| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Advances in low cost silver-containing thick film conductors
|
|
|
1982
|
22 |
6 |
p. 1194-
1 p.
|
artikel
|
| 2 |
A general software reliability model for performance prediction
|
|
|
1982
|
22 |
6 |
p. 1186-
1 p.
|
artikel
|
| 3 |
A heuristic algorithm for system failure frequency
|
|
|
1982
|
22 |
6 |
p. 1188-
1 p.
|
artikel
|
| 4 |
A K-out-of-N:G three-state unit redundant system with common-cause failures and replacements
|
|
|
1982
|
22 |
6 |
p. 1187-
1 p.
|
artikel
|
| 5 |
Aluminum plasma etch considerations for VLSI production
|
|
|
1982
|
22 |
6 |
p. 1191-
1 p.
|
artikel
|
| 6 |
A moisture protection screening test for hybrid circuit encapsulants
|
|
|
1982
|
22 |
6 |
p. 1196-
1 p.
|
artikel
|
| 7 |
Analysis of a hot-standby system with 2 identical, dependent units and a general Erlang failure time distribution
|
|
|
1982
|
22 |
6 |
p. 1185-
1 p.
|
artikel
|
| 8 |
Analysis of a two-unit parallel redundant system with phase type failure and general repair
|
|
|
1982
|
22 |
6 |
p. 1187-
1 p.
|
artikel
|
| 9 |
Analysis of thermal cycle fatigue damage in microsocket solder joints
|
|
|
1982
|
22 |
6 |
p. 1189-
1 p.
|
artikel
|
| 10 |
An error detection model for application during software development
|
|
|
1982
|
22 |
6 |
p. 1188-
1 p.
|
artikel
|
| 11 |
A new algorithm for the reliability analysis of multi-terminal networks
|
|
|
1982
|
22 |
6 |
p. 1187-1188
2 p.
|
artikel
|
| 12 |
A new technique for the evaluation of the temperatures arising from some geometries which commonly occur in microelectronics
|
|
|
1982
|
22 |
6 |
p. 1192-
1 p.
|
artikel
|
| 13 |
An improved architecture for advanced universal microprocessor development systems
|
|
|
1982
|
22 |
6 |
p. 1192-
1 p.
|
artikel
|
| 14 |
An interactive design system for hybrid ICs
|
|
|
1982
|
22 |
6 |
p. 1196-
1 p.
|
artikel
|
| 15 |
Annealing behaviour of aluminium implanted germanium
|
|
|
1982
|
22 |
6 |
p. 1198-
1 p.
|
artikel
|
| 16 |
Application-oriented description of the quality of electronic components (ppm concept)
|
|
|
1982
|
22 |
6 |
p. 1184-
1 p.
|
artikel
|
| 17 |
Applications of infrared spectroscopy to the annealing of silicon
|
|
|
1982
|
22 |
6 |
p. 1193-
1 p.
|
artikel
|
| 18 |
A simplified base failure rate model-estimation of parameters
|
Babar, A.K.
|
|
1982
|
22 |
6 |
p. 1177-1179
3 p.
|
artikel
|
| 19 |
A thick film hybrid IC amplifier for industrial use
|
|
|
1982
|
22 |
6 |
p. 1196-
1 p.
|
artikel
|
| 20 |
A two non-identical three-state units redundant system with common-cause failures and one standby unit
|
|
|
1982
|
22 |
6 |
p. 1187-
1 p.
|
artikel
|
| 21 |
A useful property of “Graphical” estimators of location and scale parameters
|
|
|
1982
|
22 |
6 |
p. 1188-
1 p.
|
artikel
|
| 22 |
Automated parametric testers to monitor the integrated circuit process
|
|
|
1982
|
22 |
6 |
p. 1191-
1 p.
|
artikel
|
| 23 |
Availability, MTBF and MTTR for repairable m out of n system
|
|
|
1982
|
22 |
6 |
p. 1188-
1 p.
