nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
Accuracy of univariate, bivariate and a “modified double Monte Carlo” technique for finding lower confidence limits of system reliability
|
|
|
1983 |
23 |
6 |
p. 1174- 1 p. |
artikel |
2 |
A cutset approach to reliability evaluation in communication networks
|
|
|
1983 |
23 |
6 |
p. 1173- 1 p. |
artikel |
3 |
Advances in automated wire and die bonding
|
|
|
1983 |
23 |
6 |
p. 1181- 1 p. |
artikel |
4 |
Advances in customization free VLSI system designers
|
|
|
1983 |
23 |
6 |
p. 1182- 1 p. |
artikel |
5 |
A graphical method applicable to age-replacement problems
|
|
|
1983 |
23 |
6 |
p. 1174- 1 p. |
artikel |
6 |
A life cycle costing methodology for the assessment of process heat generation by solar energy
|
Sherie, Yosef S. |
|
1983 |
23 |
6 |
p. 1069-1074 6 p. |
artikel |
7 |
Alternating space-charge-limited currents in hydrogenated amorphous silicon
|
|
|
1983 |
23 |
6 |
p. 1183- 1 p. |
artikel |
8 |
A Markov approach to wear-out modelling
|
|
|
1983 |
23 |
6 |
p. 1174-1175 2 p. |
artikel |
9 |
A model for the prediction of assembly, rework and test yields
|
|
|
1983 |
23 |
6 |
p. 1176- 1 p. |
artikel |
10 |
A modified block replacement with two variables
|
|
|
1983 |
23 |
6 |
p. 1176- 1 p. |
artikel |
11 |
Amorphous-silicon devices start to shape up
|
|
|
1983 |
23 |
6 |
p. 1184- 1 p. |
artikel |
12 |
Analog modeling simulates the faults of electromechanical components
|
|
|
1983 |
23 |
6 |
p. 1169- 1 p. |
artikel |
13 |
Analysis of a two-unit cold standby system with three modes
|
Goel, L.R. |
|
1983 |
23 |
6 |
p. 1041-1044 4 p. |
artikel |
14 |
Analysis of a two-unit hot standby system with three modes
|
Goel, L.R. |
|
1983 |
23 |
6 |
p. 1029-1033 5 p. |
artikel |
15 |
An analytic method for uncertainty analysis of nonlinear output functions, with applications to fault-tree analysis
|
|
|
1983 |
23 |
6 |
p. 1173- 1 p. |
artikel |
16 |
An approach to ensure stability of precision laser trimmed thick film resistors
|
|
|
1983 |
23 |
6 |
p. 1185- 1 p. |
artikel |
17 |
An error analysis for reliability quantification
|
|
|
1983 |
23 |
6 |
p. 1171- 1 p. |
artikel |
18 |
A new approach for network reliability analysis
|
|
|
1983 |
23 |
6 |
p. 1177- 1 p. |
artikel |
19 |
A new model of software reliability prediction
|
Govil, K.K. |
|
1983 |
23 |
6 |
p. 1009-1010 2 p. |
artikel |
20 |
A new package-related failure mechanism for leadless ceramic chip carriers (LC-3s) solder-attached to Alumina substrates
|
|
|
1983 |
23 |
6 |
p. 1169-1170 2 p. |
artikel |
21 |
An extension of the block preventive maintenance policy for stochastically failing items
|
|
|
1983 |
23 |
6 |
p. 1177- 1 p. |
artikel |
22 |
An LSI technology fully compatible EAROM cell
|
|
|
1983 |
23 |
6 |
p. 1179- 1 p. |
artikel |
23 |
An overview of thickness measurement techniques for metallic thin films
|
|
|
1983 |
23 |
6 |
p. 1186- 1 p. |
artikel |
24 |
Application of a software reliability model to decide software release time
|
|
|
1983 |
23 |
6 |
p. 1171- 1 p. |
artikel |
25 |
Applications of ellipsometry to in situ study of the growth of hydrogenated amorphous films
|
|
|
1983 |
23 |
6 |
p. 1183- 1 p. |
artikel |
26 |
A replacement policy based on limits for the repair cost rate
|
|
|
1983 |
23 |
6 |
p. 1177- 1 p. |
artikel |
27 |
A second-order moments method for uncertainty analysis
|
|
|
1983 |
23 |
6 |
p. 1171- 1 p. |
artikel |
28 |
A simulative approach to electron conduction in thick-film resistors
|
|
|
1983 |
23 |
6 |
p. 1185- 1 p. |
artikel |
29 |
Assembly equipment users speak out
|
|
|
1983 |
23 |
6 |
p. 1178- 1 p. |
artikel |
30 |
A time-variable ratio useful in reliability theory
|
|
|
1983 |
23 |
6 |
p. 1172- 1 p. |
artikel |
31 |
A transmission line model of a VLSI package
|
|
|
1983 |
23 |
6 |
p. 1180- 1 p. |
artikel |
32 |
Automatic hardware synthesis
|
|
|
1983 |
23 |
6 |
p. 1181- 1 p. |
artikel |
33 |
A “Zero-Time” VLSI sorter
|
|
|
1983 |
23 |
6 |
p. 1178- 1 p. |
artikel |
34 |
Bayesian reliability and availability—a review
|
|
|
1983 |
23 |
6 |
p. 1174- 1 p. |
artikel |
35 |
Bibliography of literature on nuclear system reliability
|
Dhillon, Balbir S. |
|
1983 |
23 |
6 |
p. 1143-1161 19 p. |
artikel |
36 |
Bipolar Schottky logic device failure modes due to contact metallurgical degradation
|
|
|
1983 |
23 |
6 |
