Digitale Bibliotheek
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                             251 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 Accuracy of univariate, bivariate and a “modified double Monte Carlo” technique for finding lower confidence limits of system reliability 1983
23 6 p. 1174-
1 p.
artikel
2 A cutset approach to reliability evaluation in communication networks 1983
23 6 p. 1173-
1 p.
artikel
3 Advances in automated wire and die bonding 1983
23 6 p. 1181-
1 p.
artikel
4 Advances in customization free VLSI system designers 1983
23 6 p. 1182-
1 p.
artikel
5 A graphical method applicable to age-replacement problems 1983
23 6 p. 1174-
1 p.
artikel
6 A life cycle costing methodology for the assessment of process heat generation by solar energy Sherie, Yosef S.
1983
23 6 p. 1069-1074
6 p.
artikel
7 Alternating space-charge-limited currents in hydrogenated amorphous silicon 1983
23 6 p. 1183-
1 p.
artikel
8 A Markov approach to wear-out modelling 1983
23 6 p. 1174-1175
2 p.
artikel
9 A model for the prediction of assembly, rework and test yields 1983
23 6 p. 1176-
1 p.
artikel
10 A modified block replacement with two variables 1983
23 6 p. 1176-
1 p.
artikel
11 Amorphous-silicon devices start to shape up 1983
23 6 p. 1184-
1 p.
artikel
12 Analog modeling simulates the faults of electromechanical components 1983
23 6 p. 1169-
1 p.
artikel
13 Analysis of a two-unit cold standby system with three modes Goel, L.R.
1983
23 6 p. 1041-1044
4 p.
artikel
14 Analysis of a two-unit hot standby system with three modes Goel, L.R.
1983
23 6 p. 1029-1033
5 p.
artikel
15 An analytic method for uncertainty analysis of nonlinear output functions, with applications to fault-tree analysis 1983
23 6 p. 1173-
1 p.
artikel
16 An approach to ensure stability of precision laser trimmed thick film resistors 1983
23 6 p. 1185-
1 p.
artikel
17 An error analysis for reliability quantification 1983
23 6 p. 1171-
1 p.
artikel
18 A new approach for network reliability analysis 1983
23 6 p. 1177-
1 p.
artikel
19 A new model of software reliability prediction Govil, K.K.
1983
23 6 p. 1009-1010
2 p.
artikel
20 A new package-related failure mechanism for leadless ceramic chip carriers (LC-3s) solder-attached to Alumina substrates 1983
23 6 p. 1169-1170
2 p.
artikel
21 An extension of the block preventive maintenance policy for stochastically failing items 1983
23 6 p. 1177-
1 p.
artikel
22 An LSI technology fully compatible EAROM cell 1983
23 6 p. 1179-
1 p.
artikel
23 An overview of thickness measurement techniques for metallic thin films 1983
23 6 p. 1186-
1 p.
artikel
24 Application of a software reliability model to decide software release time 1983
23 6 p. 1171-
1 p.
artikel
25 Applications of ellipsometry to in situ study of the growth of hydrogenated amorphous films 1983
23 6 p. 1183-
1 p.
artikel
26 A replacement policy based on limits for the repair cost rate 1983
23 6 p. 1177-
1 p.
artikel
27 A second-order moments method for uncertainty analysis 1983
23 6 p. 1171-
1 p.
artikel
28 A simulative approach to electron conduction in thick-film resistors 1983
23 6 p. 1185-
1 p.
artikel
29 Assembly equipment users speak out 1983
23 6 p. 1178-
1 p.
artikel
30 A time-variable ratio useful in reliability theory 1983
23 6 p. 1172-
1 p.
artikel
31 A transmission line model of a VLSI package 1983
23 6 p. 1180-
1 p.
artikel
32 Automatic hardware synthesis 1983
23 6 p. 1181-
1 p.
artikel
33 A “Zero-Time” VLSI sorter 1983
23 6 p. 1178-
1 p.
artikel
34 Bayesian reliability and availability—a review 1983
23 6 p. 1174-
1 p.
artikel
35 Bibliography of literature on nuclear system reliability Dhillon, Balbir S.
1983
23 6 p. 1143-1161
19 p.
artikel
36 Bipolar Schottky logic device failure modes due to contact metallurgical degradation 1983
23 6 p. 1169-
1 p.