|
artikel
|
| 24 |
Bayes estimation of reliability for the inverse Gaussian model
|
|
|
1982
|
22 |
6 |
p. 1185-
1 p.
|
artikel
|
| 25 |
Bipolar Schottky logic device failure modes due to contact metallurgical degradation
|
Canali, C.
|
|
1982
|
22 |
6 |
p. 1155-1175
21 p.
|
artikel
|
| 26 |
Bipolar VLSI builds 16-bit controller handling many fast peripherals at once
|
|
|
1982
|
22 |
6 |
p. 1190-
1 p.
|
artikel
|
| 27 |
Bondability problems associated with the TiPtAu metallization of hybrid microwave thin film circuits
|
|
|
1982
|
22 |
6 |
p. 1197-
1 p.
|
artikel
|
| 28 |
Breakdown voltage of discrete capacitors under single-pulse conditions
|
|
|
1982
|
22 |
6 |
p. 1184-
1 p.
|
artikel
|
| 29 |
Building quality analog circuits with C-MOS logic arrays
|
|
|
1982
|
22 |
6 |
p. 1191-
1 p.
|
artikel
|
| 30 |
CAD toolbox holds all gear for the design of custom logic arrays
|
|
|
1982
|
22 |
6 |
p. 1191-
1 p.
|
artikel
|
| 31 |
CAD tool for GaAs digital integrated circuits
|
|
|
1982
|
22 |
6 |
p. 1192-
1 p.
|
artikel
|
| 32 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1982
|
22 |
6 |
p. 1057-1059
3 p.
|
artikel
|
| 33 |
Can ATE be trusted by QC?
|
|
|
1982
|
22 |
6 |
p. 1183-
1 p.
|
artikel
|
| 34 |
Cermet resistors on ceramic substrates
|
|
|
1982
|
22 |
6 |
p. 1197-
1 p.
|
artikel
|
| 35 |
Chemiluminescence during photoresist stripping processes
|
|
|
1982
|
22 |
6 |
p. 1189-
1 p.
|
artikel
|
| 36 |
Chip carriers—their application and future direction
|
|
|
1982
|
22 |
6 |
p. 1190-
1 p.
|
artikel
|
| 37 |
C-MOS support logic helps build unified, high-speed systems
|
|
|
1982
|
22 |
6 |
p. 1192-
1 p.
|
artikel
|
| 38 |
Combination of thick-film dielectric/thin film conductor for fine pattern formation of multi-layer substrate
|
|
|
1982
|
22 |
6 |
p. 1195-
1 p.
|
artikel
|
| 39 |
Comparison of parametric models for estimating maintenance times from small samples
|
|
|
1982
|
22 |
6 |
p. 1189-
1 p.
|
artikel
|
| 40 |
Complex two-unit system with preventive maintenance
|
|
|
1982
|
22 |
6 |
p. 1186-
1 p.
|
artikel
|
| 41 |
Comprehensive test strategies help cut costs of manufacturing
|
|
|
1982
|
22 |
6 |
p. 1189-
1 p.
|
artikel
|
| 42 |
Computing failure frequency, MTBF & MTTR via mixed products of availabilities and unavailabilities
|
|
|
1982
|
22 |
6 |
p. 1184-
1 p.
|
artikel
|
| 43 |
Considerations in formulation and manufacturing of thick film inks
|
|
|
1982
|
22 |
6 |
p. 1195-
1 p.
|
artikel
|
| 44 |
CP/M—A route to cheap software
|
|
|
1982
|
22 |
6 |
p. 1192-
1 p.
|
artikel
|
| 45 |
Design and evaluation methodology for built-in-test
|
|
|
1982
|
22 |
6 |
p. 1186-1187
2 p.
|
artikel
|
| 46 |
Development and evaluation of a pre-encapsulation cleaning process to improve reliability of HIC's with aluminum metallized chips
|
|
|
1982
|
22 |
6 |
p. 1198-
1 p.
