| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A Bayes reliability growth model for a development testing program
|
|
|
1989
|
29 |
4 |
p. 650-651
2 p.
|
artikel
|
| 2 |
Accelerated thermal fatigue cycling of surface mounted PWB assemblies in Telecom equipment
|
|
|
1989
|
29 |
4 |
p. 646-
1 p.
|
artikel
|
| 3 |
A comparison of several component-testing plans for a parallel system
|
|
|
1989
|
29 |
4 |
p. 649-
1 p.
|
artikel
|
| 4 |
A comparison of the prediction of future order statistics for the 2-parameter gamma distribution
|
|
|
1989
|
29 |
4 |
p. 650-
1 p.
|
artikel
|
| 5 |
A comparison of the reliability of copper and palladium-silver thick-film crossovers
|
|
|
1989
|
29 |
4 |
p. 660-
1 p.
|
artikel
|
| 6 |
A conditional probability treatment of strict consecutive-k-out-of-n:F systems
|
Rushdi, Ali M.
|
|
1989
|
29 |
4 |
p. 581-586
6 p.
|
artikel
|
| 7 |
A consideration on spare allocation for a multi-echelon repair system
|
|
|
1989
|
29 |
4 |
p. 649-
1 p.
|
artikel
|
| 8 |
A k-out-of-n:G redundant vehicle transit system
|
Chung, Who Kee
|
|
1989
|
29 |
4 |
p. 555-558
4 p.
|
artikel
|
| 9 |
A liftoff process using edge detection (LOPED)
|
|
|
1989
|
29 |
4 |
p. 656-
1 p.
|
artikel
|
| 10 |
A mechanism for two-electron capture at deep level defects in semiconductors
|
|
|
1989
|
29 |
4 |
p. 663-
1 p.
|
artikel
|
| 11 |
A method for evaluating all the minimal cuts of a graph
|
|
|
1989
|
29 |
4 |
p. 648-
1 p.
|
artikel
|
| 12 |
A minimizing algorithm for sum of disjoint products
|
|
|
1989
|
29 |
4 |
p. 650-
1 p.
|
artikel
|
| 13 |
An age-wear dependant model of failure
|
|
|
1989
|
29 |
4 |
p. 650-
1 p.
|
artikel
|
| 14 |
An analysis of hardware and software availability exemplified on the IBM 3725 communication controller
|
|
|
1989
|
29 |
4 |
p. 652-
1 p.
|
artikel
|
| 15 |
A new boron implantation model suitable for analytical modeling of threshold voltage of MOSFETS
|
|
|
1989
|
29 |
4 |
p. 658-
1 p.
|
artikel
|
| 16 |
A new heuristic algorithm for constrained redundancy-optimization in complex systems
|
|
|
1989
|
29 |
4 |
p. 651-
1 p.
|
artikel
|
| 17 |
A new nonparametric growth model
|
|
|
1989
|
29 |
4 |
p. 650-
1 p.
|
artikel
|
| 18 |
An inside view of Air Force ground electronic equipment maintenance
|
|
|
1989
|
29 |
4 |
p. 651-
1 p.
|
artikel
|
| 19 |
A novel technique for detecting lithographic defects
|
|
|
1989
|
29 |
4 |
p. 657-
1 p.
|
artikel
|
| 20 |
An overview of IC failure analysis
|
|
|
1989
|
29 |
4 |
p. 648-
1 p.
|
artikel
|
| 21 |
Application of Kikuchi maps for the indexing of electron diffraction patterns from silicon
|
|
|
1989
|
29 |
4 |
p. 661-662
2 p.
|
artikel
|
| 22 |
Applying photoresist for optimal coatings
|
|
|
1989
|
29 |
4 |
p. 656-
1 p.
|
artikel
|
| 23 |
A preliminary test estimator of reliability in a life-testing model
|
|
|
1989
|
29 |
4 |
p. 649-
1 p.
|
artikel
|
| 24 |
Argon plasma treatment effects on SiSiO2 structures
|
|
|
1989
|
29 |
4 |
p. 663-
1 p.
|
artikel
|
| 25 |
A satellite failure database system
|
|
|
1989
|
29 |
4 |
p. 652-
1 p.
|
artikel
|
| 26 |
A simple inexpensive method for thickness measurement of thin films
|
|
|
1989
|
29 |
4 |
p. 660-
1 p.
|
artikel
|
| 27 |
A structured methodology for IC photolithography synthesis in semiconductor manufacturing
|
|
|
1989
|
29 |
4 |
p. 656-657
2 p.
|
artikel
|
| 28 |
Audio IC circuits manual
|
G.W.A.D.,
|
|
1989
|
29 |
4 |
p. 644-
1 p.
|
artikel
|
| 29 |
4763066 Automatic test equipment for integrated circuits
|
Yeung, PaulK.K.
