nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A Bayes reliability growth model for a development testing program
|
|
|
1989 |
29 |
4 |
p. 650-651 2 p. |
artikel |
2 |
Accelerated thermal fatigue cycling of surface mounted PWB assemblies in Telecom equipment
|
|
|
1989 |
29 |
4 |
p. 646- 1 p. |
artikel |
3 |
A comparison of several component-testing plans for a parallel system
|
|
|
1989 |
29 |
4 |
p. 649- 1 p. |
artikel |
4 |
A comparison of the prediction of future order statistics for the 2-parameter gamma distribution
|
|
|
1989 |
29 |
4 |
p. 650- 1 p. |
artikel |
5 |
A comparison of the reliability of copper and palladium-silver thick-film crossovers
|
|
|
1989 |
29 |
4 |
p. 660- 1 p. |
artikel |
6 |
A conditional probability treatment of strict consecutive-k-out-of-n:F systems
|
Rushdi, Ali M. |
|
1989 |
29 |
4 |
p. 581-586 6 p. |
artikel |
7 |
A consideration on spare allocation for a multi-echelon repair system
|
|
|
1989 |
29 |
4 |
p. 649- 1 p. |
artikel |
8 |
A k-out-of-n:G redundant vehicle transit system
|
Chung, Who Kee |
|
1989 |
29 |
4 |
p. 555-558 4 p. |
artikel |
9 |
A liftoff process using edge detection (LOPED)
|
|
|
1989 |
29 |
4 |
p. 656- 1 p. |
artikel |
10 |
A mechanism for two-electron capture at deep level defects in semiconductors
|
|
|
1989 |
29 |
4 |
p. 663- 1 p. |
artikel |
11 |
A method for evaluating all the minimal cuts of a graph
|
|
|
1989 |
29 |
4 |
p. 648- 1 p. |
artikel |
12 |
A minimizing algorithm for sum of disjoint products
|
|
|
1989 |
29 |
4 |
p. 650- 1 p. |
artikel |
13 |
An age-wear dependant model of failure
|
|
|
1989 |
29 |
4 |
p. 650- 1 p. |
artikel |
14 |
An analysis of hardware and software availability exemplified on the IBM 3725 communication controller
|
|
|
1989 |
29 |
4 |
p. 652- 1 p. |
artikel |
15 |
A new boron implantation model suitable for analytical modeling of threshold voltage of MOSFETS
|
|
|
1989 |
29 |
4 |
p. 658- 1 p. |
artikel |
16 |
A new heuristic algorithm for constrained redundancy-optimization in complex systems
|
|
|
1989 |
29 |
4 |
p. 651- 1 p. |
artikel |
17 |
A new nonparametric growth model
|
|
|
1989 |
29 |
4 |
p. 650- 1 p. |
artikel |
18 |
An inside view of Air Force ground electronic equipment maintenance
|
|
|
1989 |
29 |
4 |
p. 651- 1 p. |
artikel |
19 |
A novel technique for detecting lithographic defects
|
|
|
1989 |
29 |
4 |
p. 657- 1 p. |
artikel |
20 |
An overview of IC failure analysis
|
|
|
1989 |
29 |
4 |
p. 648- 1 p. |
artikel |
21 |
Application of Kikuchi maps for the indexing of electron diffraction patterns from silicon
|
|
|
1989 |
29 |
4 |
p. 661-662 2 p. |
artikel |
22 |
Applying photoresist for optimal coatings
|
|
|
1989 |
29 |
4 |
p. 656- 1 p. |
artikel |
23 |
A preliminary test estimator of reliability in a life-testing model
|
|
|
1989 |
29 |
4 |
p. 649- 1 p. |
artikel |
24 |
Argon plasma treatment effects on SiSiO2 structures
|
|
|
1989 |
29 |
4 |
p. 663- 1 p. |
artikel |
25 |
A satellite failure database system
|
|
|
1989 |
29 |
4 |
p. 652- 1 p. |
artikel |
26 |
A simple inexpensive method for thickness measurement of thin films
|
|
|
1989 |
29 |
4 |
p. 660- 1 p. |
artikel |
27 |
A structured methodology for IC photolithography synthesis in semiconductor manufacturing
|
|
|
1989 |
29 |
4 |
p. 656-657 2 p. |
artikel |
28 |
Audio IC circuits manual
|
G.W.A.D., |
|
1989 |
29 |
4 |
p. 644- 1 p. |
artikel |
29 |
4763066 Automatic test equipment for integrated circuits
|
Yeung, PaulK.K. |
|
1989 |
29 |
4 |
p. 666- 1 p. |
artikel |
30 |
Bayesian inference on parameter of exponential distribution and its characteristics
|
|
|
1989 |
29 |
4 |
p. 648- 1 p. |
artikel |
31 |
Bi-CMOS: combination circuit offers economy and power
|
|
|
1989 |
29 |
4 |
p. 658- 1 p. |
artikel |
32 |
Bidirectional blocking junctions in SOI
|
|
|
1989 |
29 |
4 |
p. 658- 1 p. |
artikel |
33 |
Buried injector logic, a vertical IIL using deep ion implantation
|
|
|
1989 |
29 |
4 |
p. 659- 1 p. |
artikel |
34 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1989 |
29 |
4 |
p. 461-465 5 p. |
artikel |
35 |
4768195 Chip tester
|
Stoner, DonaldW |
|
1989 |