|
artikel
|
| 47 |
Diagnostic specification—a proposed approach
|
|
|
1982
|
22 |
6 |
p. 1186-
1 p.
|
artikel
|
| 48 |
Direct optimisation for calculating maximum likelihood estimates of parameters of the Weibull distribution
|
|
|
1982
|
22 |
6 |
p. 1187-
1 p.
|
artikel
|
| 49 |
Dopant profiles on thin layer silicon structures with the spreading resistance technique
|
|
|
1982
|
22 |
6 |
p. 1192-
1 p.
|
artikel
|
| 50 |
Dormant storage reliability assessments—data based
|
|
|
1982
|
22 |
6 |
p. 1184-1185
2 p.
|
artikel
|
| 51 |
Duplicateur de masques a rayons X pour lithographie submicronique
|
|
|
1982
|
22 |
6 |
p. 1192-
1 p.
|
artikel
|
| 52 |
Economics of functional testing at selected levels
|
|
|
1982
|
22 |
6 |
p. 1185-
1 p.
|
artikel
|
| 53 |
Electrical activation and impurity redistribution during pulsed laser annealing of BF+ 2 implanted amorphized silicon
|
|
|
1982
|
22 |
6 |
p. 1198-
1 p.
|
artikel
|
| 54 |
Electroless nickel resistors formed on IMST substrate
|
|
|
1982
|
22 |
6 |
p. 1196-
1 p.
|
artikel
|
| 55 |
Evaluation of critical surface cleanliness by secondary ion mass spectroscopy
|
|
|
1982
|
22 |
6 |
p. 1190-
1 p.
|
artikel
|
| 56 |
Failure-frequency evaluation of complex systems using cut-set approach
|
|
|
1982
|
22 |
6 |
p. 1187-
1 p.
|
artikel
|
| 57 |
Failure mechanisms that cause high electrical leakage in multilayer ceramic capacitors
|
|
|
1982
|
22 |
6 |
p. 1183-
1 p.
|
artikel
|
| 58 |
Fault diagnosis by mathematical programming
|
|
|
1982
|
22 |
6 |
p. 1187-
1 p.
|
artikel
|
| 59 |
Fault-tolerance in a multiprocessor, digital switching system
|
|
|
1982
|
22 |
6 |
p. 1185-
1 p.
|
artikel
|
| 60 |
Fundamental LTPD aspects
|
Singmin, A.
|
|
1982
|
22 |
6 |
p. 1099-1102
4 p.
|
artikel
|
| 61 |
Fundamentals of silicon epitaxy
|
|
|
1982
|
22 |
6 |
p. 1193-
1 p.
|
artikel
|
| 62 |
GaAs chip sets speed record at room temperature
|
|
|
1982
|
22 |
6 |
p. 1191-
1 p.
|
artikel
|
| 63 |
Gallium arsenide digital integrated circuits for applications above one gigahertz
|
|
|
1982
|
22 |
6 |
p. 1192-
1 p.
|
artikel
|
| 64 |
Gallium arsenide integrated circuits technologies
|
|
|
1982
|
22 |
6 |
p. 1189-
1 p.
|
artikel
|
| 65 |
Gold conductor pastes for high density circuit
|
|
|
1982
|
22 |
6 |
p. 1196-
1 p.
|
artikel
|
| 66 |
Hardware vs software maintainability: A comparative study
|
Srivastava, Sanjaya
|
|
1982
|
22 |
6 |
p. 1077-1079
3 p.
|
artikel
|
| 67 |
High density packaging technology
|
|
|
1982
|
22 |
6 |
p. 1195-
1 p.
|
artikel
|
| 68 |
Highly accelerated temperature and humidity stress test technique (HAST)
|
|
|
1982
|
22 |
6 |
p. 1186-
1 p.
|
artikel
|
| 69 |
How computers fail
|
|
|
1982
|
22 |
6 |
p. 1185-
1 p.
