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                             20 results found
no title author magazine year volume issue page(s) type
1 A comparison of MOSFETs aging under d.c., a.c. and alternating stress conditions Revil, Nathalie
1993
33 11-12 p. 1909-1919
11 p.
article
2 An investigation of hot carrier effects in submicron CMOS integrated circuits Fang, Peng
1993
33 11-12 p. 1713-1727
15 p.
article
3 Application of the atomic force microscope to integrated circuit failure analysis Rodgers, Mark R.
1993
33 11-12 p. 1947-1956
10 p.
article
4 Characterisation of electromigration damage by multiple electrical measurements Jones, B.K.
1993
33 11-12 p. 1829-1840
12 p.
article
5 Dielectric integrity of thin thermal oxides on silicon Brożek, Tomasz
1993
33 11-12 p. 1637-1656
20 p.
article
6 Dynamic effects in hot-carrier degradation relevant for CMOS operation Weber, W.
1993
33 11-12 p. 1729-1736
8 p.
article
7 Editorial Stojadinović, N.D.
1993
33 11-12 p. 1635-1636
2 p.
article
8 Electromigration in thin-films for microelectronics Baldini, G.L.
1993
33 11-12 p. 1779-1805
27 p.
article
9 Hot-carrier effects in scaled MOS devices Takeda, Eiji
1993
33 11-12 p. 1687-1711
25 p.
article
10 Hot-carrier effects on leakage currents in MOSFETs—Modelling and experiment Oualid, J.
1993
33 11-12 p. 1759-1777
19 p.
article
11 Implications of a localised defect model for wafer level reliability measurements of thin dielectrics O'Sullivan, Paula
1993
33 11-12 p. 1679-1685
7 p.
article
12 Influence of series resistance in oxide parameter extraction data from accelerated tests Pio, F.
1993
33 11-12 p. 1657-1663
7 p.
article
13 On the status of wafer-level metal integrity testing Dion, Michael J.
1993
33 11-12 p. 1807-1827
21 p.
article
14 Reliability issues in submicron MOSFETs with oxynitride gate dielectrics Joshi, Aniruddha B.
1993
33 11-12 p. 1845-1866
22 p.
article
15 Reliability issues of offset drain transistors after different modes of static electrical stress Papadas, C.
1993
33 11-12 p. 1921-1933
13 p.
article
16 Reliability issues of silicon-dioxide structures—Application to FLOTOX EEPROM cells Papadas, C.
1993
33 11-12 p. 1867-1908
42 p.
article
17 Resistance decay after electromigration as the effect of mechanical stress relaxation Baldini, G.L.
1993
33 11-12 p. 1841-1844
4 p.
article
18 Statistical modelling of time dependent oxide breakdown distributions Vollertsen, R.-P.
1993
33 11-12 p. 1665-1677
13 p.
article
19 The in-process bond shear test: Its relationship to ball bond reliability and its application to the reduction of wirebond process variation Guzman, Melissa Shell-De
1993
33 11-12 p. 1935-1946
12 p.
article
20 Transient hot-electron effect and its impact on circuit reliability Wang, Hai
1993
33 11-12 p. 1737-1758
22 p.
article
                             20 results found
 
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