artikel
37 16-bit bipolar microprocessor marches to standard instruction set 1983
23 6 p. 1182-
1 p.
artikel
38 Bonding temperature measurements during device assembly 1983
23 6 p. 1181-
1 p.
artikel
39 Bounds on reliability of a noncoherent system using its length & width 1983
23 6 p. 1174-
1 p.
artikel
40 Broader functions and improved reliability of printed circuit boards using dry film solder mask systems 1983
23 6 p. 1170-
1 p.
artikel
41 Bubble-memory support chips allow tailored-system design 1983
23 6 p. 1179-
1 p.
artikel
42 CAD systems for VLSI in Japan 1983
23 6 p. 1178-
1 p.
artikel
43 Calculating the failure frequency of a repairable system 1983
23 6 p. 1175-
1 p.
artikel
44 Capless annealing of silicon implanted gallium arsenide 1983
23 6 p. 1186-
1 p.
artikel
45 Ceramic on metal substrates produced by plasma spraying for thick film technology 1983
23 6 p. 1185-
1 p.
artikel
46 Characterization of LPCVD and thermal silicon nitride films 1983
23 6 p. 1185-
1 p.
artikel
47 Chemical impurities and structural imperfections in semiconductor silicon. Part I 1983
23 6 p. 1183-
1 p.
artikel
48 Chip-carriers change their course 1983
23 6 p. 1179-
1 p.
artikel
49 Circuit analysis, logic simulation and design verification for VLSI 1983
23 6 p. 1181-
1 p.
artikel
50 Circuits intégrés diviseurs de fréquence réalisés sur arséniure de gallium 1983
23 6 p. 1182-
1 p.
artikel
51 Combinatorial reliability analysis of multiprocessor computers 1983
23 6 p. 1173-
1 p.
artikel
52 Comparison of mean time to first failure and mean up time 1983
23 6 p. 1170-
1 p.
artikel
53 Component failure and compensators 1983
23 6 p. 1173-
1 p.
artikel
54 Computer simulation of hybrid integrated circuits including combined electrical and thermal effects 1983
23 6 p. 1186-
1 p.
artikel
55 Constructing fault-trees by stepwise refinement 1983
23 6 p. 1172-
1 p.
artikel
56 Contribution to ion implantation through a narrow slit at higher energies 1983
23 6 p. 1187-
1 p.
artikel
57 Control of Boron diffusion in polysilicon for constructing overlapping polysilicon gate charge-coupled devices 1983
23 6 p. 1187-
1 p.
artikel
58 Croissance de monoscristaux de GaAs semi-isolant “non dopés”: trois façons de parvenir au résultat 1983
23 6 p. 1184-
1 p.
artikel
59 Current noise in thick and thin film resistors 1983
23 6 p. 1185-
1 p.
artikel
60 Defect analysis using QC data 1983
23 6 p. 1170-
1 p.
artikel
61 Defect Complexes in Semiconductor Structures G.W.A.D.,
1983
23 6 p. 1168-
1 p.
artikel
62 Demand-paged memory management boosts 16-bit microsystem throughput 1983
23 6 p. 1182-
1 p.
artikel
63 Density upgrading in tape automated bonding 1983
23 6 p. 1179-
1 p.
artikel
64 Dependability modeling of safety systems 1983
23 6 p. 1176-
1 p.
artikel
65 Design for testability—a survey 1983
23 6 p. 1179-
1 p.
artikel
66 Determine project risk using statistical methods 1983
23 6 p. 1171-
1 p.
artikel
67 Determining sample size when searching for rare items 1983
23 6 p. 1172-
1 p.
artikel
68 Developments in crystal growth from high-temperature solutions 1983
23 6 p. 1183-
1 p.
artikel
69 Device modeling 1983
23 6 p. 1180-
1 p.
artikel
70 Dielectric/semiconductor interfaces analysis using spectroscopic ellipsometry 1983
23 6 p. 1183-
1 p.
artikel
71 Diffusion characteristics of antimony and phosphorus spin-on sources 1983
23 6 p. 1184-
1 p.
artikel
72 Digital TV: makers bet on VLSI 1983
23 6 p. 1181-
1 p.
artikel
73 Digitizing, layout, rule checking—the everyday tasks of chip designers 1983
23 6 p. 1180-
1 p.
