| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Accuracy of univariate, bivariate and a “modified double Monte Carlo” technique for finding lower confidence limits of system reliability
|
|
|
1983
|
23 |
6 |
p. 1174-
1 p.
|
artikel
|
| 2 |
A cutset approach to reliability evaluation in communication networks
|
|
|
1983
|
23 |
6 |
p. 1173-
1 p.
|
artikel
|
| 3 |
Advances in automated wire and die bonding
|
|
|
1983
|
23 |
6 |
p. 1181-
1 p.
|
artikel
|
| 4 |
Advances in customization free VLSI system designers
|
|
|
1983
|
23 |
6 |
p. 1182-
1 p.
|
artikel
|
| 5 |
A graphical method applicable to age-replacement problems
|
|
|
1983
|
23 |
6 |
p. 1174-
1 p.
|
artikel
|
| 6 |
A life cycle costing methodology for the assessment of process heat generation by solar energy
|
Sherie, Yosef S.
|
|
1983
|
23 |
6 |
p. 1069-1074
6 p.
|
artikel
|
| 7 |
Alternating space-charge-limited currents in hydrogenated amorphous silicon
|
|
|
1983
|
23 |
6 |
p. 1183-
1 p.
|
artikel
|
| 8 |
A Markov approach to wear-out modelling
|
|
|
1983
|
23 |
6 |
p. 1174-1175
2 p.
|
artikel
|
| 9 |
A model for the prediction of assembly, rework and test yields
|
|
|
1983
|
23 |
6 |
p. 1176-
1 p.
|
artikel
|
| 10 |
A modified block replacement with two variables
|
|
|
1983
|
23 |
6 |
p. 1176-
1 p.
|
artikel
|
| 11 |
Amorphous-silicon devices start to shape up
|
|
|
1983
|
23 |
6 |
p. 1184-
1 p.
|
artikel
|
| 12 |
Analog modeling simulates the faults of electromechanical components
|
|
|
1983
|
23 |
6 |
p. 1169-
1 p.
|
artikel
|
| 13 |
Analysis of a two-unit cold standby system with three modes
|
Goel, L.R.
|
|
1983
|
23 |
6 |
p. 1041-1044
4 p.
|
artikel
|
| 14 |
Analysis of a two-unit hot standby system with three modes
|
Goel, L.R.
|
|
1983
|
23 |
6 |
p. 1029-1033
5 p.
|
artikel
|
| 15 |
An analytic method for uncertainty analysis of nonlinear output functions, with applications to fault-tree analysis
|
|
|
1983
|
23 |
6 |
p. 1173-
1 p.
|
artikel
|
| 16 |
An approach to ensure stability of precision laser trimmed thick film resistors
|
|
|
1983
|
23 |
6 |
p. 1185-
1 p.
|
artikel
|
| 17 |
An error analysis for reliability quantification
|
|
|
1983
|
23 |
6 |
p. 1171-
1 p.
|
artikel
|
| 18 |
A new approach for network reliability analysis
|
|
|
1983
|
23 |
6 |
p. 1177-
1 p.
|
artikel
|
| 19 |
A new model of software reliability prediction
|
Govil, K.K.
|
|
1983
|
23 |
6 |
p. 1009-1010
2 p.
|
artikel
|
| 20 |
A new package-related failure mechanism for leadless ceramic chip carriers (LC-3s) solder-attached to Alumina substrates
|
|
|
1983
|
23 |
6 |
p. 1169-1170
2 p.
|
artikel
|
| 21 |
An extension of the block preventive maintenance policy for stochastically failing items
|
|
|
1983
|
23 |
6 |
p. 1177-
1 p.
|
artikel
|
| 22 |
An LSI technology fully compatible EAROM cell
|
|
|
1983
|
23 |
6 |
p. 1179-
1 p.
|
artikel
|
| 23 |
An overview of thickness measurement techniques for metallic thin films
|
|
|
1983
|
23 |
6 |
p. 1186-
1 p.
|
artikel
|
| 24 |
Application of a software reliability model to decide software release time
|
|
|
1983
|
23 |
6 |
p. 1171-
1 p.
|
artikel
|
| 25 |
Applications of ellipsometry to in situ study of the growth of hydrogenated amorphous films
|
|
|
1983
|
23 |
6 |
p. 1183-
1 p.
|
artikel
|
| 26 |
A replacement policy based on limits for the repair cost rate
|
|
|
1983
|
23 |
6 |
p. 1177-
1 p.
|
artikel
|
| 27 |
A second-order moments method for uncertainty analysis
|
|
|
1983
|
23 |
6 |
p. 1171-
1 p.
|
artikel
|
| 28 |
A simulative approach to electron conduction in thick-film resistors
|
|
|
1983
|
23 |
6 |
p. 1185-
1 p.
|
artikel
|
| 29 |
Assembly equipment users speak out
|
|
|
1983
|
23 |
6 |
p. 1178-
1 p.
|
artikel
|
| 30 |
A time-variable ratio useful in reliability theory
|
|
|
1983
|
23 |
6 |
p. 1172-
1 p.
|
artikel
|
| 31 |
A transmission line model of a VLSI package
|
|
|
1983
|
23 |
6 |
p. 1180-
1 p.
|
artikel
|
| 32 |
Automatic hardware synthesis
|
|
|
1983
|
23 |
6 |
p. 1181-
1 p.
|
artikel
|
| 33 |
A “Zero-Time” VLSI sorter
|
|
|
1983
|
23 |
6 |
p. 1178-
1 p.