p. 1169- 1 p. |
artikel |
37 |
16-bit bipolar microprocessor marches to standard instruction set
|
|
|
1983 |
23 |
6 |
p. 1182- 1 p. |
artikel |
38 |
Bonding temperature measurements during device assembly
|
|
|
1983 |
23 |
6 |
p. 1181- 1 p. |
artikel |
39 |
Bounds on reliability of a noncoherent system using its length & width
|
|
|
1983 |
23 |
6 |
p. 1174- 1 p. |
artikel |
40 |
Broader functions and improved reliability of printed circuit boards using dry film solder mask systems
|
|
|
1983 |
23 |
6 |
p. 1170- 1 p. |
artikel |
41 |
Bubble-memory support chips allow tailored-system design
|
|
|
1983 |
23 |
6 |
p. 1179- 1 p. |
artikel |
42 |
CAD systems for VLSI in Japan
|
|
|
1983 |
23 |
6 |
p. 1178- 1 p. |
artikel |
43 |
Calculating the failure frequency of a repairable system
|
|
|
1983 |
23 |
6 |
p. 1175- 1 p. |
artikel |
44 |
Capless annealing of silicon implanted gallium arsenide
|
|
|
1983 |
23 |
6 |
p. 1186- 1 p. |
artikel |
45 |
Ceramic on metal substrates produced by plasma spraying for thick film technology
|
|
|
1983 |
23 |
6 |
p. 1185- 1 p. |
artikel |
46 |
Characterization of LPCVD and thermal silicon nitride films
|
|
|
1983 |
23 |
6 |
p. 1185- 1 p. |
artikel |
47 |
Chemical impurities and structural imperfections in semiconductor silicon. Part I
|
|
|
1983 |
23 |
6 |
p. 1183- 1 p. |
artikel |
48 |
Chip-carriers change their course
|
|
|
1983 |
23 |
6 |
p. 1179- 1 p. |
artikel |
49 |
Circuit analysis, logic simulation and design verification for VLSI
|
|
|
1983 |
23 |
6 |
p. 1181- 1 p. |
artikel |
50 |
Circuits intégrés diviseurs de fréquence réalisés sur arséniure de gallium
|
|
|
1983 |
23 |
6 |
p. 1182- 1 p. |
artikel |
51 |
Combinatorial reliability analysis of multiprocessor computers
|
|
|
1983 |
23 |
6 |
p. 1173- 1 p. |
artikel |
52 |
Comparison of mean time to first failure and mean up time
|
|
|
1983 |
23 |
6 |
p. 1170- 1 p. |
artikel |
53 |
Component failure and compensators
|
|
|
1983 |
23 |
6 |
p. 1173- 1 p. |
artikel |
54 |
Computer simulation of hybrid integrated circuits including combined electrical and thermal effects
|
|
|
1983 |
23 |
6 |
p. 1186- 1 p. |
artikel |
55 |
Constructing fault-trees by stepwise refinement
|
|
|
1983 |
23 |
6 |
p. 1172- 1 p. |
artikel |
56 |
Contribution to ion implantation through a narrow slit at higher energies
|
|
|
1983 |
23 |
6 |
p. 1187- 1 p. |
artikel |
57 |
Control of Boron diffusion in polysilicon for constructing overlapping polysilicon gate charge-coupled devices
|
|
|
1983 |
23 |
6 |
p. 1187- 1 p. |
artikel |
58 |
Croissance de monoscristaux de GaAs semi-isolant “non dopés”: trois façons de parvenir au résultat
|
|
|
1983 |
23 |
6 |
p. 1184- 1 p. |
artikel |
59 |
Current noise in thick and thin film resistors
|
|
|
1983 |
23 |
6 |
p. 1185- 1 p. |
artikel |
60 |
Defect analysis using QC data
|
|
|
1983 |
23 |
6 |
p. 1170- 1 p. |
artikel |
61 |
Defect Complexes in Semiconductor Structures
|
G.W.A.D., |
|
1983 |
23 |
6 |
p. 1168- 1 p. |
artikel |
62 |
Demand-paged memory management boosts 16-bit microsystem throughput
|
|
|
1983 |
23 |
6 |
p. 1182- 1 p. |
artikel |
63 |
Density upgrading in tape automated bonding
|
|
|
1983 |
23 |
6 |
p. 1179- 1 p. |
artikel |
64 |
Dependability modeling of safety systems
|
|
|
1983 |
23 |
6 |
p. 1176- 1 p. |
artikel |
65 |
Design for testability—a survey
|
|
|
1983 |
23 |
6 |
p. 1179- 1 p. |
artikel |
66 |
Determine project risk using statistical methods
|
|
|
1983 |
23 |
6 |
p. 1171- 1 p. |
artikel |
67 |
Determining sample size when searching for rare items
|
|
|
1983 |
23 |
6 |
p. 1172- 1 p. |
artikel |
68 |
Developments in crystal growth from high-temperature solutions
|
|
|
1983 |
23 |
6 |
p. 1183- 1 p. |
artikel |
69 |
Device modeling
|
|
|
1983 |
23 |
6 |
p. 1180- 1 p. |
artikel |
70 |
Dielectric/semiconductor interfaces analysis using spectroscopic ellipsometry
|
|
|
1983 |
23 |
6 |
p. 1183- 1 p. |
artikel |
71 |
Diffusion characteristics of antimony and phosphorus spin-on sources
|
|
|
1983 |
23 |
6 |
p. 1184- 1 p. |
artikel |
72 |
Digital TV: makers bet on VLSI
|
|
|
1983 |
23 |
6 |
p. 1181- 1 p. |
artikel |
73 |
Digitizing, layout, rule checking—the everyday tasks of chip designers
|
|
|
1983 |
23 |
6 |
p. 1180- 1 p. |
artikel |
74 |
Direct computation for consecutive-k-out-of-n: F systems
|
|
|
1983 |
23 |
6 |
p. 1172- 1 p. |
artikel |
75 |