29 |
4 |
p. 669- 1 p. |
artikel |
36 |
Choosing between parametric test instruments and systems
|
|
|
1989 |
29 |
4 |
p. 653- 1 p. |
artikel |
37 |
Class 10 robots in PECVD processing
|
|
|
1989 |
29 |
4 |
p. 654- 1 p. |
artikel |
38 |
Closed-loop job release control for VLSI circuit manufacturing
|
|
|
1989 |
29 |
4 |
p. 656- 1 p. |
artikel |
39 |
Closely packed microstrip lines as very high-speed chip-to-chip interconnects
|
|
|
1989 |
29 |
4 |
p. 656- 1 p. |
artikel |
40 |
CMOS active and field device fabrication
|
|
|
1989 |
29 |
4 |
p. 656- 1 p. |
artikel |
41 |
CMOS contacts and interconnects
|
|
|
1989 |
29 |
4 |
p. 653- 1 p. |
artikel |
42 |
CMOS hot carrier protection with LDD
|
|
|
1989 |
29 |
4 |
p. 663- 1 p. |
artikel |
43 |
Comment on “study of acceleration factor on moisture resistance test of plastic encapsulated semiconductor devices”
|
Fokkens, K. |
|
1989 |
29 |
4 |
p. 481- 1 p. |
artikel |
44 |
Common-cause failures in repairable systems
|
|
|
1989 |
29 |
4 |
p. 651- 1 p. |
artikel |
45 |
Comparative studies of vibrational reliability of electron-conductive adhesive and soldered microjoints
|
|
|
1989 |
29 |
4 |
p. 656- 1 p. |
artikel |
46 |
Comparison of two wafer inspection methods for particle monitoring in semiconductor manufacturing
|
|
|
1989 |
29 |
4 |
p. 657- 1 p. |
artikel |
47 |
Considerations for the design of an SRAM with SOI technology
|
|
|
1989 |
29 |
4 |
p. 653- 1 p. |
artikel |
48 |
Cooperative spirit guides European chipmakers
|
|
|
1989 |
29 |
4 |
p. 653- 1 p. |
artikel |
49 |
Correlation between fabrication processes and thermal distribution in medium power MESFETs
|
Canali, C. |
|
1989 |
29 |
4 |
p. 499-504 6 p. |
artikel |
50 |
Creep and stress relaxation in solder joints of surface-mounted chip carriers
|
|
|
1989 |
29 |
4 |
p. 647- 1 p. |
artikel |
51 |
CSCC for the mean and standard deviation of non-normally distributed life test data
|
Singh, H.R. |
|
1989 |
29 |
4 |
p. 639-641 3 p. |
artikel |
52 |
Currents trends in VLSI materials. Part 2: dielectrics
|
|
|
1989 |
29 |
4 |
p. 653- 1 p. |
artikel |
53 |
Current trends in VLSI materials. Part 1: conductor systems
|
|
|
1989 |
29 |
4 |
p. 653- 1 p. |
artikel |
54 |
Curve tracers advance MOSFET technology
|
|
|
1989 |
29 |
4 |
p. 658- 1 p. |
artikel |
55 |
Defect structure of (Ba, Pb)TiO3 positive temperature coefficient ceramics and its influence on electrical properties
|
|
|
1989 |
29 |
4 |
p. 647- 1 p. |
artikel |
56 |
Delamination and fracture of thin films
|
|
|
1989 |
29 |
4 |
p. 660- 1 p. |
artikel |
57 |
Dependability evaluation of integrated hardware/software systems
|
|
|
1989 |
29 |
4 |
p. 649- 1 p. |
artikel |
58 |
Dependence of breakdown voltage on molar concentration of 1,1,1, trichloroethane (TCA) in thermal SiO2
|
Bhan, R.K. |
|
1989 |
29 |
4 |
p. 537-541 5 p. |
artikel |
59 |
Design and performance of a system for VLSI packaging: thermal modeling and characterization
|
|
|
1989 |
29 |
4 |
p. 654- 1 p. |
artikel |
60 |
Design automation standards development
|
|
|
1989 |
29 |
4 |
p. 646- 1 p. |
artikel |
61 |
Determination of doping profiles for low boron ion implantations in silicon
|
|
|
1989 |
29 |
4 |
p. 659- 1 p. |
artikel |
62 |
Diagnosability and distinguishability analysis and its applications
|
|
|
1989 |
29 |
4 |
p. 650- 1 p. |
artikel |
63 |
Durability of floppy disks
|
|
|
1989 |
29 |
4 |
p. 646-647 2 p. |
artikel |
64 |
Effect of electron-electron collisions on properties of hot electrons
|
|
|
1989 |
29 |
4 |
p. 663- 1 p. |
artikel |
65 |
Electrical and microstructural investigation of polysilicon emitter contacts for high-performance bipolar VLSI
|
|
|
1989 |
29 |
4 |
p. 646- 1 p. |
artikel |
66 |
Electrical properties of SiSiO2 structures treated in helium plasma
|
|
|
1989 |
29 |
4 |
p. 662- 1 p. |
artikel |
67 |
Electrical size effects of thin C54-TiSi2 films grown on silicon substrates
|
|
|
1989 |
29 |
4 |
p. 663-664 2 p. |
artikel |
68 |
4779046 Electron beam integrated circuit tester
|
Rouberoi, Jean-Miche |
|
1989 |
29 |
4 |
p. 670- 1 p. |
artikel |
69 |
4766372 Electron beam tester
|
Rao, ValluriRM |
