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                             163 results found
no title author magazine year volume issue page(s) type
1 Achieving maintainability by random fault injection 1983
 23 2 p. 396-
1 p.
 article
2 A comparison of GaAs and Si processing technology 1983
 23 2 p. 400-
1 p.
 article
3 A comparison of semiconductor devices for high-speed logic 1983
 23 2 p. 400-
1 p.
 article
4 A comparison of silver halide systems as applied to today's advanced semiconductor requirements 1983
 23 2 p. 401-
1 p.
 article
5 A conduction-cooled module for high-performance LSI devices 1983
 23 2 p. 402-
1 p.
 article
6 Advances in GaAs ICs highlighted 1983
 23 2 p. 398-
1 p.
 article
7 Advances in VLSI plasma etching 1983
 23 2 p. 399-
1 p.
 article
8 Aerospace mechanical reliability practise 1983
 23 2 p. 396-
1 p.
 article
9 Aging degradation of Ni and NiCr-Ni thin film conductor systems 1983
 23 2 p. 405-
1 p.
 article
10 A graphical method for optimal reliability allocation Agarwala, R.A.
 1983
 23 2 p. 373-377
5 p.
 article
11 Airborne-particle monitoring know-how 1983
 23 2 p. 400-
1 p.
 article
12 Allowable power in NiCr film resistors 1983
 23 2 p. 405-
1 p.
 article
13 A multistate system with two repair distributions Goel, L.R.
 1983
 23 2 p. 337-340
4 p.
 article
14 Analog-Digital and Digital-Analog conversion G.W.A.D.,
 1983
 23 2 p. 393-
1 p.
 article
15 Analysis of a two-unit parallel redundancy with an imperfect switch Srinivasan, S.K.
 1983
 23 2 p. 309-318
10 p.
 article
16 Analysis of N2 plasma to characterize plasma etching systems 1983
 23 2 p. 398-
1 p.
 article
17 An efficient two-dimensional placement algorithm for the master-slice LSI layout 1983
 23 2 p. 400-
1 p.
 article
18 An engineer's view of the assurance and control of software quality 1983
 23 2 p. 395-
1 p.
 article
19 A new frequency independent attenuator in distributed multilayer thin film microsystem Singh, H.R.
 1983
 23 2 p. 379-381
3 p.
 article
20 A physical model for the dependence of carrier lifetime on doping density in nondegenerate silicon 1983
 23 2 p. 403-
1 p.
 article
21 Applications of high-speed data acquisition for semiconductor device yield analysis. Part II 1983
 23 2 p. 395-
1 p.
 article
22 A reliability physics model for parallel system Gopalan, M.N.
 1983
 23 2 p. 367-371
5 p.
 article
23 A review of error propagation analysis in systems Kuo, Way
 1983
 23 2 p. 235-248
14 p.
 article
24 A single-chip non-recursive digital processor 1983
 23 2 p. 402-
1 p.
 article
25 A submicron CMOS/SOS process for VLSI 1983
 23 2 p. 399-
1 p.
 article
26 Asynchronous circuits accelerate access to 256-K read-only memory 1983
 23 2 p. 402-
1 p.
 article
27 ATE system upgrades production efficiency and accuracy 1983
 23 2 p. 395-
1 p.
 article
28 Bonding refractory sputtering targets 1983
 23 2 p. 399-
1 p.
 article
29 Burn-in G.W.A.D.,
 1983
 23 2 p. 391-392
2 p.
 article
30 Burn-in: a new emphasis 1983
 23 2 p. 396-
1 p.
 article
31 Busy-period analysis of a two-unit warm standby system with inspection time Subramanyam Naidu, R.
 1983
 23 2 p. 341-346
6 p.
 article
32 Calendar of international conferences, symposia, lectures and meetings of interest 1983
 23 2 p. 201-204
4 p.
 article
33 Capture cross sections of the gold donor and acceptor states in n-type Czochralski silicon 1983
 23 2 p. 403-
1 p.
 article
34 Carbon in silicon: properties and impact on devices 1983
 23 2 p. 404-
1 p.
 article
35 Catastrophic events: actual risk versus sociental impact 1983
 23 2 p. 397-
1 p.
 article
36 Chemical vapor deposition of inorganic glass films 1983
 23 2 p. 398-
1 p.
 article
37 Chemical vapor deposition, trends and equipment 1983
 23 2 p. 398-
1 p.
 article
38 Chemisorption of atomic oxygen on silicon surface 1983
 23 2 p. 403-
1 p.
 article
39 Chip-package substrate cushions dense, high-speed circuitries 1983
 23 2 p. 399-
1 p.
 article
40 Circuit design boosts 15-V C-MOS process to drive 60-V displays 1983
 23 2 p. 402-
1 p.
