| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A buffer distribution algorithm for high-performance clock net optimization
|
|
|
1996
|
36 |
4 |
p. 556-557
2 p.
|
artikel
|
| 2 |
A coverage analysis tool for the effective of software testing
|
|
|
1996
|
36 |
4 |
p. 543-
1 p.
|
artikel
|
| 3 |
A four ASIC MCM-C, design for manufacturability and the next generation silicon
|
|
|
1996
|
36 |
4 |
p. 552-553
2 p.
|
artikel
|
| 4 |
A generalized geometric de-eutrophication software-reliability model
|
|
|
1996
|
36 |
4 |
p. 536-
1 p.
|
artikel
|
| 5 |
Algorithms for coupled transient simulation of circuits and complicated 3D packaging
|
|
|
1996
|
36 |
4 |
p. 555-
1 p.
|
artikel
|
| 6 |
A low temperature co-fired ceramic land grid array for high speed digital applications
|
|
|
1996
|
36 |
4 |
p. 546-
1 p.
|
artikel
|
| 7 |
A micromachined array probe card—characterization
|
|
|
1996
|
36 |
4 |
p. 549-
1 p.
|
artikel
|
| 8 |
A micromachined array probe card-fabrication process
|
|
|
1996
|
36 |
4 |
p. 545-
1 p.
|
artikel
|
| 9 |
A modified bathtub curve with latent failures
|
|
|
1996
|
36 |
4 |
p. 534-
1 p.
|
artikel
|
| 10 |
Analysis of TAB inner lead fatigue in thermal cycle environments
|
|
|
1996
|
36 |
4 |
p. 537-
1 p.
|
artikel
|
| 11 |
Analysis technique for real-time, fault-tolerant, VLSI processing arrays
|
|
|
1996
|
36 |
4 |
p. 542-
1 p.
|
artikel
|
| 12 |
An approach to quantifying reliability-growth effectiveness
|
|
|
1996
|
36 |
4 |
p. 542-
1 p.
|
artikel
|
| 13 |
An efficient multi-layer diagonal router for multi-terminal printed circuit boards
|
|
|
1996
|
36 |
4 |
p. 550-
1 p.
|
artikel
|
| 14 |
An exact recursion relation solution for the steady-state surface temperature of a general multilayer structure
|
|
|
1996
|
36 |
4 |
p. 538-
1 p.
|
artikel
|
| 15 |
An investigation of solder joint fatigue using electrical resistance spectroscopy
|
|
|
1996
|
36 |
4 |
p. 534-535
2 p.
|
artikel
|
| 16 |
An O(k3·log( n k )) algorithm for the consecutive-k-out-of-n:F system
|
|
|
1996
|
36 |
4 |
p. 538-
1 p.
|
artikel
|
| 17 |
An O(n·(log 2(n))2) algorithm for computing the reliability of k-out-of-n:G k-to-l-out-of-n:G systems
|
|
|
1996
|
36 |
4 |
p. 537-538
2 p.
|
artikel
|
| 18 |
A novel active area bumped flip chip technology for convergent heat transfer from gallium arsenide power devices
|
|
|
1996
|
36 |
4 |
p. 546-547
2 p.
|
artikel
|
| 19 |
Application boundary-tracking gradient-method for optimizing spares cost for k-out-of-n: G systems
|
|
|
1996
|
36 |
4 |
p. 542-
1 p.
|
artikel
|
| 20 |
Application of fuzzy theory to reliability prediction
|
|
|
1996
|
36 |
4 |
p. 540-
1 p.
|
artikel
|
| 21 |
Approximate analysis of n-unit cold-standby systems
|
Gopalan, M.N.
|
|
1996
|
36 |
4 |
p. 505-509
5 p.
|
artikel
|
| 22 |
A practical methodology for the statistical design of complex logic producfs for performance
|
|
|
1996
|
36 |
4 |
p. 556-
1 p.
|
artikel
|
| 23 |
A reliability study of fuzz button interconnects
|
|
|
1996
|
36 |
4 |
p. 550-
1 p.
|
artikel
|
| 24 |
Artifical neural network techniques for the estimation of thick-film resistance
|
|
|
1996
|
36 |
4 |
p. 560-
1 p.
|
artikel
|
| 25 |
A simple lower bound for reliability of k-out-of-n:G systems
|
|
|
1996
|
36 |
4 |
p. 540-
1 p.