|
|
1989
|
29 |
4 |
p. 666-
1 p.
|
artikel
|
| 30 |
Bayesian inference on parameter of exponential distribution and its characteristics
|
|
|
1989
|
29 |
4 |
p. 648-
1 p.
|
artikel
|
| 31 |
Bi-CMOS: combination circuit offers economy and power
|
|
|
1989
|
29 |
4 |
p. 658-
1 p.
|
artikel
|
| 32 |
Bidirectional blocking junctions in SOI
|
|
|
1989
|
29 |
4 |
p. 658-
1 p.
|
artikel
|
| 33 |
Buried injector logic, a vertical IIL using deep ion implantation
|
|
|
1989
|
29 |
4 |
p. 659-
1 p.
|
artikel
|
| 34 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1989
|
29 |
4 |
p. 461-465
5 p.
|
artikel
|
| 35 |
4768195 Chip tester
|
Stoner, DonaldW
|
|
1989
|
29 |
4 |
p. 669-
1 p.
|
artikel
|
| 36 |
Choosing between parametric test instruments and systems
|
|
|
1989
|
29 |
4 |
p. 653-
1 p.
|
artikel
|
| 37 |
Class 10 robots in PECVD processing
|
|
|
1989
|
29 |
4 |
p. 654-
1 p.
|
artikel
|
| 38 |
Closed-loop job release control for VLSI circuit manufacturing
|
|
|
1989
|
29 |
4 |
p. 656-
1 p.
|
artikel
|
| 39 |
Closely packed microstrip lines as very high-speed chip-to-chip interconnects
|
|
|
1989
|
29 |
4 |
p. 656-
1 p.
|
artikel
|
| 40 |
CMOS active and field device fabrication
|
|
|
1989
|
29 |
4 |
p. 656-
1 p.
|
artikel
|
| 41 |
CMOS contacts and interconnects
|
|
|
1989
|
29 |
4 |
p. 653-
1 p.
|
artikel
|
| 42 |
CMOS hot carrier protection with LDD
|
|
|
1989
|
29 |
4 |
p. 663-
1 p.
|
artikel
|
| 43 |
Comment on “study of acceleration factor on moisture resistance test of plastic encapsulated semiconductor devices”
|
Fokkens, K.
|
|
1989
|
29 |
4 |
p. 481-
1 p.
|
artikel
|
| 44 |
Common-cause failures in repairable systems
|
|
|
1989
|
29 |
4 |
p. 651-
1 p.
|
artikel
|
| 45 |
Comparative studies of vibrational reliability of electron-conductive adhesive and soldered microjoints
|
|
|
1989
|
29 |
4 |
p. 656-
1 p.
|
artikel
|
| 46 |
Comparison of two wafer inspection methods for particle monitoring in semiconductor manufacturing
|
|
|
1989
|
29 |
4 |
p. 657-
1 p.
|
artikel
|
| 47 |
Considerations for the design of an SRAM with SOI technology
|
|
|
1989
|
29 |
4 |
p. 653-
1 p.
|
artikel
|
| 48 |
Cooperative spirit guides European chipmakers
|
|
|
1989
|
29 |
4 |
p. 653-
1 p.
|
artikel
|
| 49 |
Correlation between fabrication processes and thermal distribution in medium power MESFETs
|
Canali, C.
|
|
1989
|
29 |
4 |
p. 499-504
6 p.
|
artikel
|
| 50 |
Creep and stress relaxation in solder joints of surface-mounted chip carriers
|
|
|
1989
|
29 |
4 |
p. 647-
1 p.
|
artikel
|
| 51 |
CSCC for the mean and standard deviation of non-normally distributed life test data
|
Singh, H.R.
|
|
1989
|
29 |
4 |
p. 639-641
3 p.
|
artikel
|
| 52 |
Currents trends in VLSI materials. Part 2: dielectrics
|
|
|
1989
|
29 |
4 |
p. 653-
1 p.
|
artikel
|
| 53 |
Current trends in VLSI materials. Part 1: conductor systems
|
|
|
1989
|
29 |
4 |
p. 653-
1 p.
|
artikel
|
| 54 |
Curve tracers advance MOSFET technology
|
|
|
1989
|
29 |
4 |
p. 658-
1 p.
|
artikel
|
| 55 |
Defect structure of (Ba, Pb)TiO3 positive temperature coefficient ceramics and its influence on electrical properties
|
|
|
1989
|
29 |
4 |
p. 647-
1 p.
|
artikel
|
| 56 |
Delamination and fracture of thin films
|
|
|
1989
|
29 |
4 |
p. 660-
1 p.
|
artikel
|
| 57 |
Dependability evaluation of integrated hardware/software systems
|
|
|
1989
|
29 |
4 |
p. 649-
1 p.