|
artikel
|
| 34 |
Bayesian reliability and availability—a review
|
|
|
1983
|
23 |
6 |
p. 1174-
1 p.
|
artikel
|
| 35 |
Bibliography of literature on nuclear system reliability
|
Dhillon, Balbir S.
|
|
1983
|
23 |
6 |
p. 1143-1161
19 p.
|
artikel
|
| 36 |
Bipolar Schottky logic device failure modes due to contact metallurgical degradation
|
|
|
1983
|
23 |
6 |
p. 1169-
1 p.
|
artikel
|
| 37 |
16-bit bipolar microprocessor marches to standard instruction set
|
|
|
1983
|
23 |
6 |
p. 1182-
1 p.
|
artikel
|
| 38 |
Bonding temperature measurements during device assembly
|
|
|
1983
|
23 |
6 |
p. 1181-
1 p.
|
artikel
|
| 39 |
Bounds on reliability of a noncoherent system using its length & width
|
|
|
1983
|
23 |
6 |
p. 1174-
1 p.
|
artikel
|
| 40 |
Broader functions and improved reliability of printed circuit boards using dry film solder mask systems
|
|
|
1983
|
23 |
6 |
p. 1170-
1 p.
|
artikel
|
| 41 |
Bubble-memory support chips allow tailored-system design
|
|
|
1983
|
23 |
6 |
p. 1179-
1 p.
|
artikel
|
| 42 |
CAD systems for VLSI in Japan
|
|
|
1983
|
23 |
6 |
p. 1178-
1 p.
|
artikel
|
| 43 |
Calculating the failure frequency of a repairable system
|
|
|
1983
|
23 |
6 |
p. 1175-
1 p.
|
artikel
|
| 44 |
Capless annealing of silicon implanted gallium arsenide
|
|
|
1983
|
23 |
6 |
p. 1186-
1 p.
|
artikel
|
| 45 |
Ceramic on metal substrates produced by plasma spraying for thick film technology
|
|
|
1983
|
23 |
6 |
p. 1185-
1 p.
|
artikel
|
| 46 |
Characterization of LPCVD and thermal silicon nitride films
|
|
|
1983
|
23 |
6 |
p. 1185-
1 p.
|
artikel
|
| 47 |
Chemical impurities and structural imperfections in semiconductor silicon. Part I
|
|
|
1983
|
23 |
6 |
p. 1183-
1 p.
|
artikel
|
| 48 |
Chip-carriers change their course
|
|
|
1983
|
23 |
6 |
p. 1179-
1 p.
|
artikel
|
| 49 |
Circuit analysis, logic simulation and design verification for VLSI
|
|
|
1983
|
23 |
6 |
p. 1181-
1 p.
|
artikel
|
| 50 |
Circuits intégrés diviseurs de fréquence réalisés sur arséniure de gallium
|
|
|
1983
|
23 |
6 |
p. 1182-
1 p.
|
artikel
|
| 51 |
Combinatorial reliability analysis of multiprocessor computers
|
|
|
1983
|
23 |
6 |
p. 1173-
1 p.
|
artikel
|
| 52 |
Comparison of mean time to first failure and mean up time
|
|
|
1983
|
23 |
6 |
p. 1170-
1 p.
|
artikel
|
| 53 |
Component failure and compensators
|
|
|
1983
|
23 |
6 |
p. 1173-
1 p.
|
artikel
|
| 54 |
Computer simulation of hybrid integrated circuits including combined electrical and thermal effects
|
|
|
1983
|
23 |
6 |
p. 1186-
1 p.
|
artikel
|
| 55 |
Constructing fault-trees by stepwise refinement
|
|
|
1983
|
23 |
6 |
p. 1172-
1 p.
|
artikel
|
| 56 |
Contribution to ion implantation through a narrow slit at higher energies
|
|
|
1983
|
23 |
6 |
p. 1187-
1 p.
|
artikel
|
| 57 |
Control of Boron diffusion in polysilicon for constructing overlapping polysilicon gate charge-coupled devices
|
|
|
1983
|
23 |
6 |
p. 1187-
1 p.
|
artikel
|
| 58 |
Croissance de monoscristaux de GaAs semi-isolant “non dopés”: trois façons de parvenir au résultat
|
|
|
1983
|
23 |
6 |
p. 1184-
1 p.
|
artikel
|
| 59 |
Current noise in thick and thin film resistors
|
|
|
1983
|
23 |
6 |
p. 1185-
1 p.
|
artikel
|
| 60 |
Defect analysis using QC data
|
|
|
1983
|
23 |
6 |
p. 1170-
1 p.
|
artikel
|
| 61 |
Defect Complexes in Semiconductor Structures
|
G.W.A.D.,
|
|
1983
|
23 |
6 |
p. 1168-
1 p.
|
artikel
|
| 62 |
Demand-paged memory management boosts 16-bit microsystem throughput
|
|
|
1983
|
23 |
6 |
p. 1182-
1 p.
|
artikel
|
| 63 |
Density upgrading in tape automated bonding
|
|
|
1983
|
23 |
6 |
p. 1179-
1 p.
|
artikel
|
| 64 |
Dependability modeling of safety systems
|
|
|
1983
|
23 |
6 |
p. 1176-
1 p.
|
artikel
|
| 65 |
Design for testability—a survey
|
|
|
1983
|
23 |
6 |
p. 1179-
1 p.
|
artikel
|
| 66 |
Determine project risk using statistical methods
|
|
|
1983
|
23 |
6 |
p. 1171-
1 p.