Distribution of a life ratio and its application
|
|
|
1983 |
23 |
6 |
p. 1171- 1 p. |
artikel |
76 |
DMA controller adds muscle to offload microprocessor
|
|
|
1983 |
23 |
6 |
p. 1182- 1 p. |
artikel |
77 |
Donor generation in monocrystalline silicon by Halogen implantation
|
|
|
1983 |
23 |
6 |
p. 1187- 1 p. |
artikel |
78 |
Dynamic properties of microelectronic digital systems
|
|
|
1983 |
23 |
6 |
p. 1182- 1 p. |
artikel |
79 |
Effect of intermittent repair in a two unit redundant system with standby failure
|
Rastogi, A.K. |
|
1983 |
23 |
6 |
p. 1051-1054 4 p. |
artikel |
80 |
Effects of MBE growth conditions on carbon contamination in GaAs
|
|
|
1983 |
23 |
6 |
p. 1183- 1 p. |
artikel |
81 |
4376947 Electrically programmable floating gate semiconductor memory device
|
Chiu, Te-Long |
|
1983 |
23 |
6 |
p. 1196- 1 p. |
artikel |
82 |
Electric subbands in p-type germanium inversion layers
|
|
|
1983 |
23 |
6 |
p. 1184- 1 p. |
artikel |
83 |
Electromigration-induced failures in VLSI interconnects
|
|
|
1983 |
23 |
6 |
p. 1169- 1 p. |
artikel |
84 |
Electrostatic device damage
|
|
|
1983 |
23 |
6 |
p. 1169- 1 p. |
artikel |
85 |
Empirical prediction of overall reliability in computer communication networks
|
|
|
1983 |
23 |
6 |
p. 1175- 1 p. |
artikel |
86 |
Endor investigation of tellurium donors in silicon
|
|
|
1983 |
23 |
6 |
p. 1184- 1 p. |
artikel |
87 |
Enumeration of all simple paths in a directed graph using Petri Net: a systematic approach
|
|
|
1983 |
23 |
6 |
p. 1171- 1 p. |
artikel |
88 |
E-PROMs graduate to 256-K density with scaled n-channel process
|
|
|
1983 |
23 |
6 |
p. 1182- 1 p. |
artikel |
89 |
EPROM Testing—Part II: Application to 16K N-channel devices
|
|
|
1983 |
23 |
6 |
p. 1176- 1 p. |
artikel |
90 |
EPROM testing—Part I: theoretical considerations
|
|
|
1983 |
23 |
6 |
p. 1177- 1 p. |
artikel |
91 |
ESCAF—a new and cheap system for complex reliability analysis and computation
|
|
|
1983 |
23 |
6 |
p. 1172- 1 p. |
artikel |
92 |
Estimation of mixed Weibull parameters in life testing
|
|
|
1983 |
23 |
6 |
p. 1171-1172 2 p. |
artikel |
93 |
Etching characteristics of polysilicon, SiO2 and MoSi2 in NF3 and SF6 plasmas
|
|
|
1983 |
23 |
6 |
p. 1183- 1 p. |
artikel |
94 |
Evaluation of Du Pont copper-compatible resistor system
|
|
|
1983 |
23 |
6 |
p. 1185- 1 p. |
artikel |
95 |
Evaporation induced corrosion of YZ-LiNb03
|
Singh, Awatar |
|
1983 |
23 |
6 |
p. 1067-1068 2 p. |
artikel |
96 |
Evaporation induced frequency shift in S.A.W. filter
|
Singh, Awatar |
|
1983 |
23 |
6 |
p. 1163-1164 2 p. |
artikel |
97 |
Experience with polymer thick film technology
|
|
|
1983 |
23 |
6 |
p. 1186- 1 p. |
artikel |
98 |
Experimental and theoretical characterization of thick and thin films for microwave uses on 99.6% alumina substrates
|
|
|
1983 |
23 |
6 |
p. 1186- 1 p. |
artikel |
99 |
Failure diagnosis on the LT1280
|
|
|
1983 |
23 |
6 |
p. 1176- 1 p. |
artikel |
100 |
Failure modes induced in TTL-LS bipolar logics by negative inputs
|
|
|
1983 |
23 |
6 |
p. 1176- 1 p. |
artikel |
101 |
Fast algorithm for unavailability and sensitivity analysis of series-parallel systems
|
|
|
1983 |
23 |
6 |
p. 1172- 1 p. |
artikel |
102 |
Fast solutions for consecutive-k-out-of-n: F system
|
|
|
1983 |
23 |
6 |
p. 1174- 1 p. |
artikel |
103 |
Fatigue failure models—Birnbaum-Saunders vs inverse Gaussian
|
|
|
1983 |
23 |
6 |
p. 1172- 1 p. |
artikel |
104 |
Float-zoning of semiconductor silicon: a perspective
|
|
|
1983 |
23 |
6 |
p. 1184- 1 p. |
artikel |
105 |
Fundamental LTPD aspects
|
|
|
1983 |
23 |
6 |
p. 1178- 1 p. |
artikel |
106 |
Germanium selenide as a negative inorganic resist for ion beam microfabrication
|
|
|
1983 |
23 |
6 |
p. 1187- 1 p. |
artikel |
107 |
Hands-on investigations help exploit CMOS designs
|
|
|
1983 |
23 |
6 |
p. 1181- 1 p. |
artikel |
108 |
Hardware vs software maintainability; a comparative study
|
|
|
1983 |
23 |
6 |
p. 1177-1178 2 p. |
artikel |
109 |
Hierarchical design methodologies and tools for VLSI chips
|
|
|
1983 |
23 |
6 |
p. 1181- 1 p. |
artikel |
110 |
HP-41C programs for Bayesian binomial and exponential interval estimation with a uniform prior on the reliability
|
|
|
1983 |
23 |
6 |
p. 1172- 1 p. |
artikel |
111 |
I challenge your beliefs about reliability Part V: planning and policies
|
|
|
1983 |
23 |
6 |
p. 1169- 1 p. |