|
artikel
|
| 58 |
Dependence of breakdown voltage on molar concentration of 1,1,1, trichloroethane (TCA) in thermal SiO2
|
Bhan, R.K.
|
|
1989
|
29 |
4 |
p. 537-541
5 p.
|
artikel
|
| 59 |
Design and performance of a system for VLSI packaging: thermal modeling and characterization
|
|
|
1989
|
29 |
4 |
p. 654-
1 p.
|
artikel
|
| 60 |
Design automation standards development
|
|
|
1989
|
29 |
4 |
p. 646-
1 p.
|
artikel
|
| 61 |
Determination of doping profiles for low boron ion implantations in silicon
|
|
|
1989
|
29 |
4 |
p. 659-
1 p.
|
artikel
|
| 62 |
Diagnosability and distinguishability analysis and its applications
|
|
|
1989
|
29 |
4 |
p. 650-
1 p.
|
artikel
|
| 63 |
Durability of floppy disks
|
|
|
1989
|
29 |
4 |
p. 646-647
2 p.
|
artikel
|
| 64 |
Effect of electron-electron collisions on properties of hot electrons
|
|
|
1989
|
29 |
4 |
p. 663-
1 p.
|
artikel
|
| 65 |
Electrical and microstructural investigation of polysilicon emitter contacts for high-performance bipolar VLSI
|
|
|
1989
|
29 |
4 |
p. 646-
1 p.
|
artikel
|
| 66 |
Electrical properties of SiSiO2 structures treated in helium plasma
|
|
|
1989
|
29 |
4 |
p. 662-
1 p.
|
artikel
|
| 67 |
Electrical size effects of thin C54-TiSi2 films grown on silicon substrates
|
|
|
1989
|
29 |
4 |
p. 663-664
2 p.
|
artikel
|
| 68 |
4779046 Electron beam integrated circuit tester
|
Rouberoi, Jean-Miche
|
|
1989
|
29 |
4 |
p. 670-
1 p.
|
artikel
|
| 69 |
4766372 Electron beam tester
|
Rao, ValluriRM
|
|
1989
|
29 |
4 |
p. 666-
1 p.
|
artikel
|
| 70 |
Electronic structure of strained Si n/Ge n(001) superlattices
|
|
|
1989
|
29 |
4 |
p. 662-
1 p.
|
artikel
|
| 71 |
Electronic warfare coordination module (EWCM): integrating design, R&M, and logistic support analysis
|
|
|
1989
|
29 |
4 |
p. 652-
1 p.
|
artikel
|
| 72 |
Estimating integrated-circuit failure rates from field performance
|
|
|
1989
|
29 |
4 |
p. 646-
1 p.
|
artikel
|
| 73 |
Estimation of probability in strength-stress relationship and its use in structural reliability
|
|
|
1989
|
29 |
4 |
p. 651-
1 p.
|
artikel
|
| 74 |
Etching of phosphorous doped polysilicon films
|
|
|
1989
|
29 |
4 |
p. 656-
1 p.
|
artikel
|
| 75 |
Evidence for thermal defect creation in amorphous silicon
|
|
|
1989
|
29 |
4 |
p. 664-
1 p.
|
artikel
|
| 76 |
Examining competitive submicron lithography
|
|
|
1989
|
29 |
4 |
p. 655-
1 p.
|
artikel
|
| 77 |
Failure probability of strict consecutive-k-out-of-n:F systems
|
|
|
1989
|
29 |
4 |
p. 648-
1 p.
|
artikel
|
| 78 |
Failure-time distribution of electronic components
|
|
|
1989
|
29 |
4 |
p. 647-
1 p.
|
artikel
|
| 79 |
Fast turn around for ASIC photomasks
|
|
|
1989
|
29 |
4 |
p. 656-
1 p.
|
artikel
|
| 80 |
Fault diagnosis assistant
|
|
|
1989
|
29 |
4 |
p. 645-646
2 p.
|
artikel
|
| 81 |
Fault-tolerant ICs: the reliability of TMR yield-enhanced ICs
|
|
|
1989
|
29 |
4 |
p. 649-
1 p.
|
artikel
|
| 82 |
Field acceleration factor for dielectric breakdown of MOS devices
|
Patrikar, R.M.
|
|
1989
|
29 |
4 |
p. 603-607
5 p.
|
artikel
|
| 83 |
First-generation electronic R&M CAE
|
|
|
1989
|
29 |
4 |
p. 652-
1 p.
|
artikel
|
| 84 |
First uptime and downtime joint distribution of a duplication system with random switching time
|
Mahmoud, M.A.W.
|
|
1989
|
29 |
4 |
p. 505-507
3 p.
|
artikel
|
| 85 |
Fitting and optimal grouping on gamma reliability data
|
|
|
1989
|
29 |
4 |
p. 650-
1 p.
