| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
AESOP: a simulation-based knowledge system for CMOS process diagnosis
|
|
|
1990
|
30 |
4 |
p. 829-
1 p.
|
artikel
|
| 2 |
A full wafer Static RAM designed and manufactured within the ESPRIT project 824 “Wafer Scale Integration”
|
|
|
1990
|
30 |
4 |
p. 828-
1 p.
|
artikel
|
| 3 |
A heuristic method of link reliability assignment for maximal reliability
|
Jain, S.P.
|
|
1990
|
30 |
4 |
p. 673-679
7 p.
|
artikel
|
| 4 |
Amorphous-crystalline silicon beterojunction: theoretical evaluation of the current terms
|
|
|
1990
|
30 |
4 |
p. 830-831
2 p.
|
artikel
|
| 5 |
Analysis for mission reliability of a combat tank
|
|
|
1990
|
30 |
4 |
p. 826-
1 p.
|
artikel
|
| 6 |
Analytical techniques for the evaluation of co-precipitated materials
|
Anjard, Ronald P.
|
|
1990
|
30 |
4 |
p. 629-634
6 p.
|
artikel
|
| 7 |
An improved self-aligned silicide process for VLSI
|
|
|
1990
|
30 |
4 |
p. 827-
1 p.
|
artikel
|
| 8 |
A replacement policy maximizing MTTF of a system with several spare units
|
|
|
1990
|
30 |
4 |
p. 825-
1 p.
|
artikel
|
| 9 |
A study of protean systems—Redundancy optimization in consecutive-k-out-of-n:F systems
|
Kalyan, Radha
|
|
1990
|
30 |
4 |
p. 635-638
4 p.
|
artikel
|
| 10 |
A study of the transport properties of InP/Ga0.47In0.53As modulation doped heterojunctions
|
|
|
1990
|
30 |
4 |
p. 829-
1 p.
|
artikel
|
| 11 |
A thick-film coplanar probe for time domain measurements
|
|
|
1990
|
30 |
4 |
p. 832-
1 p.
|
artikel
|
| 12 |
A two-unit redundant system with different types of failure and “imperfect” repair
|
Subramanian, R.
|
|
1990
|
30 |
4 |
p. 697-699
3 p.
|
artikel
|
| 13 |
Bayes estimation of reliability under a random environment governed by a Dirichlet prior
|
|
|
1990
|
30 |
4 |
p. 825-
1 p.
|
artikel
|
| 14 |
Bibliography of literature on failure data
|
Dhillon, B.S.
|
|
1990
|
30 |
4 |
p. 723-750
28 p.
|
artikel
|
| 15 |
Breakdown in SiO2 films in VLSI MOS structures
|
|
|
1990
|
30 |
4 |
p. 830-
1 p.
|
artikel
|
| 16 |
Burn-in optimization under reliability and capacity restrictions
|
|
|
1990
|
30 |
4 |
p. 826-
1 p.
|
artikel
|
| 17 |
Calculation of electrical parameters of a thin-film multichip package
|
|
|
1990
|
30 |
4 |
p. 831-
1 p.
|
artikel
|
| 18 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1990
|
30 |
4 |
p. 813-816
4 p.
|
artikel
|
| 19 |
Characterization of inverse gaussian and inverted gamma distributions
|
Jaisingh, Lloyd R.
|
|
1990
|
30 |
4 |
p. 775-780
6 p.
|
artikel
|
| 20 |
Charge trapping and dielectric breakdown in MOS devices in 77–400 K temperature range
|
|
|
1990
|
30 |
4 |
p. 830-
1 p.
|
artikel
|
| 21 |
Chemical potential shift in Si(100) MOS structure induced by submillimeter radiation
|
|
|
1990
|
30 |
4 |
p. 830-
1 p.
|
artikel
|
| 22 |
Closed-form solution for lifetime distribution of single-component failure delay systems
|
Limnios, N.
|
|
1990
|
30 |
4 |
p. 781-784
4 p.
