| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A bond failure mechanism
|
|
|
1987
|
27 |
3 |
p. 591-592
2 p.
|
artikel
|
| 2 |
Accurate estimation of statistical parametric variation in microelectronic test structures
|
Kumar, Mahesh
|
|
1987
|
27 |
3 |
p. 575-577
3 p.
|
artikel
|
| 3 |
A computational algorithm for reliability bounds in probabilistic design
|
|
|
1987
|
27 |
3 |
p. 588-
1 p.
|
artikel
|
| 4 |
A Cu-Al2O3-Al moisture sensor for high humidities
|
Nahar, R.K.
|
|
1987
|
27 |
3 |
p. 451-456
6 p.
|
artikel
|
| 5 |
Additive X-ray mask patterning
|
|
|
1987
|
27 |
3 |
p. 590-
1 p.
|
artikel
|
| 6 |
Advanced packaging for VLSI
|
|
|
1987
|
27 |
3 |
p. 590-
1 p.
|
artikel
|
| 7 |
A layer damage model for calculating thermal fatigue lifetime of power devices
|
|
|
1987
|
27 |
3 |
p. 584-
1 p.
|
artikel
|
| 8 |
A method to evaluate reliability of systems with critical and non-critical human errors
|
Dhillon, Balbir S.
|
|
1987
|
27 |
3 |
p. 531-547
17 p.
|
artikel
|
| 9 |
Analysis of a two unit standby redundant fail-safe system
|
Zhibang, Zhou
|
|
1987
|
27 |
3 |
p. 469-474
6 p.
|
artikel
|
| 10 |
An efficient algorithm for simultaneously deducing minimal paths as well as cuts of a communication network
|
Samad, M.A.
|
|
1987
|
27 |
3 |
p. 437-441
5 p.
|
artikel
|
| 11 |
An efficient method for terminal and multiterminal pathset enumeration
|
Samad, M.A.
|
|
1987
|
27 |
3 |
p. 443-446
4 p.
|
artikel
|
| 12 |
An inventory model with product obsolescence and its implications for high technology industry
|
|
|
1987
|
27 |
3 |
p. 581-
1 p.
|
artikel
|
| 13 |
An investigation into the termination resistance of thin film resistors
|
van Nie, A.G.
|
|
1987
|
27 |
3 |
p. 423-428
6 p.
|
artikel
|
| 14 |
A note on the confidence interval for the availability ratio
|
Masters, B.N.
|
|
1987
|
27 |
3 |
p. 487-492
6 p.
|
artikel
|
| 15 |
A novel method for measuring nonuniformities in metallization temperatures of an operating integrated circuit
|
|
|
1987
|
27 |
3 |
p. 591-
1 p.
|
artikel
|
| 16 |
Application of maximum entropy principle in paralleled repairable systems
|
Gupta, Yash P.
|
|
1987
|
27 |
3 |
p. 429-436
8 p.
|
artikel
|
| 17 |
A practical VLSI characterization and failure analysis system for the IC user
|
|
|
1987
|
27 |
3 |
p. 583-
1 p.
|
artikel
|
| 18 |
A program for reliability evaluation of undirected networks via polygon-to-chain reductions
|
|
|
1987
|
27 |
3 |
p. 585-
1 p.
|
artikel
|
| 19 |
A review of fault-tolerant techniques for the enhancement of integrated circuit yield
|
|
|
1987
|
27 |
3 |
p. 585-
1 p.
|
artikel
|
| 20 |
Army reliability growth management policy
|
|
|
1987
|
27 |
3 |
p. 589-
1 p.
|
artikel
|
| 21 |
A simple and asymptotically optimal test for equality of q(≥ 2) multivariate normal distributions: A pragmatic approach to multivatiate one-way classification
|
Singh, N.
|
|
1987
|
27 |
3 |
p. 567-573
7 p.
|
artikel
|
| 22 |
A simple Markovian method for MTTF calculation
|
Dubi, A.
|
|
1987
|
27 |
3 |
p. 459-462
4 p.
|
artikel
|
| 23 |
A simplified model for the static characteristics of amorphous silicon thin-film transistors
|
|
|
1987
|
27 |
3 |
p. 594-
1 p.
|
artikel
|
| 24 |
A simulation approach for computing systems reliability
|
Alidrisi, Mustafa M.
|
|
1987
|
27 |
3 |
p. 463-467
5 p.