|
artikel
|
| 86 |
4766670 Full panel electronic packaging structure and method of making same
|
Gazdik, CharlesE
|
|
1989
|
29 |
4 |
p. 668-
1 p.
|
artikel
|
| 87 |
Functional testing of LSI/VLSI chips—a survey
|
|
|
1989
|
29 |
4 |
p. 645-
1 p.
|
artikel
|
| 88 |
Gallium arsenide ICs promising as fast ICs in the high-frequency range
|
|
|
1989
|
29 |
4 |
p. 658-
1 p.
|
artikel
|
| 89 |
Gate array playing a main role in ASIC
|
|
|
1989
|
29 |
4 |
p. 657-658
2 p.
|
artikel
|
| 90 |
Generation currents from interface states in selectively implanted MOS structures
|
|
|
1989
|
29 |
4 |
p. 659-
1 p.
|
artikel
|
| 91 |
Heavy doping effects in silicon
|
|
|
1989
|
29 |
4 |
p. 662-663
2 p.
|
artikel
|
| 92 |
Helium leak detection in vacuum systems and IC packages
|
|
|
1989
|
29 |
4 |
p. 657-
1 p.
|
artikel
|
| 93 |
hFE shift on the reverse bias test for emitter-base junction
|
|
|
1989
|
29 |
4 |
p. 663-
1 p.
|
artikel
|
| 94 |
4776695 High accuracy film thickness measurement system
|
van Pham, Hung
|
|
1989
|
29 |
4 |
p. 669-
1 p.
|
artikel
|
| 95 |
High density packaging. Connecting the third dimension
|
|
|
1989
|
29 |
4 |
p. 652-
1 p.
|
artikel
|
| 96 |
High-field drift velocity of electrons in silicon inversion layers
|
|
|
1989
|
29 |
4 |
p. 663-
1 p.
|
artikel
|
| 97 |
4761767 High reliability integrated circuit memory
|
Ferrant, Richard
|
|
1989
|
29 |
4 |
p. 666-
1 p.
|
artikel
|
| 98 |
High vacuum production in the microelectronics industry
|
G.W.A.D.,
|
|
1989
|
29 |
4 |
p. 643-
1 p.
|
artikel
|
| 99 |
Horizontal die cracking as a yield and reliability problem in integrated circuit devices
|
|
|
1989
|
29 |
4 |
p. 648-
1 p.
|
artikel
|
| 100 |
4777355 IC card and system for checking the functionality thereof
|
Takahira, Kenichi
|
|
1989
|
29 |
4 |
p. 669-670
2 p.
|
artikel
|
| 101 |
4760575 IC card having fault checking function
|
Watanabe, Hirosh
|
|
1989
|
29 |
4 |
p. 665-
1 p.
|
artikel
|
| 102 |
In-process wafer test and measurement
|
|
|
1989
|
29 |
4 |
p. 655-
1 p.
|
artikel
|
| 103 |
4764926 Integrated circuits
|
Knight, WilliamL
|
|
1989
|
29 |
4 |
p. 666-
1 p.
|
artikel
|
| 104 |
Inverted gamma as a life distribution
|
Lin, C.T.
|
|
1989
|
29 |
4 |
p. 619-626
8 p.
|
artikel
|
| 105 |
Investigation of the reliability of copper ball bonds to aluminium electrodes
|
|
|
1989
|
29 |
4 |
p. 655-
1 p.
|
artikel
|
| 106 |
Investigation of thick film technology for microwave applications
|
|
|
1989
|
29 |
4 |
p. 660-
1 p.
|
artikel
|
| 107 |
Large-scale hybrid integrated circuitry: a case study
|
|
|
1989
|
29 |
4 |
p. 659-660
2 p.
|
artikel
|
| 108 |
4760335 Large scale integrated circuit test system
|
Lindberg, FrankA
|
|
1989
|
29 |
4 |
p. 665-
1 p.
|
artikel
|
| 109 |
Laser annealing of GaAs implanted with low doses of selenium ions
|
|
|
1989
|
29 |
4 |
p. 658-
1 p.
|
artikel
|
| 110 |
Life characteristics of systems with dependent failures
|
Bhattacharya, A.
|
|
1989
|
29 |
4 |
p. 517-521
5 p.
|
artikel
|
| 111 |
Life estimation for IC plastic packages under temperature cycling based on fracture mechanics
|
|
|
1989
|
29 |
4 |
p. 646-
1 p.
|
artikel
|
| 112 |
Low temperature annealing of He+ implanted optical wave-guides in LiNbO3
|
|
|
1989
|
29 |
4 |
p. 659-
1 p.
|
artikel
|
| 113 |
Mask-making equipment/process drives IBM's IM chips
|
|
|
1989
|
29 |
4 |
p. 656-
1 p.
|
artikel
|
| 114 |
Materials testing to avoid static problems with microelectronics
|
|
|
1989
|
29 |
4 |
p. 657-
1 p.