|
artikel
|
| 26 |
Assembly-level reliability: a methodology for effective manufacturing of IC packages
|
|
|
1996
|
36 |
4 |
p. 549-550
2 p.
|
artikel
|
| 27 |
A two-unit duplicating standby system with correlated failure-repair/vbreplacement times
|
Goel, L.R.
|
|
1996
|
36 |
4 |
p. 517-523
7 p.
|
artikel
|
| 28 |
A unified design methodology for CMOS tapered buffers
|
|
|
1996
|
36 |
4 |
p. 557-558
2 p.
|
artikel
|
| 29 |
Behavioural analysis of a shell gasification and carbon recovery process in a urea fertilizer plant
|
Kumar, S.
|
|
1996
|
36 |
4 |
p. 477-480
4 p.
|
artikel
|
| 30 |
Bus-invert coding low-power I/O
|
|
|
1996
|
36 |
4 |
p. 556-
1 p.
|
artikel
|
| 31 |
Calendar of international conference, symposia, lectures and meetings of interest
|
|
|
1996
|
36 |
4 |
p. 577-579
3 p.
|
artikel
|
| 32 |
Carrier and socket technology for high pin count WEP packages
|
|
|
1996
|
36 |
4 |
p. 552-
1 p.
|
artikel
|
| 33 |
C-4/CBGA comparison with other MLC single chip package alternates
|
|
|
1996
|
36 |
4 |
p. 557-
1 p.
|
artikel
|
| 34 |
Characterization and evaluation of the underfill encapsulants for flip chip assembly
|
|
|
1996
|
36 |
4 |
p. 551-
1 p.
|
artikel
|
| 35 |
Characterization of distributions by relationships between failure rate and mean residual life
|
|
|
1996
|
36 |
4 |
p. 537-
1 p.
|
artikel
|
| 36 |
CMOS scaling into the 21st century: 0.1 μm and beyond
|
|
|
1996
|
36 |
4 |
p. 543-
1 p.
|
artikel
|
| 37 |
Concurrent packaging architecture design
|
|
|
1996
|
36 |
4 |
p. 546-
1 p.
|
artikel
|
| 38 |
Conductive adhesives for SMT and potential applications
|
|
|
1996
|
36 |
4 |
p. 554-555
2 p.
|
artikel
|
| 39 |
Consideration of component failure mechanisms in the reliability assessment of electronic equipment— Addressing the constant failure rate assumption
|
|
|
1996
|
36 |
4 |
p. 534-
1 p.
|
artikel
|
| 40 |
Corrosion in plastic packages—sensitive initial delamination recognition
|
|
|
1996
|
36 |
4 |
p. 558-
1 p.
|
artikel
|
| 41 |
Cracking failures in lead-on-chip packages induced by chip backside contamination
|
|
|
1996
|
36 |
4 |
p. 545-
1 p.
|
artikel
|
| 42 |
Cumulative balance testing of logic circuits
|
|
|
1996
|
36 |
4 |
p. 539-
1 p.
|
artikel
|
| 43 |
Cu/photosensitive-BCB thin-film multilayer technology for high-performance multichip modules
|
|
|
1996
|
36 |
4 |
p. 560-
1 p.
|
artikel
|
| 44 |
Demonstrated reliability of plastic-encapsulated microcircuits for missile applications
|
|
|
1996
|
36 |
4 |
p. 535-
1 p.
|
artikel
|
| 45 |
Dependent-faiures in spacecraft: root causes, coupling, factors, defenses and design implications
|
|
|
1996
|
36 |
4 |
p. 541-
1 p.
|
artikel
|
| 46 |
Design and procurement of eutectic Sn Pb solder-bumped flip chip test die and organic substrates
|
|
|
1996
|
36 |
4 |
p. 550-
1 p.
|
artikel
|
| 47 |
Design and realization of high-performance wavepipelined 8 × 8b multiplier in CMOS technology
|
|
|
1996
|
36 |
4 |
p. 557-
1 p.
|
artikel
|
| 48 |
Design at the system level with VLSI CMOS
|
|
|
1996
|
36 |
4 |
p. 555-
1 p.
|
artikel
|
| 49 |
Detection of multiple faults using SSFTS in CMOS logic circuits
|
|
|
1996
|
36 |
4 |
p. 538-
1 p.