|
artikel
|
| 23 |
Comment on “The nonhomogeneous Poisson process—a model for the reliability of complex repairable systems”
|
Ascher, H.
|
|
1990
|
30 |
4 |
p. 807-808
2 p.
|
artikel
|
| 24 |
Comparison of the conventional and extended WKB approximations for tunneling in semiconductors
|
|
|
1990
|
30 |
4 |
p. 831-
1 p.
|
artikel
|
| 25 |
Component-placement optimization for convectively cooled electronics
|
|
|
1990
|
30 |
4 |
p. 825-
1 p.
|
artikel
|
| 26 |
Component vs system burn-in techniques for electronic equipment
|
|
|
1990
|
30 |
4 |
p. 824-
1 p.
|
artikel
|
| 27 |
Computer-aided failure mode and effect analysis of electronic circuits
|
Lehtelä, M.
|
|
1990
|
30 |
4 |
p. 761-773
13 p.
|
artikel
|
| 28 |
Damage of oxide layers on an Al-alloy by electron bombardment
|
|
|
1990
|
30 |
4 |
p. 832-
1 p.
|
artikel
|
| 29 |
Detection of α-particles via phonons by ionization of A+ centers in silicon
|
|
|
1990
|
30 |
4 |
p. 830-
1 p.
|
artikel
|
| 30 |
Determination of thermal stress resistance of copper electroplate by hot rupture tests
|
|
|
1990
|
30 |
4 |
p. 825-
1 p.
|
artikel
|
| 31 |
Development and performance characterization of the lightly doped drain MOS transistor
|
Andhare, P.N.
|
|
1990
|
30 |
4 |
p. 681-690
10 p.
|
artikel
|
| 32 |
Direct evaluation of fault trees using object-oriented programming techniques
|
|
|
1990
|
30 |
4 |
p. 825-
1 p.
|
artikel
|
| 33 |
Electronics reliability and measurement technology
|
G.W.A.D.,
|
|
1990
|
30 |
4 |
p. 811-812
2 p.
|
artikel
|
| 34 |
Electronic structure of substitutional oxygen in silicon
|
|
|
1990
|
30 |
4 |
p. 830-
1 p.
|
artikel
|
| 35 |
Electron paramagnetic resonance of defects in doped microcrystalline silicon
|
|
|
1990
|
30 |
4 |
p. 829-
1 p.
|
artikel
|
| 36 |
Electron-stimulated desorption of ions from surfaces: techniques, methodology and some recent findings with water at metals and semiconductors
|
|
|
1990
|
30 |
4 |
p. 832-
1 p.
|
artikel
|
| 37 |
Enumeration of multiprocessing events and reliability computation of a multiprocessor system
|
Prasad, E.V.
|
|
1990
|
30 |
4 |
p. 691-695
5 p.
|
artikel
|
| 38 |
Fault trees and imperfect coverage
|
|
|
1990
|
30 |
4 |
p. 825-826
2 p.
|
artikel
|
| 39 |
Finding modules in fault trees
|
|
|
1990
|
30 |
4 |
p. 826-
1 p.
|
artikel
|
| 40 |
Formation and characterization of multilayer coatings for X-ray optics
|
|
|
1990
|
30 |
4 |
p. 831-
1 p.
|
artikel
|
| 41 |
Fretting damage in tin-plated aluminum and copper connectors
|
|
|
1990
|
30 |
4 |
p. 823-
1 p.
|
artikel
|
| 42 |
High purity InP epilayers grown by low pressure metalorganic chemical vapor deposition
|
|
|
1990
|
30 |
4 |
p. 829-830
2 p.
|
artikel
|
| 43 |
How to define system improvement and deterioration for a repairable system
|
|
|
1990
|
30 |
4 |
p. 826-
1 p.
|
artikel
|
| 44 |
Importance and impact of the just-in-time philosophy
|
|
|
1990
|
30 |
4 |
p. 827-
1 p.
