| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A comparison of radiation and hot-electron-induced damages in MOS capacitors with rapid thermally nitrided thin-gate oxides
|
|
|
1992
|
32 |
9 |
p. 1343-
1 p.
|
artikel
|
| 2 |
A comprehensive approach for the analysis of package induced stress in ICs using analytical and empirical methods
|
|
|
1992
|
32 |
9 |
p. 1333-
1 p.
|
artikel
|
| 3 |
A computer approach for reliability evaluation of telecommunication networks with heterogeneous link-capacities
|
|
|
1992
|
32 |
9 |
p. 1335-
1 p.
|
artikel
|
| 4 |
A computer program for component life estimation using multiply censored system life data
|
|
|
1992
|
32 |
9 |
p. 1332-
1 p.
|
artikel
|
| 5 |
Advanced ceramic substrates for multichip modules with multilevel thin film interconnects
|
|
|
1992
|
32 |
9 |
p. 1346-
1 p.
|
artikel
|
| 6 |
A generic computer simulation model to characterize photolithography manufacturing area in an IC FAB facility
|
|
|
1992
|
32 |
9 |
p. 1339-
1 p.
|
artikel
|
| 7 |
A multi-period design model for survivable network architecture selection for SONET interoffice networks
|
|
|
1992
|
32 |
9 |
p. 1336-
1 p.
|
artikel
|
| 8 |
An additional temperature increase within GaAs/(AlGa)As diode lasers caused by the deterioration of an indium solder
|
|
|
1992
|
32 |
9 |
p. 1347-
1 p.
|
artikel
|
| 9 |
An age replacement policy with minimal repair and general random repair cost
|
Sheu, Shey-Huei
|
|
1992
|
32 |
9 |
p. 1283-1289
7 p.
|
artikel
|
| 10 |
An algorithm for designing rings for survivable fiber networks
|
|
|
1992
|
32 |
9 |
p. 1332-
1 p.
|
artikel
|
| 11 |
Analysis of alternative rework strategies for printed wiring assembly manufacturing systems
|
|
|
1992
|
32 |
9 |
p. 1337-
1 p.
|
artikel
|
| 12 |
Analyzing quality for better testing
|
|
|
1992
|
32 |
9 |
p. 1334-
1 p.
|
artikel
|
| 13 |
An efficient approach for channel routing in VLSI
|
|
|
1992
|
32 |
9 |
p. 1343-
1 p.
|
artikel
|
| 14 |
An empirical study on complexity metrics of Petri nets
|
Lee, Gang Soo
|
|
1992
|
32 |
9 |
p. 1215-1221
7 p.
|
artikel
|
| 15 |
An expert aid to fault diagnosis and trouble-shooting in satellite communications
|
|
|
1992
|
32 |
9 |
p. 1336-
1 p.
|
artikel
|
| 16 |
An expert system framework for machine fault diagnosis
|
|
|
1992
|
32 |
9 |
p. 1334-
1 p.
|
artikel
|
| 17 |
An interarrival hyperexponential machine interference with balking and reneging
|
Abou El-Ata, M.O.
|
|
1992
|
32 |
9 |
p. 1251-1256
6 p.
|
artikel
|
| 18 |
An overview of X-ray lithography for use in semiconductor device preparation
|
|
|
1992
|
32 |
9 |
p. 1344-
1 p.
|
artikel
|
| 19 |
A precision vertical interconnect technology
|
|
|
1992
|
32 |
9 |
p. 1337-
1 p.
|
artikel
|
| 20 |
A process control methodology applied to manufacturing GaAs MMICs
|
|
|
1992
|
32 |
9 |
p. 1342-
1 p.
|
artikel
|
| 21 |
A proposed approach to computer-supported TQM in maintenance work induction and accomplishment
|
|
|
1992
|
32 |
9 |
p. 1335-
1 p.
|
artikel
|
| 22 |
A transistor fault model for nMOS combinational circuits
|
|
|
1992
|
32 |
9 |
p. 1335-
1 p.
