| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A closed loop system for reliability improvement
|
|
|
1987
|
27 |
2 |
p. 382-
1 p.
|
artikel
|
| 2 |
A computer-aided technique for fault detection in combinational circuits
|
Rai, Suresh
|
|
1987
|
27 |
2 |
p. 263-265
3 p.
|
artikel
|
| 3 |
A decomposition technique for the overall reliability evaluation of large computer communication networks
|
Mandaltsis, D.
|
|
1987
|
27 |
2 |
p. 299-312
14 p.
|
artikel
|
| 4 |
ADEE grows with automation trend
|
|
|
1987
|
27 |
2 |
p. 383-
1 p.
|
artikel
|
| 5 |
4612805 Adhesion characterization test site
|
Bruce, JamesA
|
|
1987
|
27 |
2 |
p. 397-
1 p.
|
artikel
|
| 6 |
Airborne particle monitoring approaches 0.1 μm
|
|
|
1987
|
27 |
2 |
p. 387-
1 p.
|
artikel
|
| 7 |
A memory-effective fast algorithm for computing the reliability of complex systems/networks
|
Rueger, W.J.
|
|
1987
|
27 |
2 |
p. 273-277
5 p.
|
artikel
|
| 8 |
A modified ion source for semiconductor implantation purposes
|
|
|
1987
|
27 |
2 |
p. 391-
1 p.
|
artikel
|
| 9 |
An algorithm for automatic prober movement control for better coverage of test sites on a wafer during measurement
|
Gupta, Shobha
|
|
1987
|
27 |
2 |
p. 281-282
2 p.
|
artikel
|
| 10 |
An availability prediction method for computer systems
|
|
|
1987
|
27 |
2 |
p. 381-382
2 p.
|
artikel
|
| 11 |
A new scheme for device packaging
|
|
|
1987
|
27 |
2 |
p. 385-
1 p.
|
artikel
|
| 12 |
Applications for MeV ion implantation
|
|
|
1987
|
27 |
2 |
p. 391-
1 p.
|
artikel
|
| 13 |
A self-focused multichannel electron beam source for annealing of ion-implanted semiconductors
|
|
|
1987
|
27 |
2 |
p. 391-
1 p.
|
artikel
|
| 14 |
A simple technique for failure analysis of MOS IC using liquid crystal
|
|
|
1987
|
27 |
2 |
p. 380-
1 p.
|
artikel
|
| 15 |
A study on optimal maintenance of system with exponential distribution
|
|
|
1987
|
27 |
2 |
p. 382-
1 p.
|
artikel
|
| 16 |
A Tellegen's theorem approach to the fault diagnosis of general analog circuits
|
Al-Shanuti, Sulaiman I.
|
|
1987
|
27 |
2 |
p. 283-297
15 p.
|
artikel
|
| 17 |
Availability of a system with permissible repair time
|
|
|
1987
|
27 |
2 |
p. 381-
1 p.
|
artikel
|
| 18 |
A VHSIC lithography overview
|
|
|
1987
|
27 |
2 |
p. 384-
1 p.
|
artikel
|
| 19 |
Bibliography of literature on reliability in automotive industries
|
Dhillon, Balbir S.
|
|
1987
|
27 |
2 |
p. 361-373
13 p.
|
artikel
|
| 20 |
Built-in-test for fail-safe design
|
|
|
1987
|
27 |
2 |
p. 383-
1 p.
|
artikel
|
| 21 |
Built-in-test verification techniques
|
|
|
1987
|
27 |
2 |
p. 383-
1 p.
|
artikel
|
| 22 |
CAFTA+: a comprehensive fault tree development work station
|
|
|
1987
|
27 |
2 |
p. 383-
1 p.
|
artikel
|
| 23 |
Calculating the S-T up and down distributions of a class of stochastic networks
|
Kiu, Sun-Wah
|
|
1987
|
27 |
2 |
p. 313-326
14 p.
|
artikel
|
| 24 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1987
|
27 |
2 |
p. 201-205
5 p.
|
artikel
|
| 25 |
Classification of macroscopic defects contained in p-type EFG ribbon silicon
|
|
|
1987
|
27 |
2 |
p. 388-
1 p.
|
artikel
|
| 26 |
4590388 CMOS spare decoder circuit
|
Clemons, DonaldG
|
|
1987
|
27 |
2 |
p. 393-
1 p.