|
1989 |
29 |
4 |
p. 666- 1 p. |
artikel |
70 |
Electronic structure of strained Si n/Ge n(001) superlattices
|
|
|
1989 |
29 |
4 |
p. 662- 1 p. |
artikel |
71 |
Electronic warfare coordination module (EWCM): integrating design, R&M, and logistic support analysis
|
|
|
1989 |
29 |
4 |
p. 652- 1 p. |
artikel |
72 |
Estimating integrated-circuit failure rates from field performance
|
|
|
1989 |
29 |
4 |
p. 646- 1 p. |
artikel |
73 |
Estimation of probability in strength-stress relationship and its use in structural reliability
|
|
|
1989 |
29 |
4 |
p. 651- 1 p. |
artikel |
74 |
Etching of phosphorous doped polysilicon films
|
|
|
1989 |
29 |
4 |
p. 656- 1 p. |
artikel |
75 |
Evidence for thermal defect creation in amorphous silicon
|
|
|
1989 |
29 |
4 |
p. 664- 1 p. |
artikel |
76 |
Examining competitive submicron lithography
|
|
|
1989 |
29 |
4 |
p. 655- 1 p. |
artikel |
77 |
Failure probability of strict consecutive-k-out-of-n:F systems
|
|
|
1989 |
29 |
4 |
p. 648- 1 p. |
artikel |
78 |
Failure-time distribution of electronic components
|
|
|
1989 |
29 |
4 |
p. 647- 1 p. |
artikel |
79 |
Fast turn around for ASIC photomasks
|
|
|
1989 |
29 |
4 |
p. 656- 1 p. |
artikel |
80 |
Fault diagnosis assistant
|
|
|
1989 |
29 |
4 |
p. 645-646 2 p. |
artikel |
81 |
Fault-tolerant ICs: the reliability of TMR yield-enhanced ICs
|
|
|
1989 |
29 |
4 |
p. 649- 1 p. |
artikel |
82 |
Field acceleration factor for dielectric breakdown of MOS devices
|
Patrikar, R.M. |
|
1989 |
29 |
4 |
p. 603-607 5 p. |
artikel |
83 |
First-generation electronic R&M CAE
|
|
|
1989 |
29 |
4 |
p. 652- 1 p. |
artikel |
84 |
First uptime and downtime joint distribution of a duplication system with random switching time
|
Mahmoud, M.A.W. |
|
1989 |
29 |
4 |
p. 505-507 3 p. |
artikel |
85 |
Fitting and optimal grouping on gamma reliability data
|
|
|
1989 |
29 |
4 |
p. 650- 1 p. |
artikel |
86 |
4766670 Full panel electronic packaging structure and method of making same
|
Gazdik, CharlesE |
|
1989 |
29 |
4 |
p. 668- 1 p. |
artikel |
87 |
Functional testing of LSI/VLSI chips—a survey
|
|
|
1989 |
29 |
4 |
p. 645- 1 p. |
artikel |
88 |
Gallium arsenide ICs promising as fast ICs in the high-frequency range
|
|
|
1989 |
29 |
4 |
p. 658- 1 p. |
artikel |
89 |
Gate array playing a main role in ASIC
|
|
|
1989 |
29 |
4 |
p. 657-658 2 p. |
artikel |
90 |
Generation currents from interface states in selectively implanted MOS structures
|
|
|
1989 |
29 |
4 |
p. 659- 1 p. |
artikel |
91 |
Heavy doping effects in silicon
|
|
|
1989 |
29 |
4 |
p. 662-663 2 p. |
artikel |
92 |
Helium leak detection in vacuum systems and IC packages
|
|
|
1989 |
29 |
4 |
p. 657- 1 p. |
artikel |
93 |
hFE shift on the reverse bias test for emitter-base junction
|
|
|
1989 |
29 |
4 |
p. 663- 1 p. |
artikel |
94 |
4776695 High accuracy film thickness measurement system
|
van Pham, Hung |
|
1989 |
29 |
4 |
p. 669- 1 p. |
artikel |
95 |
High density packaging. Connecting the third dimension
|
|
|
1989 |
29 |
4 |
p. 652- 1 p. |
artikel |
96 |
High-field drift velocity of electrons in silicon inversion layers
|
|
|
1989 |
29 |
4 |
p. 663- 1 p. |
artikel |
97 |
4761767 High reliability integrated circuit memory
|
Ferrant, Richard |
|
1989 |
29 |
4 |
p. 666- 1 p. |
artikel |
98 |
High vacuum production in the microelectronics industry
|
G.W.A.D., |
|
1989 |
29 |
4 |
p. 643- 1 p. |
artikel |
99 |
Horizontal die cracking as a yield and reliability problem in integrated circuit devices
|
|
|
1989 |
29 |
4 |
p. 648- 1 p. |
artikel |
100 |
4777355 IC card and system for checking the functionality thereof
|
Takahira, Kenichi |
|
1989 |
29 |
4 |
p. 669-670 2 p. |
artikel |
101 |
4760575 IC card having fault checking function
|
Watanabe, Hirosh |
|
1989 |
29 |
4 |
p. 665- 1 p. |
artikel |
102 |
In-process wafer test and measurement
|
|
|
1989 |
29 |
4 |
p. 655- 1 p. |
artikel |
103 |
4764926 Integrated circuits
|
Knight, WilliamL |
|
1989 |
29 |
4 |
p. 666- 1 p. |
artikel |
104 |
Inverted gamma as a life distribution
|
Lin, C.T. |
|
1989 |
29 |
4 |
p. 619-626 8 p. |
artikel |
105 |
