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                             168 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 A Bayes sensitivity analysis when using the beta distribution as a prior 1989
29 5 p. 892-
1 p.
artikel
2 A comparison between noise measurements and conventional electromigration reliability testing 1989
29 5 p. 898-
1 p.
artikel
3 A comparison of algorithms for terminal-pair reliability 1989
29 5 p. 891-
1 p.
artikel
4 A direct algorithm for computing reliability of a consecutive-k cycle 1989
29 5 p. 891-892
2 p.
artikel
5 Admissibility of a test procedure based on preliminary test of significance for life data Singh, S.K.
1989
29 5 p. 721-722
2 p.
artikel
6 A fast algorithm for the performance index of a telecommunication network 1989
29 5 p. 891-
1 p.
artikel
7 A literature survey of the human reliability component in a man-machine system 1989
29 5 p. 885-
1 p.
artikel
8 Alpha-particle-induced soft-error mechanism in semi-insulating GaAs substrate 1989
29 5 p. 896-
1 p.
artikel
9 A mathematical analysis of human-machine interface configurations for a safety monitoring system 1989
29 5 p. 885-
1 p.
artikel
10 A method for microprocessor software reliability prediction 1989
29 5 p. 892-
1 p.
artikel
11 A method for obtaining software reliability measures during development 1989
29 5 p. 891-
1 p.
artikel
12 A method of detecting the nature of IC defects 1989
29 5 p. 886-
1 p.
artikel
13 A modified technique for computing network reliability 1989
29 5 p. 891-
1 p.
artikel
14 Analysis of a three-unit redundant system with two types of repair and inspection Goel, L.R.
1989
29 5 p. 769-773
5 p.
artikel
15 Analysis of package cracking during reflow soldering process 1989
29 5 p. 894-
1 p.
artikel
16 A new bond failure wire crater in surface mount device 1989
29 5 p. 887-
1 p.
artikel
17 A new low temperature polysilicon CVD process 1989
29 5 p. 894-
1 p.
artikel
18 A new method for the determination of channel depth and doping profile in buried-channel MOS transistors 1989
29 5 p. 896-897
2 p.
artikel
19 A new soft-error phenomenon in VLSIs The alpha-particle-induced source/drain penetration (ALPEN) effect 1989
29 5 p. 895-
1 p.
artikel
20 An improved method of estimating Bayes posterior probability density function in reliability data analysis Wang, Qun
1989
29 5 p. 757-760
4 p.
artikel
21 An overview of collection, analysis, and application of reliability data in the process industries 1989
29 5 p. 885-
1 p.
artikel
22 A petri net approach for the enumeration of all K-trees and K-cutsets and its application on K-terminal network reliability evaluation Kontoleon, J.M.
1989
29 5 p. 819-828
10 p.
artikel
23 Application of copper conductor and ruthenium containing oxides-glass resistor to high-frequency hybrid ICs for a protable cellular radio 1989
29 5 p. 898-
1 p.
artikel
24 A reliability study of relay suitable for surface mount process using high-temperature-resistant plastics 1989
29 5 p. 888-
1 p.
artikel
25 A review of IC fabrication design and assembly defects manifested as field failures in Air Force avionic equipment 1989
29 5 p. 895-
1 p.
artikel
26 Army operational test and evaluation of TMDE+ 1989
29 5 p. 890-
1 p.
artikel
27 ASIC photolithography: characterization challenges 1989
29 5 p. 894-
1 p.
artikel
28 A single channel queue with bulk service subject to interruptions Madan, K.C.
1989
29 5 p. 813-818
6 p.
artikel
29 A test of the exponential MTBF and comparison of power functions in the random censoring case 1989
29 5 p. 892-
1 p.
artikel
30 Atomic beam scattering 1989
29 5 p. 899-
1 p.
artikel
31 Automated generation of reliability models 1989
29 5 p. 890-
1 p.
artikel
32 Availability of a washing system in the paper industry Kumar, Dinesh
1989
29 5 p. 775-778
4 p.
artikel
33 4812755 Base board for testing integrated circuits Toshiyuki, Nakaie
1989
29 5 p. ii-iii
nvt p.