|
artikel
|
| 70 |
Hybrid voltage regulator for automobiles
|
|
|
1982
|
22 |
6 |
p. 1197-
1 p.
|
artikel
|
| 71 |
IC packaging technology for electronic watches
|
|
|
1982
|
22 |
6 |
p. 1193-
1 p.
|
artikel
|
| 72 |
Improved cost effectiveness and product reliability through solder alloy development
|
|
|
1982
|
22 |
6 |
p. 1191-
1 p.
|
artikel
|
| 73 |
Influence of emitter edge dislocations on reliability of planar NPN transistors
|
Stojadinovic, N.D.
|
|
1982
|
22 |
6 |
p. 1113-1120
8 p.
|
artikel
|
| 74 |
Interlevel insulation reliability evaluation
|
|
|
1982
|
22 |
6 |
p. 1184-
1 p.
|
artikel
|
| 75 |
Ion-assisted plasma etching of silicon-oxides in a multifacet system
|
|
|
1982
|
22 |
6 |
p. 1198-
1 p.
|
artikel
|
| 76 |
Ion implantation in wafer fabrication
|
|
|
1982
|
22 |
6 |
p. 1198-
1 p.
|
artikel
|
| 77 |
Large area hybrid module
|
|
|
1982
|
22 |
6 |
p. 1198-
1 p.
|
artikel
|
| 78 |
Laser annealing
|
|
|
1982
|
22 |
6 |
p. 1199-
1 p.
|
artikel
|
| 79 |
Laser-patterned Ta2N resistors for thin film circuits
|
|
|
1982
|
22 |
6 |
p. 1197-
1 p.
|
artikel
|
| 80 |
Leadless carriers, components increase board density by 6:1
|
|
|
1982
|
22 |
6 |
p. 1190-
1 p.
|
artikel
|
| 81 |
Lessons from NASA
|
|
|
1982
|
22 |
6 |
p. 1185-
1 p.
|
artikel
|
| 82 |
Lessons from the military
|
|
|
1982
|
22 |
6 |
p. 1185-
1 p.
|
artikel
|
| 83 |
Lift-off techniques for fine line metal patterning
|
|
|
1982
|
22 |
6 |
p. 1192-
1 p.
|
artikel
|
| 84 |
Limitations of minimal cut-set approach in evaluating reliability of systems with repairable components
|
|
|
1982
|
22 |
6 |
p. 1188-
1 p.
|
artikel
|
| 85 |
Liquid nitrogen and wafer fabrication problems
|
|
|
1982
|
22 |
6 |
p. 1192-
1 p.
|
artikel
|
| 86 |
Logistic simulation—a credible tool for decision makers?
|
|
|
1982
|
22 |
6 |
p. 1185-
1 p.
|
artikel
|
| 87 |
Low cost chip carriers for the 1980's
|
|
|
1982
|
22 |
6 |
p. 1191-
1 p.
|
artikel
|
| 88 |
Low energy Ar ion bombardment damage of Si, GaAs, and InP surfaces
|
|
|
1982
|
22 |
6 |
p. 1199-
1 p.
|
artikel
|
| 89 |
Low energy LSI and packaging for system performance
|
|
|
1982
|
22 |
6 |
p. 1190-
1 p.
|
artikel
|
| 90 |
LSI packaging that passes PIND test
|
|
|
1982
|
22 |
6 |
p. 1191-1192
2 p.
|
artikel
|
| 91 |
Minicomputer interactive system for hybrid automation
|
|
|
1982
|
22 |
6 |
p. 1194-
1 p.
|
artikel
|
| 92 |
Minimal pathset and minimal cutsets using search technique
|
Bansal, V.K.
|
|
1982
|
22 |
6 |
p. 1067-1075
9 p.
|
artikel
|
| 93 |
Models for hardware-software system operational-performance evaluation
|
|
|
1982
|
22 |
6 |
p. 1186-
1 p.