Investigation of the reliability of copper ball bonds to aluminium electrodes
|
|
|
1989 |
29 |
4 |
p. 655- 1 p. |
artikel |
106 |
Investigation of thick film technology for microwave applications
|
|
|
1989 |
29 |
4 |
p. 660- 1 p. |
artikel |
107 |
Large-scale hybrid integrated circuitry: a case study
|
|
|
1989 |
29 |
4 |
p. 659-660 2 p. |
artikel |
108 |
4760335 Large scale integrated circuit test system
|
Lindberg, FrankA |
|
1989 |
29 |
4 |
p. 665- 1 p. |
artikel |
109 |
Laser annealing of GaAs implanted with low doses of selenium ions
|
|
|
1989 |
29 |
4 |
p. 658- 1 p. |
artikel |
110 |
Life characteristics of systems with dependent failures
|
Bhattacharya, A. |
|
1989 |
29 |
4 |
p. 517-521 5 p. |
artikel |
111 |
Life estimation for IC plastic packages under temperature cycling based on fracture mechanics
|
|
|
1989 |
29 |
4 |
p. 646- 1 p. |
artikel |
112 |
Low temperature annealing of He+ implanted optical wave-guides in LiNbO3
|
|
|
1989 |
29 |
4 |
p. 659- 1 p. |
artikel |
113 |
Mask-making equipment/process drives IBM's IM chips
|
|
|
1989 |
29 |
4 |
p. 656- 1 p. |
artikel |
114 |
Materials testing to avoid static problems with microelectronics
|
|
|
1989 |
29 |
4 |
p. 657- 1 p. |
artikel |
115 |
Mean time to achieve a failure-free requirement under provisions of spare and repair
|
|
|
1989 |
29 |
4 |
p. 651- 1 p. |
artikel |
116 |
Measurement of generation lifetime in thin silicon layers
|
|
|
1989 |
29 |
4 |
p. 662- 1 p. |
artikel |
117 |
Mechanical stress reliability factors for packaging GaAs MMIC and LSIC components
|
|
|
1989 |
29 |
4 |
p. 653-654 2 p. |
artikel |
118 |
Memo to all Indian authors
|
G.W.A.D., |
|
1989 |
29 |
4 |
p. 479- 1 p. |
artikel |
119 |
4777434 Microelectronic burn-in system
|
Miller, Vernon |
|
1989 |
29 |
4 |
p. 670- 1 p. |
artikel |
120 |
Microfluorescence analysis of photoresists and contaminants in LSI processing
|
|
|
1989 |
29 |
4 |
p. 654- 1 p. |
artikel |
121 |
MIL-STD-718C fixed time test: effect of redundancy
|
|
|
1989 |
29 |
4 |
p. 651- 1 p. |
artikel |
122 |
Miniaturization of electronics and its limits
|
|
|
1989 |
29 |
4 |
p. 653- 1 p. |
artikel |
123 |
Modelling of minority-carrier transport in heavily doped silicon emitters
|
|
|
1989 |
29 |
4 |
p. 661- 1 p. |
artikel |
124 |
Modelling of the MOS integrated circuit yield associated with random defects of dielectric layers
|
|
|
1989 |
29 |
4 |
p. 646- 1 p. |
artikel |
125 |
Monitoring and diagnosis of plasma etch processes
|
|
|
1989 |
29 |
4 |
p. 654- 1 p. |
artikel |
126 |
Multichip packaging design for VLSI-based systems
|
|
|
1989 |
29 |
4 |
p. 655-656 2 p. |
artikel |
127 |
4771236 Multilayered printed circuit board type resistor isolated tray for stress testing integrated circuits and method of making same
|
Banks, ShermanM |
|
1989 |
29 |
4 |
p. 667- 1 p. |
artikel |
128 |
Multiple-threshold-voltage CMOS/SOS by focused ion beams
|
|
|
1989 |
29 |
4 |
p. 659- 1 p. |
artikel |
129 |
Neuron-like transient phenomena in silicon p-i-n structures
|
|
|
1989 |
29 |
4 |
p. 662- 1 p. |
artikel |
130 |
New directions in CMOS processing
|
|
|
1989 |
29 |
4 |
p. 654- 1 p. |
artikel |
131 |
New integral representations of circuit models and elements for the circuit technique for semiconductor device analysis
|
|
|
1989 |
29 |
4 |
p. 657- 1 p. |
artikel |
132 |
New profile of ultra low stress resin encapsulants for large chip semiconductor devices
|
|
|
1989 |
29 |
4 |
p. 654-655 2 p. |
artikel |
133 |
Nitrogen-fireable resistors; emerging technology for thick-film hybrids
|
|
|
1989 |
29 |
4 |
p. 660- 1 p. |
artikel |
134 |
N-type SIPOS and poly-silicon emitters
|
|
|
1989 |
29 |
4 |
p. 662- 1 p. |
artikel |
135 |
Off the bathtub onto the roller-coaster curve
|
|
|
1989 |
29 |
4 |
p. 645- 1 p. |
artikel |
136 |
On a two-dissimilar-unit standby system with three modes and administrative delay in repair
|
Mokaddis, G.S. |
|
1989 |
29 |
4 |
p. 511-515 5 p. |
artikel |
137 |
On Bayes estimation for mixtures of two Weibull distributions under type I censoring
|
Chen, Keh-Wei |
|
1989 |
29 |
4 |
p. 609-617 9 p. |
artikel |
138 |
One-chip microcomputer creates new features in the consumer electronic industry