artikel
34 Battlefield damage assessment and repair (BDAR) of electronic equipment 1989
29 5 p. 889-
1 p.
artikel
35 Bond pad structure reliability 1989
29 5 p. 888-
1 p.
artikel
36 Bounding network-reliability using consecutive minimal cutsets 1989
29 5 p. 892-
1 p.
artikel
37 Bromine based aluminium etching 1989
29 5 p. 895-
1 p.
artikel
38 CAD techniques for improved maintainability design 1989
29 5 p. 889-
1 p.
artikel
39 Calendar of international conferences, symposia, lectures and meetings of interest 1989
29 5 p. 671-675
5 p.
artikel
40 Censored life-data analysis using linguistic variables 1989
29 5 p. 892-
1 p.
artikel
41 Chemical-system reliability: a review 1989
29 5 p. 885-
1 p.
artikel
42 Choosing a wafer-probing technique 1989
29 5 p. 895-
1 p.
artikel
43 COFT program—a tailored R&M approach 1989
29 5 p. 891-
1 p.
artikel
44 Collection of maintenance data: impact of PORTER on R&M 1989
29 5 p. 890-
1 p.
artikel
45 Common cause failure consideration in a cold standby duplex system Singh, H.R.
1989
29 5 p. 723-728
6 p.
artikel
46 Computer aided life cycle engineering 1989
29 5 p. 890-
1 p.
artikel
47 Computer-aided reliability diagnostic system 1989
29 5 p. 891-
1 p.
artikel
48 4812756 Contactless technique for semicondutor wafer testing Curtis, Huntington
1989
29 5 p. iii-
1 p.
artikel
49 Cost analysis of a two unit cold standby system with preparation time for repair Singh, H.R.
1989
29 5 p. 729-732
4 p.
artikel
50 Cost-benefit analysis of a two unit cold standby system with random switchover and service time Singh, H.R.
1989
29 5 p. 711-716
6 p.
artikel
51 Data bank for probabilistic risk-assessment of nuclear-fuel reprocessing plants 1989
29 5 p. 892-
1 p.
artikel
52 Data sources for microcomputer component selection 1989
29 5 p. 893-
1 p.
artikel
53 Designing electronics for automated inspection 1989
29 5 p. 895-896
2 p.
artikel
54 Design of fault-tolerant computing systems using real-time performance monitors Heaney, Albert A.
1989
29 5 p. 783-800
18 p.
artikel
55 Design-safety enhancement through the use of hazard and risk analysis 1989
29 5 p. 885-
1 p.
artikel
56 Detection of junction spiking and its induced latch-up by emission microscopy 1989
29 5 p. 886-
1 p.
artikel
57 Determining shelf life of epoxy molding compounds 1989
29 5 p. 894-
1 p.
artikel
58 4811344 Device for the testing and checking of the operation of blocks within an integrated circuit Chauvel, Gerard
1989
29 5 p. i-
1 p.
artikel
59 Dielectric spectroscopy of silicon barrier devices 1989
29 5 p. 897-
1 p.
artikel
60 Discrete wire bonding using laser energy 1989
29 5 p. 898-
1 p.
artikel
61 4812678 Easily testable semiconductor LSI device Abe, Seiichi
1989
29 5 p. ii-
1 p.
artikel
62 Economic inventory and replacement management of a system in which components are subject to failure Sivazlian, B.D.
1989
29 5 p. 861-881
21 p.
artikel
63 Effect of BIT on expendable weapon test results 1989
29 5 p. 889-
1 p.
artikel
64 Effect of metal line geometry on electromigration lifetime in Al-Cu submicron interconnects 1989
29 5 p. 887-
1 p.
artikel
65 Effect of oxide glass on the sintering behaviour and electrical properties in Ag thick films 1989
29 5 p. 897-
1 p.
artikel
66 Effect of RuO2 on the behaviour of silver at thick-film terminations 1989
29 5 p. 897-
1 p.
artikel
67 Effects of annealing temperature on electromigration performance of multilayer metallisation systems 1989
29 5 p. 893-
1 p.
artikel
68 Effects of contamination on aluminum films. Part 1: room temperature deposition 1989
29 5 p. 894-
1 p.