artikel
74 Direct computation for consecutive-k-out-of-n: F systems 1983
23 6 p. 1172-
1 p.
artikel
75 Distribution of a life ratio and its application 1983
23 6 p. 1171-
1 p.
artikel
76 DMA controller adds muscle to offload microprocessor 1983
23 6 p. 1182-
1 p.
artikel
77 Donor generation in monocrystalline silicon by Halogen implantation 1983
23 6 p. 1187-
1 p.
artikel
78 Dynamic properties of microelectronic digital systems 1983
23 6 p. 1182-
1 p.
artikel
79 Effect of intermittent repair in a two unit redundant system with standby failure Rastogi, A.K.
1983
23 6 p. 1051-1054
4 p.
artikel
80 Effects of MBE growth conditions on carbon contamination in GaAs 1983
23 6 p. 1183-
1 p.
artikel
81 4376947 Electrically programmable floating gate semiconductor memory device Chiu, Te-Long
1983
23 6 p. 1196-
1 p.
artikel
82 Electric subbands in p-type germanium inversion layers 1983
23 6 p. 1184-
1 p.
artikel
83 Electromigration-induced failures in VLSI interconnects 1983
23 6 p. 1169-
1 p.
artikel
84 Electrostatic device damage 1983
23 6 p. 1169-
1 p.
artikel
85 Empirical prediction of overall reliability in computer communication networks 1983
23 6 p. 1175-
1 p.
artikel
86 Endor investigation of tellurium donors in silicon 1983
23 6 p. 1184-
1 p.
artikel
87 Enumeration of all simple paths in a directed graph using Petri Net: a systematic approach 1983
23 6 p. 1171-
1 p.
artikel
88 E-PROMs graduate to 256-K density with scaled n-channel process 1983
23 6 p. 1182-
1 p.
artikel
89 EPROM Testing—Part II: Application to 16K N-channel devices 1983
23 6 p. 1176-
1 p.
artikel
90 EPROM testing—Part I: theoretical considerations 1983
23 6 p. 1177-
1 p.
artikel
91 ESCAF—a new and cheap system for complex reliability analysis and computation 1983
23 6 p. 1172-
1 p.
artikel
92 Estimation of mixed Weibull parameters in life testing 1983
23 6 p. 1171-1172
2 p.
artikel
93 Etching characteristics of polysilicon, SiO2 and MoSi2 in NF3 and SF6 plasmas 1983
23 6 p. 1183-
1 p.
artikel
94 Evaluation of Du Pont copper-compatible resistor system 1983
23 6 p. 1185-
1 p.
artikel
95 Evaporation induced corrosion of YZ-LiNb03 Singh, Awatar
1983
23 6 p. 1067-1068
2 p.
artikel
96 Evaporation induced frequency shift in S.A.W. filter Singh, Awatar
1983
23 6 p. 1163-1164
2 p.
artikel
97 Experience with polymer thick film technology 1983
23 6 p. 1186-
1 p.
artikel
98 Experimental and theoretical characterization of thick and thin films for microwave uses on 99.6% alumina substrates 1983
23 6 p. 1186-
1 p.
artikel
99 Failure diagnosis on the LT1280 1983
23 6 p. 1176-
1 p.
artikel
100 Failure modes induced in TTL-LS bipolar logics by negative inputs 1983
23 6 p. 1176-
1 p.
artikel
101 Fast algorithm for unavailability and sensitivity analysis of series-parallel systems 1983
23 6 p. 1172-
1 p.
artikel
102 Fast solutions for consecutive-k-out-of-n: F system 1983
23 6 p. 1174-
1 p.
artikel
103 Fatigue failure models—Birnbaum-Saunders vs inverse Gaussian 1983
23 6 p. 1172-
1 p.
artikel
104 Float-zoning of semiconductor silicon: a perspective 1983
23 6 p. 1184-
1 p.
artikel
105 Fundamental LTPD aspects 1983
23 6 p. 1178-
1 p.
artikel
106 Germanium selenide as a negative inorganic resist for ion beam microfabrication 1983
23 6 p. 1187-
1 p.
artikel
107 Hands-on investigations help exploit CMOS designs 1983
23 6 p. 1181-
1 p.
artikel
108 Hardware vs software maintainability; a comparative study 1983
23 6 p. 1177-1178
2 p.