|
artikel
|
| 67 |
Determining sample size when searching for rare items
|
|
|
1983
|
23 |
6 |
p. 1172-
1 p.
|
artikel
|
| 68 |
Developments in crystal growth from high-temperature solutions
|
|
|
1983
|
23 |
6 |
p. 1183-
1 p.
|
artikel
|
| 69 |
Device modeling
|
|
|
1983
|
23 |
6 |
p. 1180-
1 p.
|
artikel
|
| 70 |
Dielectric/semiconductor interfaces analysis using spectroscopic ellipsometry
|
|
|
1983
|
23 |
6 |
p. 1183-
1 p.
|
artikel
|
| 71 |
Diffusion characteristics of antimony and phosphorus spin-on sources
|
|
|
1983
|
23 |
6 |
p. 1184-
1 p.
|
artikel
|
| 72 |
Digital TV: makers bet on VLSI
|
|
|
1983
|
23 |
6 |
p. 1181-
1 p.
|
artikel
|
| 73 |
Digitizing, layout, rule checking—the everyday tasks of chip designers
|
|
|
1983
|
23 |
6 |
p. 1180-
1 p.
|
artikel
|
| 74 |
Direct computation for consecutive-k-out-of-n: F systems
|
|
|
1983
|
23 |
6 |
p. 1172-
1 p.
|
artikel
|
| 75 |
Distribution of a life ratio and its application
|
|
|
1983
|
23 |
6 |
p. 1171-
1 p.
|
artikel
|
| 76 |
DMA controller adds muscle to offload microprocessor
|
|
|
1983
|
23 |
6 |
p. 1182-
1 p.
|
artikel
|
| 77 |
Donor generation in monocrystalline silicon by Halogen implantation
|
|
|
1983
|
23 |
6 |
p. 1187-
1 p.
|
artikel
|
| 78 |
Dynamic properties of microelectronic digital systems
|
|
|
1983
|
23 |
6 |
p. 1182-
1 p.
|
artikel
|
| 79 |
Effect of intermittent repair in a two unit redundant system with standby failure
|
Rastogi, A.K.
|
|
1983
|
23 |
6 |
p. 1051-1054
4 p.
|
artikel
|
| 80 |
Effects of MBE growth conditions on carbon contamination in GaAs
|
|
|
1983
|
23 |
6 |
p. 1183-
1 p.
|
artikel
|
| 81 |
4376947 Electrically programmable floating gate semiconductor memory device
|
Chiu, Te-Long
|
|
1983
|
23 |
6 |
p. 1196-
1 p.
|
artikel
|
| 82 |
Electric subbands in p-type germanium inversion layers
|
|
|
1983
|
23 |
6 |
p. 1184-
1 p.
|
artikel
|
| 83 |
Electromigration-induced failures in VLSI interconnects
|
|
|
1983
|
23 |
6 |
p. 1169-
1 p.
|
artikel
|
| 84 |
Electrostatic device damage
|
|
|
1983
|
23 |
6 |
p. 1169-
1 p.
|
artikel
|
| 85 |
Empirical prediction of overall reliability in computer communication networks
|
|
|
1983
|
23 |
6 |
p. 1175-
1 p.
|
artikel
|
| 86 |
Endor investigation of tellurium donors in silicon
|
|
|
1983
|
23 |
6 |
p. 1184-
1 p.
|
artikel
|
| 87 |
Enumeration of all simple paths in a directed graph using Petri Net: a systematic approach
|
|
|
1983
|
23 |
6 |
p. 1171-
1 p.
|
artikel
|
| 88 |
E-PROMs graduate to 256-K density with scaled n-channel process
|
|
|
1983
|
23 |
6 |
p. 1182-
1 p.
|
artikel
|
| 89 |
EPROM Testing—Part II: Application to 16K N-channel devices
|
|
|
1983
|
23 |
6 |
p. 1176-
1 p.
|
artikel
|
| 90 |
EPROM testing—Part I: theoretical considerations
|
|
|
1983
|
23 |
6 |
p. 1177-
1 p.
|
artikel
|
| 91 |
ESCAF—a new and cheap system for complex reliability analysis and computation
|
|
|
1983
|
23 |
6 |
p. 1172-
1 p.
|
artikel
|
| 92 |
Estimation of mixed Weibull parameters in life testing
|
|
|
1983
|
23 |
6 |
p. 1171-1172
2 p.
|
artikel
|
| 93 |
Etching characteristics of polysilicon, SiO2 and MoSi2 in NF3 and SF6 plasmas
|
|
|
1983
|
23 |
6 |
p. 1183-
1 p.
|
artikel
|
| 94 |
Evaluation of Du Pont copper-compatible resistor system
|
|
|
1983
|
23 |
6 |
p. 1185-
1 p.
|
artikel
|
| 95 |
Evaporation induced corrosion of YZ-LiNb03
|
Singh, Awatar
|
|
1983
|
23 |
6 |
p. 1067-1068
2 p.
|
artikel
|
| 96 |
Evaporation induced frequency shift in S.A.W. filter
|
Singh, Awatar
|
|
1983
|
23 |
6 |
p. 1163-1164
2 p.
|
artikel
|
| 97 |
Experience with polymer thick film technology
|
|
|
1983
|
23 |
6 |
p. 1186-
1 p.
|
artikel
|
| 98 |
Experimental and theoretical characterization of thick and thin films for microwave uses on 99.6% alumina substrates
|
|
|
1983
|
23 |
6 |
p. 1186-
1 p.