|
artikel
|
| 115 |
Mean time to achieve a failure-free requirement under provisions of spare and repair
|
|
|
1989
|
29 |
4 |
p. 651-
1 p.
|
artikel
|
| 116 |
Measurement of generation lifetime in thin silicon layers
|
|
|
1989
|
29 |
4 |
p. 662-
1 p.
|
artikel
|
| 117 |
Mechanical stress reliability factors for packaging GaAs MMIC and LSIC components
|
|
|
1989
|
29 |
4 |
p. 653-654
2 p.
|
artikel
|
| 118 |
Memo to all Indian authors
|
G.W.A.D.,
|
|
1989
|
29 |
4 |
p. 479-
1 p.
|
artikel
|
| 119 |
4777434 Microelectronic burn-in system
|
Miller, Vernon
|
|
1989
|
29 |
4 |
p. 670-
1 p.
|
artikel
|
| 120 |
Microfluorescence analysis of photoresists and contaminants in LSI processing
|
|
|
1989
|
29 |
4 |
p. 654-
1 p.
|
artikel
|
| 121 |
MIL-STD-718C fixed time test: effect of redundancy
|
|
|
1989
|
29 |
4 |
p. 651-
1 p.
|
artikel
|
| 122 |
Miniaturization of electronics and its limits
|
|
|
1989
|
29 |
4 |
p. 653-
1 p.
|
artikel
|
| 123 |
Modelling of minority-carrier transport in heavily doped silicon emitters
|
|
|
1989
|
29 |
4 |
p. 661-
1 p.
|
artikel
|
| 124 |
Modelling of the MOS integrated circuit yield associated with random defects of dielectric layers
|
|
|
1989
|
29 |
4 |
p. 646-
1 p.
|
artikel
|
| 125 |
Monitoring and diagnosis of plasma etch processes
|
|
|
1989
|
29 |
4 |
p. 654-
1 p.
|
artikel
|
| 126 |
Multichip packaging design for VLSI-based systems
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1989
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29 |
4 |
p. 655-656
2 p.
|
artikel
|
| 127 |
4771236 Multilayered printed circuit board type resistor isolated tray for stress testing integrated circuits and method of making same
|
Banks, ShermanM
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1989
|
29 |
4 |
p. 667-
1 p.
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artikel
|
| 128 |
Multiple-threshold-voltage CMOS/SOS by focused ion beams
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1989
|
29 |
4 |
p. 659-
1 p.
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artikel
|
| 129 |
Neuron-like transient phenomena in silicon p-i-n structures
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1989
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29 |
4 |
p. 662-
1 p.
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artikel
|
| 130 |
New directions in CMOS processing
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1989
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29 |
4 |
p. 654-
1 p.
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artikel
|
| 131 |
New integral representations of circuit models and elements for the circuit technique for semiconductor device analysis
|
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1989
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29 |
4 |
p. 657-
1 p.
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artikel
|
| 132 |
New profile of ultra low stress resin encapsulants for large chip semiconductor devices
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1989
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29 |
4 |
p. 654-655
2 p.
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artikel
|
| 133 |
Nitrogen-fireable resistors; emerging technology for thick-film hybrids
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1989
|
29 |
4 |
p. 660-
1 p.
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artikel
|
| 134 |
N-type SIPOS and poly-silicon emitters
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1989
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29 |
4 |
p. 662-
1 p.
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artikel
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| 135 |
Off the bathtub onto the roller-coaster curve
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1989
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29 |
4 |
p. 645-
1 p.
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artikel
|
| 136 |
On a two-dissimilar-unit standby system with three modes and administrative delay in repair
|
Mokaddis, G.S.
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1989
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29 |
4 |
p. 511-515
5 p.
|
artikel
|
| 137 |
On Bayes estimation for mixtures of two Weibull distributions under type I censoring
|
Chen, Keh-Wei
|
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1989
|
29 |
4 |
p. 609-617
9 p.
|
artikel
|
| 138 |
One-chip microcomputer creates new features in the consumer electronic industry
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1989
|
29 |
4 |
p. 658-
1 p.
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artikel
|
| 139 |
On estimating component reliability for systems with random redundancy levels
|
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1989
|
29 |
4 |
p. 649-
1 p.
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artikel
|
| 140 |
On the evaluation of the reliability of k-out-of-n systems
|
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1989
|
29 |
4 |
p. 649-
1 p.
|
artikel
|
| 141 |
Optical characterization of heavily doped silicon
|
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1989
|
29 |
4 |
p. 662-
1 p.
|
artikel
|
| 142 |
Optimum ordering policies with random lead times and salvage cost
|
Subramanian, R.
