| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A Bayes sensitivity analysis when using the beta distribution as a prior
|
|
|
1989
|
29 |
5 |
p. 892-
1 p.
|
artikel
|
| 2 |
A comparison between noise measurements and conventional electromigration reliability testing
|
|
|
1989
|
29 |
5 |
p. 898-
1 p.
|
artikel
|
| 3 |
A comparison of algorithms for terminal-pair reliability
|
|
|
1989
|
29 |
5 |
p. 891-
1 p.
|
artikel
|
| 4 |
A direct algorithm for computing reliability of a consecutive-k cycle
|
|
|
1989
|
29 |
5 |
p. 891-892
2 p.
|
artikel
|
| 5 |
Admissibility of a test procedure based on preliminary test of significance for life data
|
Singh, S.K.
|
|
1989
|
29 |
5 |
p. 721-722
2 p.
|
artikel
|
| 6 |
A fast algorithm for the performance index of a telecommunication network
|
|
|
1989
|
29 |
5 |
p. 891-
1 p.
|
artikel
|
| 7 |
A literature survey of the human reliability component in a man-machine system
|
|
|
1989
|
29 |
5 |
p. 885-
1 p.
|
artikel
|
| 8 |
Alpha-particle-induced soft-error mechanism in semi-insulating GaAs substrate
|
|
|
1989
|
29 |
5 |
p. 896-
1 p.
|
artikel
|
| 9 |
A mathematical analysis of human-machine interface configurations for a safety monitoring system
|
|
|
1989
|
29 |
5 |
p. 885-
1 p.
|
artikel
|
| 10 |
A method for microprocessor software reliability prediction
|
|
|
1989
|
29 |
5 |
p. 892-
1 p.
|
artikel
|
| 11 |
A method for obtaining software reliability measures during development
|
|
|
1989
|
29 |
5 |
p. 891-
1 p.
|
artikel
|
| 12 |
A method of detecting the nature of IC defects
|
|
|
1989
|
29 |
5 |
p. 886-
1 p.
|
artikel
|
| 13 |
A modified technique for computing network reliability
|
|
|
1989
|
29 |
5 |
p. 891-
1 p.
|
artikel
|
| 14 |
Analysis of a three-unit redundant system with two types of repair and inspection
|
Goel, L.R.
|
|
1989
|
29 |
5 |
p. 769-773
5 p.
|
artikel
|
| 15 |
Analysis of package cracking during reflow soldering process
|
|
|
1989
|
29 |
5 |
p. 894-
1 p.
|
artikel
|
| 16 |
A new bond failure wire crater in surface mount device
|
|
|
1989
|
29 |
5 |
p. 887-
1 p.
|
artikel
|
| 17 |
A new low temperature polysilicon CVD process
|
|
|
1989
|
29 |
5 |
p. 894-
1 p.
|
artikel
|
| 18 |
A new method for the determination of channel depth and doping profile in buried-channel MOS transistors
|
|
|
1989
|
29 |
5 |
p. 896-897
2 p.
|
artikel
|
| 19 |
A new soft-error phenomenon in VLSIs The alpha-particle-induced source/drain penetration (ALPEN) effect
|
|
|
1989
|
29 |
5 |
p. 895-
1 p.
|
artikel
|
| 20 |
An improved method of estimating Bayes posterior probability density function in reliability data analysis
|
Wang, Qun
|
|
1989
|
29 |
5 |
p. 757-760
4 p.
|
artikel
|
| 21 |
An overview of collection, analysis, and application of reliability data in the process industries
|
|
|
1989
|
29 |
5 |
p. 885-
1 p.
|
artikel
|
| 22 |
A petri net approach for the enumeration of all K-trees and K-cutsets and its application on K-terminal network reliability evaluation
|
Kontoleon, J.M.
|
|
1989
|
29 |
5 |
p. 819-828
10 p.
|
artikel
|
| 23 |
Application of copper conductor and ruthenium containing oxides-glass resistor to high-frequency hybrid ICs for a protable cellular radio
|
|
|
1989
|
29 |
5 |
p. 898-
1 p.