|
artikel
|
| 99 |
Failure diagnosis on the LT1280
|
|
|
1983
|
23 |
6 |
p. 1176-
1 p.
|
artikel
|
| 100 |
Failure modes induced in TTL-LS bipolar logics by negative inputs
|
|
|
1983
|
23 |
6 |
p. 1176-
1 p.
|
artikel
|
| 101 |
Fast algorithm for unavailability and sensitivity analysis of series-parallel systems
|
|
|
1983
|
23 |
6 |
p. 1172-
1 p.
|
artikel
|
| 102 |
Fast solutions for consecutive-k-out-of-n: F system
|
|
|
1983
|
23 |
6 |
p. 1174-
1 p.
|
artikel
|
| 103 |
Fatigue failure models—Birnbaum-Saunders vs inverse Gaussian
|
|
|
1983
|
23 |
6 |
p. 1172-
1 p.
|
artikel
|
| 104 |
Float-zoning of semiconductor silicon: a perspective
|
|
|
1983
|
23 |
6 |
p. 1184-
1 p.
|
artikel
|
| 105 |
Fundamental LTPD aspects
|
|
|
1983
|
23 |
6 |
p. 1178-
1 p.
|
artikel
|
| 106 |
Germanium selenide as a negative inorganic resist for ion beam microfabrication
|
|
|
1983
|
23 |
6 |
p. 1187-
1 p.
|
artikel
|
| 107 |
Hands-on investigations help exploit CMOS designs
|
|
|
1983
|
23 |
6 |
p. 1181-
1 p.
|
artikel
|
| 108 |
Hardware vs software maintainability; a comparative study
|
|
|
1983
|
23 |
6 |
p. 1177-1178
2 p.
|
artikel
|
| 109 |
Hierarchical design methodologies and tools for VLSI chips
|
|
|
1983
|
23 |
6 |
p. 1181-
1 p.
|
artikel
|
| 110 |
HP-41C programs for Bayesian binomial and exponential interval estimation with a uniform prior on the reliability
|
|
|
1983
|
23 |
6 |
p. 1172-
1 p.
|
artikel
|
| 111 |
I challenge your beliefs about reliability Part V: planning and policies
|
|
|
1983
|
23 |
6 |
p. 1169-
1 p.
|
artikel
|
| 112 |
IC makers, users adopt ship-to-stock
|
|
|
1983
|
23 |
6 |
p. 1178-
1 p.
|
artikel
|
| 113 |
IC process modeling and topography design
|
|
|
1983
|
23 |
6 |
p. 1180-
1 p.
|
artikel
|
| 114 |
Implantation through a window with medium to high energy ions
|
|
|
1983
|
23 |
6 |
p. 1187-
1 p.
|
artikel
|
| 115 |
Improved implementation of search technique to find spanning trees
|
|
|
1983
|
23 |
6 |
p. 1175-
1 p.
|
artikel
|
| 116 |
Influence of emitter edge dislocations on reliability of planar NPN transistors
|
|
|
1983
|
23 |
6 |
p. 1170-
1 p.
|
artikel
|
| 117 |
437794 Integrated gas sensitive unit comprising a gas sensitive semiconductor element and a resistor for gas concentration measurement
|
Hishii, Toshiyasu
|
|
1983
|
23 |
6 |
p. 1191-
1 p.
|
artikel
|
| 118 |
Interactive multiobjective optimization by the Sequential Proxy Optimization Technique (SPOT)
|
|
|
1983
|
23 |
6 |
p. 1173-
1 p.
|
artikel
|
| 119 |
Introduction to MOS LSI design
|
G.W.A.D.,
|
|
1983
|
23 |
6 |
p. 1167-1168
2 p.
|
artikel
|
| 120 |
Investigation on high speed CW edge-emitting LEDs grown on semiinsulating GaAs substrate
|
|
|
1983
|
23 |
6 |
p. 1184-
1 p.
|
artikel
|
| 121 |
Investment analysis of introducing standby or redundancy into a production system
|
|
|
1983
|
23 |
6 |
p. 1175-
1 p.
|
artikel
|
| 122 |
Ion beam etching with reactive gases
|
|
|
1983
|
23 |
6 |
p. 1186-
1 p.
|
artikel
|
| 123 |
Ion range statistics by a Fourier series
|
|
|
1983
|
23 |
6 |
p. 1187-
1 p.
|
artikel
|
| 124 |
Ions expose masks with a precision of 0.1 micrometer
|
|
|
1983
|
23 |
6 |
p. 1186-
1 p.
|
artikel
|
| 125 |
Knowledge databases, emulation extend automated-tester capabilities
|
|
|
1983
|
23 |
6 |
p. 1179-1180
2 p.
|
artikel
|
| 126 |
Les problemes de Brasabilite dans l'industrie electronique spatiale
|
|
|
1983
|
23 |
6 |
p. 1170-
1 p.
|
artikel
|
| 127 |
Managing VLSI complexity: an outlook
|
|
|
1983
|
23 |
6 |
p. 1182-
1 p.
|
artikel
|
| 128 |
Marginal distribution estimators for the Gamma-Prior parameters for a group of Poisson processes
|
|
|
1983
|
23 |
6 |
p. 1174-
1 p.
|
artikel
|
| 129 |
Mathematical models for marginal reliability analysis
|
Corsi, F.
|
|
1983
|
23 |
6 |
p. 1087-1102
16 p.