artikel
69 Electron energy loss spectroscopy applied to semiconductor space charge layers 1989
29 5 p. 897-
1 p.
artikel
70 Electronic band structure of monolayer thin semiconductor superlattices 1989
29 5 p. 896-
1 p.
artikel
71 Enumeration of k-trees and their application to the reliability evaluation of communication networks Mandaltsis, D.
1989
29 5 p. 733-735
3 p.
artikel
72 4812750 Environmental stress screening apparatus Keel, JerryL
1989
29 5 p. ii-
1 p.
artikel
73 Estimation in a random censoring model with incomplete information: exponential lifetime distribution 1989
29 5 p. 891-
1 p.
artikel
74 Evidence for acceptor surface states in GaAs planar-type devices 1989
29 5 p. 896-
1 p.
artikel
75 Failure prediction by marginal checking 1989
29 5 p. 890-
1 p.
artikel
76 Field operational R&M warranty 1989
29 5 p. 891-
1 p.
artikel
77 Finding floppy-drive faults 1989
29 5 p. 888-
1 p.
artikel
78 Functional programming aspects of wafer scale integration 1989
29 5 p. 895-
1 p.
artikel
79 Generation-annealing of oxide and interface traps at 150 and 298 K in oxidized silicon stressed by Fowler-Nordheim electron tunneling 1989
29 5 p. 896-
1 p.
artikel
80 Getting more out of handlers 1989
29 5 p. 894-
1 p.
artikel
81 Gold-silicon fiber shorts in VLSI devices 1989
29 5 p. 886-
1 p.
artikel
82 4811082 High performance integrated circuit packaging structure Jacobs, ScottL
1989
29 5 p. i-
1 p.
artikel
83 High reliability Al-Si alloy/Si contacts by rapid thermal sintering 1989
29 5 p. 895-
1 p.
artikel
84 High temperature lifetesting of silicon metal-thin insulator-semiconductor heterojunction emitter bipolar transistors 1989
29 5 p. 886-
1 p.
artikel
85 How to improve the effectiveness of hazard and operability analysis 1989
29 5 p. 885-
1 p.
artikel
86 Human reliability model with probabilistic learning in continuous time domain Kim, Kuk
1989
29 5 p. 801-811
11 p.
artikel
87 Improvements in step stress tests Trujillo Alvarado, Héctor S.
1989
29 5 p. 701-703
3 p.
artikel
88 Impurity concentration dependence of the 1 f noise parameter α in silicon 1989
29 5 p. 896-
1 p.
artikel
89 In situ tapered contact etch 1989
29 5 p. 894-
1 p.
artikel
90 4813024 Integrated circuit for the confidential storage and processing of data, comprising a device against fraudulent use Lisimaque, Gilles
1989
29 5 p. iii-
1 p.
artikel
91 4812742 Integrated circuit package having a removable test region for testing for shorts and opens Abel, KennethN
1989
29 5 p. ii-
1 p.
artikel
92 Investigation of instability in multi-layer dielectric structures 1989
29 5 p. 887-888
2 p.
artikel
93 Kinetic study of electromigration failure in Cr/Al-Cu thin film conductors covered with polyimide and the problem of the stress dependent activation energy 1989
29 5 p. 896-
1 p.
artikel
94 Laser-based pattern generation 1989
29 5 p. 898-
1 p.
artikel
95 L f noise in ion-implanted indium phosphide layers 1989
29 5 p. 899-
1 p.
artikel
96 Liquid dropping resin for IC encapsulation 1989
29 5 p. 894-
1 p.
artikel
97 Low-frequency noise in GaAs layers grown by molecular beam epitaxy 1989
29 5 p. 898-
1 p.
artikel
98 Low vs. high temperature epitaxial growth 1989
29 5 p. 895-
1 p.
artikel
99 Measuring response of mass flow controllers 1989
29 5 p. 895-
1 p.
artikel
100 Measuring software for its reuse potential 1989
29 5 p. 889-
1 p.
artikel
101 Microprocessor based systems for the higher technician G.W.A.D.,
1989
29 5 p. 883-
1 p.