|
artikel
|
| 50 |
Determining the duration of a demonstration life-test before all units fail
|
|
|
1996
|
36 |
4 |
p. 543-
1 p.
|
artikel
|
| 51 |
Development of a plastic encapuslated multichip technology for high volume, low cost commercial electronics
|
|
|
1996
|
36 |
4 |
p. 548-549
2 p.
|
artikel
|
| 52 |
Development of conductive adhesive joining for surface-mounting electronics manufacturing
|
|
|
1996
|
36 |
4 |
p. 552-
1 p.
|
artikel
|
| 53 |
Double acceptor (77/200 meV) native defect in GaAs
|
|
|
1996
|
36 |
4 |
p. 559-
1 p.
|
artikel
|
| 54 |
Effects of die coatings, mold compounds, and test conditions on temperature cycling failures
|
|
|
1996
|
36 |
4 |
p. 547-
1 p.
|
artikel
|
| 55 |
Efficient algorithms for k-out-of-n and consecutive weighted-k-out-of-n:F system
|
|
|
1996
|
36 |
4 |
p. 537-
1 p.
|
artikel
|
| 56 |
Electrical characterization of the innerconnected mesh power system (IMPS) MCM topology
|
|
|
1996
|
36 |
4 |
p. 550-551
2 p.
|
artikel
|
| 57 |
Electrical design of an MCM package for a multi-processor digital system
|
|
|
1996
|
36 |
4 |
p. 548-
1 p.
|
artikel
|
| 58 |
Electrically conductive adhesives: a prospective alternative for SMD soldering?
|
|
|
1996
|
36 |
4 |
p. 553-
1 p.
|
artikel
|
| 59 |
Electronic component reliability
|
|
|
1996
|
36 |
4 |
p. 564-565
2 p.
|
artikel
|
| 60 |
Emission microscopes reveal IC defects
|
|
|
1996
|
36 |
4 |
p. 555-
1 p.
|
artikel
|
| 61 |
Environmental stress screening strategies for multi-component systems with Weibull failure-times and imperfect failure detection
|
|
|
1996
|
36 |
4 |
p. 542-
1 p.
|
artikel
|
| 62 |
Environmental stress testing experiment using the Taguchi method
|
|
|
1996
|
36 |
4 |
p. 537-
1 p.
|
artikel
|
| 63 |
ESD in silicon integrated circuits
|
|
|
1996
|
36 |
4 |
p. 563-
1 p.
|
artikel
|
| 64 |
Example of a mixed-signal global positioning system (GPS) receiver using MCM-L packaging
|
|
|
1996
|
36 |
4 |
p. 546-
1 p.
|
artikel
|
| 65 |
Exceptional performance from the development qualification and implementation of a silicone adhesive for bonding heatsinks to semiconductor packages'
|
|
|
1996
|
36 |
4 |
p. 551-
1 p.
|
artikel
|
| 66 |
Fault-tolerant routing algorithms using estimator discretized learning automata for high-speed packet-switched networks
|
|
|
1996
|
36 |
4 |
p. 536-
1 p.
|
artikel
|
| 67 |
Fault-tree analysis: a knowledge-engineering approach
|
|
|
1996
|
36 |
4 |
p. 538-539
2 p.
|
artikel
|
| 68 |
Fine line circuit manufacturing technology with electroless copper plating
|
|
|
1996
|
36 |
4 |
p. 547-
1 p.
|
artikel
|
| 69 |
Flip chip rework process
|
|
|
1996
|
36 |
4 |
p. 551-
1 p.
|
artikel
|
| 70 |
320 Gb/s high-speed ATM switching system hardware technologies based on copper-polyimide MCM
|
|
|
1996
|
36 |
4 |
p. 544-545
2 p.
|
artikel
|
| 71 |
GERT analysis of a two-unit warm standby system with repair
|
Shankar, G.
|
|
1996
|
36 |
4 |
p. 481-484
4 p.
|
artikel
|
| 72 |
Gold wire weakening in the thermosonic bonding of the first bond
|
|
|
1996
|
36 |
4 |
p. 549-
1 p.
|
artikel
|
| 73 |
High reliability internal capacitor of LTCC
|
|
|
1996
|
36 |
4 |
p. 535-
1 p.
|
artikel
|
| 74 |
Hot carrier effect—model, mechanism and effects on C-V and I-V characteristics in MOS structures
|
Cezhou, Zhao
|
|
1996
|
36 |
4 |
p. 493-496
4 p.