|
artikel
|
| 24 |
A reliability study of relay suitable for surface mount process using high-temperature-resistant plastics
|
|
|
1989
|
29 |
5 |
p. 888-
1 p.
|
artikel
|
| 25 |
A review of IC fabrication design and assembly defects manifested as field failures in Air Force avionic equipment
|
|
|
1989
|
29 |
5 |
p. 895-
1 p.
|
artikel
|
| 26 |
Army operational test and evaluation of TMDE+
|
|
|
1989
|
29 |
5 |
p. 890-
1 p.
|
artikel
|
| 27 |
ASIC photolithography: characterization challenges
|
|
|
1989
|
29 |
5 |
p. 894-
1 p.
|
artikel
|
| 28 |
A single channel queue with bulk service subject to interruptions
|
Madan, K.C.
|
|
1989
|
29 |
5 |
p. 813-818
6 p.
|
artikel
|
| 29 |
A test of the exponential MTBF and comparison of power functions in the random censoring case
|
|
|
1989
|
29 |
5 |
p. 892-
1 p.
|
artikel
|
| 30 |
Atomic beam scattering
|
|
|
1989
|
29 |
5 |
p. 899-
1 p.
|
artikel
|
| 31 |
Automated generation of reliability models
|
|
|
1989
|
29 |
5 |
p. 890-
1 p.
|
artikel
|
| 32 |
Availability of a washing system in the paper industry
|
Kumar, Dinesh
|
|
1989
|
29 |
5 |
p. 775-778
4 p.
|
artikel
|
| 33 |
4812755 Base board for testing integrated circuits
|
Toshiyuki, Nakaie
|
|
1989
|
29 |
5 |
p. ii-iii
nvt p.
|
artikel
|
| 34 |
Battlefield damage assessment and repair (BDAR) of electronic equipment
|
|
|
1989
|
29 |
5 |
p. 889-
1 p.
|
artikel
|
| 35 |
Bond pad structure reliability
|
|
|
1989
|
29 |
5 |
p. 888-
1 p.
|
artikel
|
| 36 |
Bounding network-reliability using consecutive minimal cutsets
|
|
|
1989
|
29 |
5 |
p. 892-
1 p.
|
artikel
|
| 37 |
Bromine based aluminium etching
|
|
|
1989
|
29 |
5 |
p. 895-
1 p.
|
artikel
|
| 38 |
CAD techniques for improved maintainability design
|
|
|
1989
|
29 |
5 |
p. 889-
1 p.
|
artikel
|
| 39 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1989
|
29 |
5 |
p. 671-675
5 p.
|
artikel
|
| 40 |
Censored life-data analysis using linguistic variables
|
|
|
1989
|
29 |
5 |
p. 892-
1 p.
|
artikel
|
| 41 |
Chemical-system reliability: a review
|
|
|
1989
|
29 |
5 |
p. 885-
1 p.
|
artikel
|
| 42 |
Choosing a wafer-probing technique
|
|
|
1989
|
29 |
5 |
p. 895-
1 p.
|
artikel
|
| 43 |
COFT program—a tailored R&M approach
|
|
|
1989
|
29 |
5 |
p. 891-
1 p.
|
artikel
|
| 44 |
Collection of maintenance data: impact of PORTER on R&M
|
|
|
1989
|
29 |
5 |
p. 890-
1 p.
|
artikel
|
| 45 |
Common cause failure consideration in a cold standby duplex system
|
Singh, H.R.
|
|
1989
|
29 |
5 |
p. 723-728
6 p.
|
artikel
|
| 46 |
Computer aided life cycle engineering
|
|
|
1989
|
29 |
5 |
p. 890-
1 p.
|
artikel
|
| 47 |
Computer-aided reliability diagnostic system
|
|
|
1989
|
29 |
5 |
p. 891-
1 p.
|
artikel
|
| 48 |
4812756 Contactless technique for semicondutor wafer testing
|
Curtis, Huntington
|
|
1989
|
29 |
5 |
p. iii-
1 p.
|
artikel
|
| 49 |
Cost analysis of a two unit cold standby system with preparation time for repair
|
Singh, H.R.
|
|
1989
|
29 |
5 |
p. 729-732
4 p.