|
artikel
|
| 27 |
CMOS—the emerging VLSI technology
|
|
|
1987
|
27 |
2 |
p. 384-
1 p.
|
artikel
|
| 28 |
Combined in-circuit and functional tests: Model and application
|
Sultan, Torky I.
|
|
1987
|
27 |
2 |
p. 279-280
2 p.
|
artikel
|
| 29 |
Corrosion failure modes in a TAB200 test vehicle
|
|
|
1987
|
27 |
2 |
p. 382-
1 p.
|
artikel
|
| 30 |
Current-leakage kinetics across tinned Cr/Cu lands having epoxy overlay
|
|
|
1987
|
27 |
2 |
p. 379-
1 p.
|
artikel
|
| 31 |
Custom v.l.s.i. circuits for man-machine interaction: an automatic design method
|
|
|
1987
|
27 |
2 |
p. 387-
1 p.
|
artikel
|
| 32 |
Designing and manufacturing surface mount assemblies
|
|
|
1987
|
27 |
2 |
p. 386-
1 p.
|
artikel
|
| 33 |
Designing for reliability in the automatic washing machine with a micro-computer
|
|
|
1987
|
27 |
2 |
p. 382-
1 p.
|
artikel
|
| 34 |
Designing sequential life test with type I censoring
|
|
|
1987
|
27 |
2 |
p. 381-
1 p.
|
artikel
|
| 35 |
Determination of all hamiltonian paths and circuits and the minimal feedback set in a graph through Petri nets
|
Hura, G.S.
|
|
1987
|
27 |
2 |
p. 223-227
5 p.
|
artikel
|
| 36 |
4604572 Device for testing semiconductor devices at a high temperature
|
Horiuchi, Akinor
|
|
1987
|
27 |
2 |
p. 395-
1 p.
|
artikel
|
| 37 |
Direct-write pyrolytic laser deposition
|
|
|
1987
|
27 |
2 |
p. 392-
1 p.
|
artikel
|
| 38 |
Dominating the maximum likelihood estimator in predicting reliability
|
Jaisingh, Lloyd R.
|
|
1987
|
27 |
2 |
p. 345-350
6 p.
|
artikel
|
| 39 |
4598308 Easily repairable, low cost, high speed electromechanical assembly of integrated circuit die
|
James, ChristopherD
|
|
1987
|
27 |
2 |
p. 395-
1 p.
|
artikel
|
| 40 |
Effect of planarization on VLSI processing
|
|
|
1987
|
27 |
2 |
p. 386-
1 p.
|
artikel
|
| 41 |
Efficient silicon compilation of digital control specifications
|
|
|
1987
|
27 |
2 |
p. 387-
1 p.
|
artikel
|
| 42 |
Electrical and thermal stability of AuGeNi OHMIC contacts to GaAs fabricated with in situ RF sputter cleaning
|
|
|
1987
|
27 |
2 |
p. 388-
1 p.
|
artikel
|
| 43 |
Electrical characterization of packages for high-speed integrated circuits
|
|
|
1987
|
27 |
2 |
p. 387-
1 p.
|
artikel
|
| 44 |
Environmental stress screening (ESS) demonstrate its value in the field
|
|
|
1987
|
27 |
2 |
p. 383-
1 p.
|
artikel
|
| 45 |
EPIC: a cost-effective plastic chip carrier for VLSI packaging
|
|
|
1987
|
27 |
2 |
p. 385-
1 p.
|
artikel
|
| 46 |
4612640 Error checking and correction circuitry for use with an electrically-programmable and electrically-erasable memory array
|
Mehrotra, Sanja
|
|
1987
|
27 |
2 |
p. 396-397
2 p.
|
artikel
|
| 47 |
Estimation of reliability for silicon devices irradiated with electrons
|
|
|
1987
|
27 |
2 |
p. 392-
1 p.
|
artikel
|
| 48 |
Estimation of storage of spare replacement/maintainance equipment
|
|
|
1987
|
27 |
2 |
p. 382-
1 p.
|
artikel
|
| 49 |
Evaluating ion implanter options
|
|
|
1987
|
27 |
2 |
p. 391-
1 p.
|
artikel
|
| 50 |
Field data on electronic components for industrial measuring instruments and their problems
|
|
|
1987
|
27 |
2 |
p. 380-
1 p.