|
artikel
|
| 25 |
A software technique for diagnosing and correcting memory errors
|
|
|
1987
|
27 |
3 |
p. 587-
1 p.
|
artikel
|
| 26 |
Assay of mixed acid etchants by ion chromatography
|
|
|
1987
|
27 |
3 |
p. 594-
1 p.
|
artikel
|
| 27 |
Assembly process automation. Part 1: PLCC problems and solutions
|
|
|
1987
|
27 |
3 |
p. 590-
1 p.
|
artikel
|
| 28 |
Assessing the joints in surface-mounted assemblies
|
|
|
1987
|
27 |
3 |
p. 581-
1 p.
|
artikel
|
| 29 |
A study of gold ball bond intermetallic formation in PEDs using infra-red microscopy
|
|
|
1987
|
27 |
3 |
p. 592-
1 p.
|
artikel
|
| 30 |
A testing-effort dependent software reliability model and its application
|
Yamada, Shigeru
|
|
1987
|
27 |
3 |
p. 507-522
16 p.
|
artikel
|
| 31 |
A total framework for semiconductor production planning and scheduling
|
|
|
1987
|
27 |
3 |
p. 591-
1 p.
|
artikel
|
| 32 |
Automatic cleaning technique for pellicles
|
|
|
1987
|
27 |
3 |
p. 590-
1 p.
|
artikel
|
| 33 |
Automation of IC manufacturing: control problems
|
|
|
1987
|
27 |
3 |
p. 591-
1 p.
|
artikel
|
| 34 |
Benefits of integrated-circuit burn-in to obtain high reliability parts
|
|
|
1987
|
27 |
3 |
p. 582-
1 p.
|
artikel
|
| 35 |
Burn-in effectiveness evaluation a lotus 1-2-3™ application
|
|
|
1987
|
27 |
3 |
p. 586-
1 p.
|
artikel
|
| 36 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1987
|
27 |
3 |
p. 399-403
5 p.
|
artikel
|
| 37 |
Calibrating microscopic linewidth measurement systems
|
|
|
1987
|
27 |
3 |
p. 590-
1 p.
|
artikel
|
| 38 |
Call setup time standards
|
Sultan, Torky I.
|
|
1987
|
27 |
3 |
p. 523-530
8 p.
|
artikel
|
| 39 |
CAM system requirements for ASIC manufacturing
|
|
|
1987
|
27 |
3 |
p. 590-591
2 p.
|
artikel
|
| 40 |
CMOS test chip design for process problem debugging and yield prediction experiments
|
|
|
1987
|
27 |
3 |
p. 582-
1 p.
|
artikel
|
| 41 |
Comprehensive model for humidity testing correlation
|
|
|
1987
|
27 |
3 |
p. 583-
1 p.
|
artikel
|
| 42 |
Correction for BIT detectability measurement error
|
|
|
1987
|
27 |
3 |
p. 586-
1 p.
|
artikel
|
| 43 |
Corrosion failure of Al-Mg alloy bonding wires in plastic packages
|
|
|
1987
|
27 |
3 |
p. 582-
1 p.
|
artikel
|
| 44 |
Cost optimal, parallel reliability systems with fixed repair sanction
|
Venugopal, N.
|
|
1987
|
27 |
3 |
p. 419-422
4 p.
|
artikel
|
| 45 |
Designing for zero-defect soldering
|
|
|
1987
|
27 |
3 |
p. 582-
1 p.
|
artikel
|
| 46 |
Detection and ranking of culprit variables
|
|
|
1987
|
27 |
3 |
p. 588-589
2 p.
|
artikel
|
| 47 |
Die separation: changing to meet industry needs
|
|
|
1987
|
27 |
3 |
p. 592-
1 p.
|
artikel
|
| 48 |
Distribution-free analysis of repairable fault-tolerant systems
|
Matloff, Norman S.
|
|
1987
|
27 |
3 |
p. 549-556
8 p.
|
artikel
|
| 49 |
Dry etching of SiO2 and Si3N4
|
|
|
1987
|
27 |
3 |
p. 592-
1 p.
|
artikel
|
| 50 |
Dry film photoresists
|
|
|
1987
|
27 |
3 |
p. 590-
1 p.
|
artikel
|
| 51 |
Effect of V2O5 dopant on the electrical conductivity of RuO2 thick film resistors
|
|
|
1987
|
27 |
3 |
p. 593-
1 p.