artikel
109 Hierarchical design methodologies and tools for VLSI chips 1983
23 6 p. 1181-
1 p.
artikel
110 HP-41C programs for Bayesian binomial and exponential interval estimation with a uniform prior on the reliability 1983
23 6 p. 1172-
1 p.
artikel
111 I challenge your beliefs about reliability Part V: planning and policies 1983
23 6 p. 1169-
1 p.
artikel
112 IC makers, users adopt ship-to-stock 1983
23 6 p. 1178-
1 p.
artikel
113 IC process modeling and topography design 1983
23 6 p. 1180-
1 p.
artikel
114 Implantation through a window with medium to high energy ions 1983
23 6 p. 1187-
1 p.
artikel
115 Improved implementation of search technique to find spanning trees 1983
23 6 p. 1175-
1 p.
artikel
116 Influence of emitter edge dislocations on reliability of planar NPN transistors 1983
23 6 p. 1170-
1 p.
artikel
117 437794 Integrated gas sensitive unit comprising a gas sensitive semiconductor element and a resistor for gas concentration measurement Hishii, Toshiyasu
1983
23 6 p. 1191-
1 p.
artikel
118 Interactive multiobjective optimization by the Sequential Proxy Optimization Technique (SPOT) 1983
23 6 p. 1173-
1 p.
artikel
119 Introduction to MOS LSI design G.W.A.D.,
1983
23 6 p. 1167-1168
2 p.
artikel
120 Investigation on high speed CW edge-emitting LEDs grown on semiinsulating GaAs substrate 1983
23 6 p. 1184-
1 p.
artikel
121 Investment analysis of introducing standby or redundancy into a production system 1983
23 6 p. 1175-
1 p.
artikel
122 Ion beam etching with reactive gases 1983
23 6 p. 1186-
1 p.
artikel
123 Ion range statistics by a Fourier series 1983
23 6 p. 1187-
1 p.
artikel
124 Ions expose masks with a precision of 0.1 micrometer 1983
23 6 p. 1186-
1 p.
artikel
125 Knowledge databases, emulation extend automated-tester capabilities 1983
23 6 p. 1179-1180
2 p.
artikel
126 Les problemes de Brasabilite dans l'industrie electronique spatiale 1983
23 6 p. 1170-
1 p.
artikel
127 Managing VLSI complexity: an outlook 1983
23 6 p. 1182-
1 p.
artikel
128 Marginal distribution estimators for the Gamma-Prior parameters for a group of Poisson processes 1983
23 6 p. 1174-
1 p.
artikel
129 Mathematical models for marginal reliability analysis Corsi, F.
1983
23 6 p. 1087-1102
16 p.
artikel
130 Maximum likelihood estimation of parameters of several continuous and discrete failure distributions 1983
23 6 p. 1177-
1 p.
artikel
131 Measurement technique of electromigration Lu, Y.Z.
1983
23 6 p. 1103-1118
16 p.
artikel
132 Meeting the testing challenge: today and tomorrow 1983
23 6 p. 1179-
1 p.
artikel
133 4377030 Metallization of selectively implanted AIII-BV compound semiconductors Pettenpaul, Ewald
1983
23 6 p. 1194-1195
2 p.
artikel
134 4376336 Method for fabricating a semiconductor device Endo, Norio
1983
23 6 p. 1198-
1 p.
artikel
135 4377605 Method for forming an insulating layer on a polycrystalline silicon layer of a semiconductor device usng a two-step thermal oxidation technique Yamamoto, Takashi
1983
23 6 p. 1194-
1 p.
artikel
136 4377903 Method for manufacturing an I2L semiconductor device Kanzaki, Koichi
1983
23 6 p. 1191-1192
2 p.
artikel
137 4378255 Method for producing integrated semiconductor light emitter Holonyak, Nick
1983
23 6 p. 1190-
1 p.
artikel
138 4377438 Method for producing semiconductor device Moriya, Takahiko
1983
23 6 p. 1194-
1 p.
artikel
139 4376688 Method for producing semiconductor films Ceasar, GeraldP
1983
23 6 p. 1196-
1 p.
artikel
140 4377028 Method for registering a mask pattern in a photoetching apparatus for semiconductor devices Imahashi, Isse
1983
23 6 p. 1195-
1 p.