|
artikel
|
| 51 |
Future requirements of pure water analysis
|
|
|
1987
|
27 |
2 |
p. 387-
1 p.
|
artikel
|
| 52 |
G/G/G two-unit standby redundant systems
|
Subramanian, R.
|
|
1987
|
27 |
2 |
p. 249-261
13 p.
|
artikel
|
| 53 |
Guidance in the use of MIL-STD-781D and MIL-HDBK-781
|
|
|
1987
|
27 |
2 |
p. 384-
1 p.
|
artikel
|
| 54 |
Hazardous production gases. Part 1: storage and control
|
|
|
1987
|
27 |
2 |
p. 387-
1 p.
|
artikel
|
| 55 |
High-accuracy die-bonding technology for LED array
|
|
|
1987
|
27 |
2 |
p. 385-
1 p.
|
artikel
|
| 56 |
High-adhesion thick-film gold without glass or metal-oxide powder additives
|
|
|
1987
|
27 |
2 |
p. 389-
1 p.
|
artikel
|
| 57 |
8603632 High reliability complementary logic
|
Kirsch, HowardClayton
|
|
1987
|
27 |
2 |
p. 398-
1 p.
|
artikel
|
| 58 |
High reliable package designing of the surface mount device; PLCC
|
|
|
1987
|
27 |
2 |
p. 386-
1 p.
|
artikel
|
| 59 |
How to calculate the true permissible leak rate and how to raise it by four orders of magnitude
|
|
|
1987
|
27 |
2 |
p. 385-386
2 p.
|
artikel
|
| 60 |
Human performance reliability modeling
|
|
|
1987
|
27 |
2 |
p. 379-
1 p.
|
artikel
|
| 61 |
Human reliability analysis, prediction, and prevention of human errors
|
G.W.A.D.,
|
|
1987
|
27 |
2 |
p. 375-376
2 p.
|
artikel
|
| 62 |
IC interface for electronic displays: the way forward
|
|
|
1987
|
27 |
2 |
p. 383-384
2 p.
|
artikel
|
| 63 |
Imaging latch-up sites in CMOS integrated circuits using laser scanning
|
|
|
1987
|
27 |
2 |
p. 391-
1 p.
|
artikel
|
| 64 |
Improving thermosonic gold ball bond reliability
|
|
|
1987
|
27 |
2 |
p. 385-
1 p.
|
artikel
|
| 65 |
Insuring reliability in the desing process
|
|
|
1987
|
27 |
2 |
p. 383-
1 p.
|
artikel
|
| 66 |
4613970 Integrated circuit device and method of diagnosing the same
|
Masuda, Ikuro
|
|
1987
|
27 |
2 |
p. 397-
1 p.
|
artikel
|
| 67 |
International Conference ICOREM '86
|
|
|
1987
|
27 |
2 |
p. 221-
1 p.
|
artikel
|
| 68 |
Investigation and interpretation of adsorption on silicon surfaces
|
|
|
1987
|
27 |
2 |
p. 388-
1 p.
|
artikel
|
| 69 |
Investigation of the Si-SiO2 interface by surface inversion currents
|
|
|
1987
|
27 |
2 |
p. 388-
1 p.
|
artikel
|
| 70 |
Ion and plasma assisted etching of holographic gratings
|
|
|
1987
|
27 |
2 |
p. 390-391
2 p.
|
artikel
|
| 71 |
Ion implanters: major 1986 trends
|
|
|
1987
|
27 |
2 |
p. 391-
1 p.
|
artikel
|
| 72 |
Ionized cluster beam technique
|
|
|
1987
|
27 |
2 |
p. 391-
1 p.
|
artikel
|
| 73 |
Laser-based structure studies of silicon and gallium arsenide
|
|
|
1987
|
27 |
2 |
p. 391-392
2 p.
|
artikel
|
| 74 |
Laser-enhanced plating and etching for microelectronic applications
|
|
|
1987
|
27 |
2 |
p. 390-
1 p.
|
artikel
|
| 75 |
Laser planarization
|
|
|
1987
|
27 |
2 |
p. 391-
1 p.
|
artikel
|
| 76 |
Low-stress resin encapsulants for semiconductor devices
|
|
|
1987
|
27 |
2 |
p. 385-
1 p.
|
artikel
|
| 77 |
LSI failure analysis using an electron-beam tester directly combined to an LSI tester
|
|
|
1987
|
27 |
2 |
p. 390-
1 p.