|
artikel
|
| 94 |
Multiware boards complete with microstrip and strip-line packaging
|
|
|
1982
|
22 |
6 |
p. 1190-
1 p.
|
artikel
|
| 95 |
New Du Pont composition applied in thick-film temperature and humidity sensors
|
|
|
1982
|
22 |
6 |
p. 1197-
1 p.
|
artikel
|
| 96 |
Nichrome thin film technology and its application
|
|
|
1982
|
22 |
6 |
p. 1194-
1 p.
|
artikel
|
| 97 |
[No title]
|
G.W.A.D.,
|
|
1982
|
22 |
6 |
p. 1181-
1 p.
|
artikel
|
| 98 |
Number of vias: a control parameter for global wiring of high-density chips
|
|
|
1982
|
22 |
6 |
p. 1190-
1 p.
|
artikel
|
| 99 |
On an analytical solution for two-dimensional diffusion of silicon self-interstitials during oxidation of silicon
|
|
|
1982
|
22 |
6 |
p. 1193-
1 p.
|
artikel
|
| 100 |
On built-in test techniques in reliable computer systems
|
|
|
1982
|
22 |
6 |
p. 1185-
1 p.
|
artikel
|
| 101 |
On-chip stereo filter cuts noise without preprocessing signals
|
|
|
1982
|
22 |
6 |
p. 1190-
1 p.
|
artikel
|
| 102 |
On profit evaluation in a two-unit maintained redundant system
|
|
|
1982
|
22 |
6 |
p. 1187-
1 p.
|
artikel
|
| 103 |
On selective electroplating of gold in fabrication of MIC's
|
|
|
1982
|
22 |
6 |
p. 1191-
1 p.
|
artikel
|
| 104 |
Optical requirements for projection lithography
|
|
|
1982
|
22 |
6 |
p. 1190-
1 p.
|
artikel
|
| 105 |
Optimum ordering policies with random lead times
|
|
|
1982
|
22 |
6 |
p. 1186-
1 p.
|
artikel
|
| 106 |
Packaging VLSI
|
|
|
1982
|
22 |
6 |
p. 1189-
1 p.
|
artikel
|
| 107 |
Pattern shift and pattern distortion during CVD epitaxy on (111) and (100) silicon
|
|
|
1982
|
22 |
6 |
p. 1193-
1 p.
|
artikel
|
| 108 |
Performance index to quantify reliability using fuzzy subset theory
|
|
|
1982
|
22 |
6 |
p. 1186-
1 p.
|
artikel
|
| 109 |
Permutational expansion of a 4-element sub-set
|
Singmin, A.
|
|
1982
|
22 |
6 |
p. 1103-1111
9 p.
|
artikel
|
| 110 |
Probabilistic analysis of a pulverizer system with common-cause failures
|
Dhillon, B.S.
|
|
1982
|
22 |
6 |
p. 1121-1133
13 p.
|
artikel
|
| 111 |
Process and accelerated aging test of GANG bonding for gold-plated TAB outer leads
|
|
|
1982
|
22 |
6 |
p. 1189-1190
2 p.
|
artikel
|
| 112 |
Process conditions affecting hot electron trapping in DC magnetron sputtered MOS devices
|
|
|
1982
|
22 |
6 |
p. 1193-
1 p.
|
artikel
|
| 113 |
Processing considerations of thick film devices with multilayered resistors
|
|
|
1982
|
22 |
6 |
p. 1195-
1 p.
|
artikel
|
| 114 |
Quality control
|
|
|
1982
|
22 |
6 |
p. 1185-
1 p.
|
artikel
|
| 115 |
Raman scattering from ion-implanted carriers in n-GaAs
|
|
|
1982
|
22 |
6 |
p. 1198-
1 p.
|
artikel
|
| 116 |
Recent trends in ion implantation
|
|
|
1982
|
22 |
6 |
p. 1198-
1 p.