artikel
141 Methodical aspects of logic synthesis 1983
23 6 p. 1173-1174
2 p.
artikel
142 4377904 Method of fabricating a narrow band-gap semiconductor CCD imaging device Chapman, RichardA
1983
23 6 p. 1191-
1 p.
artikel
143 4378383 Method of making conductive paths through a lamina in a semiconductor device Moritz, Holge
1983
23 6 p. 1190-
1 p.
artikel
144 4376657 Method of making fault-free surface zone in semiconductor devices by step-wise heat treating Nagasawa, Kazutoshi
1983
23 6 p. 1197-1198
2 p.
artikel
145 4377900 Method of manufacturing semiconductor device Nonaka, Terumoto
1983
23 6 p. 1192-
1 p.
artikel
146 4377902 Method of manufacturing semiconductor device using laser beam crystallized poly/amorphous layer Shinada, Kazuyoshi
1983
23 6 p. 1192-
1 p.
artikel
147 4376581 Method of positioning disk-shaped workpieces, preferably semiconductor wafers Mayer, HerbertE
1983
23 6 p. 1198-
1 p.
artikel
148 4376664 Method of producing a semiconductor device Hataishi, Osamu
1983
23 6 p. 1196-
1 p.
artikel
149 4376658 Method of producing structures composed of photosensitive resist for integrated semiconductor circuits Sigusch, Reiner
1983
23 6 p. 1197-
1 p.
artikel
150 Microbit brings self-testing on board complex microcomputers 1983
23 6 p. 1180-1181
2 p.
artikel
151 Microelectronics in China 1979–82—a review 1983
23 6 p. 1178-
1 p.
artikel
152 Miniaturisation des amplificateurs monolithiques sur AsGa à 10 GHz 1983
23 6 p. 1182-
1 p.
artikel
153 Minimal pathset and minimal cutsets using search technique 1983
23 6 p. 1177-
1 p.
artikel
154 Modelling digital circuits with delays by Stochastic Petri Nets Castagnolo, B.
1983
23 6 p. 1075-1086
12 p.
artikel
155 Modelling human performance reliability in a two stage combined manual and decision task Rahim, M.A.
1983
23 6 p. 1131-1141
11 p.
artikel
156 Moment identities for nonnegative variables via integrated survival curves 1983
23 6 p. 1172-1173
2 p.
artikel
157 Moments of n-unit redundant systems with time dependent failure rates 1983
23 6 p. 1175-
1 p.
artikel
158 Mounting of micropackages in vapour phase soldering and study of ageing mechanism 1983
23 6 p. 1170-
1 p.
artikel
159 Multi-chip module technology 1983
23 6 p. 1179-
1 p.
artikel
160 Multi-chip module test and diagnostic methodology 1983
23 6 p. 1176-
1 p.
artikel
161 MVU estimators for some multivariate normal probability models: an application to stress-strength models 1983
23 6 p. 1175-
1 p.
artikel
162 New bubble-memory packaging cuts board space and manufacturing costs 1983
23 6 p. 1178-
1 p.
artikel
163 New thick-film temperature sensors applied in some hybrid measurement devices 1983
23 6 p. 1186-
1 p.
artikel
164 Nonparametric accelerated life testing 1983
23 6 p. 1172-
1 p.
artikel
165 Novel technique of determining aluminium quality for S.A.W. devices fabrication on YZ-LiNbO3 Singh, Awatar
1983
23 6 p. 1027-1028
2 p.
artikel
166 Numerical calculation of mean mission duration 1983
23 6 p. 1171-
1 p.
artikel
167 Ohmic contacts to III–V compound semiconductors: a review of fabrication techniques 1983
23 6 p. 1180-
1 p.
artikel
168 On Bayes estimation of reliability for the Birnbaum-Saunders fatigue life model 1983
23 6 p. 1173-
1 p.
artikel
169 On discrete hazard functions 1983
23 6 p. 1172-
1 p.
artikel
170 On hardware/software trade-offs in computer system design 1983
23 6 p. 1171-
1 p.
artikel
171 On the design of algorithms for VLSI systolic arrays 1983
23 6 p. 1177-
1 p.
artikel
172 OYSTER: a study of integrated circuits as three-dimensional structures 1983
23 6 p. 1182-
1 p.