|
artikel
|
| 78 |
Machine vision automates inspection of thick-film hybrids
|
|
|
1987
|
27 |
2 |
p. 389-
1 p.
|
artikel
|
| 79 |
4601034 Method and apparatus for testing very large scale integrated memory circuits
|
Sridhar, Thirumalai
|
|
1987
|
27 |
2 |
p. 394-
1 p.
|
artikel
|
| 80 |
4600597 Method and device for determining the contour of spin-coated thin films of material on substrate topography
|
White, Lawrence
|
|
1987
|
27 |
2 |
p. 393-394
2 p.
|
artikel
|
| 81 |
4599241 Method for inspecting defects of thin material film
|
Nakaboh, Hiroshi
|
|
1987
|
27 |
2 |
p. 393-
1 p.
|
artikel
|
| 82 |
Miniature microwave hybrid circuits—alternative to monolithic circuits
|
|
|
1987
|
27 |
2 |
p. 389-
1 p.
|
artikel
|
| 83 |
Miniline: research applied to manufacturing
|
|
|
1987
|
27 |
2 |
p. 384-385
2 p.
|
artikel
|
| 84 |
4603405 Monolithically integrated semiconductor circuit
|
Michael, Ewald
|
|
1987
|
27 |
2 |
p. 394-
1 p.
|
artikel
|
| 85 |
4602210 Multiplexed-access scan testable integrated circuit
|
Fasang, PatrickP
|
|
1987
|
27 |
2 |
p. 394-
1 p.
|
artikel
|
| 86 |
New oxygen related shallow thermal donor centres in Czochralski-grown silicon
|
|
|
1987
|
27 |
2 |
p. 388-
1 p.
|
artikel
|
| 87 |
New plastic molded power devices for high reliability
|
|
|
1987
|
27 |
2 |
p. 381-
1 p.
|
artikel
|
| 88 |
Non-mass analysed ion implantation using microwave ion source
|
|
|
1987
|
27 |
2 |
p. 391-
1 p.
|
artikel
|
| 89 |
One micron lithography using a dyed resist on highly reflective topography
|
|
|
1987
|
27 |
2 |
p. 386-
1 p.
|
artikel
|
| 90 |
Packaging technology for the NEC SX supercomputer
|
|
|
1987
|
27 |
2 |
p. 385-
1 p.
|
artikel
|
| 91 |
PAFT F77, programme for the analysis of fault trees
|
|
|
1987
|
27 |
2 |
p. 382-
1 p.
|
artikel
|
| 92 |
Photomask and reticle materials review
|
|
|
1987
|
27 |
2 |
p. 387-
1 p.
|
artikel
|
| 93 |
Plasma deposition of metal oxide films for integrated optics
|
|
|
1987
|
27 |
2 |
p. 390-
1 p.
|
artikel
|
| 94 |
Plasma filament ion source
|
|
|
1987
|
27 |
2 |
p. 390-
1 p.
|
artikel
|
| 95 |
4591891 Post-metal electron beam programmable MOS read only memory
|
Chatterjee, PallabK
|
|
1987
|
27 |
2 |
p. 393-
1 p.
|
artikel
|
| 96 |
Power-temperature dependence of elements in hybrid circuits
|
|
|
1987
|
27 |
2 |
p. 389-
1 p.
|
artikel
|
| 97 |
Probabilistic analysis of a two-unit system with a warm standby subject to preventive maintenance and a single service facility
|
Mokaddis, G.S.
|
|
1987
|
27 |
2 |
p. 327-343
17 p.
|
artikel
|
| 98 |
Process physics: implications for manufacturing of submicron silicon devices
|
|
|
1987
|
27 |
2 |
p. 387-
1 p.
|
artikel
|
| 99 |
Products liability: the problem of the non-designing manufacturer
|
|
|
1987
|
27 |
2 |
p. 383-
1 p.
|
artikel
|
| 100 |
4605872 Programmable CMOS circuit for use in connecting and disconnecting a semiconductor device in a redundant electrical circuit
|
Rung, Robert
|
|
1987
|
27 |
2 |
p. 396-
1 p.
|
artikel
|
| 101 |
4611320 Programmable testing analyzer
|
Southard, Gar
|
|
1987
|
27 |
2 |
p. 396-
1 p.