artikel |
112 |
IC makers, users adopt ship-to-stock
|
|
|
1983 |
23 |
6 |
p. 1178- 1 p. |
artikel |
113 |
IC process modeling and topography design
|
|
|
1983 |
23 |
6 |
p. 1180- 1 p. |
artikel |
114 |
Implantation through a window with medium to high energy ions
|
|
|
1983 |
23 |
6 |
p. 1187- 1 p. |
artikel |
115 |
Improved implementation of search technique to find spanning trees
|
|
|
1983 |
23 |
6 |
p. 1175- 1 p. |
artikel |
116 |
Influence of emitter edge dislocations on reliability of planar NPN transistors
|
|
|
1983 |
23 |
6 |
p. 1170- 1 p. |
artikel |
117 |
437794 Integrated gas sensitive unit comprising a gas sensitive semiconductor element and a resistor for gas concentration measurement
|
Hishii, Toshiyasu |
|
1983 |
23 |
6 |
p. 1191- 1 p. |
artikel |
118 |
Interactive multiobjective optimization by the Sequential Proxy Optimization Technique (SPOT)
|
|
|
1983 |
23 |
6 |
p. 1173- 1 p. |
artikel |
119 |
Introduction to MOS LSI design
|
G.W.A.D., |
|
1983 |
23 |
6 |
p. 1167-1168 2 p. |
artikel |
120 |
Investigation on high speed CW edge-emitting LEDs grown on semiinsulating GaAs substrate
|
|
|
1983 |
23 |
6 |
p. 1184- 1 p. |
artikel |
121 |
Investment analysis of introducing standby or redundancy into a production system
|
|
|
1983 |
23 |
6 |
p. 1175- 1 p. |
artikel |
122 |
Ion beam etching with reactive gases
|
|
|
1983 |
23 |
6 |
p. 1186- 1 p. |
artikel |
123 |
Ion range statistics by a Fourier series
|
|
|
1983 |
23 |
6 |
p. 1187- 1 p. |
artikel |
124 |
Ions expose masks with a precision of 0.1 micrometer
|
|
|
1983 |
23 |
6 |
p. 1186- 1 p. |
artikel |
125 |
Knowledge databases, emulation extend automated-tester capabilities
|
|
|
1983 |
23 |
6 |
p. 1179-1180 2 p. |
artikel |
126 |
Les problemes de Brasabilite dans l'industrie electronique spatiale
|
|
|
1983 |
23 |
6 |
p. 1170- 1 p. |
artikel |
127 |
Managing VLSI complexity: an outlook
|
|
|
1983 |
23 |
6 |
p. 1182- 1 p. |
artikel |
128 |
Marginal distribution estimators for the Gamma-Prior parameters for a group of Poisson processes
|
|
|
1983 |
23 |
6 |
p. 1174- 1 p. |
artikel |
129 |
Mathematical models for marginal reliability analysis
|
Corsi, F. |
|
1983 |
23 |
6 |
p. 1087-1102 16 p. |
artikel |
130 |
Maximum likelihood estimation of parameters of several continuous and discrete failure distributions
|
|
|
1983 |
23 |
6 |
p. 1177- 1 p. |
artikel |
131 |
Measurement technique of electromigration
|
Lu, Y.Z. |
|
1983 |
23 |
6 |
p. 1103-1118 16 p. |
artikel |
132 |
Meeting the testing challenge: today and tomorrow
|
|
|
1983 |
23 |
6 |
p. 1179- 1 p. |
artikel |
133 |
4377030 Metallization of selectively implanted AIII-BV compound semiconductors
|
Pettenpaul, Ewald |
|
1983 |
23 |
6 |
p. 1194-1195 2 p. |
artikel |
134 |
4376336 Method for fabricating a semiconductor device
|
Endo, Norio |
|
1983 |
23 |
6 |
p. 1198- 1 p. |
artikel |
135 |
4377605 Method for forming an insulating layer on a polycrystalline silicon layer of a semiconductor device usng a two-step thermal oxidation technique
|
Yamamoto, Takashi |
|
1983 |
23 |
6 |
p. 1194- 1 p. |
artikel |
136 |
4377903 Method for manufacturing an I2L semiconductor device
|
Kanzaki, Koichi |
|
1983 |
23 |
6 |
p. 1191-1192 2 p. |
artikel |
137 |
4378255 Method for producing integrated semiconductor light emitter
|
Holonyak, Nick |
|
1983 |
23 |
6 |
p. 1190- 1 p. |
artikel |
138 |
4377438 Method for producing semiconductor device
|
Moriya, Takahiko |
|
1983 |
23 |
6 |
p. 1194- 1 p. |
artikel |
139 |
4376688 Method for producing semiconductor films
|
Ceasar, GeraldP |
|
1983 |
23 |
6 |
p. 1196- 1 p. |
artikel |
140 |
4377028 Method for registering a mask pattern in a photoetching apparatus for semiconductor devices
|
Imahashi, Isse |
|
1983 |
23 |
6 |
p. 1195- 1 p. |
artikel |
141 |
Methodical aspects of logic synthesis
|
|
|
1983 |
23 |
6 |
p. 1173-1174 2 p. |
artikel |
142 |
4377904 Method of fabricating a narrow band-gap semiconductor CCD imaging device
|
Chapman, RichardA |
|
1983 |
23 |
6 |
p. 1191- 1 p. |
artikel |
143 |
4378383 Method of making conductive paths through a lamina in a semiconductor device
|
Moritz, Holge |
|
1983 |
23 |
6 |
p. 1190- 1 p. |
artikel |
144 |
4376657 Method of making fault-free surface zone in semiconductor devices by step-wise heat treating
|
Nagasawa, Kazutoshi |
|
1983 |
23 |
6 |
p. 1197-1198 2 p. |
artikel |