|
artikel
|
| 23 |
A two-unit cold standby system with major and minor failures and preparation time in the case of major failure
|
Rander, M.C.
|
|
1992
|
32 |
9 |
p. 1199-1204
6 p.
|
artikel
|
| 24 |
Automatic resistor-generation and thick film circuit layout using the Magic layout editor
|
|
|
1992
|
32 |
9 |
p. 1345-
1 p.
|
artikel
|
| 25 |
Availability for 2/n: F and secondary subsystems with general repair-time distributions and shut-off rules
|
Chen, Yow-Mow
|
|
1992
|
32 |
9 |
p. 1257-1270
14 p.
|
artikel
|
| 26 |
Breakdown voltage of diffused epitaxial junctions
|
|
|
1992
|
32 |
9 |
p. 1344-
1 p.
|
artikel
|
| 27 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1992
|
32 |
9 |
p. 1327-1329
3 p.
|
artikel
|
| 28 |
Catastrophic damage in diode lasers caused by an increase in their facet reflectivity
|
|
|
1992
|
32 |
9 |
p. 1331-
1 p.
|
artikel
|
| 29 |
Causes of cracks in SMD and type specific remedies
|
|
|
1992
|
32 |
9 |
p. 1338-
1 p.
|
artikel
|
| 30 |
CEPT—a computer-aided manufacturing application for managing equipment reliability and availability in the semiconductor industry
|
|
|
1992
|
32 |
9 |
p. 1331-
1 p.
|
artikel
|
| 31 |
Characterization of a JFET operational amplifier by planned experimentation and its impact on IC manufacturing
|
|
|
1992
|
32 |
9 |
p. 1342-
1 p.
|
artikel
|
| 32 |
Closed-form analytical solutions for avalanche breakdown quantities in high-voltage diffused junctions
|
|
|
1992
|
32 |
9 |
p. 1344-
1 p.
|
artikel
|
| 33 |
Combination of numerical and experimental methods for stress analysis of small electronic components
|
|
|
1992
|
32 |
9 |
p. 1333-
1 p.
|
artikel
|
| 34 |
Composite solders
|
|
|
1992
|
32 |
9 |
p. 1342-
1 p.
|
artikel
|
| 35 |
Computer integrated manufacturing and networking in advanced IC manufacturing
|
|
|
1992
|
32 |
9 |
p. 1337-
1 p.
|
artikel
|
| 36 |
Computerized tolerance techniques
|
|
|
1992
|
32 |
9 |
p. 1334-1335
2 p.
|
artikel
|
| 37 |
Computer vision for quality control in automated manufacturing systems
|
|
|
1992
|
32 |
9 |
p. 1338-
1 p.
|
artikel
|
| 38 |
Data flow model of a total service quality management system
|
|
|
1992
|
32 |
9 |
p. 1335-1336
2 p.
|
artikel
|
| 39 |
Defect size distribution in VLSI chips
|
|
|
1992
|
32 |
9 |
p. 1332-
1 p.
|
artikel
|
| 40 |
3-D electromagnetic field analysis of interconnections in copper-polyimide multichip modules
|
|
|
1992
|
32 |
9 |
p. 1341-
1 p.
|
artikel
|
| 41 |
Design of a VLSI digit slicing fast Fourier transform processor
|
|
|
1992
|
32 |
9 |
p. 1343-
1 p.
|
artikel
|
| 42 |
Design of metallizations and components for aluminum nitride packages for VLSIC
|
|
|
1992
|
32 |
9 |
p. 1340-
1 p.
|
artikel
|
| 43 |
Design of survivable communications networks under performance constraints
|
|
|
1992
|
32 |
9 |
p. 1343-
1 p.
|
artikel
|
| 44 |
Determination of the trapped charge distribution in scaled silicon nitride MONOS nonvolatile memory devices by tunneling spectroscopy
|
|
|
1992
|
32 |
9 |
p. 1343-
1 p.
|
artikel
|
| 45 |
Development of temperature-stable thick-film dielectrics: III. Role of glass on the microstructure evolution of a thick-film dielectric
|
|
|
1992
|
32 |
9 |
p. 1345-
1 p.