|
artikel
|
| 50 |
Cost-benefit analysis of a two unit cold standby system with random switchover and service time
|
Singh, H.R.
|
|
1989
|
29 |
5 |
p. 711-716
6 p.
|
artikel
|
| 51 |
Data bank for probabilistic risk-assessment of nuclear-fuel reprocessing plants
|
|
|
1989
|
29 |
5 |
p. 892-
1 p.
|
artikel
|
| 52 |
Data sources for microcomputer component selection
|
|
|
1989
|
29 |
5 |
p. 893-
1 p.
|
artikel
|
| 53 |
Designing electronics for automated inspection
|
|
|
1989
|
29 |
5 |
p. 895-896
2 p.
|
artikel
|
| 54 |
Design of fault-tolerant computing systems using real-time performance monitors
|
Heaney, Albert A.
|
|
1989
|
29 |
5 |
p. 783-800
18 p.
|
artikel
|
| 55 |
Design-safety enhancement through the use of hazard and risk analysis
|
|
|
1989
|
29 |
5 |
p. 885-
1 p.
|
artikel
|
| 56 |
Detection of junction spiking and its induced latch-up by emission microscopy
|
|
|
1989
|
29 |
5 |
p. 886-
1 p.
|
artikel
|
| 57 |
Determining shelf life of epoxy molding compounds
|
|
|
1989
|
29 |
5 |
p. 894-
1 p.
|
artikel
|
| 58 |
4811344 Device for the testing and checking of the operation of blocks within an integrated circuit
|
Chauvel, Gerard
|
|
1989
|
29 |
5 |
p. i-
1 p.
|
artikel
|
| 59 |
Dielectric spectroscopy of silicon barrier devices
|
|
|
1989
|
29 |
5 |
p. 897-
1 p.
|
artikel
|
| 60 |
Discrete wire bonding using laser energy
|
|
|
1989
|
29 |
5 |
p. 898-
1 p.
|
artikel
|
| 61 |
4812678 Easily testable semiconductor LSI device
|
Abe, Seiichi
|
|
1989
|
29 |
5 |
p. ii-
1 p.
|
artikel
|
| 62 |
Economic inventory and replacement management of a system in which components are subject to failure
|
Sivazlian, B.D.
|
|
1989
|
29 |
5 |
p. 861-881
21 p.
|
artikel
|
| 63 |
Effect of BIT on expendable weapon test results
|
|
|
1989
|
29 |
5 |
p. 889-
1 p.
|
artikel
|
| 64 |
Effect of metal line geometry on electromigration lifetime in Al-Cu submicron interconnects
|
|
|
1989
|
29 |
5 |
p. 887-
1 p.
|
artikel
|
| 65 |
Effect of oxide glass on the sintering behaviour and electrical properties in Ag thick films
|
|
|
1989
|
29 |
5 |
p. 897-
1 p.
|
artikel
|
| 66 |
Effect of RuO2 on the behaviour of silver at thick-film terminations
|
|
|
1989
|
29 |
5 |
p. 897-
1 p.
|
artikel
|
| 67 |
Effects of annealing temperature on electromigration performance of multilayer metallisation systems
|
|
|
1989
|
29 |
5 |
p. 893-
1 p.
|
artikel
|
| 68 |
Effects of contamination on aluminum films. Part 1: room temperature deposition
|
|
|
1989
|
29 |
5 |
p. 894-
1 p.
|
artikel
|
| 69 |
Electron energy loss spectroscopy applied to semiconductor space charge layers
|
|
|
1989
|
29 |
5 |
p. 897-
1 p.
|
artikel
|
| 70 |
Electronic band structure of monolayer thin semiconductor superlattices
|
|
|
1989
|
29 |
5 |
p. 896-
1 p.
|
artikel
|
| 71 |
Enumeration of k-trees and their application to the reliability evaluation of communication networks
|
Mandaltsis, D.
|
|
1989
|
29 |
5 |
p. 733-735
3 p.
|
artikel
|
| 72 |
4812750 Environmental stress screening apparatus
|
Keel, JerryL
|
|
1989
|
29 |
5 |
p. ii-
1 p.