|
artikel
|
| 75 |
Improvement in reliability of n-MOSFETs by using rapid thermal N2O-reoxidized nitrided gate oxides
|
|
|
1996
|
36 |
4 |
p. 559-
1 p.
|
artikel
|
| 76 |
Infinite-failure models for a finite world: a simulation study of fault discovery
|
|
|
1996
|
36 |
4 |
p. 541-
1 p.
|
artikel
|
| 77 |
Influence of etching on the surface properties of Cd0.99Mn0.01Te gallium doped
|
|
|
1996
|
36 |
4 |
p. 559-
1 p.
|
artikel
|
| 78 |
In-situ temperature cleaning of silicon surfaces using hydrogen atoms
|
|
|
1996
|
36 |
4 |
p. 558-
1 p.
|
artikel
|
| 79 |
Integrated cost and productivity learning in CMOS semiconductor manufacturing
|
|
|
1996
|
36 |
4 |
p. 544-
1 p.
|
artikel
|
| 80 |
Integrated flex: rigid-flex capability in a high performance MCM
|
|
|
1996
|
36 |
4 |
p. 545-546
2 p.
|
artikel
|
| 81 |
Interconnect design with VLSI CMOS
|
|
|
1996
|
36 |
4 |
p. 557-
1 p.
|
artikel
|
| 82 |
Interfacial recombination of current carriers: influence on magnetoconcentration effect in semiconductor heterostructure
|
|
|
1996
|
36 |
4 |
p. 559-
1 p.
|
artikel
|
| 83 |
Large area fine line patterning by scanning projection lithography
|
|
|
1996
|
36 |
4 |
p. 547-548
2 p.
|
artikel
|
| 84 |
Large format fabrication—a practical approach to low cot MCM-D
|
|
|
1996
|
36 |
4 |
p. 549-
1 p.
|
artikel
|
| 85 |
Latent design faults in the development of the multiflow TRACE/200
|
|
|
1996
|
36 |
4 |
p. 537-
1 p.
|
artikel
|
| 86 |
Latent open defect detection using phase-sensitive nonlinearity detection technqiue
|
|
|
1996
|
36 |
4 |
p. 539-
1 p.
|
artikel
|
| 87 |
Liquid cooling performance for a 3D multichip module and miniature heat sink
|
|
|
1996
|
36 |
4 |
p. 548-
1 p.
|
artikel
|
| 88 |
Low-cost molded packaging for optical data links
|
|
|
1996
|
36 |
4 |
p. 551-552
2 p.
|
artikel
|
| 89 |
Manufacturability of capacitively coupled multichip modules
|
|
|
1996
|
36 |
4 |
p. 556-
1 p.
|
artikel
|
| 90 |
MCM-LD: large area procesisng using photosensitive — BCB
|
|
|
1996
|
36 |
4 |
p. 558-
1 p.
|
artikel
|
| 91 |
MCM-L product development process for low-cost MCM's
|
|
|
1996
|
36 |
4 |
p. 545-
1 p.
|
artikel
|
| 92 |
MCM-L Technology: a systems cost analysis for a high volume automotive electronic applications
|
|
|
1996
|
36 |
4 |
p. 548-
1 p.
|
artikel
|
| 93 |
MCM substrate with high capacitance
|
|
|
1996
|
36 |
4 |
p. 558-
1 p.
|
artikel
|
| 94 |
Mechanical and electrical evaluation of a bumped-substrate die-level burn-in
|
|
|
1996
|
36 |
4 |
p. 553-554
2 p.
|
artikel
|
| 95 |
Modelling joining materials for microelectronics packaging
|
|
|
1996
|
36 |
4 |
p. 554-
1 p.
|
artikel
|
| 96 |
On modification of the relative complexity metric
|
Meitzler, Thomas
|
|
1996
|
36 |
4 |
p. 469-475
7 p.
|
artikel
|
| 97 |
On reliability growth testing
|
|
|
1996
|
36 |
4 |
p. 541-
1 p.
|
artikel
|
| 98 |
On the reliability of links in a ring network E. Abuelyaman Microelectronics and reliability, vol. 33, no. 6, pp: 813–826 (1993)
|
Lee, John
|
|
1996
|
36 |
4 |
p. 561-562
2 p.
|
artikel
|
| 99 |
On the transient behaviour of a repairable system with a warm standby
|
Gopalan, M.N.