 article
41 Circuit module implements practical self-testing 1983
 23 2 p. 402-
1 p.
 article
42 Circuit module implements practical self-testing 1983
 23 2 p. 395-
1 p.
 article
43 Common cause hazard analysis for random glitches 1983
 23 2 p. 397-
1 p.
 article
44 Conduction cooling for an LSI package: a one-dimensional approach 1983
 23 2 p. 401-402
2 p.
 article
45 Conference report Report of the Fourth Conference of the Israel Society for Quality Assurance Jacobs, Richard M.
 1983
 23 2 p. 213-214
2 p.
 article
46 Controlling oxygen in silicon: key to higher VLSI circuit yields 1983
 23 2 p. 401-
1 p.
 article
47 Cost limit replacement policy under minimal repair Park, Kyung S.
 1983
 23 2 p. 347-349
3 p.
 article
48 Counting and identifying particles in high purity water 1983
 23 2 p. 398-
1 p.
 article
49 Design verification system for large-scale LSI designs 1983
 23 2 p. 402-
1 p.
 article
50 Development of a reliability strategy for new IC component family and process Kohoutek, Henry J.
 1983
 23 2 p. 383-389
7 p.
 article
51 Diagnostic programming: costs and benefits 1983
 23 2 p. 397-
1 p.
 article
52 Differing product-safety needs needn't bar universal designs 1983
 23 2 p. 400-
1 p.
 article
53 Diffusion and reactions in gold films 1983
 23 2 p. 404-
1 p.
 article
54 Direct mounting of chip carriers on printed wiring board 1983
 23 2 p. 400-
1 p.
 article
55 Discussion of “optimization by Integer programming of constrained reliability problems with several modes of failure” 1983
 23 2 p. 396-
1 p.
 article
56 Double-implanted subvolt JFETs 1983
 23 2 p. 401-
1 p.
 article
57 Dual RF diode/DC magnetron sputtered aluminum alloy films for VLSI 1983
 23 2 p. 404-
1 p.
 article
58 Effect of firing temperature and glass content on the electrical properties of thick film capacitors 1983
 23 2 p. 405-
1 p.
 article
59 Effect of linear emitter recombination on OCVD determination of lifetime in p-i-n diodes 1983
 23 2 p. 403-
1 p.
 article
60 Electrostatic discharge failure mechanisms and models 1983
 23 2 p. 395-
1 p.
 article
61 Endpoint detection in a batch loaded planar etcher 1983
 23 2 p. 398-
1 p.
 article
62 Engineering reliability management Dhillon, Balbir S.
 1983
 23 2 p. 215-234
20 p.
 article
63 Expanding the horizons of optical projection lithography 1983
 23 2 p. 401-
1 p.
 article
64 Failure analysis in brief 1983
 23 2 p. 396-
1 p.
 article
65 Fault tree analysis method of a system having components of multiple failure modes Zhi, Huang Xi
 1983
 23 2 p. 325-328
4 p.
 article
66 FMEA technique for microcomputer assemblies 1983
 23 2 p. 397-
1 p.
 article
67 1 f noise in RU-based thick-film resistors 1983
 23 2 p. 405-
1 p.
 article
68 1982 Forecast on processing 1983
 23 2 p. 402-
1 p.
 article
69 Full automation of IC assembly will push productivity to new highs 1983
 23 2 p. 400-
1 p.
 article
70 GaAs bulk-crystal growth technology 1983
 23 2 p. 404-
1 p.
 article
71 GaAs for high-speed digital circuits 1983
 23 2 p. 401-
1 p.
 article
72 General formulas for calculating the steady-state frequency of system failure 1983
 23 2 p. 396-
1 p.
 article
73 Greed versus fear—the search for reliability 1983
 23 2 p. 395-
1 p.
 article
74 Growth and properties of new artificial doping superlattices in GaAs 1983
 23 2 p. 404-
1 p.
 article
75 Handbook of electronic connectors G.W.A.D.,
 1983
 23 2 p. 392-
1 p.
 article
76 Hermetic packages and sealing techniques 1983
 23 2 p. 400-
1 p.
 article
77 High rate reactive ion etching using a magnetron discharge 1983
 23 2 p. 405-406
2 p.
 article
78 High risk safety technology G.W.A.D.,
 1983
 23 2 p. 391-
1 p.
 article
79 High speed GaAs integrated circuits 1983
 23 2 p. 401-
1 p.
 article
80 Ideal projection lithography using a multilayer resist process 1983
 23 2 p. 399-
1 p.
 article
81 Identification of factors which cause software failure 1983
 23 2 p. 396-
1 p.
