. 531-
1 p.
|
artikel
|
| 25 |
A test for the BMRL-t 0 class
|
Lee, Seung Min
|
|
1997
|
37 |
3 |
p. 457-459
3 p.
|
artikel
|
| 26 |
A VLSI priority packet queue with inheritance and overwrite
|
|
|
1997
|
37 |
3 |
p. 542-
1 p.
|
artikel
|
| 27 |
A wafer level testability approach based on an improved scan insertion technique
|
|
|
1997
|
37 |
3 |
p. 542-
1 p.
|
artikel
|
| 28 |
Bathtub failure rate and upside-down bathtub mean residual life
|
|
|
1997
|
37 |
3 |
p. 536-
1 p.
|
artikel
|
| 29 |
Behaviour of delaminated plastic IC packages subjected to encapsulation cooling, moisture absorption and wave soldering
|
|
|
1997
|
37 |
3 |
p. 541-542
2 p.
|
artikel
|
| 30 |
Best linear unbiased estimator of the Rayleigh scale parameter based on fairly large censored samples
|
|
|
1997
|
37 |
3 |
p. 535-
1 p.
|
artikel
|
| 31 |
Bulk micromachining of Si by lithography and reactive ion etching (LIRIE)
|
|
|
1997
|
37 |
3 |
p. 543-
1 p.
|
artikel
|
| 32 |
Cast: An electrical stress test to monitor single bit failures in flash-EEPROM structures
|
Cappelletti, P.
|
|
1997
|
37 |
3 |
p. 473-481
9 p.
|
artikel
|
| 33 |
Chip scale package: ‘a lightly dressed LSI chip’
|
|
|
1997
|
37 |
3 |
p. 538-
1 p.
|
artikel
|
| 34 |
Comparisons of block diagram and Markov method system reliability and mean time to failure results for constant and non-constant unit failure rates
|
Dhillon, B.S.
|
|
1997
|
37 |
3 |
p. 505-509
5 p.
|
artikel
|
| 35 |
Compound Poisson approximation in reliability theory
|
|
|
1997
|
37 |
3 |
p. 535-
1 p.
|
artikel
|
| 36 |
Cosmic ray induced failures in high power semiconductor devices
|
|
|
1997
|
37 |
3 |
p. 534-
1 p.
|
artikel
|
| 37 |
Deep-level trapping in ion-implanted InP JFETs
|
|
|
1997
|
37 |
3 |
p. 545-
1 p.
|
artikel
|
| 38 |
Defect and fault tolerant interconnection strategies for WASP devices
|
|
|
1997
|
37 |
3 |
p. 533-
1 p.
|
artikel
|
| 39 |
Designing-in of quality through axiomatic design
|
|
|
1997
|
37 |
3 |
p. 538-539
2 p.
|
artikel
|
| 40 |
Design of 0.35-mm pitch QFP lead and its assembly technology
|
|
|
1997
|
37 |
3 |
p. 539-
1 p.
|
artikel
|
| 41 |
Development of 0.45-mm thick ultra-thin small outline package
|
|
|
1997
|
37 |
3 |
p. 540-541
2 p.
|
artikel
|
| 42 |
Die attach failures related to wafer back metal processing—an AES study
|
Radhakrishnan, M.K.
|
|
1997
|
37 |
3 |
p. 519-523
5 p.
|
artikel
|
| 43 |
Differential BiCMOS logic circuits: fault characterization and design-for-testability
|
|
|
1997
|
37 |
3 |
p. 535-536
2 p.
|
artikel
|
| 44 |
Effective erosion rates for selected contact materials in low-voltage contactors
|
|
|
1997
|
37 |
3 |
p. 530-
1 p.
|
artikel
|
| 45 |
Efficient network folding techniques for routing permutations in VLSI
|
|
|
1997
|
37 |
3 |
p. 542-
1 p.
|
artikel
|
| 46 |
Electrical characterisation of integrated circuit metal line thickness
|
|
|
1997
|
37 |
3 |
p. 543-544
2 p.
|
artikel
|
| 47 |
Electrical characteristics of various contact contaminations
|
|
|
1997
|
37 |
3 |
p. 530-
1 p.
|
artikel
|
| 48 |
Electrochemical processes resulting in migrated short failures in microcircuits
|
|
|
1997
|
37 |
3 |
p. 536-
1 p.
|
artikel
|
| 49 |
Enumeration of minimal cuts of modified networks
|
Nahman, J.M.
|
|
1997
|
37 |
3 |
p. 483-485
3 p.
|
artikel
|
| 50 |
Evaluation methods of ion migration by dew condensation cycle test
|
|
|
1997
|
37 |
3 |
p. 542-543
2 p.
|
artikel
|
| 51 |
Failure mechanisms in AlGaAs/GaAs HEMTs
|
|
|
1997
|
37 |
3 |
p. 530-
1 p.
|
artikel
|
| 52 |
Failure mode analysis of AlGaAs/GaAs HBTs using electrostatic discharge method
|
|
|
1997
|
37 |
3 |
p. 543-
1 p.