|
|
|
1989 |
29 |
4 |
p. 658- 1 p. |
artikel |
139 |
On estimating component reliability for systems with random redundancy levels
|
|
|
1989 |
29 |
4 |
p. 649- 1 p. |
artikel |
140 |
On the evaluation of the reliability of k-out-of-n systems
|
|
|
1989 |
29 |
4 |
p. 649- 1 p. |
artikel |
141 |
Optical characterization of heavily doped silicon
|
|
|
1989 |
29 |
4 |
p. 662- 1 p. |
artikel |
142 |
Optimum ordering policies with random lead times and salvage cost
|
Subramanian, R. |
|
1989 |
29 |
4 |
p. 523-527 5 p. |
artikel |
143 |
Optimum policies for a system with imperfect maintenance
|
|
|
1989 |
29 |
4 |
p. 650- 1 p. |
artikel |
144 |
Optimum single-sample inspection plans for products sold under free and rebate warranty
|
|
|
1989 |
29 |
4 |
p. 645- 1 p. |
artikel |
145 |
Overall reliability evaluation of hierarchical computer networks with dynamic behaviour
|
Kontoleon, J.M. |
|
1989 |
29 |
4 |
p. 483-487 5 p. |
artikel |
146 |
Percolation network for thick resistive films
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1989 |
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p. 661- 1 p. |
artikel |
147 |
Photomask and reticle blanks
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1989 |
29 |
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p. 656- 1 p. |
artikel |
148 |
Polyimides in microelectronics
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1989 |
29 |
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p. 656- 1 p. |
artikel |
149 |
Practical Markov modeling for reliability analysis
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1989 |
29 |
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p. 651-652 2 p. |
artikel |
150 |
4758785 Pressure control apparatus for use in an integrated circuit testing station
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Rath, Dale |
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1989 |
29 |
4 |
p. 665- 1 p. |
artikel |
151 |
Pressure dependence of donor levels in GaP: electronic Raman scattering experiments
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1989 |
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p. 661- 1 p. |
artikel |
152 |
Process simulation of submicron technologies
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1989 |
29 |
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p. 653- 1 p. |
artikel |
153 |
Publications, notices, calls for papers, etc.
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1989 |
29 |
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p. 467-475 9 p. |
artikel |
154 |
Purposes of three-dimensional circuits
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1989 |
29 |
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p. 653- 1 p. |
artikel |
155 |
Quality across the boards
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1989 |
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p. 646- 1 p. |
artikel |
156 |
R&D of three dimensional circuit device getting to the final stage
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1989 |
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p. 658- 1 p. |
artikel |
157 |
Reactive and chemically assisted ion beam etching of Si and SiO2
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1989 |
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p. 659- 1 p. |
artikel |
158 |
Reliability analysis for a real non-coherent system
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1989 |
29 |
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p. 649- 1 p. |
artikel |
159 |
Reliability analysis of a k-out-of-n:G vehicle fleet
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Chung, Who Keé |
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1989 |
29 |
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p. 549-553 5 p. |
artikel |
160 |
Reliability analysis of repairable and non-repairable systems with common-cause failures
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Chung, Who Kee |
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1989 |
29 |