|
artikel
|
| 46 |
Downward laser trimming of thick film resistors
|
|
|
1992
|
32 |
9 |
p. 1346-
1 p.
|
artikel
|
| 47 |
Effect of component interactions on the removal of organic impurities in ultrapure water systems
|
|
|
1992
|
32 |
9 |
p. 1333-
1 p.
|
artikel
|
| 48 |
Effects of backend processing on counter-doped N+ poly-Si resistance
|
|
|
1992
|
32 |
9 |
p. 1343-
1 p.
|
artikel
|
| 49 |
Electroplated solder joints for flip-chip applications
|
|
|
1992
|
32 |
9 |
p. 1338-
1 p.
|
artikel
|
| 50 |
Enhanced conductivity and breakdown of oxides grown on heavily implanted substrates
|
|
|
1992
|
32 |
9 |
p. 1347-
1 p.
|
artikel
|
| 51 |
Enhanced self-test techniques for VLSI systems applied to the IBM enterprise system/9000 type 9121 processor
|
|
|
1992
|
32 |
9 |
p. 1335-
1 p.
|
artikel
|
| 52 |
ESD degradation in GaAs MES structures
|
|
|
1992
|
32 |
9 |
p. 1344-
1 p.
|
artikel
|
| 53 |
Evaluation of modelling refinements on work sampling statistics
|
|
|
1992
|
32 |
9 |
p. 1334-
1 p.
|
artikel
|
| 54 |
Exhaust gas detoxifying systems used in microelectronics
|
|
|
1992
|
32 |
9 |
p. 1338-
1 p.
|
artikel
|
| 55 |
Fault tolerant packet-switched network design and its sensitivity
|
|
|
1992
|
32 |
9 |
p. 1333-
1 p.
|
artikel
|
| 56 |
Fine pitch wire bonding development using a new multipurpose, multipad pitch test die
|
|
|
1992
|
32 |
9 |
p. 1339-
1 p.
|
artikel
|
| 57 |
Flexible connectors adapt to SMT requirements
|
|
|
1992
|
32 |
9 |
p. 1343-
1 p.
|
artikel
|
| 58 |
Fusion: a plan for developing a familiar user system interface for the IC fabrication industry
|
|
|
1992
|
32 |
9 |
p. 1339-1340
2 p.
|
artikel
|
| 59 |
Fuzzy reliability modelling — Linguistic approach
|
Ramachandran, V.
|
|
1992
|
32 |
9 |
p. 1311-1318
8 p.
|
artikel
|
| 60 |
GaAs-GaInP multilayers for high performance electronic devices
|
|
|
1992
|
32 |
9 |
p. 1340-
1 p.
|
artikel
|
| 61 |
Generation of vertex and edge cutsets
|
Prasad, V.C.
|
|
1992
|
32 |
9 |
p. 1291-1310
20 p.
|
artikel
|
| 62 |
Grain boundary sliding in surface mount solders during thermal cycling
|
|
|
1992
|
32 |
9 |
p. 1337-1338
2 p.
|
artikel
|
| 63 |
Hermetic sealing process with atmospheric pressure vibration for LSI packages
|
|
|
1992
|
32 |
9 |
p. 1338-1339
2 p.
|
artikel
|
| 64 |
High density microelectronic packaging with thick film hermetic packages
|
|
|
1992
|
32 |
9 |
p. 1344-1345
2 p.
|
artikel
|
| 65 |
Highly reliable Au-Sn eutectic bonding with background GaAs LSI chips
|
|
|
1992
|
32 |
9 |
p. 1339-
1 p.
|
artikel
|
| 66 |
High mechanical reliability of back-ground GaAs LSI chips with low thermal resistance
|
|
|
1992
|
32 |
9 |
p. 1332-1333
2 p.
|
artikel
|
| 67 |
Hybrid IC makers embrace “small is good” trends
|
|
|
1992
|
32 |
9 |
p. 1346-
1 p.
|
artikel
|
| 68 |
Implementing total quality management at the U.S. Department of Defense
|
|
|
1992
|
32 |
9 |
p. 1337-
1 p.