|
artikel
|
| 45 |
Influence on the electrical characteristics of the—NH radicals incorporated into PECVD silicon nitride films
|
|
|
1990
|
30 |
4 |
p. 831-
1 p.
|
artikel
|
| 46 |
4830622 Integrated circuit socket and board
|
Erickson, George
|
|
1990
|
30 |
4 |
p. i-
1 p.
|
artikel
|
| 47 |
Internal thermal resistance of a multi-chip packaging design for VLSI-based systems
|
|
|
1990
|
30 |
4 |
p. 828-
1 p.
|
artikel
|
| 48 |
Interrelating surface insulation resistance test patterns
|
|
|
1990
|
30 |
4 |
p. 823-
1 p.
|
artikel
|
| 49 |
Introduction of surface mounted device technology
|
|
|
1990
|
30 |
4 |
p. 827-828
2 p.
|
artikel
|
| 50 |
Investigations on structural and optical properties of InP/Ga 0.47 In 0.53 As superlattices grown by metalorganic chemical vapor deposition
|
|
|
1990
|
30 |
4 |
p. 831-
1 p.
|
artikel
|
| 51 |
I-V characteristics of integrated n+pn− reachthrough diodes
|
|
|
1990
|
30 |
4 |
p. 833-
1 p.
|
artikel
|
| 52 |
Metallization technologies for ULSI
|
|
|
1990
|
30 |
4 |
p. 827-
1 p.
|
artikel
|
| 53 |
4841232 Method and apparatus for testing three state drivers
|
Graham, Patricia
|
|
1990
|
30 |
4 |
p. ii-
1 p.
|
artikel
|
| 54 |
Modeling-dependent failures for the availability of extra high voltage transmission lines
|
|
|
1990
|
30 |
4 |
p. 826-
1 p.
|
artikel
|
| 55 |
Multichip thin-film technology on silicon
|
|
|
1990
|
30 |
4 |
p. 831-832
2 p.
|
artikel
|
| 56 |
Multi-layer thin-film substrates for multi-chip packaging
|
|
|
1990
|
30 |
4 |
p. 832-
1 p.
|
artikel
|
| 57 |
Neural network for the reliability analysis of simplex systems
|
Manzoul, Mahmoud A.
|
|
1990
|
30 |
4 |
p. 795-800
6 p.
|
artikel
|
| 58 |
On some aspects of variance remaining life distributions
|
Abouammoh, A.M.
|
|
1990
|
30 |
4 |
p. 751-760
10 p.
|
artikel
|
| 59 |
On the oxide interface micro-roughness in MOS devices
|
|
|
1990
|
30 |
4 |
p. 830-
1 p.
|
artikel
|
| 60 |
Optimal topological design of large telephone networks
|
Cătuneanu, V.M.
|
|
1990
|
30 |
4 |
p. 705-711
7 p.
|
artikel
|
| 61 |
Optimization of the epitaxial layer properties for low voltage capability VDMOS devices
|
|
|
1990
|
30 |
4 |
p. 829-
1 p.
|
artikel
|
| 62 |
Optimum ordering policies with non-linear running and salvage costs
|
Kaio, Naoto
|
|
1990
|
30 |
4 |
p. 785-793
9 p.
|
artikel
|
| 63 |
Particle-free wafer cleaning and drying technology
|
|
|
1990
|
30 |
4 |
p. 827-
1 p.
|
artikel
|
| 64 |
4830497 Pattern inspection system
|
Iwata, Satoshi
|
|
1990
|
30 |
4 |
p. i-
1 p.
|
artikel
|
| 65 |
Periodic replacement when minimal repair costs depend on the age and the number of minimal repairs for a multi-unit system
|
Sheu, Shey-Huei
|
|
1990
|
30 |
4 |
p. 713-718
6 p.
|
artikel
|
| 66 |
Positive photoresist stripping by plasma barrel
|
|
|
1990
|
30 |
4 |
p. 829-
1 p.