|
artikel
|
| 102 |
Properties of reactive sputtered TiW
|
|
|
1987
|
27 |
2 |
p. 389-
1 p.
|
artikel
|
| 103 |
Publications, notices, calls for papers, Etc
|
|
|
1987
|
27 |
2 |
p. 207-219
13 p.
|
artikel
|
| 104 |
4616178 Pulsed linear integrated circuit tester
|
Thornton, MaxC
|
|
1987
|
27 |
2 |
p. 397-
1 p.
|
artikel
|
| 105 |
Rapid evaluation methods for thick-film multilayer conductor systems for hybrid microcircuits
|
|
|
1987
|
27 |
2 |
p. 389-
1 p.
|
artikel
|
| 106 |
Recent IC assembly technology and reliability Ag paste glue die bonding
|
|
|
1987
|
27 |
2 |
p. 386-
1 p.
|
artikel
|
| 107 |
4606013 Redundancy-secured semiconductor memory
|
Yoshimoto, Masahiko
|
|
1987
|
27 |
2 |
p. 396-
1 p.
|
artikel
|
| 108 |
Reliability analysis of a repairable parallel system with standby involving human error and common-cause failures
|
Who Kee Chung,
|
|
1987
|
27 |
2 |
p. 269-271
3 p.
|
artikel
|
| 109 |
Reliability analysis of multiple-state devices
|
Who Kee Chung,
|
|
1987
|
27 |
2 |
p. 267-268
2 p.
|
artikel
|
| 110 |
Reliability considerations for communications satellites
|
|
|
1987
|
27 |
2 |
p. 383-
1 p.
|
artikel
|
| 111 |
Reliability evaluation for optimally operated, large, electric power systems
|
|
|
1987
|
27 |
2 |
p. 382-
1 p.
|
artikel
|
| 112 |
Reliability growth by stress screening and more
|
|
|
1987
|
27 |
2 |
p. 383-
1 p.
|
artikel
|
| 113 |
Reliability of CRT. The life-span of CRT and the accelerated evaluation method
|
|
|
1987
|
27 |
2 |
p. 381-
1 p.
|
artikel
|
| 114 |
Reliability of GaAs FET
|
|
|
1987
|
27 |
2 |
p. 380-
1 p.
|
artikel
|
| 115 |
Reliability of high-voltage LSI's made using the dielectric isolation process
|
|
|
1987
|
27 |
2 |
p. 380-
1 p.
|
artikel
|
| 116 |
Semiconductor industry tries to move to single sourcing
|
|
|
1987
|
27 |
2 |
p. 384-
1 p.
|
artikel
|
| 117 |
4598388 Semiconductor memory with redundant column circuitry
|
Anderson, DanielF
|
|
1987
|
27 |
2 |
p. 395-
1 p.
|
artikel
|
| 118 |
Sizing hybrid packages for optimum reliability
|
|
|
1987
|
27 |
2 |
p. 388-389
2 p.
|
artikel
|
| 119 |
Solder pad geometry studies for surface mount of chip capacitors
|
|
|
1987
|
27 |
2 |
p. 380-
1 p.
|
artikel
|
| 120 |
Specifying maintainability—a new approach
|
|
|
1987
|
27 |
2 |
p. 379-
1 p.
|
artikel
|
| 121 |
Steady-state computer simulations of package sealing methods
|
|
|
1987
|
27 |
2 |
p. 384-
1 p.
|
artikel
|
| 122 |
Stochastic model of multiple unit system
|
Subramanian, R.
|
|
1987
|
27 |
2 |
p. 351-359
9 p.
|
artikel
|
| 123 |
Stress-induced deformation of aluminum metallization in plastic molded semiconductor devices
|
|
|
1987
|
27 |
2 |
p. 379-380
2 p.
|
artikel
|
| 124 |
Supply and failure data reliability analysis system
|
|
|
1987
|
27 |
2 |
p. 382-
1 p.
|
artikel
|
| 125 |
Surface mount digital package reliability
|
|
|
1987
|
27 |
2 |
p. 381-
1 p.
|
artikel
|
| 126 |
Surface mounted assemblies
|
G.W.A.D.,
|
|
1987
|
27 |
2 |
p. 376-377
2 p.
|
artikel
|
| 127 |
Surface mount technology experience: problems and solutions
|
|
|
1987
|
27 |
2 |
p. 387-
1 p.