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|
1989
|
29 |
4 |
p. 523-527
5 p.
|
artikel
|
| 143 |
Optimum policies for a system with imperfect maintenance
|
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1989
|
29 |
4 |
p. 650-
1 p.
|
artikel
|
| 144 |
Optimum single-sample inspection plans for products sold under free and rebate warranty
|
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1989
|
29 |
4 |
p. 645-
1 p.
|
artikel
|
| 145 |
Overall reliability evaluation of hierarchical computer networks with dynamic behaviour
|
Kontoleon, J.M.
|
|
1989
|
29 |
4 |
p. 483-487
5 p.
|
artikel
|
| 146 |
Percolation network for thick resistive films
|
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1989
|
29 |
4 |
p. 661-
1 p.
|
artikel
|
| 147 |
Photomask and reticle blanks
|
|
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1989
|
29 |
4 |
p. 656-
1 p.
|
artikel
|
| 148 |
Polyimides in microelectronics
|
|
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1989
|
29 |
4 |
p. 656-
1 p.
|
artikel
|
| 149 |
Practical Markov modeling for reliability analysis
|
|
|
1989
|
29 |
4 |
p. 651-652
2 p.
|
artikel
|
| 150 |
4758785 Pressure control apparatus for use in an integrated circuit testing station
|
Rath, Dale
|
|
1989
|
29 |
4 |
p. 665-
1 p.
|
artikel
|
| 151 |
Pressure dependence of donor levels in GaP: electronic Raman scattering experiments
|
|
|
1989
|
29 |
4 |
p. 661-
1 p.
|
artikel
|
| 152 |
Process simulation of submicron technologies
|
|
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1989
|
29 |
4 |
p. 653-
1 p.
|
artikel
|
| 153 |
Publications, notices, calls for papers, etc.
|
|
|
1989
|
29 |
4 |
p. 467-475
9 p.
|
artikel
|
| 154 |
Purposes of three-dimensional circuits
|
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1989
|
29 |
4 |
p. 653-
1 p.
|
artikel
|
| 155 |
Quality across the boards
|
|
|
1989
|
29 |
4 |
p. 646-
1 p.
|
artikel
|
| 156 |
R&D of three dimensional circuit device getting to the final stage
|
|
|
1989
|
29 |
4 |
p. 658-
1 p.
|
artikel
|
| 157 |
Reactive and chemically assisted ion beam etching of Si and SiO2
|
|
|
1989
|
29 |
4 |
p. 659-
1 p.
|
artikel
|
| 158 |
Reliability analysis for a real non-coherent system
|
|
|
1989
|
29 |
4 |
p. 649-
1 p.
|
artikel
|
| 159 |
Reliability analysis of a k-out-of-n:G vehicle fleet
|
Chung, Who Keé
|
|
1989
|
29 |
4 |
p. 549-553
5 p.
|
artikel
|
| 160 |
Reliability analysis of repairable and non-repairable systems with common-cause failures
|
Chung, Who Kee
|
|
1989
|
29 |
4 |
p. 545-547
3 p.
|
artikel
|
| 161 |
Reliability and quality data in court
|
|
|
1989
|
29 |
4 |
p. 645-
1 p.
|
artikel
|
| 162 |
Reliability assurance on purchased electronic components
|
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1989
|
29 |
4 |
p. 647-
1 p.
|
artikel
|
| 163 |
Reliability modeling and evaluation for networks under multiple and fluctuating operational conditions
|
|
|
1989
|
29 |
4 |
p. 648-
1 p.
|
artikel
|
| 164 |
Reliability modelling and analysis of multiprocessor systems
|
Prasad, E.V.
|
|
1989
|
29 |
4 |
p. 533-536
4 p.
|
artikel
|
| 165 |
Reliability of redundant systems with unreliable switches
|
|
|
1989
|
29 |
4 |
p. 649-
1 p.
|
artikel
|
| 166 |
Reliability of systems with consecutive minimal cutsets
|
|
|
1989
|
29 |
4 |
p. 648-
1 p.
|
artikel
|
| 167 |
Reliability of two dependent paralleled devices with application to the electromigration failure phenomenon
|
Wanchoo, Anna-Karin M.
|
|
1989
|
29 |
4 |
p. 587-602
16 p.
|
artikel
|
| 168 |
Reliability optimization with the Lagrange multiplier and branch-and-bound technique
|
|
|
1989
|
29 |
4 |
p. 651-
1 p.
|
artikel
|
| 169 |
Reliability, thermal and thermochemical characteristics of polymer-on-metal multilayer boards
|
|
|
1989
|
29 |
4 |
p. 661-
1 p.
|
artikel
|
| 170 |
Reliable high speed bipolar ICs for long distance transmission
|
|
|
1989
|
29 |
4 |
p. 657-
1 p.
|
artikel
|
| 171 |
Removal processes for damage and contamination after CF4/40%H2 reactive ion etching of silicon
|
|
|
1989
|
29 |
4 |
p. 658-
1 p.