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p. 545-547 3 p. |
artikel |
161 |
Reliability and quality data in court
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1989 |
29 |
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p. 645- 1 p. |
artikel |
162 |
Reliability assurance on purchased electronic components
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1989 |
29 |
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p. 647- 1 p. |
artikel |
163 |
Reliability modeling and evaluation for networks under multiple and fluctuating operational conditions
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1989 |
29 |
4 |
p. 648- 1 p. |
artikel |
164 |
Reliability modelling and analysis of multiprocessor systems
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Prasad, E.V. |
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1989 |
29 |
4 |
p. 533-536 4 p. |
artikel |
165 |
Reliability of redundant systems with unreliable switches
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1989 |
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p. 649- 1 p. |
artikel |
166 |
Reliability of systems with consecutive minimal cutsets
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1989 |
29 |
4 |
p. 648- 1 p. |
artikel |
167 |
Reliability of two dependent paralleled devices with application to the electromigration failure phenomenon
|
Wanchoo, Anna-Karin M. |
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1989 |
29 |
4 |
p. 587-602 16 p. |
artikel |
168 |
Reliability optimization with the Lagrange multiplier and branch-and-bound technique
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1989 |
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p. 651- 1 p. |
artikel |
169 |
Reliability, thermal and thermochemical characteristics of polymer-on-metal multilayer boards
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1989 |
29 |
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p. 661- 1 p. |
artikel |
170 |
Reliable high speed bipolar ICs for long distance transmission
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1989 |
29 |
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p. 657- 1 p. |
artikel |
171 |
Removal processes for damage and contamination after CF4/40%H2 reactive ion etching of silicon
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1989 |
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p. 658- 1 p. |
artikel |
172 |
Rheology of silver-filled glass die attach adhesive for high-speed automatic processing
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1989 |
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p. 655- 1 p. |
artikel |
173 |
Résines pour microlithographie
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1989 |
29 |
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p. 654- 1 p. |
artikel |
174 |
SEM and EMPA analysis of impurities related to GaAs substrates and MBE grown GaAs layers
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1989 |
29 |
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p. 661- 1 p. |
artikel |
175 |
4769744 Semiconductor chip packages having solder layers of enhanced durability
|
Neugebauer, ConstantineA |
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1989 |
29 |
4 |
p. 667- 1 p. |
artikel |
176 |
4768193 Semiconductor memory device having error correction function and incorporating redundancy configuration
|
Takemae, Yoshihiro |
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1989 |
29 |
4 |
p. 668- 1 p. |
artikel |
177 |
4780851 Semiconductor memory device having improved redundant structure
|
Kurakami, Osamu |
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1989 |
29 |
4 |
p. 670- 1 p. |
artikel |
178 |
Sensitivity study of the cumulant method for evaluating reliability measures of two interconnected systems
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1989 |
29 |
4 |
p. 648-649 2 p. |
artikel |
179 |
Sequential test for the ratio of two constant failure rates
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1989 |
29 |
4 |
p. 652- 1 p. |
artikel |
180 |
Signal degradation through module pins in VLSI packaging