145 |
4377900 Method of manufacturing semiconductor device
|
Nonaka, Terumoto |
|
1983 |
23 |
6 |
p. 1192- 1 p. |
artikel |
146 |
4377902 Method of manufacturing semiconductor device using laser beam crystallized poly/amorphous layer
|
Shinada, Kazuyoshi |
|
1983 |
23 |
6 |
p. 1192- 1 p. |
artikel |
147 |
4376581 Method of positioning disk-shaped workpieces, preferably semiconductor wafers
|
Mayer, HerbertE |
|
1983 |
23 |
6 |
p. 1198- 1 p. |
artikel |
148 |
4376664 Method of producing a semiconductor device
|
Hataishi, Osamu |
|
1983 |
23 |
6 |
p. 1196- 1 p. |
artikel |
149 |
4376658 Method of producing structures composed of photosensitive resist for integrated semiconductor circuits
|
Sigusch, Reiner |
|
1983 |
23 |
6 |
p. 1197- 1 p. |
artikel |
150 |
Microbit brings self-testing on board complex microcomputers
|
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|
1983 |
23 |
6 |
p. 1180-1181 2 p. |
artikel |
151 |
Microelectronics in China 1979–82—a review
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|
1983 |
23 |
6 |
p. 1178- 1 p. |
artikel |
152 |
Miniaturisation des amplificateurs monolithiques sur AsGa à 10 GHz
|
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1983 |
23 |
6 |
p. 1182- 1 p. |
artikel |
153 |
Minimal pathset and minimal cutsets using search technique
|
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1983 |
23 |
6 |
p. 1177- 1 p. |
artikel |
154 |
Modelling digital circuits with delays by Stochastic Petri Nets
|
Castagnolo, B. |
|
1983 |
23 |
6 |
p. 1075-1086 12 p. |
artikel |
155 |
Modelling human performance reliability in a two stage combined manual and decision task
|
Rahim, M.A. |
|
1983 |
23 |
6 |
p. 1131-1141 11 p. |
artikel |
156 |
Moment identities for nonnegative variables via integrated survival curves
|
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1983 |
23 |
6 |
p. 1172-1173 2 p. |
artikel |
157 |
Moments of n-unit redundant systems with time dependent failure rates
|
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1983 |
23 |
6 |
p. 1175- 1 p. |
artikel |
158 |
Mounting of micropackages in vapour phase soldering and study of ageing mechanism
|
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1983 |
23 |
6 |
p. 1170- 1 p. |
artikel |
159 |
Multi-chip module technology
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1983 |
23 |
6 |
p. 1179- 1 p. |
artikel |
160 |
Multi-chip module test and diagnostic methodology
|
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1983 |
23 |
6 |
p. 1176- 1 p. |
artikel |
161 |
MVU estimators for some multivariate normal probability models: an application to stress-strength models
|
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1983 |
23 |
6 |
p. 1175- 1 p. |
artikel |
162 |
New bubble-memory packaging cuts board space and manufacturing costs
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1983 |
23 |
6 |
p. 1178- 1 p. |
artikel |
163 |
New thick-film temperature sensors applied in some hybrid measurement devices
|
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1983 |
23 |
6 |
p. 1186- 1 p. |
artikel |
164 |
Nonparametric accelerated life testing
|
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|
1983 |
23 |
6 |
p. 1172- 1 p. |
artikel |
165 |
Novel technique of determining aluminium quality for S.A.W. devices fabrication on YZ-LiNbO3
|
Singh, Awatar |
|
1983 |
23 |
6 |
p. 1027-1028 2 p. |
artikel |
166 |
Numerical calculation of mean mission duration
|
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1983 |
23 |
6 |
p. 1171- 1 p. |
artikel |
167 |
Ohmic contacts to III–V compound semiconductors: a review of fabrication techniques
|
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1983 |
23 |
6 |
p. 1180- 1 p. |
artikel |
168 |
On Bayes estimation of reliability for the Birnbaum-Saunders fatigue life model
|
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1983 |
23 |
6 |
p. 1173- 1 p. |
artikel |
169 |
On discrete hazard functions
|
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1983 |
23 |
6 |
p. 1172- 1 p. |
artikel |
170 |
On hardware/software trade-offs in computer system design
|
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1983 |
23 |
6 |
p. 1171- 1 p. |
artikel |
171 |
On the design of algorithms for VLSI systolic arrays
|
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1983 |
23 |
6 |