|
|
1996
|
36 |
4 |
p. 525-532
8 p.
|
artikel
|
| 100 |
Open repair technologies for MCM-D
|
|
|
1996
|
36 |
4 |
p. 534-
1 p.
|
artikel
|
| 101 |
Optimal preventive-replacement intervals for the Weibull life distribution: solutions and applications
|
|
|
1996
|
36 |
4 |
p. 539-
1 p.
|
artikel
|
| 102 |
Optimum constant-stress accelerated life-test plans
|
|
|
1996
|
36 |
4 |
p. 540-541
2 p.
|
artikel
|
| 103 |
Performance and reliability of optical fibre connectors in the outside plant environment
|
|
|
1996
|
36 |
4 |
p. 535-
1 p.
|
artikel
|
| 104 |
Performance, wireability, and cooling tradeoffs for planar and 3D packaging architecture
|
|
|
1996
|
36 |
4 |
p. 553-
1 p.
|
artikel
|
| 105 |
Physical models and algorithms for optoelectronic MCM layout
|
|
|
1996
|
36 |
4 |
p. 552-
1 p.
|
artikel
|
| 106 |
Potential barrier relations for low carrier injection at semiconductor surfaces of microelectronic devices and ICs
|
|
|
1996
|
36 |
4 |
p. 559-
1 p.
|
artikel
|
| 107 |
Power cycling and stress variation in a multichip module
|
|
|
1996
|
36 |
4 |
p. 539-
1 p.
|
artikel
|
| 108 |
Preparation and characterization of germanium substrates for MIS electronic devices
|
|
|
1996
|
36 |
4 |
p. 558-559
2 p.
|
artikel
|
| 109 |
Process optimization for polysilicon-thermal oxide-polysilicon capacitors
|
|
|
1996
|
36 |
4 |
p. 536-
1 p.
|
artikel
|
| 110 |
Properties of the Akaike information criterion
|
Awad, Adnan M.
|
|
1996
|
36 |
4 |
p. 457-464
8 p.
|
artikel
|
| 111 |
Publications, notices, calls for papers, etc
|
|
|
1996
|
36 |
4 |
p. 567-576
10 p.
|
artikel
|
| 112 |
Rationalizing scheduled-maintenance requirements using reliability centered maintenance—A Canadian Air Force perspective
|
|
|
1996
|
36 |
4 |
p. 539-
1 p.
|
artikel
|
| 113 |
Reliability and performance evaluation of four tree multistage interconnection network
|
Bansal, Savina
|
|
1996
|
36 |
4 |
p. 511-515
5 p.
|
artikel
|
| 114 |
Reliability assessment of isotropically conductive adhesive joints surface mount applications
|
|
|
1996
|
36 |
4 |
p. 553-
1 p.
|
artikel
|
| 115 |
Reliability AuSn flip-chip bonding on flexible prints
|
|
|
1996
|
36 |
4 |
p. 554-
1 p.
|
artikel
|
| 116 |
Reliability-centred test
|
|
|
1996
|
36 |
4 |
p. 541-
1 p.
|
artikel
|
| 117 |
Reliability comparison of two metallurgies for ceramic ball grid array
|
|
|
1996
|
36 |
4 |
p. 544-
1 p.
|
artikel
|
| 118 |
Reliability comparisons for plastic-encapsulated microcircuits
|
|
|
1996
|
36 |
4 |
p. 534-
1 p.
|
artikel
|
| 119 |
Reliability development and qualification of a low-cost PQFB-based MCM
|
|
|
1996
|
36 |
4 |
p. 536-537
2 p.
|
artikel
|
| 120 |
Reliability issues of replacing solder with conductive adhesives in power modules
|
|
|
1996
|
36 |
4 |
p. 534-
1 p.
|
artikel
|
| 121 |
Reliability of mobile phones
|
|
|
1996
|
36 |
4 |
p. 540-
1 p.
|
artikel
|
| 122 |
Reliability prediction and estimation of prolog programmes
|
|
|
1996
|
36 |
4 |
p. 538-
1 p.
|
artikel
|
| 123 |
Reliability study of aluminum electrolytic capacitors for space use
|
|
|
1996
|
36 |
4 |
p. 535-
1 p.
|
artikel
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Reliability test on chip type of high capacitance multilayer ceramic capcitors
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1996
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36 |
4 |
p. 535-
1 p.