|
artikel
|
| 73 |
Estimation in a random censoring model with incomplete information: exponential lifetime distribution
|
|
|
1989
|
29 |
5 |
p. 891-
1 p.
|
artikel
|
| 74 |
Evidence for acceptor surface states in GaAs planar-type devices
|
|
|
1989
|
29 |
5 |
p. 896-
1 p.
|
artikel
|
| 75 |
Failure prediction by marginal checking
|
|
|
1989
|
29 |
5 |
p. 890-
1 p.
|
artikel
|
| 76 |
Field operational R&M warranty
|
|
|
1989
|
29 |
5 |
p. 891-
1 p.
|
artikel
|
| 77 |
Finding floppy-drive faults
|
|
|
1989
|
29 |
5 |
p. 888-
1 p.
|
artikel
|
| 78 |
Functional programming aspects of wafer scale integration
|
|
|
1989
|
29 |
5 |
p. 895-
1 p.
|
artikel
|
| 79 |
Generation-annealing of oxide and interface traps at 150 and 298 K in oxidized silicon stressed by Fowler-Nordheim electron tunneling
|
|
|
1989
|
29 |
5 |
p. 896-
1 p.
|
artikel
|
| 80 |
Getting more out of handlers
|
|
|
1989
|
29 |
5 |
p. 894-
1 p.
|
artikel
|
| 81 |
Gold-silicon fiber shorts in VLSI devices
|
|
|
1989
|
29 |
5 |
p. 886-
1 p.
|
artikel
|
| 82 |
4811082 High performance integrated circuit packaging structure
|
Jacobs, ScottL
|
|
1989
|
29 |
5 |
p. i-
1 p.
|
artikel
|
| 83 |
High reliability Al-Si alloy/Si contacts by rapid thermal sintering
|
|
|
1989
|
29 |
5 |
p. 895-
1 p.
|
artikel
|
| 84 |
High temperature lifetesting of silicon metal-thin insulator-semiconductor heterojunction emitter bipolar transistors
|
|
|
1989
|
29 |
5 |
p. 886-
1 p.
|
artikel
|
| 85 |
How to improve the effectiveness of hazard and operability analysis
|
|
|
1989
|
29 |
5 |
p. 885-
1 p.
|
artikel
|
| 86 |
Human reliability model with probabilistic learning in continuous time domain
|
Kim, Kuk
|
|
1989
|
29 |
5 |
p. 801-811
11 p.
|
artikel
|
| 87 |
Improvements in step stress tests
|
Trujillo Alvarado, Héctor S.
|
|
1989
|
29 |
5 |
p. 701-703
3 p.
|
artikel
|
| 88 |
Impurity concentration dependence of the 1 f noise parameter α in silicon
|
|
|
1989
|
29 |
5 |
p. 896-
1 p.
|
artikel
|
| 89 |
In situ tapered contact etch
|
|
|
1989
|
29 |
5 |
p. 894-
1 p.
|
artikel
|
| 90 |
4813024 Integrated circuit for the confidential storage and processing of data, comprising a device against fraudulent use
|
Lisimaque, Gilles
|
|
1989
|
29 |
5 |
p. iii-
1 p.
|
artikel
|
| 91 |
4812742 Integrated circuit package having a removable test region for testing for shorts and opens
|
Abel, KennethN
|
|
1989
|
29 |
5 |
p. ii-
1 p.
|
artikel
|
| 92 |
Investigation of instability in multi-layer dielectric structures
|
|
|
1989
|
29 |
5 |
p. 887-888
2 p.
|
artikel
|
| 93 |
Kinetic study of electromigration failure in Cr/Al-Cu thin film conductors covered with polyimide and the problem of the stress dependent activation energy
|
|
|
1989
|
29 |
5 |
p. 896-
1 p.
|
artikel
|
| 94 |
Laser-based pattern generation
|
|
|
1989
|
29 |
5 |
p. 898-
1 p.
|
artikel
|
| 95 |
L f noise in ion-implanted indium phosphide layers
|
|
|
1989
|
29 |
5 |
p. 899-
1 p.
|
artikel
|
| 96 |
Liquid dropping resin for IC encapsulation
|
|
|
1989
|
29 |
5 |
p. 894-
1 p.