|
artikel
|
| 52 |
Effects of O2 and SF6 on the anisotropic etching of polysilicon
|
|
|
1987
|
27 |
3 |
p. 591-
1 p.
|
artikel
|
| 53 |
Effects of reverse bias failure on surface mounted tantalum capacitors
|
|
|
1987
|
27 |
3 |
p. 584-
1 p.
|
artikel
|
| 54 |
Electrical measurement techniques for the characterization of X-ray lithography systems
|
|
|
1987
|
27 |
3 |
p. 594-
1 p.
|
artikel
|
| 55 |
Electromigration in aluminum to tantalum silicide contacts
|
|
|
1987
|
27 |
3 |
p. 591-
1 p.
|
artikel
|
| 56 |
Electromigration in titanium doped aluminum alloys
|
|
|
1987
|
27 |
3 |
p. 590-
1 p.
|
artikel
|
| 57 |
Ella—a language for VLSI
|
|
|
1987
|
27 |
3 |
p. 592-
1 p.
|
artikel
|
| 58 |
Evaluation of large fault-trees with repeated events using an efficient bottom-up algorithm
|
|
|
1987
|
27 |
3 |
p. 588-
1 p.
|
artikel
|
| 59 |
Factory management modeling and implementation
|
|
|
1987
|
27 |
3 |
p. 591-
1 p.
|
artikel
|
| 60 |
Failure analysis and failure mechanisms of high voltage (530 V) gated diode crosspoint arrays
|
|
|
1987
|
27 |
3 |
p. 584-
1 p.
|
artikel
|
| 61 |
Fault and error models for VLSI
|
|
|
1987
|
27 |
3 |
p. 581-
1 p.
|
artikel
|
| 62 |
Fault contrast: a new voltage contrast VLSI diagnosis technique
|
|
|
1987
|
27 |
3 |
p. 581-
1 p.
|
artikel
|
| 63 |
Field and temperature dependent life-time limiting effects of metal-GaAs interfaces of device structures studied by XPS and electrical measurements
|
|
|
1987
|
27 |
3 |
p. 583-
1 p.
|
artikel
|
| 64 |
Field vs. predicted for commercial SATCOM terminals
|
|
|
1987
|
27 |
3 |
p. 587-
1 p.
|
artikel
|
| 65 |
Flow restricting devices used with semiconductor process gases
|
|
|
1987
|
27 |
3 |
p. 591-
1 p.
|
artikel
|
| 66 |
Forum report: equipment reliability
|
|
|
1987
|
27 |
3 |
p. 581-
1 p.
|
artikel
|
| 67 |
General algorithms for calculating system reliability
|
Xu, Wenxin
|
|
1987
|
27 |
3 |
p. 413-418
6 p.
|
artikel
|
| 68 |
4631234 Germanium hardened silicon substrate
|
Larrabee, Graydon
|
|
1987
|
27 |
3 |
p. 597-
1 p.
|
artikel
|
| 69 |
Gradual degradation of GaAs FETs under normal operation
|
|
|
1987
|
27 |
3 |
p. 584-
1 p.
|
artikel
|
| 70 |
Growing interdependence within the microelectronics industry: an overview perspective
|
|
|
1987
|
27 |
3 |
p. 589-
1 p.
|
artikel
|
| 71 |
Guidelines for prevention of ESD damage to integrated circuits
|
|
|
1987
|
27 |
3 |
p. 592-
1 p.
|
artikel
|
| 72 |
Guidelines for space station maintainability
|
|
|
1987
|
27 |
3 |
p. 587-
1 p.
|
artikel
|
| 73 |
High power pulse reliability of GaAs Power FETs
|
|
|
1987
|
27 |
3 |
p. 584-585
2 p.
|
artikel
|
| 74 |
High pressure technology for silicon IC fabrication
|
|
|
1987
|
27 |
3 |
p. 592-
1 p.
|
artikel
|
| 75 |
Hot-electron trapping and generic reliability of p+ polysilicon/SiO2/Si structures for fine-line CMOS technology
|
|
|
1987
|
27 |
3 |
p. 593-
1 p.
|
artikel
|
| 76 |
Impact of ceramic packaging anneal on the reliability of Al interconnects
|
|
|
1987
|
27 |
3 |
p. 583-
1 p.
|
artikel
|
| 77 |
Infrared microscopy as applied to failure analysis of P-DIP devices
|
|
|
1987
|
27 |
3 |
p. 583-
1 p.