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artikel
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| 125 |
Simulating transient-state system effectiveness for human-machine systems
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1996
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36 |
4 |
p. 544-
1 p.
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artikel
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| 126 |
Simulation of high speed interconnects using a convolution-based hierarchical packaging simulator
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1996
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36 |
4 |
p. 545-
1 p.
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artikel
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| 127 |
Simultaneous development and qualification in the fast-changing 3.5″ hard-disk-drive technology
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1996
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36 |
4 |
p. 533-
1 p.
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artikel
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Software reliability growth supermodels
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Popenţiu, Fl.
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1996
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36 |
4 |
p. 485-491
7 p.
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artikel
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| 129 |
Some characteristics of a two-dissimilar-unit cold standby redundant system with three modes
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Mokaddis, G.S.
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1996
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36 |
4 |
p. 497-503
7 p.
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artikel
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| 130 |
Some new reliability problems and results for one-unit repairable system
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Ying Hui Tang,
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1996
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36 |
4 |
p. 465-468
4 p.
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artikel
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| 131 |
Substrate thickness optimization for liquid immersion cooled silicon multichip modules
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1996
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36 |
4 |
p. 548-
1 p.
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artikel
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| 132 |
System level hardware module generation
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1996
|
36 |
4 |
p. 555-556
2 p.
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artikel
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| 133 |
System reliability analysis of an N-Version programming application
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1996
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36 |
4 |
p. 541-
1 p.
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artikel
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| 134 |
Technology CAD at AT&T
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1996
|
36 |
4 |
p. 543-544
2 p.
|
artikel
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| 135 |
Testing constant failure rate against NBAFR alternatives with randomly right-censored data
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1996
|
36 |
4 |
p. 536-
1 p.
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artikel
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| 136 |
The benefits of stress testing
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1996
|
36 |
4 |
p. 543-
1 p.
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artikel
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| 137 |
The effect of self-ions bombardment on the structure and properties of thin metal films
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1996
|
36 |
4 |
p. 560-
1 p.
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artikel
|
| 138 |
The effect of wirebond geometry and die setting on wire sweep
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1996
|
36 |
4 |
p. 550-
1 p.
|
artikel
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| 139 |
The evolution of IBM CMOS DRAM technology
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1996
|
36 |
4 |
p. 544-
1 p.
|
artikel
|
| 140 |
Theory of the drain leakage current in silicon MOSFETs
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1996
|
36 |
4 |
p. 559-
1 p.
|
artikel
|
| 141 |
The reliability of aluminum metallization with a polyimide passivation
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1996
|
36 |
4 |
p. 554-
1 p.
|
artikel
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| 142 |
Thermal characterization of a tape carrier packages
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1996
|
36 |
4 |
p. 548-
1 p.
|
artikel
|
| 143 |
Thermal enhancement of plastic IC packages
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1996
|
36 |
4 |
p. 547-
1 p.
|
artikel
|
| 144 |
Thermal modelling and experimental characterization of the C4/surface-mount-array interconnect technologies
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1996
|
36 |
4 |
p. 556-
1 p.
|
artikel
|
| 145 |
Thermocompression bonding effects on bump-pad adhesion
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1996
|
36 |
4 |
p. 550-
1 p.
|
artikel
|
| 146 |
Thick-film resistor/dielectric interactions in a low temperature co-fired ceramic package
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1996
|
36 |
4 |
p. 560-
1 p.
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artikel
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| 147 |
Thin-film decoupling capacitors for multichip modules
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1996
|
36 |
4 |
p. 559-560
2 p.
|
artikel
|
| 148 |
Thin film transfer process for low cost MCM-D fabrication
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1996
|
36 |
4 |
p. 560-
1 p.
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artikel
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| 149 |
Time-varying failure rates in the availability and reliability analysis of repairable systems
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1996
|
36 |
4 |
p. 540-
1 p.
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artikel
|
| 150 |
To cut or not cut: a thermomechanical stress analysis of polyimide thin-film on ceramic structures
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1996
|
36 |
4 |
p. 547-
1 p.
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artikel
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| 151 |
Ultra-fine particle circuits and multi-chip modules
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1996
|
36 |
4 |
p. 555-
1 p.
|
artikel
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| 152 |
Vibration fatigue of surface mount technology (SMT) solder joints
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|
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1996
|
36 |
4 |
p. 533-
1 p.
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