|
artikel
|
| 130 |
Maximum likelihood estimation of parameters of several continuous and discrete failure distributions
|
|
|
1983
|
23 |
6 |
p. 1177-
1 p.
|
artikel
|
| 131 |
Measurement technique of electromigration
|
Lu, Y.Z.
|
|
1983
|
23 |
6 |
p. 1103-1118
16 p.
|
artikel
|
| 132 |
Meeting the testing challenge: today and tomorrow
|
|
|
1983
|
23 |
6 |
p. 1179-
1 p.
|
artikel
|
| 133 |
4377030 Metallization of selectively implanted AIII-BV compound semiconductors
|
Pettenpaul, Ewald
|
|
1983
|
23 |
6 |
p. 1194-1195
2 p.
|
artikel
|
| 134 |
4376336 Method for fabricating a semiconductor device
|
Endo, Norio
|
|
1983
|
23 |
6 |
p. 1198-
1 p.
|
artikel
|
| 135 |
4377605 Method for forming an insulating layer on a polycrystalline silicon layer of a semiconductor device usng a two-step thermal oxidation technique
|
Yamamoto, Takashi
|
|
1983
|
23 |
6 |
p. 1194-
1 p.
|
artikel
|
| 136 |
4377903 Method for manufacturing an I2L semiconductor device
|
Kanzaki, Koichi
|
|
1983
|
23 |
6 |
p. 1191-1192
2 p.
|
artikel
|
| 137 |
4378255 Method for producing integrated semiconductor light emitter
|
Holonyak, Nick
|
|
1983
|
23 |
6 |
p. 1190-
1 p.
|
artikel
|
| 138 |
4377438 Method for producing semiconductor device
|
Moriya, Takahiko
|
|
1983
|
23 |
6 |
p. 1194-
1 p.
|
artikel
|
| 139 |
4376688 Method for producing semiconductor films
|
Ceasar, GeraldP
|
|
1983
|
23 |
6 |
p. 1196-
1 p.
|
artikel
|
| 140 |
4377028 Method for registering a mask pattern in a photoetching apparatus for semiconductor devices
|
Imahashi, Isse
|
|
1983
|
23 |
6 |
p. 1195-
1 p.
|
artikel
|
| 141 |
Methodical aspects of logic synthesis
|
|
|
1983
|
23 |
6 |
p. 1173-1174
2 p.
|
artikel
|
| 142 |
4377904 Method of fabricating a narrow band-gap semiconductor CCD imaging device
|
Chapman, RichardA
|
|
1983
|
23 |
6 |
p. 1191-
1 p.
|
artikel
|
| 143 |
4378383 Method of making conductive paths through a lamina in a semiconductor device
|
Moritz, Holge
|
|
1983
|
23 |
6 |
p. 1190-
1 p.
|
artikel
|
| 144 |
4376657 Method of making fault-free surface zone in semiconductor devices by step-wise heat treating
|
Nagasawa, Kazutoshi
|
|
1983
|
23 |
6 |
p. 1197-1198
2 p.
|
artikel
|
| 145 |
4377900 Method of manufacturing semiconductor device
|
Nonaka, Terumoto
|
|
1983
|
23 |
6 |
p. 1192-
1 p.
|
artikel
|
| 146 |
4377902 Method of manufacturing semiconductor device using laser beam crystallized poly/amorphous layer
|
Shinada, Kazuyoshi
|
|
1983
|
23 |
6 |
p. 1192-
1 p.
|
artikel
|
| 147 |
4376581 Method of positioning disk-shaped workpieces, preferably semiconductor wafers
|
Mayer, HerbertE
|
|
1983
|
23 |
6 |
p. 1198-
1 p.
|
artikel
|
| 148 |
4376664 Method of producing a semiconductor device
|
Hataishi, Osamu
|
|
1983
|
23 |
6 |
p. 1196-
1 p.
|
artikel
|
| 149 |
4376658 Method of producing structures composed of photosensitive resist for integrated semiconductor circuits
|
Sigusch, Reiner
|
|
1983
|
23 |
6 |
p. 1197-
1 p.
|
artikel
|
| 150 |
Microbit brings self-testing on board complex microcomputers
|
|
|
1983
|
23 |
6 |
p. 1180-1181
2 p.
|
artikel
|
| 151 |
Microelectronics in China 1979–82—a review
|
|
|
1983
|
23 |
6 |
p. 1178-
1 p.
|
artikel
|
| 152 |
Miniaturisation des amplificateurs monolithiques sur AsGa à 10 GHz
|
|
|
1983
|
23 |
6 |
p. 1182-
1 p.
|
artikel
|
| 153 |
Minimal pathset and minimal cutsets using search technique
|
|
|
1983
|
23 |
6 |
p. 1177-
1 p.
|
artikel
|
| 154 |
Modelling digital circuits with delays by Stochastic Petri Nets
|
Castagnolo, B.
|
|
1983
|
23 |
6 |
p. 1075-1086
12 p.
|
artikel
|
| 155 |
Modelling human performance reliability in a two stage combined manual and decision task
|
Rahim, M.A.
|
|
1983
|
23 |
6 |
p. 1131-1141
11 p.
|
artikel
|
| 156 |
Moment identities for nonnegative variables via integrated survival curves
|
|
|
1983
|
23 |
6 |
p. 1172-1173
2 p.
|
artikel
|
| 157 |
Moments of n-unit redundant systems with time dependent failure rates
|
|
|
1983
|
23 |
6 |
p. 1175-
1 p.