|
artikel
|
| 128 |
Surface mount technology for high reliability telecoms applications
|
|
|
1987
|
27 |
2 |
p. 386-
1 p.
|
artikel
|
| 129 |
TAB versus wire bond—relative thermal performance
|
|
|
1987
|
27 |
2 |
p. 384-
1 p.
|
artikel
|
| 130 |
4612499 Test input demultiplexing circuit
|
Andresen, BernhardH
|
|
1987
|
27 |
2 |
p. 396-
1 p.
|
artikel
|
| 131 |
8604686 Test pattern generator
|
Kawaguchi, Ikuo
|
|
1987
|
27 |
2 |
p. 398-
1 p.
|
artikel
|
| 132 |
The development and application of an ion implanter based on ion thruster technology
|
|
|
1987
|
27 |
2 |
p. 390-
1 p.
|
artikel
|
| 133 |
The effect of joint design on the thermal fatigue life of leadless chip carrier solder joints
|
|
|
1987
|
27 |
2 |
p. 380-
1 p.
|
artikel
|
| 134 |
The highs and lows of reliability predictions
|
|
|
1987
|
27 |
2 |
p. 380-381
2 p.
|
artikel
|
| 135 |
The impact of surface mount technology on electronics manufacturing
|
|
|
1987
|
27 |
2 |
p. 386-
1 p.
|
artikel
|
| 136 |
The modeling of plasma etching processes using response surface methodology
|
|
|
1987
|
27 |
2 |
p. 387-
1 p.
|
artikel
|
| 137 |
Theoretical study of thermal properties for Si-Ge system
|
|
|
1987
|
27 |
2 |
p. 388-
1 p.
|
artikel
|
| 138 |
The PCB connector as a surface mounted device
|
|
|
1987
|
27 |
2 |
p. 385-
1 p.
|
artikel
|
| 139 |
The physical limitations of integration and size reduction in semiconductors
|
|
|
1987
|
27 |
2 |
p. 384-
1 p.
|
artikel
|
| 140 |
The reliability of surface mounted solder joints under PWB cyclic mechanical stresses
|
|
|
1987
|
27 |
2 |
p. 380-
1 p.
|
artikel
|
| 141 |
The technology of computer-aided design
|
|
|
1987
|
27 |
2 |
p. 386-387
2 p.
|
artikel
|
| 142 |
Thick film pressure transducers
|
|
|
1987
|
27 |
2 |
p. 389-390
2 p.
|
artikel
|
| 143 |
Throughput modeling for ion implantation
|
|
|
1987
|
27 |
2 |
p. 391-
1 p.
|
artikel
|
| 144 |
Trends and targets of high reliability test techniques for computer system
|
|
|
1987
|
27 |
2 |
p. 381-
1 p.
|
artikel
|
| 145 |
Étude et réalisation d'une colonne ionique pour faisceaux d'ions de dimensions submicroniques. Applications á l'écriture ionique localisée
|
|
|
1987
|
27 |
2 |
p. 390-
1 p.
|
artikel
|
| 146 |
Two-unit standby systems with non-instantaneous switchover and imperfect switch
|
Subramanian, R.
|
|
1987
|
27 |
2 |
p. 237-247
11 p.
|
artikel
|
| 147 |
Ultradense chips: the drive quickens
|
|
|
1987
|
27 |
2 |
p. 386-
1 p.
|
artikel
|
| 148 |
VLSI design using Apple MacIntosh
|
Anneberg, Lisa
|
|
1987
|
27 |
2 |
p. 229-235
7 p.
|
artikel
|
| 149 |
Warranty pricing with a life cycle cost model
|
|
|
1987
|
27 |
2 |
p. 379-
1 p.
|
artikel
|
| 150 |
X-ray lithography
|
|
|
1987
|
27 |
2 |
p. 387-
1 p.
|
artikel
|
| 151 |
Yield analysis and improvement of CCD devices
|
|
|
1987
|
27 |
2 |
p. 381-
1 p.
|
artikel
|
| 152 |
4613959 Zero power CMOS redundancy circuit
|
Jiang, Ching-Lin
|
|
1987
|
27 |
2 |
p. 397-
1 p.
|
artikel
|
| 153 |
Zirconium nitride thin-film resistors with high thermal durability
|
|
|
1987
|
27 |
2 |
p. 389-
1 p.
|
artikel
|
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