|
artikel
|
| 67 |
Predictive subset testing: optimizing IC parametric performance testing for quality, cost and yield
|
|
|
1990
|
30 |
4 |
p. 828-
1 p.
|
artikel
|
| 68 |
Procurement and standardisation of components
|
|
|
1990
|
30 |
4 |
p. 824-825
2 p.
|
artikel
|
| 69 |
Profit analysis of a two-unit cold standby system with varying physical conditions of the repairman
|
Goel, L.R.
|
|
1990
|
30 |
4 |
p. 655-660
6 p.
|
artikel
|
| 70 |
Profit analysis of two-unit priority standby system with rest period of the operator
|
Gupta, Rakesh
|
|
1990
|
30 |
4 |
p. 649-654
6 p.
|
artikel
|
| 71 |
PROLOG in distributed systems: An overview
|
Hura, G.S.
|
|
1990
|
30 |
4 |
p. 639-648
10 p.
|
artikel
|
| 72 |
Publications, notices, calls for papers, etc.
|
|
|
1990
|
30 |
4 |
p. 817-822
6 p.
|
artikel
|
| 73 |
Pulsed microwave photoconductivity studies of defect formation in germanium subjected to ion implantation and successive pulsed laser annealing
|
|
|
1990
|
30 |
4 |
p. 833-
1 p.
|
artikel
|
| 74 |
Radiation-enhanced adhesion of thin films
|
|
|
1990
|
30 |
4 |
p. 831-
1 p.
|
artikel
|
| 75 |
4841150 Reflection technique for thermal mapping of semiconductors
|
Walter, MartinJ
|
|
1990
|
30 |
4 |
p. ii-
1 p.
|
artikel
|
| 76 |
Reliability analysis of TMR systems on neural network
|
Manzoul, Mahmoud A.
|
|
1990
|
30 |
4 |
p. 801-806
6 p.
|
artikel
|
| 77 |
Reliability evaluation of a communication system considering a multistate model
|
Sharma, Usha
|
|
1990
|
30 |
4 |
p. 701-704
4 p.
|
artikel
|
| 78 |
Reliability of consecutive-k-out-of-n:F systems with nonidentical component reliabilities
|
|
|
1990
|
30 |
4 |
p. 826-
1 p.
|
artikel
|
| 79 |
Residue on printed wiring assemblies: an overview and a case history
|
|
|
1990
|
30 |
4 |
p. 824-
1 p.
|
artikel
|
| 80 |
Robustness and precision of parametric and distribution-free tolerance limits for two lifetime distributions
|
|
|
1990
|
30 |
4 |
p. 826-
1 p.
|
artikel
|
| 81 |
4841233 Semiconductor integrated circuit adapted to carry out operation test
|
Yoshida, Masanobu
|
|
1990
|
30 |
4 |
p. ii-
1 p.
|
artikel
|
| 82 |
4839864 Semiconductor memory device comprising programmable redundancy circuit
|
Fujishima, Kazuyasu
|
|
1990
|
30 |
4 |
p. i-ii
nvt p.
|
artikel
|
| 83 |
Significance of charge exchange in the determination of yields in broad-beam ion etching
|
|
|
1990
|
30 |
4 |
p. 832-
1 p.
|
artikel
|
| 84 |
Silicon device miniaturization and its effect on processing techniques
|
|
|
1990
|
30 |
4 |
p. 829-
1 p.
|
artikel
|
| 85 |
Slope etching of silicon dioxide
|
Kal, S.
|
|
1990
|
30 |
4 |
p. 719-722
4 p.
|
artikel
|
| 86 |
Society of reliability engineers bulletin
|
Reiche, Hans
|
|
1990
|
30 |
4 |
p. 809-
1 p.
|
artikel
|
| 87 |
Spontaneous emission by ballistic electronics in semiconducting heterostructures
|
|
|
1990
|
30 |
4 |
p. 830-
1 p.