|
artikel
|
| 158 |
Mounting of micropackages in vapour phase soldering and study of ageing mechanism
|
|
|
1983
|
23 |
6 |
p. 1170-
1 p.
|
artikel
|
| 159 |
Multi-chip module technology
|
|
|
1983
|
23 |
6 |
p. 1179-
1 p.
|
artikel
|
| 160 |
Multi-chip module test and diagnostic methodology
|
|
|
1983
|
23 |
6 |
p. 1176-
1 p.
|
artikel
|
| 161 |
MVU estimators for some multivariate normal probability models: an application to stress-strength models
|
|
|
1983
|
23 |
6 |
p. 1175-
1 p.
|
artikel
|
| 162 |
New bubble-memory packaging cuts board space and manufacturing costs
|
|
|
1983
|
23 |
6 |
p. 1178-
1 p.
|
artikel
|
| 163 |
New thick-film temperature sensors applied in some hybrid measurement devices
|
|
|
1983
|
23 |
6 |
p. 1186-
1 p.
|
artikel
|
| 164 |
Nonparametric accelerated life testing
|
|
|
1983
|
23 |
6 |
p. 1172-
1 p.
|
artikel
|
| 165 |
Novel technique of determining aluminium quality for S.A.W. devices fabrication on YZ-LiNbO3
|
Singh, Awatar
|
|
1983
|
23 |
6 |
p. 1027-1028
2 p.
|
artikel
|
| 166 |
Numerical calculation of mean mission duration
|
|
|
1983
|
23 |
6 |
p. 1171-
1 p.
|
artikel
|
| 167 |
Ohmic contacts to III–V compound semiconductors: a review of fabrication techniques
|
|
|
1983
|
23 |
6 |
p. 1180-
1 p.
|
artikel
|
| 168 |
On Bayes estimation of reliability for the Birnbaum-Saunders fatigue life model
|
|
|
1983
|
23 |
6 |
p. 1173-
1 p.
|
artikel
|
| 169 |
On discrete hazard functions
|
|
|
1983
|
23 |
6 |
p. 1172-
1 p.
|
artikel
|
| 170 |
On hardware/software trade-offs in computer system design
|
|
|
1983
|
23 |
6 |
p. 1171-
1 p.
|
artikel
|
| 171 |
On the design of algorithms for VLSI systolic arrays
|
|
|
1983
|
23 |
6 |
p. 1177-
1 p.
|
artikel
|
| 172 |
OYSTER: a study of integrated circuits as three-dimensional structures
|
|
|
1983
|
23 |
6 |
p. 1182-
1 p.
|
artikel
|
| 173 |
Packaging and assembly: the 1983 semiconductor technology forecast
|
|
|
1983
|
23 |
6 |
p. 1179-
1 p.
|
artikel
|
| 174 |
Panorama des technoligies de circuits intégrés Si, GaAs et Josephson: limites et évolution
|
|
|
1983
|
23 |
6 |
p. 1178-
1 p.
|
artikel
|
| 175 |
Passivation of gallium arsenide by reactively sputtered gallium nitride thin films
|
|
|
1983
|
23 |
6 |
p. 1185-1186
2 p.
|
artikel
|
| 176 |
Pattern transfer; overview of equipment needs
|
|
|
1983
|
23 |
6 |
p. 1179-
1 p.
|
artikel
|
| 177 |
Épitaxie en phase liquide de Ga x In1−x As yP1−y
|
|
|
1983
|
23 |
6 |
p. 1184-
1 p.
|
artikel
|
| 178 |
Plasma-enhanced deposition of tungsten, molybdenum and tungsten silicide films
|
|
|
1983
|
23 |
6 |
p. 1187-
1 p.
|
artikel
|
| 179 |
Plasma etching of oxides and nitrides
|
|
|
1983
|
23 |
6 |
p. 1180-
1 p.
|
artikel
|
| 180 |
Point estimation of the parameter of a truncated exponential distribution
|
|
|
1983
|
23 |
6 |
p. 1172-
1 p.
|
artikel
|
| 181 |
Probabilistic analysis of a pulverizer system with commoncause failures
|
|
|
1983
|
23 |
6 |
p. 1171-
1 p.
|
artikel
|
| 182 |
4376659 Process for forming semiconductor alloys having a desired bandgap
|
Castro, CarlosA
|
|
1983
|
23 |
6 |
p. 1197-
1 p.
|
artikel
|
| 183 |
4378260 Process for producing a semiconductor device
|
Fukuda, Takeshi
|
|
1983
|
23 |
6 |
p. 1190-
1 p.
|
artikel
|
| 184 |
Product quality level monitoring and control for logic chips and modules
|
|
|
1983
|
23 |
6 |
p. 1170-
1 p.
|
artikel
|
| 185 |
Properties of digital microelectronic systems from the viewpoint of signal transmission
|
|
|
1983
|
23 |
6 |
p. 1182-
1 p.
|
artikel
|
| 186 |
4378586 Protective circuitry for semiconductor switches
|
Bete, Manfred
|
|
1983
|
23 |
6 |
p. 1189-1190
2 p.
|
artikel
|
| 187 |
Publications, notices, calls for papers, etc
|
|
|
1983
|
23 |
6 |
p. 1007-1008
2 p.
|
artikel
|
| 188 |
Recursive algorithm to evaluate the reliability of a consecutive-k-out of-n: F system
|
|
|
1983
|
23 |
6 |
p. 1172-
1 p.