|
artikel
|
| 69 |
Improved thermal conductivity in microelectronic encapsulants
|
|
|
1992
|
32 |
9 |
p. 1341-
1 p.
|
artikel
|
| 70 |
Improvements in wire bonding and solderability of surface mount components using plasma cleaning techniques
|
|
|
1992
|
32 |
9 |
p. 1340-1341
2 p.
|
artikel
|
| 71 |
Improving hot-electron hardness of narrow channel MOSFETs by fluorine implantation
|
|
|
1992
|
32 |
9 |
p. 1343-
1 p.
|
artikel
|
| 72 |
Improving manufacturing reliability in IC package assembly using the FMEA technique
|
|
|
1992
|
32 |
9 |
p. 1341-
1 p.
|
artikel
|
| 73 |
Incorporation of impurities in GaAs grown by MOCVD
|
|
|
1992
|
32 |
9 |
p. 1344-
1 p.
|
artikel
|
| 74 |
Influence of environment on the fatigue of Pb-Sn solder joints
|
|
|
1992
|
32 |
9 |
p. 1341-
1 p.
|
artikel
|
| 75 |
Integrating economics into quality control charts
|
|
|
1992
|
32 |
9 |
p. 1331-
1 p.
|
artikel
|
| 76 |
Interconnection techniques for GaAs packaging
|
|
|
1992
|
32 |
9 |
p. 1338-
1 p.
|
artikel
|
| 77 |
Investigations of laser soldered TAB inner lead contacts
|
|
|
1992
|
32 |
9 |
p. 1346-1347
2 p.
|
artikel
|
| 78 |
Kinetics of triode mode reactive ion etching of Si(100) wafers by chlorine plasmas: temperature and d.c. self-bias effects
|
|
|
1992
|
32 |
9 |
p. 1347-
1 p.
|
artikel
|
| 79 |
Low-temperature degradation studies of AlGaAs/GaAs modulation-doped field effect transistors
|
|
|
1992
|
32 |
9 |
p. 1332-
1 p.
|
artikel
|
| 80 |
Mechanical behaviour of ceramic capacitors
|
|
|
1992
|
32 |
9 |
p. 1332-
1 p.
|
artikel
|
| 81 |
Metallurgical changes in tin-lead platings due to heat ageing
|
|
|
1992
|
32 |
9 |
p. 1341-1342
2 p.
|
artikel
|
| 82 |
Method for controlling the manufacturing quality of diode lasers based on investigations of their transient thermal properties
|
|
|
1992
|
32 |
9 |
p. 1347-
1 p.
|
artikel
|
| 83 |
Microelectronics technology takes on hybrid ICs
|
|
|
1992
|
32 |
9 |
p. 1346-
1 p.
|
artikel
|
| 84 |
Microstructural evolution in Sn/Pb solder and Pd/Ag thick film conductor metallization
|
|
|
1992
|
32 |
9 |
p. 1346-
1 p.
|
artikel
|
| 85 |
Modelling the sidewall masked oxidation process using the boundary element method
|
|
|
1992
|
32 |
9 |
p. 1340-
1 p.
|
artikel
|
| 86 |
Multilayer ceramic chip capacitors gain acceptance
|
|
|
1992
|
32 |
9 |
p. 1332-
1 p.
|
artikel
|
| 87 |
Multi-ring structures for contact resistance measurements on metal-thin-layer semiconductors
|
|
|
1992
|
32 |
9 |
p. 1343-
1 p.
|
artikel
|
| 88 |
New applications of low temperature PECVD silicon nitride films for microelectronics device fabrication
|
|
|
1992
|
32 |
9 |
p. 1338-
1 p.
|
artikel
|
| 89 |
New physical model of multiplication-induced breakdown in MOSFETs
|
|
|
1992
|
32 |
9 |
p. 1344-
1 p.
|
artikel
|
| 90 |
New trimming technology of a thick film resistor by the pulse voltage method
|
|
|
1992
|
32 |
9 |
p. 1345-
1 p.