|
artikel
|
| 78 |
Ionic concentrations found in pure water used by the semiconductor industry
|
|
|
1987
|
27 |
3 |
p. 593-
1 p.
|
artikel
|
| 79 |
Just-in-time approach to IC fabrication
|
|
|
1987
|
27 |
3 |
p. 591-
1 p.
|
artikel
|
| 80 |
Localization of defects in gate oxides by means of tunneling current microscopy
|
|
|
1987
|
27 |
3 |
p. 585-
1 p.
|
artikel
|
| 81 |
Maintenance matters. Electrical fault finding on soldering machines. Part 2
|
|
|
1987
|
27 |
3 |
p. 582-
1 p.
|
artikel
|
| 82 |
Masked ion beam lithography: an emerging technology
|
|
|
1987
|
27 |
3 |
p. 594-
1 p.
|
artikel
|
| 83 |
Megacells simplify end to end design tasks
|
|
|
1987
|
27 |
3 |
p. 589-590
2 p.
|
artikel
|
| 84 |
Microlithographic techniques for high speed GaAs field effect transistors
|
|
|
1987
|
27 |
3 |
p. 593-
1 p.
|
artikel
|
| 85 |
Modeling IC failure rates
|
|
|
1987
|
27 |
3 |
p. 583-
1 p.
|
artikel
|
| 86 |
Moisture determination in IC packages by conductance technique
|
|
|
1987
|
27 |
3 |
p. 583-584
2 p.
|
artikel
|
| 87 |
Multilayer resist lithography: performance and manufacturability
|
|
|
1987
|
27 |
3 |
p. 592-
1 p.
|
artikel
|
| 88 |
Multiple-stress assembly-level stress screening
|
|
|
1987
|
27 |
3 |
p. 588-
1 p.
|
artikel
|
| 89 |
Normal approach on correctness software estimation
|
Roca, JoséLuis
|
|
1987
|
27 |
3 |
p. 457-458
2 p.
|
artikel
|
| 90 |
Offshore assembly: a time of change
|
|
|
1987
|
27 |
3 |
p. 589-
1 p.
|
artikel
|
| 91 |
On Bayes estimation for mixtures of two exponential life distributions from right-censored samples
|
|
|
1987
|
27 |
3 |
p. 589-
1 p.
|
artikel
|
| 92 |
On the reliability of a number of s-p reducible graphs
|
Katsademas, Sophocles L.
|
|
1987
|
27 |
3 |
p. 493-505
13 p.
|
artikel
|
| 93 |
Optical lithography and contrast enhancement
|
|
|
1987
|
27 |
3 |
p. 592-
1 p.
|
artikel
|
| 94 |
Optimal allocation of effort to improve system reliability
|
|
|
1987
|
27 |
3 |
p. 581-
1 p.
|
artikel
|
| 95 |
Optimal inspection and replacement of a coherent system
|
Aven, Terje
|
|
1987
|
27 |
3 |
p. 447-450
4 p.
|
artikel
|
| 96 |
Pattern transfer
|
|
|
1987
|
27 |
3 |
p. 590-
1 p.
|
artikel
|
| 97 |
Pb-Sn solder for die bonding of silicon chips
|
|
|
1987
|
27 |
3 |
p. 582-
1 p.
|
artikel
|
| 98 |
Power GaAs FET RF life test using temperature-compensated electrical stressing
|
|
|
1987
|
27 |
3 |
p. 583-
1 p.
|
artikel
|
| 99 |
Practical adhesion of an Ag-Pd thick-film conductor: an acoustic emission study of pull tests—Part II, aged adhesion
|
|
|
1987
|
27 |
3 |
p. 594-
1 p.
|
artikel
|
| 100 |
Practical adhesion of an Ag-Pd thick-film conductor: an acoustic emission study of pull tests—Part I, monitoring system and initial adhesion
|
|
|
1987
|
27 |
3 |
p. 594-
1 p.
|
artikel
|
| 101 |
Predicting reliability of LSI printed circuit carriers
|
|
|
1987
|
27 |
3 |
p. 582-
1 p.
|
artikel
|
| 102 |
Preparation and properties of a new thick film system
|
|
|
1987
|
27 |
3 |
p. 593-594
2 p.
|
artikel
|
| 103 |
Probing ASIC devices
|
|
|
1987
|
27 |
3 |
p. 592-
1 p.
|
artikel
|
| 104 |
4632294 Process and apparatus for individual pin repair in a dense array of connector pins of an electronic packaging structure
|
Druschel, William
|
|
1987
|
27 |
3 |
p. 597-
1 p.