|
artikel
|
| 97 |
Low-frequency noise in GaAs layers grown by molecular beam epitaxy
|
|
|
1989
|
29 |
5 |
p. 898-
1 p.
|
artikel
|
| 98 |
Low vs. high temperature epitaxial growth
|
|
|
1989
|
29 |
5 |
p. 895-
1 p.
|
artikel
|
| 99 |
Measuring response of mass flow controllers
|
|
|
1989
|
29 |
5 |
p. 895-
1 p.
|
artikel
|
| 100 |
Measuring software for its reuse potential
|
|
|
1989
|
29 |
5 |
p. 889-
1 p.
|
artikel
|
| 101 |
Microprocessor based systems for the higher technician
|
G.W.A.D.,
|
|
1989
|
29 |
5 |
p. 883-
1 p.
|
artikel
|
| 102 |
Moisture induced package cracking in plastic encapsulated surface mount components during solder reflow process
|
|
|
1989
|
29 |
5 |
p. 886-887
2 p.
|
artikel
|
| 103 |
New directions in wet chemical processing
|
|
|
1989
|
29 |
5 |
p. 894-895
2 p.
|
artikel
|
| 104 |
New microwave ion source for multiply charged ion beam production
|
|
|
1989
|
29 |
5 |
p. 898-
1 p.
|
artikel
|
| 105 |
One method for sample size evaluation
|
Brkić, D.M.
|
|
1989
|
29 |
5 |
p. 691-693
3 p.
|
artikel
|
| 106 |
On estimation of population mean in repeated surveys subsequent to preliminary test of significance
|
Sisodia, B.V.S.
|
|
1989
|
29 |
5 |
p. 765-767
3 p.
|
artikel
|
| 107 |
On space-charge-limited conduction in semi-insulating GaAs
|
|
|
1989
|
29 |
5 |
p. 897-
1 p.
|
artikel
|
| 108 |
On the reliability evaluation of dynamic networks with m-level hierarchical routing
|
Kontoleon, J.M.
|
|
1989
|
29 |
5 |
p. 737-741
5 p.
|
artikel
|
| 109 |
Optimal continuous-wear limit replacement under periodic inspections
|
|
|
1989
|
29 |
5 |
p. 892-
1 p.
|
artikel
|
| 110 |
Optimal preventive maintenance with repair
|
|
|
1989
|
29 |
5 |
p. 892-
1 p.
|
artikel
|
| 111 |
Optimum number of errors corrected before releasing a software system
|
|
|
1989
|
29 |
5 |
p. 895-
1 p.
|
artikel
|
| 112 |
Particle control in high-current ion implanters
|
|
|
1989
|
29 |
5 |
p. 898-
1 p.
|
artikel
|
| 113 |
Parts renewal in continuous-time Monte Carlo reliability simulation
|
|
|
1989
|
29 |
5 |
p. 889-
1 p.
|
artikel
|
| 114 |
Performability evaluation of multicomponent fault-tolerant systems
|
|
|
1989
|
29 |
5 |
p. 893-
1 p.
|
artikel
|
| 115 |
Plastic packaging stress induced failures in TiW/Al-Si metal to silicide contacts
|
|
|
1989
|
29 |
5 |
p. 888-
1 p.
|
artikel
|
| 116 |
Polymer encapsulants for microelectronics: mechanisms for protection and failure
|
|
|
1989
|
29 |
5 |
p. 886-
1 p.
|
artikel
|
| 117 |
Preparation of titanium nitride films by reactive ion plating and the influence of discharge current density on the film properties
|
|
|
1989
|
29 |
5 |
p. 899-
1 p.
|
artikel
|
| 118 |
Profit evaluation of a two unit cold standby system with a proviso of rest
|
Singh, S.K.
|
|
1989
|
29 |
5 |
p. 705-709
5 p.
|
artikel
|
| 119 |
Properties of diffused resistors in solar-grade semicrystalline silicon
|
|
|
1989
|
29 |
5 |
p. 896-
1 p.
|
artikel
|
| 120 |
Publications, notices, calls for papers, etc.
|
|
|
1989
|
29 |
5 |
p. 677-687
11 p.