p. 1177- 1 p. |
artikel |
172 |
OYSTER: a study of integrated circuits as three-dimensional structures
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1983 |
23 |
6 |
p. 1182- 1 p. |
artikel |
173 |
Packaging and assembly: the 1983 semiconductor technology forecast
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1983 |
23 |
6 |
p. 1179- 1 p. |
artikel |
174 |
Panorama des technoligies de circuits intégrés Si, GaAs et Josephson: limites et évolution
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1983 |
23 |
6 |
p. 1178- 1 p. |
artikel |
175 |
Passivation of gallium arsenide by reactively sputtered gallium nitride thin films
|
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1983 |
23 |
6 |
p. 1185-1186 2 p. |
artikel |
176 |
Pattern transfer; overview of equipment needs
|
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1983 |
23 |
6 |
p. 1179- 1 p. |
artikel |
177 |
Épitaxie en phase liquide de Ga x In1−x As yP1−y
|
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1983 |
23 |
6 |
p. 1184- 1 p. |
artikel |
178 |
Plasma-enhanced deposition of tungsten, molybdenum and tungsten silicide films
|
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1983 |
23 |
6 |
p. 1187- 1 p. |
artikel |
179 |
Plasma etching of oxides and nitrides
|
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1983 |
23 |
6 |
p. 1180- 1 p. |
artikel |
180 |
Point estimation of the parameter of a truncated exponential distribution
|
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1983 |
23 |
6 |
p. 1172- 1 p. |
artikel |
181 |
Probabilistic analysis of a pulverizer system with commoncause failures
|
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1983 |
23 |
6 |
p. 1171- 1 p. |
artikel |
182 |
4376659 Process for forming semiconductor alloys having a desired bandgap
|
Castro, CarlosA |
|
1983 |
23 |
6 |
p. 1197- 1 p. |
artikel |
183 |
4378260 Process for producing a semiconductor device
|
Fukuda, Takeshi |
|
1983 |
23 |
6 |
p. 1190- 1 p. |
artikel |
184 |
Product quality level monitoring and control for logic chips and modules
|
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1983 |
23 |
6 |
p. 1170- 1 p. |
artikel |
185 |
Properties of digital microelectronic systems from the viewpoint of signal transmission
|
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1983 |
23 |
6 |
p. 1182- 1 p. |
artikel |
186 |
4378586 Protective circuitry for semiconductor switches
|
Bete, Manfred |
|
1983 |
23 |
6 |
p. 1189-1190 2 p. |
artikel |
187 |
Publications, notices, calls for papers, etc
|
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1983 |
23 |
6 |
p. 1007-1008 2 p. |
artikel |
188 |
Recursive algorithm to evaluate the reliability of a consecutive-k-out of-n: F system
|
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1983 |
23 |
6 |
p. 1172- 1 p. |
artikel |
189 |
Reducing PCB testing
|
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1983 |
23 |
6 |
p. 1178-1179 2 p. |
artikel |
190 |
Reliability analysis and investment decision in electric motors for irrigation
|
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1983 |
23 |
6 |
p. 1170- 1 p. |
artikel |
191 |
Reliability analysis of a 2-out-of-n: F system with repairable primary and degradation units
|
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1983 |
23 |
6 |
p. 1177- 1 p. |
artikel |
192 |
Reliability analysis of fault tolerant pipeline ring networks
|
Lombardi, Fabrizio |
|
1983 |
23 |
6 |
p. 1055-1065 11 p. |
artikel |
193 |
Reliability analysis of multi-unit cold standby system with two operating modes
|
Goel, L.R. |
|
1983 |
23 |
6 |
p. 1045-1050 6 p. |
artikel |
194 |
Reliability and maintainability of a multicomponent series-parallel system under several repair disciplines
|
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|
1983 |
23 |
6 |
p. 1175-1176 2 p. |
artikel |
195 |
Reliability evaluation by network decomposition
|
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1983 |
23 |
6 |
p. 1172- 1 p. |
artikel |
196 |
Reliability growth models for hardware and software systems based on nonhomogeneous Poisson processes: a survey
|
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1983 |
23 |
6 |
p. 1170- 1 p. |
artikel |
197 |
Reliability, maintainability and cost-effectiveness: a bibliographical note
|
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1983 |