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1989 |
29 |
4 |
p. 657- 1 p. |
artikel |
181 |
Silicon dioxide removal in anhydrous HF gas
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1989 |
29 |
4 |
p. 657- 1 p. |
artikel |
182 |
Silicon heterojunction bipolar transistors with amorphous and microcrystalline emitters
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1989 |
29 |
4 |
p. 662- 1 p. |
artikel |
183 |
Silicon nitride film as GaAs annealing encapsulant
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1989 |
29 |
4 |
p. 659- 1 p. |
artikel |
184 |
Simple Bayes test of equality of exponential means
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1989 |
29 |
4 |
p. 652- 1 p. |
artikel |
185 |
Simple enumeration of minimal tiesets of undirected graph
|
Hasanuddin Ahmad, S. |
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1989 |
29 |
4 |
p. 509-510 2 p. |
artikel |
186 |
SMT: today and tomorrow
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1989 |
29 |
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p. 653- 1 p. |
artikel |
187 |
Society of reliability engineers newsletter
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1989 |
29 |
4 |
p. 477-478 2 p. |
artikel |
188 |
Some optimal designs for grouped data in reliability demonstration tests
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1989 |
29 |
4 |
p. 649-650 2 p. |
artikel |
189 |
Some properties of thin-film SOI MOSFETs
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1989 |
29 |
4 |
p. 660- 1 p. |
artikel |
190 |
Special series on irradiation enhanced adhesion. Ion beam bombardment effects during film deposition
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1989 |
29 |
4 |
p. 659- 1 p. |
artikel |
191 |
Stochastic analysis of a parallel system with common-cause failures and critical human errors
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Dhillon, B.S. |
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1989 |
29 |
4 |
p. 627-637 11 p. |
artikel |
192 |
Stochastic analysis of a two-unit priority cold standby redundant system with administrative delay in repair
|
Singh Joorel, J.P. |
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1989 |
29 |
4 |
p. 489-491 3 p. |
artikel |
193 |
Stochastic analysis of a 2-unit standby system with two failure modes and slow switch
|
Goel, L.R. |
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1989 |
29 |
4 |
p. 493-498 6 p. |
artikel |
194 |
Stochastic behaviour of a man-machine system operating under changing environment subject to a Markov process with two states
|
Cao, Jinhua |
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1989 |
29 |
4 |
p. 529-531 3 p. |
artikel |
195 |
Surface vibrational study of acetylene adsorption on cleaved silicon
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1989 |
29 |
4 |
p. 661- 1 p. |
artikel |
196 |
4774461 System for inspecting exposure pattern data of semiconductor integrated circuit device
|
Matsui, Shogo |
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1989 |
29 |
4 |
p. 669- 1 p. |
artikel |
197 |
System reliability using binomial failure rate
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1989 |
29 |
4 |
p. 650- 1 p. |
artikel |
198 |
4766371 Test board for semiconductor packages
|
Moriya, Tadashi |
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1989 |
29 |
4 |
p. 666- 1 p. |
artikel |
199 |
Testing against a change in the NBUE property
|
Klefsjö, Bengt |
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1989 |
29 |
4 |
p. 559-570 12 p. |
artikel |
200 |
Testing high speed VLSI ICs
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1989 |
29 |
4 |
p. 646- 1 p. |
artikel |
201 |
4768073 Testing integrated circuits
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Adams, GarryA |
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1989 |
29 |
4 |
p. 668- 1 p. |
artikel |
202 |
The beauty of ‘almost standard’ VLSI
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1989 |
29 |
4 |
p. 653- 1 p. |
artikel |
203 |
The effects of heat sinking on THB testing of ICs