|
artikel
|
| 172 |
Rheology of silver-filled glass die attach adhesive for high-speed automatic processing
|
|
|
1989
|
29 |
4 |
p. 655-
1 p.
|
artikel
|
| 173 |
Résines pour microlithographie
|
|
|
1989
|
29 |
4 |
p. 654-
1 p.
|
artikel
|
| 174 |
SEM and EMPA analysis of impurities related to GaAs substrates and MBE grown GaAs layers
|
|
|
1989
|
29 |
4 |
p. 661-
1 p.
|
artikel
|
| 175 |
4769744 Semiconductor chip packages having solder layers of enhanced durability
|
Neugebauer, ConstantineA
|
|
1989
|
29 |
4 |
p. 667-
1 p.
|
artikel
|
| 176 |
4768193 Semiconductor memory device having error correction function and incorporating redundancy configuration
|
Takemae, Yoshihiro
|
|
1989
|
29 |
4 |
p. 668-
1 p.
|
artikel
|
| 177 |
4780851 Semiconductor memory device having improved redundant structure
|
Kurakami, Osamu
|
|
1989
|
29 |
4 |
p. 670-
1 p.
|
artikel
|
| 178 |
Sensitivity study of the cumulant method for evaluating reliability measures of two interconnected systems
|
|
|
1989
|
29 |
4 |
p. 648-649
2 p.
|
artikel
|
| 179 |
Sequential test for the ratio of two constant failure rates
|
|
|
1989
|
29 |
4 |
p. 652-
1 p.
|
artikel
|
| 180 |
Signal degradation through module pins in VLSI packaging
|
|
|
1989
|
29 |
4 |
p. 657-
1 p.
|
artikel
|
| 181 |
Silicon dioxide removal in anhydrous HF gas
|
|
|
1989
|
29 |
4 |
p. 657-
1 p.
|
artikel
|
| 182 |
Silicon heterojunction bipolar transistors with amorphous and microcrystalline emitters
|
|
|
1989
|
29 |
4 |
p. 662-
1 p.
|
artikel
|
| 183 |
Silicon nitride film as GaAs annealing encapsulant
|
|
|
1989
|
29 |
4 |
p. 659-
1 p.
|
artikel
|
| 184 |
Simple Bayes test of equality of exponential means
|
|
|
1989
|
29 |
4 |
p. 652-
1 p.
|
artikel
|
| 185 |
Simple enumeration of minimal tiesets of undirected graph
|
Hasanuddin Ahmad, S.
|
|
1989
|
29 |
4 |
p. 509-510
2 p.
|
artikel
|
| 186 |
SMT: today and tomorrow
|
|
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1989
|
29 |
4 |
p. 653-
1 p.
|
artikel
|
| 187 |
Society of reliability engineers newsletter
|
|
|
1989
|
29 |
4 |
p. 477-478
2 p.
|
artikel
|
| 188 |
Some optimal designs for grouped data in reliability demonstration tests
|
|
|
1989
|
29 |
4 |
p. 649-650
2 p.
|
artikel
|
| 189 |
Some properties of thin-film SOI MOSFETs
|
|
|
1989
|
29 |
4 |
p. 660-
1 p.
|
artikel
|
| 190 |
Special series on irradiation enhanced adhesion. Ion beam bombardment effects during film deposition
|
|
|
1989
|
29 |
4 |
p. 659-
1 p.
|
artikel
|
| 191 |
Stochastic analysis of a parallel system with common-cause failures and critical human errors
|
Dhillon, B.S.
|
|
1989
|
29 |
4 |
p. 627-637
11 p.
|
artikel
|
| 192 |
Stochastic analysis of a two-unit priority cold standby redundant system with administrative delay in repair
|
Singh Joorel, J.P.
|
|
1989
|
29 |
4 |
p. 489-491
3 p.
|
artikel
|
| 193 |
Stochastic analysis of a 2-unit standby system with two failure modes and slow switch
|
Goel, L.R.
|
|
1989
|
29 |
4 |
p. 493-498
6 p.
|
artikel
|
| 194 |
Stochastic behaviour of a man-machine system operating under changing environment subject to a Markov process with two states
|
Cao, Jinhua
|
|
1989
|
29 |
4 |
p. 529-531
3 p.
|
artikel
|
| 195 |
Surface vibrational study of acetylene adsorption on cleaved silicon
|
|
|
1989
|
29 |
4 |
p. 661-
1 p.
|
artikel
|
| 196 |
4774461 System for inspecting exposure pattern data of semiconductor integrated circuit device
|
Matsui, Shogo
|
|
1989
|
29 |
4 |
p. 669-
1 p.
|
artikel
|
| 197 |
System reliability using binomial failure rate
|
|
|
1989
|
29 |
4 |
p. 650-
1 p.