artikel
102 Moisture induced package cracking in plastic encapsulated surface mount components during solder reflow process 1989
29 5 p. 886-887
2 p.
artikel
103 New directions in wet chemical processing 1989
29 5 p. 894-895
2 p.
artikel
104 New microwave ion source for multiply charged ion beam production 1989
29 5 p. 898-
1 p.
artikel
105 One method for sample size evaluation Brkić, D.M.
1989
29 5 p. 691-693
3 p.
artikel
106 On estimation of population mean in repeated surveys subsequent to preliminary test of significance Sisodia, B.V.S.
1989
29 5 p. 765-767
3 p.
artikel
107 On space-charge-limited conduction in semi-insulating GaAs 1989
29 5 p. 897-
1 p.
artikel
108 On the reliability evaluation of dynamic networks with m-level hierarchical routing Kontoleon, J.M.
1989
29 5 p. 737-741
5 p.
artikel
109 Optimal continuous-wear limit replacement under periodic inspections 1989
29 5 p. 892-
1 p.
artikel
110 Optimal preventive maintenance with repair 1989
29 5 p. 892-
1 p.
artikel
111 Optimum number of errors corrected before releasing a software system 1989
29 5 p. 895-
1 p.
artikel
112 Particle control in high-current ion implanters 1989
29 5 p. 898-
1 p.
artikel
113 Parts renewal in continuous-time Monte Carlo reliability simulation 1989
29 5 p. 889-
1 p.
artikel
114 Performability evaluation of multicomponent fault-tolerant systems 1989
29 5 p. 893-
1 p.
artikel
115 Plastic packaging stress induced failures in TiW/Al-Si metal to silicide contacts 1989
29 5 p. 888-
1 p.
artikel
116 Polymer encapsulants for microelectronics: mechanisms for protection and failure 1989
29 5 p. 886-
1 p.
artikel
117 Preparation of titanium nitride films by reactive ion plating and the influence of discharge current density on the film properties 1989
29 5 p. 899-
1 p.
artikel
118 Profit evaluation of a two unit cold standby system with a proviso of rest Singh, S.K.
1989
29 5 p. 705-709
5 p.
artikel
119 Properties of diffused resistors in solar-grade semicrystalline silicon 1989
29 5 p. 896-
1 p.
artikel
120 Publications, notices, calls for papers, etc. 1989
29 5 p. 677-687
11 p.
artikel
121 RAPID: recursive algorithmic PIvotal decomposition program for complex structural reliability analysis 1989
29 5 p. 892-
1 p.
artikel
122 Rapid thermal annealing effects on gate oxide of ion implanted devices 1989
29 5 p. 898-
1 p.
artikel
123 Real-time monitoring of ion implantation 1989
29 5 p. 898-
1 p.
artikel
124 Relevancy in fault detection analysis 1989
29 5 p. 889-
1 p.
artikel
125 Reliability analysis of a biogas plant having two dissimilar units Singh, Jai
1989
29 5 p. 779-781
3 p.
artikel
126 Reliability bounds for dependent failures 1989
29 5 p. 892-
1 p.
artikel
127 Reliability evaluation and prediction for silicon photodetectors 1989
29 5 p. 887-
1 p.
artikel
128 Reliability of a system with warm standbys and repairmen Wang, K.-H.
1989
29 5 p. 849-860
12 p.
artikel
129 Reliability of discrete MODFETs: life testing, radiation effects, and ESD 1989
29 5 p. 887-
1 p.
artikel
130 Reliability of new semiconductor devices for long-distance optical submarine-cable systems 1989
29 5 p. 892-
1 p.
artikel
131 Reliability optimization in cable system design using a fuzzy uniform-cost algorithm 1989
29 5 p. 892-893
2 p.
artikel
132 Reliability performance of etox based flash memories 1989
29 5 p. 887-
1 p.
artikel
133 Reliability prediction of MOS devices: experiments and model for charge build up and annealing 1989
29 5 p. 886-
1 p.
artikel
134 R&M engineering for off-the-shelf critical software 1989
29 5 p. 888-889
2 p.
artikel
135 Robust estimators of the 2-parameter gamma distribution 1989
29 5 p. 893-
1 p.