|
artikel
|
| 91 |
Note on MTBF versus mean-wear-life versus Mil-Hdbk-217
|
Badenius, Duncan
|
|
1992
|
32 |
9 |
p. 1241-1242
2 p.
|
artikel
|
| 92 |
Object oriented programming approach for quality improvement based on systematic diagram method
|
|
|
1992
|
32 |
9 |
p. 1331-
1 p.
|
artikel
|
| 93 |
On Murphy's yield integral
|
|
|
1992
|
32 |
9 |
p. 1336-
1 p.
|
artikel
|
| 94 |
On the development of chip-net
|
|
|
1992
|
32 |
9 |
p. 1338-
1 p.
|
artikel
|
| 95 |
Optimization of GaAs-on-silicon MESFET structures
|
|
|
1992
|
32 |
9 |
p. 1338-
1 p.
|
artikel
|
| 96 |
Optimization of interconnect thickness for minimum propagation delays in VLSI
|
|
|
1992
|
32 |
9 |
p. 1339-
1 p.
|
artikel
|
| 97 |
Palladium as a lead finish for surface mount integrated circuit packages
|
|
|
1992
|
32 |
9 |
p. 1340-
1 p.
|
artikel
|
| 98 |
Parametric empirical Bayes approach to reliability analysis for the geometric life model
|
Tyagi, Ravindra K.
|
|
1992
|
32 |
9 |
p. 1271-1282
12 p.
|
artikel
|
| 99 |
Photoresist silylation and dry development for sub-micron photolithography
|
|
|
1992
|
32 |
9 |
p. 1341-
1 p.
|
artikel
|
| 100 |
Polymer thick film technology in telecommunication applications
|
|
|
1992
|
32 |
9 |
p. 1345-
1 p.
|
artikel
|
| 101 |
Principle of operation of IC-prescalers and their application in microwave frequency counters
|
|
|
1992
|
32 |
9 |
p. 1342-
1 p.
|
artikel
|
| 102 |
Production scheduling algorithms for a semiconductor test facility
|
|
|
1992
|
32 |
9 |
p. 1334-
1 p.
|
artikel
|
| 103 |
Product, technology trends spur interest in IC memory cards
|
|
|
1992
|
32 |
9 |
p. 1337-
1 p.
|
artikel
|
| 104 |
Programs/projects management and integrated product/process development in high technology electronic products industries
|
|
|
1992
|
32 |
9 |
p. 1337-
1 p.
|
artikel
|
| 105 |
Quantum-size p - n junctions in silicon
|
|
|
1992
|
32 |
9 |
p. 1343-1344
2 p.
|
artikel
|
| 106 |
Reconfigurable fault tolerant networks for fast packet switching
|
|
|
1992
|
32 |
9 |
p. 1336-
1 p.
|
artikel
|
| 107 |
Relative mean residual life: Theory and related topics
|
Wei, Xianhua
|
|
1992
|
32 |
9 |
p. 1319-1326
8 p.
|
artikel
|
| 108 |
Reliability analysis and redundancy optimisation of a multimodular fault tolerant system
|
Goel, L.R.
|
|
1992
|
32 |
9 |
p. 1243-1250
8 p.
|
artikel
|
| 109 |
Reliability analysis of a two-unit redundant system with a replaceable repair facility
|
Guo, Tongde
|
|
1992
|
32 |
9 |
p. 1237-1240
4 p.
|
artikel
|
| 110 |
Reliability enhancement by time and space redundancy in multistage interconnection networks
|
|
|
1992
|
32 |
9 |
p. 1336-
1 p.
|
artikel
|
| 111 |
Reliable laminated ceramic capacitor carries innovative external electrodes
|
|
|
1992
|
32 |
9 |
p. 1333-
1 p.
|
artikel
|
| 112 |
Semi-insulating polysilicon heterojunctions on silicon
|
|
|
1992
|
32 |
9 |
p. 1344-
1 p.
|
artikel
|
| 113 |
Sequential imperfect preventive maintenance policies: A case study
|
Jayabalan, V.
|
|
1992
|
32 |
9 |
p. 1223-1229
7 p.