|
artikel
|
| 53 |
Fuzzy multi-objective optimization decision-making of reliability of series system
|
Huang, H.-Z.
|
|
1997
|
37 |
3 |
p. 447-449
3 p.
|
artikel
|
| 54 |
Gas-assisted evaporative cooling of high density electronic modules
|
|
|
1997
|
37 |
3 |
p. 541-
1 p.
|
artikel
|
| 55 |
Genetic algorithms in optimization of system reliability
|
|
|
1997
|
37 |
3 |
p. 537-
1 p.
|
artikel
|
| 56 |
Goal-seeking problem in discrete event systems simulation
|
Arsham, H.
|
|
1997
|
37 |
3 |
p. 391-395
5 p.
|
artikel
|
| 57 |
Influence of process parameter variations on the signal distribution behaviour of wafer scale integration devices
|
|
|
1997
|
37 |
3 |
p. 541-
1 p.
|
artikel
|
| 58 |
Intelligent materials in future electronics
|
|
|
1997
|
37 |
3 |
p. 537-538
2 p.
|
artikel
|
| 59 |
Introduction to multichip modules
|
Stamenković, Zoran
|
|
1997
|
37 |
3 |
p. 547-
1 p.
|
artikel
|
| 60 |
Ionized dopant concentrations in silicon—an analytical approach
|
|
|
1997
|
37 |
3 |
p. 545-
1 p.
|
artikel
|
| 61 |
Joint reliability-importance of components
|
|
|
1997
|
37 |
3 |
p. 534-
1 p.
|
artikel
|
| 62 |
296 lead fine pitch (0.4 mm) thin plastic QFP package with TAB interconnect
|
|
|
1997
|
37 |
3 |
p. 538-
1 p.
|
artikel
|
| 63 |
Logic synthesis for reliability: an early start to controlling electromigration and hot-carrier effects
|
|
|
1997
|
37 |
3 |
p. 532-
1 p.
|
artikel
|
| 64 |
Long-run availability of a repairable parallel system
|
Vanderperre, E.J.
|
|
1997
|
37 |
3 |
p. 525-527
3 p.
|
artikel
|
| 65 |
Low-cost flip-chip bonding on FR-4 boards
|
|
|
1997
|
37 |
3 |
p. 538-
1 p.
|
artikel
|
| 66 |
Low-cost multichip modules
|
|
|
1997
|
37 |
3 |
p. 540-
1 p.
|
artikel
|
| 67 |
Low-temperature plasma deposition of silicon nitride to produce ultra-reliable, high performance, low cost sealed chip-on-board (SCOB) assemblies
|
|
|
1997
|
37 |
3 |
p. 540-
1 p.
|
artikel
|
| 68 |
Microcrystalline silicon thin films prepared by RF reactive magnetron sputter deposition
|
|
|
1997
|
37 |
3 |
p. 544-
1 p.
|
artikel
|
| 69 |
Microstructure of conductive anodic filaments formed during accelerated testing of printed wiring boards
|
|
|
1997
|
37 |
3 |
p. 531-
1 p.
|
artikel
|
| 70 |
Modelling intermediate tests for fault-tolerant multichip module systems
|
|
|
1997
|
37 |
3 |
p. 530-531
2 p.
|
artikel
|
| 71 |
Moisture sensitivity and reliability of plastic thermally enhanced QFP packages
|
|
|
1997
|
37 |
3 |
p. 531-
1 p.
|
artikel
|
| 72 |
Multiple fault diagnosis in combinational circuits
|
|
|
1997
|
37 |
3 |
p. 535-
1 p.
|
artikel
|
| 73 |
Nondestructive detection of defects in miniaturized multilayer ceramic capacitors using digital speckle correlation techniques
|
|
|
1997
|
37 |
3 |
p. 536-
1 p.
|
artikel
|
| 74 |
Optimal design of flexible and reliable process systems
|
|
|
1997
|
37 |
3 |
p. 533-
1 p.
|
artikel
|
| 75 |
Optimal replacement of an item subject to cumulative damage under periodic inspections
|
Kong, Myung B.
|
|
1997
|
37 |
3 |
p. 467-472
6 p.
|
artikel
|
| 76 |
Popcorning: a failure mechanism in plastic-encapsulated microcircuits
|
|
|
1997
|
37 |
3 |
p. 536-
1 p.
|
artikel
|
| 77 |
Preservation of some partial orderings under non-homogeneous poisson shock model and laplace transform
|
Kan, Cheng
|
|
1997
|
37 |
3 |
p. 451-455
5 p.
|
artikel
|
| 78 |
Process capability analysis for non-normal relay test data
|
Pan, J.N.
|
|
1997
|
37 |
3 |
p. 421-428
8 p.
|
artikel
|
| 79 |
Quality engineering (Taguchi Methods) for the development of electronic circuit technology
|
|
|
1997
|
37 |
3 |
p. 534-
1 p.
|
artikel
|
| 80 |
Quick inspection of power plane short fault on multilayer substrate
|
|
|
1997
|
37 |
3 |
p. 536-
1 p.