23 |
6 |
p. 1175- 1 p. |
artikel |
198 |
Reliability of digital communication system with channel redundancy
|
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|
1983 |
23 |
6 |
p. 1177- 1 p. |
artikel |
199 |
Reliability system with two types of repair facilities
|
Murari, K. |
|
1983 |
23 |
6 |
p. 1015-1025 11 p. |
artikel |
200 |
RELVEC — a tool for control system reliability analysis
|
Hossi, H.J. |
|
1983 |
23 |
6 |
p. 1119-1129 11 p. |
artikel |
201 |
Robust procedures for estimating the scale parameter and predicting future order statistics of the Weibull distribution
|
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1983 |
23 |
6 |
p. 1173- 1 p. |
artikel |
202 |
Self-consistent theory of diagonal and off-diagonal disorder in the screened impurity band of doped semiconductors
|
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|
1983 |
23 |
6 |
p. 1183- 1 p. |
artikel |
203 |
4377819 Semiconductor device
|
Sakai, Yoshio |
|
1983 |
23 |
6 |
p. 1193- 1 p. |
artikel |
204 |
4376989 Semiconductor dynamic memory
|
Takemae, Yoshihiro |
|
1983 |
23 |
6 |
p. 1195- 1 p. |
artikel |
205 |
4377816 Semiconductor element with zone guard rings
|
Sittig, Roland |
|
1983 |
23 |
6 |
p. 1194- 1 p. |
artikel |
206 |
4377817 Semiconductor image sensors
|
Nishizawa, Jun-ichi |
|
1983 |
23 |
6 |
p. 1193-1194 2 p. |
artikel |
207 |
4377865 Semiconductor laser
|
Sugino, Takashi |
|
1983 |
23 |
6 |
p. 1192-1193 2 p. |
artikel |
208 |
4378599 Semiconductor laser having broadband laser gain
|
Damen, TheodoorC |
|
1983 |
23 |
6 |
p. 1189- 1 p. |
artikel |
209 |
4376307 Semiconductor laser or intensifier
|
Rozzi, TullioE |
|
1983 |
23 |
6 |
p. 1198-1199 2 p. |
artikel |
210 |
4376985 Semiconductor memory device
|
Isogai, Hideaki |
|
1983 |
23 |
6 |
p. 1195-1196 2 p. |
artikel |
211 |
Semicustom-integrated-circuit design in the UK—a capability profile
|
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1983 |
23 |
6 |
p. 1179- 1 p. |
artikel |
212 |
Semi-insulating gallium arsenide substrates for high-frequency FET and IC fabrication
|
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1983 |
23 |
6 |
p. 1186-1187 2 p. |
artikel |
213 |
Simultaneous exposure and development technique for S.A.W. device fabrication
|
Singh, Awatar |
|
1983 |
23 |
6 |
p. 1165- 1 p. |
artikel |
214 |
Software bugs and communications system performance
|
Malec, H.A. |
|
1983 |
23 |
6 |
p. 1011-1014 4 p. |
artikel |
215 |
Software checks testability and generates tests of VLSI design
|
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1983 |
23 |
6 |
p. 1180- 1 p. |
artikel |
216 |
Solder attachment of leadless ceramic chip carriers
|
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1983 |
23 |
6 |
p. 1181- 1 p. |
artikel |
217 |
Specifying multilayer circuit boards to meet the demands of VLSI
|
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1983 |
23 |
6 |
p. 1182- 1 p. |
artikel |
218 |
4377856 Static semiconductor memory with reduced components and interconnections
|
Roesner, BruceB |
|
1983 |
23 |
6 |
p. 1193- 1 p. |
artikel |
219 |
Steady-state availability of a system with two subsystems working alternately
|
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1983 |
23 |
6 |
p. 1175- 1 p. |
artikel |
220 |
Stochastic behaviour of a two-unit (dissimilar) hot standby system with three modes
|
Goel, L.R. |
|
1983 |
23 |
6 |
p. 1035-1040 6 p. |
artikel |
221 |
Stochastic behaviour of a 2-unit standby redundant system with imperfect switchover and preventive maintenance
|
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1983 |
23 |
6 |
p. 1175- 1 p. |
artikel |
222 |
Surface mounting of leadless chip carriers on various printed circuit board type substrates
|
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1983 |
23 |
6 |
p. 1169- 1 p. |
artikel |
223 |
Switch failure in a two-unit standby redundant system
|
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1983 |
23 |
6 |
p. 1176- 1 p. |
artikel |
224 |
Synthesis of techniques creates complete system self-test
|
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1983 |
23 |
6 |
p. 1171- 1 p. |
artikel |
225 |
Systems in reduced efficiency and alternating periods
|
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1983 |
23 |
6 |
p. 1170-1171 2 p. |
artikel |
226 |
Telecommunications IC integrates still more line-card tasks