artikel
173 Packaging and assembly: the 1983 semiconductor technology forecast 1983
23 6 p. 1179-
1 p.
artikel
174 Panorama des technoligies de circuits intégrés Si, GaAs et Josephson: limites et évolution 1983
23 6 p. 1178-
1 p.
artikel
175 Passivation of gallium arsenide by reactively sputtered gallium nitride thin films 1983
23 6 p. 1185-1186
2 p.
artikel
176 Pattern transfer; overview of equipment needs 1983
23 6 p. 1179-
1 p.
artikel
177 Épitaxie en phase liquide de Ga x In1−x As yP1−y 1983
23 6 p. 1184-
1 p.
artikel
178 Plasma-enhanced deposition of tungsten, molybdenum and tungsten silicide films 1983
23 6 p. 1187-
1 p.
artikel
179 Plasma etching of oxides and nitrides 1983
23 6 p. 1180-
1 p.
artikel
180 Point estimation of the parameter of a truncated exponential distribution 1983
23 6 p. 1172-
1 p.
artikel
181 Probabilistic analysis of a pulverizer system with commoncause failures 1983
23 6 p. 1171-
1 p.
artikel
182 4376659 Process for forming semiconductor alloys having a desired bandgap Castro, CarlosA
1983
23 6 p. 1197-
1 p.
artikel
183 4378260 Process for producing a semiconductor device Fukuda, Takeshi
1983
23 6 p. 1190-
1 p.
artikel
184 Product quality level monitoring and control for logic chips and modules 1983
23 6 p. 1170-
1 p.
artikel
185 Properties of digital microelectronic systems from the viewpoint of signal transmission 1983
23 6 p. 1182-
1 p.
artikel
186 4378586 Protective circuitry for semiconductor switches Bete, Manfred
1983
23 6 p. 1189-1190
2 p.
artikel
187 Publications, notices, calls for papers, etc 1983
23 6 p. 1007-1008
2 p.
artikel
188 Recursive algorithm to evaluate the reliability of a consecutive-k-out of-n: F system 1983
23 6 p. 1172-
1 p.
artikel
189 Reducing PCB testing 1983
23 6 p. 1178-1179
2 p.
artikel
190 Reliability analysis and investment decision in electric motors for irrigation 1983
23 6 p. 1170-
1 p.
artikel
191 Reliability analysis of a 2-out-of-n: F system with repairable primary and degradation units 1983
23 6 p. 1177-
1 p.
artikel
192 Reliability analysis of fault tolerant pipeline ring networks Lombardi, Fabrizio
1983
23 6 p. 1055-1065
11 p.
artikel
193 Reliability analysis of multi-unit cold standby system with two operating modes Goel, L.R.
1983
23 6 p. 1045-1050
6 p.
artikel
194 Reliability and maintainability of a multicomponent series-parallel system under several repair disciplines 1983
23 6 p. 1175-1176
2 p.
artikel
195 Reliability evaluation by network decomposition 1983
23 6 p. 1172-
1 p.
artikel
196 Reliability growth models for hardware and software systems based on nonhomogeneous Poisson processes: a survey 1983
23 6 p. 1170-
1 p.
artikel
197 Reliability, maintainability and cost-effectiveness: a bibliographical note 1983
23 6 p. 1175-
1 p.
artikel
198 Reliability of digital communication system with channel redundancy 1983
23 6 p. 1177-
1 p.
artikel
199 Reliability system with two types of repair facilities Murari, K.
1983
23 6 p. 1015-1025
11 p.
artikel
200 RELVEC — a tool for control system reliability analysis Hossi, H.J.
1983
23 6 p. 1119-1129
11 p.
artikel
201 Robust procedures for estimating the scale parameter and predicting future order statistics of the Weibull distribution 1983
23 6 p. 1173-
1 p.
artikel
202 Self-consistent theory of diagonal and off-diagonal disorder in the screened impurity band of doped semiconductors 1983
23 6 p. 1183-
1 p.
artikel
203 4377819 Semiconductor device Sakai, Yoshio
1983
23 6 p. 1193-
1 p.
artikel
204 4376989 Semiconductor dynamic memory Takemae, Yoshihiro
1983
23 6 p. 1195-
1 p.
artikel
205 4377816 Semiconductor element with zone guard rings Sittig, Roland
1983
23 6 p. 1194-
1 p.