artikel
136 Scanning low energy electron loss microscopy (SLEELM): metals on semiconductors 1989
29 5 p. 897-
1 p.
artikel
137 Scheduling semiconductor wafer fabrication 1989
29 5 p. 894-
1 p.
artikel
138 4813043 Semiconductor test device Maeno, Hidesh
1989
29 5 p. iii-
1 p.
artikel
139 Simulation of focus effects in photolithography 1989
29 5 p. 893-894
2 p.
artikel
140 Society of reliability engineers bulletin 1989
29 5 p. 689-690
2 p.
artikel
141 Software system safety and reliability 1989
29 5 p. 890-
1 p.
artikel
142 Statistical control of VLSI fabrication processes: a framework 1989
29 5 p. 894-
1 p.
artikel
143 Statistical control of VLSI fabrication processes: a software system 1989
29 5 p. 895-
1 p.
artikel
144 Statistical modeling of silicon dioxide reliability 1989
29 5 p. 888-
1 p.
artikel
145 Statistical simulation methods for investigating the structure of reliability optimization 1989
29 5 p. 885-
1 p.
artikel
146 Submicron E-beam process control 1989
29 5 p. 894-
1 p.
artikel
147 Supportability evaluation prediction process 1989
29 5 p. 890-
1 p.
artikel
148 System characteristics and economic analysis of the G/G/R machine repair problem with warm standbys using diffusion approximation Sivazlian, B.D.
1989
29 5 p. 829-848
20 p.
artikel
149 4812421 Tab-type semiconductor process Jung, RichardH
1989
29 5 p. i-ii
nvt p.
artikel
150 The detection of ionic contamination under SM components 1989
29 5 p. 888-
1 p.
artikel
151 The dynamic scheduling of aircraft in high density terminal areas Dear, Roger G.
1989
29 5 p. 743-749
7 p.
artikel
152 The effect of interface states, at mid-gap, in p-silicon/SiO 2 junctions 1989
29 5 p. 896-
1 p.
artikel
153 The effect of nitrogen implantation on the tribological properties of gold-based alloys and electroplated palladium 1989
29 5 p. 898-
1 p.
artikel
154 The effect of stress screening process on yield and cost Sultan, Torky I.
1989
29 5 p. 695-699
5 p.
artikel
155 The impact of an external sodium diffusion source on the reliability of MOS circuitry 1989
29 5 p. 886-
1 p.
artikel
156 The probability aspects of CALS (computer-aided logistic support) 1989
29 5 p. 891-
1 p.
artikel
157 The reliability function and the availability of a duplication redundant system with a single service facility for preventive maintenance and repair Mokaddis, G.S.
1989
29 5 p. 751-756
6 p.
artikel
158 Thermal and stress analysis of semiconductor wafers in a rapid thermal processing oven 1989
29 5 p. 888-
1 p.
artikel
159 Threshold voltage models of the narrow-gate effect in micron and submicron MOSFETs 1989
29 5 p. 887-
1 p.
artikel
160 Tracking of reliability growth in early development 1989
29 5 p. 890-891
2 p.
artikel
161 Troubleshooting ion implantation processes 1989
29 5 p. 898-
1 p.
artikel
162 Two units connected in series with general bulk service and random breakdown in unit 2 Nadarajan, R.
1989
29 5 p. 761-763
3 p.
artikel
163 Two unit standby system with imperfect switching device and maximum activation time Singh, S.K.
1989
29 5 p. 717-720
4 p.
artikel
164 Ultra-low dielectric constant porous silica thick films for high-speed IC packaging 1989
29 5 p. 898-
1 p.
artikel
165 Utilizing scanning electron microscopy to observe the initiation and development of slip bands and fracture in a nickel based metallic glass 1989
29 5 p. 897-
1 p.
artikel
166 Wafer scale integration: a review 1989
29 5 p. 893-
1 p.
artikel
167 What comes first—RAMCAD or a new RAM methodology? 1989
29 5 p. 889-890
2 p.
artikel
168 Yield implications and scaling laws for submicrometer devices 1989
29 5 p. 893-
1 p.
artikel
                             168 gevonden resultaten
 
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