|
artikel
|
| 121 |
RAPID: recursive algorithmic PIvotal decomposition program for complex structural reliability analysis
|
|
|
1989
|
29 |
5 |
p. 892-
1 p.
|
artikel
|
| 122 |
Rapid thermal annealing effects on gate oxide of ion implanted devices
|
|
|
1989
|
29 |
5 |
p. 898-
1 p.
|
artikel
|
| 123 |
Real-time monitoring of ion implantation
|
|
|
1989
|
29 |
5 |
p. 898-
1 p.
|
artikel
|
| 124 |
Relevancy in fault detection analysis
|
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1989
|
29 |
5 |
p. 889-
1 p.
|
artikel
|
| 125 |
Reliability analysis of a biogas plant having two dissimilar units
|
Singh, Jai
|
|
1989
|
29 |
5 |
p. 779-781
3 p.
|
artikel
|
| 126 |
Reliability bounds for dependent failures
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|
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1989
|
29 |
5 |
p. 892-
1 p.
|
artikel
|
| 127 |
Reliability evaluation and prediction for silicon photodetectors
|
|
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1989
|
29 |
5 |
p. 887-
1 p.
|
artikel
|
| 128 |
Reliability of a system with warm standbys and repairmen
|
Wang, K.-H.
|
|
1989
|
29 |
5 |
p. 849-860
12 p.
|
artikel
|
| 129 |
Reliability of discrete MODFETs: life testing, radiation effects, and ESD
|
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|
1989
|
29 |
5 |
p. 887-
1 p.
|
artikel
|
| 130 |
Reliability of new semiconductor devices for long-distance optical submarine-cable systems
|
|
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1989
|
29 |
5 |
p. 892-
1 p.
|
artikel
|
| 131 |
Reliability optimization in cable system design using a fuzzy uniform-cost algorithm
|
|
|
1989
|
29 |
5 |
p. 892-893
2 p.
|
artikel
|
| 132 |
Reliability performance of etox based flash memories
|
|
|
1989
|
29 |
5 |
p. 887-
1 p.
|
artikel
|
| 133 |
Reliability prediction of MOS devices: experiments and model for charge build up and annealing
|
|
|
1989
|
29 |
5 |
p. 886-
1 p.
|
artikel
|
| 134 |
R&M engineering for off-the-shelf critical software
|
|
|
1989
|
29 |
5 |
p. 888-889
2 p.
|
artikel
|
| 135 |
Robust estimators of the 2-parameter gamma distribution
|
|
|
1989
|
29 |
5 |
p. 893-
1 p.
|
artikel
|
| 136 |
Scanning low energy electron loss microscopy (SLEELM): metals on semiconductors
|
|
|
1989
|
29 |
5 |
p. 897-
1 p.
|
artikel
|
| 137 |
Scheduling semiconductor wafer fabrication
|
|
|
1989
|
29 |
5 |
p. 894-
1 p.
|
artikel
|
| 138 |
4813043 Semiconductor test device
|
Maeno, Hidesh
|
|
1989
|
29 |
5 |
p. iii-
1 p.
|
artikel
|
| 139 |
Simulation of focus effects in photolithography
|
|
|
1989
|
29 |
5 |
p. 893-894
2 p.
|
artikel
|
| 140 |
Society of reliability engineers bulletin
|
|
|
1989
|
29 |
5 |
p. 689-690
2 p.
|
artikel
|
| 141 |
Software system safety and reliability
|
|
|
1989
|
29 |
5 |
p. 890-
1 p.
|
artikel
|
| 142 |
Statistical control of VLSI fabrication processes: a framework
|
|
|
1989
|
29 |
5 |
p. 894-
1 p.
|
artikel
|
| 143 |
Statistical control of VLSI fabrication processes: a software system
|
|
|
1989
|
29 |
5 |
p. 895-
1 p.
|
artikel
|
| 144 |
Statistical modeling of silicon dioxide reliability
|
|
|
1989
|
29 |
5 |
p. 888-
1 p.
|
artikel
|
| 145 |
Statistical simulation methods for investigating the structure of reliability optimization
|
|
|
1989
|
29 |
5 |
p. 885-
1 p.