|
artikel
|
| 105 |
8607652 Process for manufacturing semiconductor devices
|
UEKI, Yoshio
|
|
1987
|
27 |
3 |
p. 597-598
2 p.
|
artikel
|
| 106 |
Publications, notices, calls for papers, etc.
|
|
|
1987
|
27 |
3 |
p. 405-
1 p.
|
artikel
|
| 107 |
Quality assurance—a total systems approach
|
|
|
1987
|
27 |
3 |
p. 585-
1 p.
|
artikel
|
| 108 |
Quantum mechanical tunnelling and its application
|
G.W.A.D.,
|
|
1987
|
27 |
3 |
p. 579-
1 p.
|
artikel
|
| 109 |
“Quartzware” for diffusion furnaces
|
|
|
1987
|
27 |
3 |
p. 590-
1 p.
|
artikel
|
| 110 |
Radial dependency of reliability defects on silicon wafers
|
|
|
1987
|
27 |
3 |
p. 584-
1 p.
|
artikel
|
| 111 |
Rapidly solidified solder foil for die attachment application
|
|
|
1987
|
27 |
3 |
p. 590-
1 p.
|
artikel
|
| 112 |
Reconfigurable architectures for VLSI processing arrays
|
|
|
1987
|
27 |
3 |
p. 592-
1 p.
|
artikel
|
| 113 |
Reliability assessment of integrated circuits through reverse engineering techniques
|
|
|
1987
|
27 |
3 |
p. 582-
1 p.
|
artikel
|
| 114 |
Reliability bounds for fault-tolerant systems with competing responses to component failures
|
|
|
1987
|
27 |
3 |
p. 585-
1 p.
|
artikel
|
| 115 |
Reliability characterization of a 3 μm CMOS/SOS process
|
|
|
1987
|
27 |
3 |
p. 583-
1 p.
|
artikel
|
| 116 |
Reliability growth during flight test
|
|
|
1987
|
27 |
3 |
p. 587-
1 p.
|
artikel
|
| 117 |
Reliability growth measurement applied to ESS
|
|
|
1987
|
27 |
3 |
p. 588-
1 p.
|
artikel
|
| 118 |
Reliability in the manufacturing cycle
|
|
|
1987
|
27 |
3 |
p. 587-
1 p.
|
artikel
|
| 119 |
Reliability investigation of 1 micron depletion mode IC MESFETS
|
|
|
1987
|
27 |
3 |
p. 584-
1 p.
|
artikel
|
| 120 |
Reliability of trench capacitors for VLSI memories
|
|
|
1987
|
27 |
3 |
p. 585-
1 p.
|
artikel
|
| 121 |
RELTEST. A reliability testing method
|
|
|
1987
|
27 |
3 |
p. 586-
1 p.
|
artikel
|
| 122 |
Replacing units whose components have normal life distributions
|
|
|
1987
|
27 |
3 |
p. 585-586
2 p.
|
artikel
|
| 123 |
Reverse tailoring for realistic reliability tests
|
|
|
1987
|
27 |
3 |
p. 588-
1 p.
|
artikel
|
| 124 |
Run-in strategy for electronic assemblies
|
|
|
1987
|
27 |
3 |
p. 587-
1 p.
|
artikel
|
| 125 |
Scheduling of routine maintenance using production schedules and equipment failure history
|
|
|
1987
|
27 |
3 |
p. 587-
1 p.
|
artikel
|
| 126 |
Schottky diode analysis for evaluation of RIE effects on silicon surfaces
|
|
|
1987
|
27 |
3 |
p. 591-
1 p.
|
artikel
|
| 127 |
4631724 Semiconductor memory test equipment
|
Shimizu, Masa
|
|
1987
|
27 |
3 |
p. 597-
1 p.
|
artikel
|
| 128 |
Silicon films deposited in a vertical-flow reactor
|
|
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1987
|
27 |
3 |
p. 593-
1 p.
|
artikel
|
| 129 |
Soft-error filtering: a solution to the reliability problem of future VLSI digital circuits
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|
|
1987
|
27 |
3 |
p. 592-593
2 p.
|
artikel
|
| 130 |
Solution of wire creep rupture problem in a thick-film power hybrid
|
|
|
1987
|
27 |
3 |
p. 594-
1 p.