|
artikel
|
| 81 |
Reliability analysis of accelerated life-test data from a repairable system
|
|
|
1997
|
37 |
3 |
p. 532-533
2 p.
|
artikel
|
| 82 |
Reliability and quality in design
|
|
|
1997
|
37 |
3 |
p. 529-
1 p.
|
artikel
|
| 83 |
Reliability-estimation and stopping-rules for software testing, based on repeated appearance of bugs
|
|
|
1997
|
37 |
3 |
p. 534-
1 p.
|
artikel
|
| 84 |
Reliability of a linear connected-(r, s)-out-of-(m, n): F lattice system
|
|
|
1997
|
37 |
3 |
p. 533-
1 p.
|
artikel
|
| 85 |
Reliability of electrically conducting knife-edge bearings of switches
|
|
|
1997
|
37 |
3 |
p. 531-
1 p.
|
artikel
|
| 86 |
Reliability of printed wiring boards by thermal shock test
|
|
|
1997
|
37 |
3 |
p. 530-
1 p.
|
artikel
|
| 87 |
Reliability prediction of imperfect switching systems subject to multiple stresses
|
Pan, J.N.
|
|
1997
|
37 |
3 |
p. 439-445
7 p.
|
artikel
|
| 88 |
Selective reactive ion etching on PECVD silicon nitride over amorphous silicon in CF4/H2 and nitrogen containing CF4/H2 plasma gas mixtures
|
|
|
1997
|
37 |
3 |
p. 544-545
2 p.
|
artikel
|
| 89 |
Solder joint reliability of large plastic ball grid array assemblies under bending, twisting, and vibration conditions
|
|
|
1997
|
37 |
3 |
p. 532-
1 p.
|
artikel
|
| 90 |
Solder paste for fine line printing in hybrid microelectronics
|
|
|
1997
|
37 |
3 |
p. 544-
1 p.
|
artikel
|
| 91 |
Some characteristics of a man-machine system operating subject to different weather conditions
|
Mokaddis, G.S.
|
|
1997
|
37 |
3 |
p. 493-496
4 p.
|
artikel
|
| 92 |
Some fundamental aspects of UV laser direct imaging
|
|
|
1997
|
37 |
3 |
p. 544-
1 p.
|
artikel
|
| 93 |
Statistical tools for the rapid development and evaluation of high-reliability products
|
|
|
1997
|
37 |
3 |
p. 537-
1 p.
|
artikel
|
| 94 |
Stochastic modelling of aggregates and products of variable failure rates
|
|
|
1997
|
37 |
3 |
p. 532-
1 p.
|
artikel
|
| 95 |
Studies on design of moisture proof packing for IC packages
|
|
|
1997
|
37 |
3 |
p. 539-
1 p.
|
artikel
|
| 96 |
Surface related degradation of InP-based HEMTs during thermal stress
|
|
|
1997
|
37 |
3 |
p. 543-
1 p.
|
artikel
|
| 97 |
Test vehicle for a wafer-scale field programmable gate array
|
|
|
1997
|
37 |
3 |
p. 542-
1 p.
|
artikel
|
| 98 |
The dependence of etch rate of photo-CVD silicon nitride films on NH4F content in buffered HF
|
|
|
1997
|
37 |
3 |
p. 544-
1 p.
|
artikel
|
| 99 |
The effect of minimal repairs on economic lot-sizing
|
Dagpunar, J.S.
|
|
1997
|
37 |
3 |
p. 417-419
3 p.
|
artikel
|
| 100 |
The methods of reduction in network reliability computing
|
Wang, Wenyi
|
|
1997
|
37 |
3 |
p. 461-465
5 p.
|
artikel
|
| 101 |
Thermal fatigue behaviour of J-lead solder joints
|
|
|
1997
|
37 |
3 |
p. 536-537
2 p.
|
artikel
|
| 102 |
Thermal-mechanical enhanced high-performance silicone gels and elastomeric encapsulants in microelectronic packaging
|
|
|
1997
|
37 |
3 |
p. 541-
1 p.
|
artikel
|
| 103 |
The symmetric M/G/k loss system with heterogeneous servers
|
Fakinos, D.
|
|
1997
|
37 |
3 |
p. 437-438
2 p.
|
artikel
|
| 104 |
Tutorial: corrosion of metallic materials
|
|
|
1997
|
37 |
3 |
p. 529-530
2 p.
|
artikel
|
| 105 |
Ultra-clean processing for ULSI
|
|
|
1997
|
37 |
3 |
p. 538-
1 p.
|
artikel
|
| 106 |
Unavailability analysis of periodically tested standby components
|
|
|
1997
|
37 |
3 |
p. 537-
1 p.
|
artikel
|
| 107 |
Unreplicated experimental designs in reliability-growth programmes
|
|
|
1997
|
37 |
3 |
p. 532-
1 p.
|
artikel
|
| 108 |
Using statistically designed experiments to improve reliability and to achieve robust reliability
|
|
|
1997
|
37 |
3 |
p. 533-534
2 p.
|
artikel
|
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