|
artikel
|
| 114 |
Short and long loop manufacturing feedback using a multisensor assembly test chip
|
|
|
1992
|
32 |
9 |
p. 1334-
1 p.
|
artikel
|
| 115 |
Simulation of multiple etch fronts
|
|
|
1992
|
32 |
9 |
p. 1340-
1 p.
|
artikel
|
| 116 |
SPC and setup analysis for screen printed thick films
|
|
|
1992
|
32 |
9 |
p. 1346-
1 p.
|
artikel
|
| 117 |
Statistical control of VLSI fabrication processes
|
|
|
1992
|
32 |
9 |
p. 1334-
1 p.
|
artikel
|
| 118 |
Statistical design techniques for high-speed circuit boards with correlated structure distributions
|
|
|
1992
|
32 |
9 |
p. 1340-
1 p.
|
artikel
|
| 119 |
Stencil printing of solder paste for fine-pitch surface mount assembly
|
|
|
1992
|
32 |
9 |
p. 1341-
1 p.
|
artikel
|
| 120 |
Stochastic analysis of an Erlangian arrival with linear cost structure
|
Arora, R.T.
|
|
1992
|
32 |
9 |
p. 1205-1213
9 p.
|
artikel
|
| 121 |
Study of plasma CVD silicon-germanium films using electron beam techniques
|
|
|
1992
|
32 |
9 |
p. 1347-
1 p.
|
artikel
|
| 122 |
Sub-micron self-aligned-gate HEMT for microwave applications
|
|
|
1992
|
32 |
9 |
p. 1342-
1 p.
|
artikel
|
| 123 |
Surge test characteristics of high K multilayer ceramic capacitors
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1992
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32 |
9 |
p. 1331-1332
2 p.
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artikel
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| 124 |
Synthesis of VLSI circuits from behavioral descriptions
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1992
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32 |
9 |
p. 1342-
1 p.
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artikel
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| 125 |
TAB as a high leadcount PGA replacement
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1992
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32 |
9 |
p. 1339-
1 p.
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artikel
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| 126 |
Technology Development: focus on manufacturability
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1992
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32 |
9 |
p. 1337-
1 p.
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artikel
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| 127 |
Testers for printed circuit boards adopt latest system concept
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1992
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32 |
9 |
p. 1333-
1 p.
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artikel
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| 128 |
The effects of implantation dose and anneal temperature on the layered structure and electrical properties of oxygen-ion-implanted silicon-on-insulator
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1992
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32 |
9 |
p. 1347-
1 p.
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artikel
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| 129 |
The per-unit-length capacitance matrix of flaring VLSI packaging interconnections
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1992
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32 |
9 |
p. 1339-
1 p.
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artikel
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| 130 |
The principles of a new method of determining ion beam profile density distribution
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1992
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32 |
9 |
p. 1347-
1 p.
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artikel
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| 131 |
The reliability modelling of RAM/ROM fault tolerant memories
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Kontoleon, J.M.
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1992
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32 |
9 |
p. 1231-1236
6 p.
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artikel
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| 132 |
The role of plastic package adhesion in performance
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1992
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32 |
9 |
p. 1342-
1 p.
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artikel
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| 133 |
Thick film resistor fabricated with YBa2Cu3O7−x superconducting powder
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1992
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32 |
9 |
p. 1345-
1 p.
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artikel
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| 134 |
Two approaches to array fault tolerance in the IBM enterprise system/9000™ type 9121 processor
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1992
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32 |
9 |
p. 1334-
1 p.
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artikel
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| 135 |
Use of screening and response surface experimental designs for development of a 0.5 μm CMOS self-aligned titanium silicide process
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1992
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32 |
9 |
p. 1342-
1 p.
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artikel
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| 136 |
Using a software reliability model to design a telecommunications software architecture
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1992
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32 |
9 |
p. 1335-
1 p.
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artikel
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| 137 |
Using distributed topology update and preplanned configurations to achieve trunk network survivability
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1992
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32 |
9 |
p. 1334-
1 p.
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artikel
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