artikel
206 4377817 Semiconductor image sensors Nishizawa, Jun-ichi
1983
23 6 p. 1193-1194
2 p.
artikel
207 4377865 Semiconductor laser Sugino, Takashi
1983
23 6 p. 1192-1193
2 p.
artikel
208 4378599 Semiconductor laser having broadband laser gain Damen, TheodoorC
1983
23 6 p. 1189-
1 p.
artikel
209 4376307 Semiconductor laser or intensifier Rozzi, TullioE
1983
23 6 p. 1198-1199
2 p.
artikel
210 4376985 Semiconductor memory device Isogai, Hideaki
1983
23 6 p. 1195-1196
2 p.
artikel
211 Semicustom-integrated-circuit design in the UK—a capability profile 1983
23 6 p. 1179-
1 p.
artikel
212 Semi-insulating gallium arsenide substrates for high-frequency FET and IC fabrication 1983
23 6 p. 1186-1187
2 p.
artikel
213 Simultaneous exposure and development technique for S.A.W. device fabrication Singh, Awatar
1983
23 6 p. 1165-
1 p.
artikel
214 Software bugs and communications system performance Malec, H.A.
1983
23 6 p. 1011-1014
4 p.
artikel
215 Software checks testability and generates tests of VLSI design 1983
23 6 p. 1180-
1 p.
artikel
216 Solder attachment of leadless ceramic chip carriers 1983
23 6 p. 1181-
1 p.
artikel
217 Specifying multilayer circuit boards to meet the demands of VLSI 1983
23 6 p. 1182-
1 p.
artikel
218 4377856 Static semiconductor memory with reduced components and interconnections Roesner, BruceB
1983
23 6 p. 1193-
1 p.
artikel
219 Steady-state availability of a system with two subsystems working alternately 1983
23 6 p. 1175-
1 p.
artikel
220 Stochastic behaviour of a two-unit (dissimilar) hot standby system with three modes Goel, L.R.
1983
23 6 p. 1035-1040
6 p.
artikel
221 Stochastic behaviour of a 2-unit standby redundant system with imperfect switchover and preventive maintenance 1983
23 6 p. 1175-
1 p.
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222 Surface mounting of leadless chip carriers on various printed circuit board type substrates 1983
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223 Switch failure in a two-unit standby redundant system 1983
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224 Synthesis of techniques creates complete system self-test 1983
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225 Systems in reduced efficiency and alternating periods 1983
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226 Telecommunications IC integrates still more line-card tasks 1983
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227 Temperature verification of hybrid microelectronic circuit design 1983
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228 The application of reactive ion etching to the definition of patterns in Al-Si-Cu alloy conductor layers and thick silicon oxide films 1983
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229 The cooling of electrical and electronic equipment in sealed enclosures 1983
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230 The effect of preventive maintenance to a standby system with two types of failures 1983
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231 Thermal nitridation of silicon and silicon dioxide for thin gate insulators. Part I 1983
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232 Thermodynamical calculation of multiexciton complexes system in lightly doped Si: a contribution of excited states of the multiexciton complexes 1983
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233 Thermosonic gold wire bonding to copper conductors 1983
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234 The software integrity of a computer system installed in a Royal Naval frigate 1983
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235 The use of hybrid microelectronics in the construction of ion-selective electrodes 1983
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236 The use of solid-state circuitry within hazardous areas 1983
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237 The Wijngaard-Stidham bisection method and replacement models 1983
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238 Thin film transistors and thin film transistor circuits 1983
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239 Two chips endow 32-bit processor with fault-tolerant architecture 1983
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240 Two programmable ICs enhance line-card functionality 1983
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241 VLSI design automation: an introduction 1983
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242 VLSI metallization using aluminium and its alloys. Part I 1983
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243 VLSI metallization using aluminium and its alloys. Part II 1983
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244 VLSI—the technological giant—and the developing countries 1983
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245 Volume contents and author index 1983
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246 Wafer gettering: the key to higher yields? 1983
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247 Wafer processing in the early 1980s 1983
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248 Weapons systems analysis, Part III: warfare gaming, tactics and techniques 1983
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249 Wet etching today 1983
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250 Wire-routing machines—new tools for VLSI physical design 1983
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251 X-ray double diffraction by thin monocrystalline layers 1983
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                             251 gevonden resultaten
 
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