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1989 |
29 |
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p. 647-648 2 p. |
artikel |
204 |
The electrical effect of single-chip CMOS packages
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1989 |
29 |
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p. 654- 1 p. |
artikel |
205 |
The kinetics of thin film resistor stabilisation
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1989 |
29 |
4 |
p. 660-661 2 p. |
artikel |
206 |
The mechanisms that provide corrosion protection for silicone gel encapsulated chips
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1989 |
29 |
4 |
p. 647- 1 p. |
artikel |
207 |
The power of certain NBU tests
|
Green, Jack |
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1989 |
29 |
4 |
p. 571-580 10 p. |
artikel |
208 |
Thermal degradation of hydrogenated amorphous silicon (a-Si:H ) solar cells used in consumer appliances
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1989 |
29 |
4 |
p. 663- 1 p. |
artikel |
209 |
The role of the interfacial layer in bipolar (poly-Si)-emitter transistors
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1989 |
29 |
4 |
p. 663- 1 p. |
artikel |
210 |
The stability of polycrystalline silicon thin film resistors measured using excess noise
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Jones, B.K. |
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1989 |
29 |
4 |
p. 543-544 2 p. |
artikel |
211 |
The United States Air Force R&M 2000 process
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1989 |
29 |
4 |
p. 651- 1 p. |
artikel |
212 |
Thickness and doping dependence of the optical gap in amorphous hydrogenated silicon films
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1989 |
29 |
4 |
p. 663- 1 p. |
artikel |
213 |
Today's plasma etch chemistries
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1989 |
29 |
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p. 653- 1 p. |
artikel |
214 |
Total-dose effects of gamma-ray irradiation on CMOS/SIMOX devices
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1989 |
29 |
4 |
p. 658-659 2 p. |
artikel |
215 |
Transport equations for highly doped devices and hetero-structures
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1989 |
29 |
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p. 661- 1 p. |
artikel |
216 |
Trends in channel-less gate arrays
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1989 |
29 |
4 |
p. 657- 1 p. |
artikel |
217 |
Triple diffused transistor for digital IC applications
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1989 |
29 |
4 |
p. 657- 1 p. |
artikel |
218 |
Using internal testing program in testing the telephone subset integrated circuit
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1989 |
29 |
4 |
p. 652- 1 p. |
artikel |
219 |
Very sensitive detection for LSI's hot spot using liquid crystal
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1989 |
29 |
4 |
p. 657- 1 p. |
artikel |
220 |
VLSI and AI are getting closer
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1989 |
29 |
4 |
p. 653- 1 p. |
artikel |
221 |
VLSI chip interconnection technology using stacked solder bumps
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1989 |
29 |
4 |
p. 655- 1 p. |
artikel |
222 |
VLSI packaging and assembly
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1989 |
29 |
4 |
p. 655- 1 p. |
artikel |
223 |
4772846 Wafer alignment and positioning apparatus for chip testing by voltage contrast electron microscopy
|
Reeds, John |
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1989 |
29 |
4 |
p. 667- 1 p. |
artikel |
224 |
Wafer processing and materials
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1989 |
29 |
4 |
p. 656- 1 p. |
artikel |
225 |
World class contamination control practices
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1989 |
29 |
4 |
p. 652- 1 p. |
artikel |
226 |
Yield model for in-line integrated circuit production control
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1989 |
29 |
4 |
p. 656- 1 p. |
artikel |