 article
82 72-K RAM stands up to soft and hard errors 1983
 23 2 p. 402-403
2 p.
 article
83 Laser system repairs 256-K RAMs 1983
 23 2 p. 406-
1 p.
 article
84 Laser-trimmed thin-film resistors hold voltage references steady 1983
 23 2 p. 405-
1 p.
 article
85 Laser writing of masks for integrated optical circuits 1983
 23 2 p. 406-
1 p.
 article
86 Leed investigations of some models for reconstructed (100) surfaces of silicon 1983
 23 2 p. 404-
1 p.
 article
87 Life distributions 1983
 23 2 p. 396-
1 p.
 article
88 Lithography for VLSI: an overview 1983
 23 2 p. 399-400
2 p.
 article
89 Low cycle fatigue reliability expressions 1983
 23 2 p. 397-
1 p.
 article
90 Mask limitations to VLSI: overlay accuracy and linewidth variation 1983
 23 2 p. 400-401
2 p.
 article
91 Match CAD/CAM capabilities to your design needs 1983
 23 2 p. 400-
1 p.
 article
92 Microwave circuit design now includes computer-aided mask layout 1983
 23 2 p. 400-
1 p.
 article
93 Minimizing pattern registration errors through wafer stepper matching techniques 1983
 23 2 p. 400-
1 p.
 article
94 Modeling semiconductor heterojunctions in equilibrium 1983
 23 2 p. 403-
1 p.
 article
95 More realistic reliability analysis by conditional distributions Heidtmann, Klaus D.
 1983
 23 2 p. 261-268
8 p.
 article
96 Multi-chamber dry etching system 1983
 23 2 p. 399-
1 p.
 article
97 Non-hermetic packaging for hybrid microcircuits 1983
 23 2 p. 405-
1 p.
 article
98 Octahedral precipitates in high temperature annealed Czochralski-grown silicon 1983
 23 2 p. 404-
1 p.
 article
99 Online wafer analysis with spectrometers 1983
 23 2 p. 398-
1 p.
 article
100 On the imperfection of replacement Lombardi, Fabrizio
 1983
 23 2 p. 269-282
14 p.
 article
101 Optimal scheduling of multiple preventive maintenance activities Park, Kyung S.
 1983
 23 2 p. 351-354
4 p.
 article
102 Optimizing gate interconnections in four-phase dynamic logic m.o.s. l.s.i. technology 1983
 23 2 p. 402-
1 p.
 article
103 Optimizing spare module burn-in 1983
 23 2 p. 397-
1 p.
 article
104 Package reliability as affected by materials and processes 1983
 23 2 p. 395-
1 p.
 article
105 Packaging technology for Josephson integrated circuits 1983
 23 2 p. 401-
1 p.
 article
106 PCM regenerator IC is designed for use in all countries 1983
 23 2 p. 401-
1 p.
 article
107 Phone IC banishes carbon mike, takes on hybrid coil's functions 1983
 23 2 p. 403-
1 p.
 article
108 Positive resist material requirements for VLSI device fabrication. Part I 1983
 23 2 p. 399-
1 p.
 article
109 Practical reliability methods for 11 kV and LV distribution systems 1983
 23 2 p. 396-
1 p.
 article
110 Precision fineness of grind measurement—Techniques and instrumentation—For thick film pastes Anjard Sr, Ronald P.
 1983
 23 2 p. 319-323
5 p.
 article
111 Productive methods for the mounting of microelectronic components 1983
 23 2 p. 401-
1 p.
 article
112 Proper shielding protects ICs from electrostatic damage 1983
 23 2 p. 400-
1 p.
 article
113 Publications, notices, calls for papers, etc. 1983
 23 2 p. 205-212
8 p.
 article
114 Quasi-random stress screening using the QRS-100 1983
 23 2 p. 397-
1 p.
 article
115 Reactive ion etching of submicron MoSi2/poly-Si gates for CMOS/SOS devices 1983
 23 2 p. 406-
1 p.
 article
116 Recombination mechanism in heavily doped silicon 1983
 23 2 p. 403-
1 p.
 article
117 Reduction of hillock formation in aluminum thin films 1983
 23 2 p. 404-
1 p.
 article
118 Regression models for detecting reliability degradation 1983
 23 2 p. 397-
1 p.
 article
119 Reliability analysis of an intermittently used system Srinivasan, S.K.
 1983
 23 2 p. 295-308
14 p.
 article
120 Reliability analysis of time-dependent cascade system with random cycle times Gopalan, M.N.
 1983
 23 2 p. 355-366
12 p.
 article
121 Reliability growth, screened vs nonscreened computers 1983
 23 2 p. 396-
1 p.