|
artikel
|
| 189 |
Reducing PCB testing
|
|
|
1983
|
23 |
6 |
p. 1178-1179
2 p.
|
artikel
|
| 190 |
Reliability analysis and investment decision in electric motors for irrigation
|
|
|
1983
|
23 |
6 |
p. 1170-
1 p.
|
artikel
|
| 191 |
Reliability analysis of a 2-out-of-n: F system with repairable primary and degradation units
|
|
|
1983
|
23 |
6 |
p. 1177-
1 p.
|
artikel
|
| 192 |
Reliability analysis of fault tolerant pipeline ring networks
|
Lombardi, Fabrizio
|
|
1983
|
23 |
6 |
p. 1055-1065
11 p.
|
artikel
|
| 193 |
Reliability analysis of multi-unit cold standby system with two operating modes
|
Goel, L.R.
|
|
1983
|
23 |
6 |
p. 1045-1050
6 p.
|
artikel
|
| 194 |
Reliability and maintainability of a multicomponent series-parallel system under several repair disciplines
|
|
|
1983
|
23 |
6 |
p. 1175-1176
2 p.
|
artikel
|
| 195 |
Reliability evaluation by network decomposition
|
|
|
1983
|
23 |
6 |
p. 1172-
1 p.
|
artikel
|
| 196 |
Reliability growth models for hardware and software systems based on nonhomogeneous Poisson processes: a survey
|
|
|
1983
|
23 |
6 |
p. 1170-
1 p.
|
artikel
|
| 197 |
Reliability, maintainability and cost-effectiveness: a bibliographical note
|
|
|
1983
|
23 |
6 |
p. 1175-
1 p.
|
artikel
|
| 198 |
Reliability of digital communication system with channel redundancy
|
|
|
1983
|
23 |
6 |
p. 1177-
1 p.
|
artikel
|
| 199 |
Reliability system with two types of repair facilities
|
Murari, K.
|
|
1983
|
23 |
6 |
p. 1015-1025
11 p.
|
artikel
|
| 200 |
RELVEC — a tool for control system reliability analysis
|
Hossi, H.J.
|
|
1983
|
23 |
6 |
p. 1119-1129
11 p.
|
artikel
|
| 201 |
Robust procedures for estimating the scale parameter and predicting future order statistics of the Weibull distribution
|
|
|
1983
|
23 |
6 |
p. 1173-
1 p.
|
artikel
|
| 202 |
Self-consistent theory of diagonal and off-diagonal disorder in the screened impurity band of doped semiconductors
|
|
|
1983
|
23 |
6 |
p. 1183-
1 p.
|
artikel
|
| 203 |
4377819 Semiconductor device
|
Sakai, Yoshio
|
|
1983
|
23 |
6 |
p. 1193-
1 p.
|
artikel
|
| 204 |
4376989 Semiconductor dynamic memory
|
Takemae, Yoshihiro
|
|
1983
|
23 |
6 |
p. 1195-
1 p.
|
artikel
|
| 205 |
4377816 Semiconductor element with zone guard rings
|
Sittig, Roland
|
|
1983
|
23 |
6 |
p. 1194-
1 p.
|
artikel
|
| 206 |
4377817 Semiconductor image sensors
|
Nishizawa, Jun-ichi
|
|
1983
|
23 |
6 |
p. 1193-1194
2 p.
|
artikel
|
| 207 |
4377865 Semiconductor laser
|
Sugino, Takashi
|
|
1983
|
23 |
6 |
p. 1192-1193
2 p.
|
artikel
|
| 208 |
4378599 Semiconductor laser having broadband laser gain
|
Damen, TheodoorC
|
|
1983
|
23 |
6 |
p. 1189-
1 p.
|
artikel
|
| 209 |
4376307 Semiconductor laser or intensifier
|
Rozzi, TullioE
|
|
1983
|
23 |
6 |
p. 1198-1199
2 p.
|
artikel
|
| 210 |
4376985 Semiconductor memory device
|
Isogai, Hideaki
|
|
1983
|
23 |
6 |
p. 1195-1196
2 p.
|
artikel
|
| 211 |
Semicustom-integrated-circuit design in the UK—a capability profile
|
|
|
1983
|
23 |
6 |
p. 1179-
1 p.
|
artikel
|
| 212 |
Semi-insulating gallium arsenide substrates for high-frequency FET and IC fabrication
|
|
|
1983
|
23 |
6 |
p. 1186-1187
2 p.
|
artikel
|
| 213 |
Simultaneous exposure and development technique for S.A.W. device fabrication
|
Singh, Awatar
|
|
1983
|
23 |
6 |
p. 1165-
1 p.
|
artikel
|
| 214 |
Software bugs and communications system performance
|
Malec, H.A.
|
|
1983
|
23 |
6 |
p. 1011-1014
4 p.
|
artikel
|
| 215 |
Software checks testability and generates tests of VLSI design
|
|
|
1983
|
23 |
6 |
p. 1180-
1 p.
|
artikel
|
| 216 |
Solder attachment of leadless ceramic chip carriers
|
|
|
1983
|
23 |
6 |
p. 1181-
1 p.
|
artikel
|
| 217 |
Specifying multilayer circuit boards to meet the demands of VLSI
|
|
|
1983
|
23 |
6 |
p. 1182-
1 p.
|
artikel
|
| 218 |
4377856 Static semiconductor memory with reduced components and interconnections
|
Roesner, BruceB
|
|
1983
|
23 |
6 |
p. 1193-
1 p.