|
artikel
|
| 198 |
4766371 Test board for semiconductor packages
|
Moriya, Tadashi
|
|
1989
|
29 |
4 |
p. 666-
1 p.
|
artikel
|
| 199 |
Testing against a change in the NBUE property
|
Klefsjö, Bengt
|
|
1989
|
29 |
4 |
p. 559-570
12 p.
|
artikel
|
| 200 |
Testing high speed VLSI ICs
|
|
|
1989
|
29 |
4 |
p. 646-
1 p.
|
artikel
|
| 201 |
4768073 Testing integrated circuits
|
Adams, GarryA
|
|
1989
|
29 |
4 |
p. 668-
1 p.
|
artikel
|
| 202 |
The beauty of ‘almost standard’ VLSI
|
|
|
1989
|
29 |
4 |
p. 653-
1 p.
|
artikel
|
| 203 |
The effects of heat sinking on THB testing of ICs
|
|
|
1989
|
29 |
4 |
p. 647-648
2 p.
|
artikel
|
| 204 |
The electrical effect of single-chip CMOS packages
|
|
|
1989
|
29 |
4 |
p. 654-
1 p.
|
artikel
|
| 205 |
The kinetics of thin film resistor stabilisation
|
|
|
1989
|
29 |
4 |
p. 660-661
2 p.
|
artikel
|
| 206 |
The mechanisms that provide corrosion protection for silicone gel encapsulated chips
|
|
|
1989
|
29 |
4 |
p. 647-
1 p.
|
artikel
|
| 207 |
The power of certain NBU tests
|
Green, Jack
|
|
1989
|
29 |
4 |
p. 571-580
10 p.
|
artikel
|
| 208 |
Thermal degradation of hydrogenated amorphous silicon (a-Si:H ) solar cells used in consumer appliances
|
|
|
1989
|
29 |
4 |
p. 663-
1 p.
|
artikel
|
| 209 |
The role of the interfacial layer in bipolar (poly-Si)-emitter transistors
|
|
|
1989
|
29 |
4 |
p. 663-
1 p.
|
artikel
|
| 210 |
The stability of polycrystalline silicon thin film resistors measured using excess noise
|
Jones, B.K.
|
|
1989
|
29 |
4 |
p. 543-544
2 p.
|
artikel
|
| 211 |
The United States Air Force R&M 2000 process
|
|
|
1989
|
29 |
4 |
p. 651-
1 p.
|
artikel
|
| 212 |
Thickness and doping dependence of the optical gap in amorphous hydrogenated silicon films
|
|
|
1989
|
29 |
4 |
p. 663-
1 p.
|
artikel
|
| 213 |
Today's plasma etch chemistries
|
|
|
1989
|
29 |
4 |
p. 653-
1 p.
|
artikel
|
| 214 |
Total-dose effects of gamma-ray irradiation on CMOS/SIMOX devices
|
|
|
1989
|
29 |
4 |
p. 658-659
2 p.
|
artikel
|
| 215 |
Transport equations for highly doped devices and hetero-structures
|
|
|
1989
|
29 |
4 |
p. 661-
1 p.
|
artikel
|
| 216 |
Trends in channel-less gate arrays
|
|
|
1989
|
29 |
4 |
p. 657-
1 p.
|
artikel
|
| 217 |
Triple diffused transistor for digital IC applications
|
|
|
1989
|
29 |
4 |
p. 657-
1 p.
|
artikel
|
| 218 |
Using internal testing program in testing the telephone subset integrated circuit
|
|
|
1989
|
29 |
4 |
p. 652-
1 p.
|
artikel
|
| 219 |
Very sensitive detection for LSI's hot spot using liquid crystal
|
|
|
1989
|
29 |
4 |
p. 657-
1 p.
|
artikel
|
| 220 |
VLSI and AI are getting closer
|
|
|
1989
|
29 |
4 |
p. 653-
1 p.
|
artikel
|
| 221 |
VLSI chip interconnection technology using stacked solder bumps
|
|
|
1989
|
29 |
4 |
p. 655-
1 p.
|
artikel
|
| 222 |
VLSI packaging and assembly
|
|
|
1989
|
29 |
4 |
p. 655-
1 p.
|
artikel
|
| 223 |
4772846 Wafer alignment and positioning apparatus for chip testing by voltage contrast electron microscopy
|
Reeds, John
|
|
1989
|
29 |
4 |
p. 667-
1 p.
|
artikel
|
| 224 |
Wafer processing and materials
|
|
|
1989
|
29 |
4 |
p. 656-
1 p.
|
artikel
|
| 225 |
World class contamination control practices
|
|
|
1989
|
29 |
4 |
p. 652-
1 p.
|
artikel
|
| 226 |
Yield model for in-line integrated circuit production control
|
|
|
1989
|
29 |
4 |
p. 656-
1 p.
|
artikel
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