|
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1983 |
23 |
6 |
p. 1182- 1 p. |
artikel |
227 |
Temperature verification of hybrid microelectronic circuit design
|
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1983 |
23 |
6 |
p. 1185- 1 p. |
artikel |
228 |
The application of reactive ion etching to the definition of patterns in Al-Si-Cu alloy conductor layers and thick silicon oxide films
|
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1983 |
23 |
6 |
p. 1179- 1 p. |
artikel |
229 |
The cooling of electrical and electronic equipment in sealed enclosures
|
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1983 |
23 |
6 |
p. 1180- 1 p. |
artikel |
230 |
The effect of preventive maintenance to a standby system with two types of failures
|
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1983 |
23 |
6 |
p. 1175- 1 p. |
artikel |
231 |
Thermal nitridation of silicon and silicon dioxide for thin gate insulators. Part I
|
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1983 |
23 |
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p. 1184- 1 p. |
artikel |
232 |
Thermodynamical calculation of multiexciton complexes system in lightly doped Si: a contribution of excited states of the multiexciton complexes
|
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1983 |
23 |
6 |
p. 1184- 1 p. |
artikel |
233 |
Thermosonic gold wire bonding to copper conductors
|
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1983 |
23 |
6 |
p. 1181- 1 p. |
artikel |
234 |
The software integrity of a computer system installed in a Royal Naval frigate
|
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1983 |
23 |
6 |
p. 1176-1177 2 p. |
artikel |
235 |
The use of hybrid microelectronics in the construction of ion-selective electrodes
|
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1983 |
23 |
6 |
p. 1186- 1 p. |
artikel |
236 |
The use of solid-state circuitry within hazardous areas
|
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1983 |
23 |
6 |
p. 1180- 1 p. |
artikel |
237 |
The Wijngaard-Stidham bisection method and replacement models
|
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1983 |
23 |
6 |
p. 1174- 1 p. |
artikel |
238 |
Thin film transistors and thin film transistor circuits
|
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1983 |
23 |
6 |
p. 1185- 1 p. |
artikel |
239 |
Two chips endow 32-bit processor with fault-tolerant architecture
|
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1983 |
23 |
6 |
p. 1181-1182 2 p. |
artikel |
240 |
Two programmable ICs enhance line-card functionality
|
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1983 |
23 |
6 |
p. 1182- 1 p. |
artikel |
241 |
VLSI design automation: an introduction
|
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1983 |
23 |
6 |
p. 1178- 1 p. |
artikel |
242 |
VLSI metallization using aluminium and its alloys. Part I
|
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1983 |
23 |
6 |
p. 1179- 1 p. |
artikel |
243 |
VLSI metallization using aluminium and its alloys. Part II
|
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1983 |
23 |
6 |
p. 1181- 1 p. |
artikel |
244 |
VLSI—the technological giant—and the developing countries
|
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1983 |
23 |
6 |
p. 1178- 1 p. |
artikel |
245 |
Volume contents and author index
|
|
|
1983 |
23 |
6 |
p. i-ix nvt p. |
artikel |
246 |
Wafer gettering: the key to higher yields?
|
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1983 |
23 |
6 |
p. 1180- 1 p. |
artikel |
247 |
Wafer processing in the early 1980s
|
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1983 |
23 |
6 |
p. 1179- 1 p. |
artikel |
248 |
Weapons systems analysis, Part III: warfare gaming, tactics and techniques
|
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1983 |
23 |
6 |
p. 1177- 1 p. |
artikel |
249 |
Wet etching today
|
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|
1983 |
23 |
6 |
p. 1179- 1 p. |
artikel |
250 |
Wire-routing machines—new tools for VLSI physical design
|
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|
1983 |
23 |
6 |
p. 1180- 1 p. |
artikel |
251 |
X-ray double diffraction by thin monocrystalline layers
|
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|
1983 |
23 |
6 |
p. 1183- 1 p. |
artikel |