|
artikel
|
| 219 |
Steady-state availability of a system with two subsystems working alternately
|
|
|
1983
|
23 |
6 |
p. 1175-
1 p.
|
artikel
|
| 220 |
Stochastic behaviour of a two-unit (dissimilar) hot standby system with three modes
|
Goel, L.R.
|
|
1983
|
23 |
6 |
p. 1035-1040
6 p.
|
artikel
|
| 221 |
Stochastic behaviour of a 2-unit standby redundant system with imperfect switchover and preventive maintenance
|
|
|
1983
|
23 |
6 |
p. 1175-
1 p.
|
artikel
|
| 222 |
Surface mounting of leadless chip carriers on various printed circuit board type substrates
|
|
|
1983
|
23 |
6 |
p. 1169-
1 p.
|
artikel
|
| 223 |
Switch failure in a two-unit standby redundant system
|
|
|
1983
|
23 |
6 |
p. 1176-
1 p.
|
artikel
|
| 224 |
Synthesis of techniques creates complete system self-test
|
|
|
1983
|
23 |
6 |
p. 1171-
1 p.
|
artikel
|
| 225 |
Systems in reduced efficiency and alternating periods
|
|
|
1983
|
23 |
6 |
p. 1170-1171
2 p.
|
artikel
|
| 226 |
Telecommunications IC integrates still more line-card tasks
|
|
|
1983
|
23 |
6 |
p. 1182-
1 p.
|
artikel
|
| 227 |
Temperature verification of hybrid microelectronic circuit design
|
|
|
1983
|
23 |
6 |
p. 1185-
1 p.
|
artikel
|
| 228 |
The application of reactive ion etching to the definition of patterns in Al-Si-Cu alloy conductor layers and thick silicon oxide films
|
|
|
1983
|
23 |
6 |
p. 1179-
1 p.
|
artikel
|
| 229 |
The cooling of electrical and electronic equipment in sealed enclosures
|
|
|
1983
|
23 |
6 |
p. 1180-
1 p.
|
artikel
|
| 230 |
The effect of preventive maintenance to a standby system with two types of failures
|
|
|
1983
|
23 |
6 |
p. 1175-
1 p.
|
artikel
|
| 231 |
Thermal nitridation of silicon and silicon dioxide for thin gate insulators. Part I
|
|
|
1983
|
23 |
6 |
p. 1184-
1 p.
|
artikel
|
| 232 |
Thermodynamical calculation of multiexciton complexes system in lightly doped Si: a contribution of excited states of the multiexciton complexes
|
|
|
1983
|
23 |
6 |
p. 1184-
1 p.
|
artikel
|
| 233 |
Thermosonic gold wire bonding to copper conductors
|
|
|
1983
|
23 |
6 |
p. 1181-
1 p.
|
artikel
|
| 234 |
The software integrity of a computer system installed in a Royal Naval frigate
|
|
|
1983
|
23 |
6 |
p. 1176-1177
2 p.
|
artikel
|
| 235 |
The use of hybrid microelectronics in the construction of ion-selective electrodes
|
|
|
1983
|
23 |
6 |
p. 1186-
1 p.
|
artikel
|
| 236 |
The use of solid-state circuitry within hazardous areas
|
|
|
1983
|
23 |
6 |
p. 1180-
1 p.
|
artikel
|
| 237 |
The Wijngaard-Stidham bisection method and replacement models
|
|
|
1983
|
23 |
6 |
p. 1174-
1 p.
|
artikel
|
| 238 |
Thin film transistors and thin film transistor circuits
|
|
|
1983
|
23 |
6 |
p. 1185-
1 p.
|
artikel
|
| 239 |
Two chips endow 32-bit processor with fault-tolerant architecture
|
|
|
1983
|
23 |
6 |
p. 1181-1182
2 p.
|
artikel
|
| 240 |
Two programmable ICs enhance line-card functionality
|
|
|
1983
|
23 |
6 |
p. 1182-
1 p.
|
artikel
|
| 241 |
VLSI design automation: an introduction
|
|
|
1983
|
23 |
6 |
p. 1178-
1 p.
|
artikel
|
| 242 |
VLSI metallization using aluminium and its alloys. Part I
|
|
|
1983
|
23 |
6 |
p. 1179-
1 p.
|
artikel
|
| 243 |
VLSI metallization using aluminium and its alloys. Part II
|
|
|
1983
|
23 |
6 |
p. 1181-
1 p.
|
artikel
|
| 244 |
VLSI—the technological giant—and the developing countries
|
|
|
1983
|
23 |
6 |
p. 1178-
1 p.
|
artikel
|
| 245 |
Volume contents and author index
|
|
|
1983
|
23 |
6 |
p. i-ix
nvt p.
|
artikel
|
| 246 |
Wafer gettering: the key to higher yields?
|
|
|
1983
|
23 |
6 |
p. 1180-
1 p.
|
artikel
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| 247 |
Wafer processing in the early 1980s
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1983
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23 |
6 |
p. 1179-
1 p.
|
artikel
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| 248 |
Weapons systems analysis, Part III: warfare gaming, tactics and techniques
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1983
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23 |
6 |
p. 1177-
1 p.
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artikel
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| 249 |
Wet etching today
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1983
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23 |
6 |
p. 1179-
1 p.
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artikel
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| 250 |
Wire-routing machines—new tools for VLSI physical design
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1983
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23 |
6 |
p. 1180-
1 p.
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artikel
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| 251 |
X-ray double diffraction by thin monocrystalline layers
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1983
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23 |
6 |
p. 1183-
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