|
artikel
|
| 146 |
Submicron E-beam process control
|
|
|
1989
|
29 |
5 |
p. 894-
1 p.
|
artikel
|
| 147 |
Supportability evaluation prediction process
|
|
|
1989
|
29 |
5 |
p. 890-
1 p.
|
artikel
|
| 148 |
System characteristics and economic analysis of the G/G/R machine repair problem with warm standbys using diffusion approximation
|
Sivazlian, B.D.
|
|
1989
|
29 |
5 |
p. 829-848
20 p.
|
artikel
|
| 149 |
4812421 Tab-type semiconductor process
|
Jung, RichardH
|
|
1989
|
29 |
5 |
p. i-ii
nvt p.
|
artikel
|
| 150 |
The detection of ionic contamination under SM components
|
|
|
1989
|
29 |
5 |
p. 888-
1 p.
|
artikel
|
| 151 |
The dynamic scheduling of aircraft in high density terminal areas
|
Dear, Roger G.
|
|
1989
|
29 |
5 |
p. 743-749
7 p.
|
artikel
|
| 152 |
The effect of interface states, at mid-gap, in p-silicon/SiO 2 junctions
|
|
|
1989
|
29 |
5 |
p. 896-
1 p.
|
artikel
|
| 153 |
The effect of nitrogen implantation on the tribological properties of gold-based alloys and electroplated palladium
|
|
|
1989
|
29 |
5 |
p. 898-
1 p.
|
artikel
|
| 154 |
The effect of stress screening process on yield and cost
|
Sultan, Torky I.
|
|
1989
|
29 |
5 |
p. 695-699
5 p.
|
artikel
|
| 155 |
The impact of an external sodium diffusion source on the reliability of MOS circuitry
|
|
|
1989
|
29 |
5 |
p. 886-
1 p.
|
artikel
|
| 156 |
The probability aspects of CALS (computer-aided logistic support)
|
|
|
1989
|
29 |
5 |
p. 891-
1 p.
|
artikel
|
| 157 |
The reliability function and the availability of a duplication redundant system with a single service facility for preventive maintenance and repair
|
Mokaddis, G.S.
|
|
1989
|
29 |
5 |
p. 751-756
6 p.
|
artikel
|
| 158 |
Thermal and stress analysis of semiconductor wafers in a rapid thermal processing oven
|
|
|
1989
|
29 |
5 |
p. 888-
1 p.
|
artikel
|
| 159 |
Threshold voltage models of the narrow-gate effect in micron and submicron MOSFETs
|
|
|
1989
|
29 |
5 |
p. 887-
1 p.
|
artikel
|
| 160 |
Tracking of reliability growth in early development
|
|
|
1989
|
29 |
5 |
p. 890-891
2 p.
|
artikel
|
| 161 |
Troubleshooting ion implantation processes
|
|
|
1989
|
29 |
5 |
p. 898-
1 p.
|
artikel
|
| 162 |
Two units connected in series with general bulk service and random breakdown in unit 2
|
Nadarajan, R.
|
|
1989
|
29 |
5 |
p. 761-763
3 p.
|
artikel
|
| 163 |
Two unit standby system with imperfect switching device and maximum activation time
|
Singh, S.K.
|
|
1989
|
29 |
5 |
p. 717-720
4 p.
|
artikel
|
| 164 |
Ultra-low dielectric constant porous silica thick films for high-speed IC packaging
|
|
|
1989
|
29 |
5 |
p. 898-
1 p.
|
artikel
|
| 165 |
Utilizing scanning electron microscopy to observe the initiation and development of slip bands and fracture in a nickel based metallic glass
|
|
|
1989
|
29 |
5 |
p. 897-
1 p.
|
artikel
|
| 166 |
Wafer scale integration: a review
|
|
|
1989
|
29 |
5 |
p. 893-
1 p.
|
artikel
|
| 167 |
What comes first—RAMCAD or a new RAM methodology?
|
|
|
1989
|
29 |
5 |
p. 889-890
2 p.
|
artikel
|
| 168 |
Yield implications and scaling laws for submicrometer devices
|
|
|
1989
|
29 |
5 |
p. 893-
1 p.
|
artikel
|
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