|
artikel
|
| 88 |
Structural properties of electron beam evaporated zinc sulphide thin films
|
|
|
1990
|
30 |
4 |
p. 833-
1 p.
|
artikel
|
| 89 |
Structure and resistivity of Bi-SiO cermet films
|
|
|
1990
|
30 |
4 |
p. 831-
1 p.
|
artikel
|
| 90 |
Surface-mount attachment reliability of clip-leaded ceramic chip carriers on FR-4 circuit boards
|
|
|
1990
|
30 |
4 |
p. 824-
1 p.
|
artikel
|
| 91 |
Techniques for fabrication of wafer-scale interconnections in multichip packages
|
|
|
1990
|
30 |
4 |
p. 828-
1 p.
|
artikel
|
| 92 |
Test Strategies
|
|
|
1990
|
30 |
4 |
p. 823-
1 p.
|
artikel
|
| 93 |
The effects of dopants on the electrical resistivity in lead magnesium niobate multilayer ceramic capacitors
|
|
|
1990
|
30 |
4 |
p. 823-824
2 p.
|
artikel
|
| 94 |
The estimation of fault coverage
|
|
|
1990
|
30 |
4 |
p. 825-
1 p.
|
artikel
|
| 95 |
Theoretical investigation of the C-V relationship for an amorphous silicon p-n junction
|
|
|
1990
|
30 |
4 |
p. 831-
1 p.
|
artikel
|
| 96 |
Theory of pseudoplastic screen inks in orifice printing
|
|
|
1990
|
30 |
4 |
p. 832-
1 p.
|
artikel
|
| 97 |
The service channel subject to breakdown and idleness with bulk service
|
Singh, I.P.
|
|
1990
|
30 |
4 |
p. 667-671
5 p.
|
artikel
|
| 98 |
Three-dimensional properties of conduction electronics in semiconductor superlattices
|
|
|
1990
|
30 |
4 |
p. 830-
1 p.
|
artikel
|
| 99 |
Tribological properties of edge card connector spring/tab interface
|
|
|
1990
|
30 |
4 |
p. 825-
1 p.
|
artikel
|
| 100 |
Two novel additive processes to manufacture circuit boards: direct laser writing and direct electrostatic transfer and deposition
|
|
|
1990
|
30 |
4 |
p. 824-
1 p.
|
artikel
|
| 101 |
Two-unit cold-standby redundant system subject to random checking, corrective maintenance and system replacement with repairable and non-repairable types of failure
|
Goel, G.D.
|
|
1990
|
30 |
4 |
p. 661-665
5 p.
|
artikel
|
| 102 |
Ultrahigh voltage silicon P-N junctions with a breakdown voltage above 20 kV
|
|
|
1990
|
30 |
4 |
p. 830-
1 p.
|
artikel
|
| 103 |
Ultra-reliable packaging for silicon-on-silicon WSI
|
|
|
1990
|
30 |
4 |
p. 827-
1 p.
|
artikel
|
| 104 |
Unification of reliability/availability/repairability models for Markov systems
|
|
|
1990
|
30 |
4 |
p. 826-
1 p.
|
artikel
|
| 105 |
Using simulators to model transmitted variability in IC manufacturing
|
|
|
1990
|
30 |
4 |
p. 828-
1 p.
|
artikel
|
| 106 |
Wave soldering concerns for surface mount assemblies
|
|
|
1990
|
30 |
4 |
p. 827-
1 p.
|
artikel
|
| 107 |
XPS study of single crystal Ge-Si alloys
|
|
|
1990
|
30 |
4 |
p. 829-
1 p.
|
artikel
|
| 108 |
X-Ray assisted nitridation of silicon surface at ambient temperature
|
|
|
1990
|
30 |
4 |
p. 829-
1 p.
|
artikel
|
| 109 |
X-Ray inspection aids process control
|
|
|
1990
|
30 |
4 |
p. 827-
1 p.
|
artikel
|
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