|
artikel
|
| 131 |
Specifying operational availability
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|
|
1987
|
27 |
3 |
p. 588-
1 p.
|
artikel
|
| 132 |
Status and prospects of surface mount technology
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|
|
1987
|
27 |
3 |
p. 592-
1 p.
|
artikel
|
| 133 |
Submicron 1:1 optical lithography
|
|
|
1987
|
27 |
3 |
p. 591-
1 p.
|
artikel
|
| 134 |
Subsurface structural defects in GaAs wafers
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|
|
1987
|
27 |
3 |
p. 584-
1 p.
|
artikel
|
| 135 |
Surface analysis technology. Part 1. Applications
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|
|
1987
|
27 |
3 |
p. 592-
1 p.
|
artikel
|
| 136 |
Surface mount packaging report
|
|
|
1987
|
27 |
3 |
p. 592-
1 p.
|
artikel
|
| 137 |
Testing constant failure rate against some partially monotone alternatives
|
Xie, Min
|
|
1987
|
27 |
3 |
p. 557-565
9 p.
|
artikel
|
| 138 |
The challenge for ultrapure water
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|
|
1987
|
27 |
3 |
p. 590-
1 p.
|
artikel
|
| 139 |
The dawn of epitaxy's new era
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|
|
1987
|
27 |
3 |
p. 589-
1 p.
|
artikel
|
| 140 |
The distribution of electromigration failures
|
|
|
1987
|
27 |
3 |
p. 583-
1 p.
|
artikel
|
| 141 |
The effect of incomplete and deleterious periodic maintenance on fault-tolerant computer systems
|
|
|
1987
|
27 |
3 |
p. 586-
1 p.
|
artikel
|
| 142 |
The effect of long-term stress on filler-induced failure in high density RAMs
|
|
|
1987
|
27 |
3 |
p. 584-
1 p.
|
artikel
|
| 143 |
The graphical solution of optimum fixed-age replacement problems based upon the alternative criterion of Derman and Sacks
|
Bendell, A.
|
|
1987
|
27 |
3 |
p. 409-412
4 p.
|
artikel
|
| 144 |
The impact of stepper field registration on manufacturing
|
|
|
1987
|
27 |
3 |
p. 592-
1 p.
|
artikel
|
| 145 |
The low process yield of some PNP power transistors
|
Hayat, S.A.
|
|
1987
|
27 |
3 |
p. 475-486
12 p.
|
artikel
|
| 146 |
Theoretical problems in ion implantation and the Monte Carlo methods
|
|
|
1987
|
27 |
3 |
p. 594-595
2 p.
|
artikel
|
| 147 |
The power of approximate tests for the regression coefficients in a gamma regression model
|
|
|
1987
|
27 |
3 |
p. 593-
1 p.
|
artikel
|
| 148 |
The reliability of encapsulated and unencapsulated thick-film hybrid microcircuits
|
|
|
1987
|
27 |
3 |
p. 585-
1 p.
|
artikel
|
| 149 |
Thermo-mechanical cycling behaviour of Al thin-film metallization
|
|
|
1987
|
27 |
3 |
p. 594-
1 p.
|
artikel
|
| 150 |
Thick film temperature sensors using standard pastes
|
|
|
1987
|
27 |
3 |
p. 593-
1 p.
|
artikel
|
| 151 |
Today's clean room success
|
|
|
1987
|
27 |
3 |
p. 590-
1 p.
|
artikel
|
| 152 |
Trends in vertical diffusion furnaces
|
|
|
1987
|
27 |
3 |
p. 590-
1 p.
|
artikel
|
| 153 |
US army battlefield damage assessment and repair program—manuals and kits
|
|
|
1987
|
27 |
3 |
p. 587-
1 p.
|
artikel
|
| 154 |
Use of excimer lasers in photolithography
|
|
|
1987
|
27 |
3 |
p. 595-
1 p.
|
artikel
|
| 155 |
VLSI impact on RAMS strategies in avionics design
|
|
|
1987
|
27 |
3 |
p. 589-
1 p.
|
artikel
|
| 156 |
Wafer steppers and lens options
|
|
|
1987
|
27 |
3 |
p. 590-
1 p.
|
artikel
|
| 157 |
X-ray lithography: can it be justified?
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|
|
1987
|
27 |
3 |
p. 589-
1 p.
|
artikel
|
| 158 |
Zero-defect software: the elusive goal
|
|
|
1987
|
27 |
3 |
p. 588-
1 p.
|
artikel
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