 article
122 Reliability implications of destructive gold wire bond pull and ball bond shear testing 1983
 23 2 p. 395-
1 p.
 article
123 Reliability management of nuclear power plant 1983
 23 2 p. 397-
1 p.
 article
124 Reliability of integrated circuits—the Eurocon perspective 1983
 23 2 p. 395-
1 p.
 article
125 Reliability of nuclear-power-station protective systems 1983
 23 2 p. 395-396
2 p.
 article
126 Reliability prediction of microcircuits Palo, Sauli
 1983
 23 2 p. 283-294
12 p.
 article
127 Reliability simulation of hierarchic structures—comparison of the results of two different state models 1983
 23 2 p. 396-
1 p.
 article
128 Repair-discard concepts in design 1983
 23 2 p. 397-
1 p.
 article
129 RESIN, a desktop-computer program for finding cut-sets 1983
 23 2 p. 396-
1 p.
 article
130 Resolution and linewidth tolerances in electron beam and optical projection lithography 1983
 23 2 p. 406-
1 p.
 article
131 RFI prevention in RF plasma systems 1983
 23 2 p. 398-
1 p.
 article
132 R & M design—problem definition 1983
 23 2 p. 396-
1 p.
 article
133 R/M/LCC effects of commercial off-the-shelf equipment 1983
 23 2 p. 397-
1 p.
 article
134 SEM-analysis of the electrically active subsurface p-n junctions in MOS configuration 1983
 23 2 p. 403-
1 p.
 article
135 Semiconductor processing 1983
 23 2 p. 399-
1 p.
 article
136 Silicon as a mechanical material 1983
 23 2 p. 403-
1 p.
 article
137 Silicon compilers and foundries will usher in user-designed VLSI 1983
 23 2 p. 400-
1 p.
 article
138 Silicon foundries provide customer-owned tooling/wafer processing services 1983
 23 2 p. 400-
1 p.
 article
139 Single wafer plasma etching. 1. Al and Al/Si alloys 1983
 23 2 p. 398-
1 p.
 article
140 Software automates design process of IC packages 1983
 23 2 p. 400-
1 p.
 article
141 Software reliability estimation: A realization of competing risk Kuo, Way
 1983
 23 2 p. 249-260
12 p.
 article
142 Some physico-chemical aspects of semi-insulating gallium arsenide 1983
 23 2 p. 403-
1 p.
 article
143 Stochastic behaviour of a standby redundant system with three modes Gupta, S.M.
 1983
 23 2 p. 329-331
3 p.
 article
144 Stochastic behaviour of a two-unit cold standby system with three modes and allowed down time Gupta, S.M.
 1983
 23 2 p. 333-336
4 p.
 article
145 Strange temperature characteristics of RuO2-based thick film resistors 1983
 23 2 p. 405-
1 p.
 article
146 Surface Science Analysis Techniques 1983
 23 2 p. 401-
1 p.
 article
147 Surface topography of laser annealed silicon 1983
 23 2 p. 404-
1 p.
 article
148 System-reliability evaluation techniques for complex/large systems—a review 1983
 23 2 p. 396-
1 p.
 article
149 The effect of sequential heat treatment on resistance and temperature coefficient of resistance (TCR) of NiCr thin films 1983
 23 2 p. 405-
1 p.
 article
150 The influence of electrical pulses on thick film (Du Pont 1421 Birox) resistors 1983
 23 2 p. 405-
1 p.
 article
151 The neutral divacancy in silicon 1983
 23 2 p. 403-404
2 p.
 article
152 Thermal-conduction module cradles and cools up to 133 LSI chips 1983
 23 2 p. 399-
1 p.
 article
153 Thermal-wave microscopy 1983
 23 2 p. 399-
1 p.
 article
154 The silicon process balancing act for VLSI 1983
 23 2 p. 399-
1 p.
 article
155 The use of molybdenum in semiconductor devices 1983
 23 2 p. 399-
1 p.
 article
156 Thick-film materials for hybrids 1983
 23 2 p. 405-
1 p.
 article
157 Tolerance effects in submicroampere current generator design 1983
 23 2 p. 398-
1 p.
 article
158 UV exposure, systems and control 1983
 23 2 p. 399-
1 p.
 article
159 VHSIC's industry impact 1983
 23 2 p. 398-
1 p.
 article
160 Vibration-thermal screening reliability prediction 1983
 23 2 p. 398-
1 p.
 article
161 Wafer flatness utilizing the pin-recess chuck 1983
 23 2 p. 401-
1 p.
 article
162 Wafer steppers: considering the issues 1983
 23 2 p. 399-
1 p.
 article
163 Winchester electronic functions fit on four high-speed chips 1983
 23 2 p. 402-
1 p.
 article
                             163 results found
 
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