|
artikel
|
| 117 |
Redundancy reliability
|
|
|
1982
|
22 |
6 |
p. 1186-
1 p.
|
artikel
|
| 118 |
Reference materials and the semiconductor industry
|
|
|
1982
|
22 |
6 |
p. 1189-
1 p.
|
artikel
|
| 119 |
Reliability analysis of a 2-out-of-n:F system with repairable primary and degradation units
|
Yonehara, Yasuhiro
|
|
1982
|
22 |
6 |
p. 1081-1097
17 p.
|
artikel
|
| 120 |
Reliability and application of leaded plastic chip carriers
|
|
|
1982
|
22 |
6 |
p. 1184-
1 p.
|
artikel
|
| 121 |
Reliability and maintainability of a multicomponent series-parallel system under several repair disciplines
|
Kodama, Masanori
|
|
1982
|
22 |
6 |
p. 1135-1153
19 p.
|
artikel
|
| 122 |
Reliability considerations of flip chip components for automotive electronic applications
|
|
|
1982
|
22 |
6 |
p. 1183-1184
2 p.
|
artikel
|
| 123 |
Reliability evaluation of aluminium-metallized MOS dynamic RAM's in plastic packages in high humidity and temperature environments
|
|
|
1982
|
22 |
6 |
p. 1184-
1 p.
|
artikel
|
| 124 |
Reliability evaluation of thick film resistors through measurement of third harmonic index
|
|
|
1982
|
22 |
6 |
p. 1197-1198
2 p.
|
artikel
|
| 125 |
Reliability of electronic components Part 4: Reliability of semiconductor diodes and rectifiers
|
|
|
1982
|
22 |
6 |
p. 1184-
1 p.
|
artikel
|
| 126 |
Reliability of TAB products
|
|
|
1982
|
22 |
6 |
p. 1190-
1 p.
|
artikel
|
| 127 |
Reliability techniques in the service of industry
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1982
|
22 |
6 |
p. 1187-
1 p.
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artikel
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| 128 |
Reliable systems: design and tests
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1982
|
22 |
6 |
p. 1185-
1 p.
|
artikel
|
| 129 |
Role of test chips in coordinating logic and circuit design and layout aids for VLSI
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1982
|
22 |
6 |
p. 1191-
1 p.
|
artikel
|
| 130 |
Rules for calculating the time-specific frequency of system failure
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1982
|
22 |
6 |
p. 1188-
1 p.
|
artikel
|
| 131 |
Scaling merged single-device-well MOSFETs for very large scale integration
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1982
|
22 |
6 |
p. 1190-
1 p.
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artikel
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| 132 |
Sequential life-testing with spacings, exponential model
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1982
|
22 |
6 |
p. 1187-
1 p.
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artikel
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| 133 |
Serially testing a board's states takes the trickiness out of debugging it
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1982
|
22 |
6 |
p. 1193-
1 p.
|
artikel
|
| 134 |
Silicon epitaxy for high performance integrated circuits
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1982
|
22 |
6 |
p. 1192-
1 p.
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artikel
|
| 135 |
Silicon foundries gaining adherents
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1982
|
22 |
6 |
p. 1191-
1 p.
|
artikel
|
| 136 |
Software aids to microcomputer system reliability
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1982
|
22 |
6 |
p. 1187-
1 p.
|
artikel
|
| 137 |
Solder attachment of leaded components to thick film hybrids
|
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1982
|
22 |
6 |
p. 1196-
1 p.
|
artikel
|
| 138 |
Solder post attachment of ceramic chip carriers to ceramic film integrated circuits
|
|
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1982
|
22 |
6 |
p. 1183-
1 p.
|
artikel
|
| 139 |
Stochastic behaviour of a 1-server n-unit system subject to general repair distribution
|
|
|
1982
|
22 |
6 |
p. 1185-
1 p.
|
artikel
|
| 140 |
Stochastic reliability-growth: a model for fault-removal in computer-programs and hardware-designs
|
|
|
1982
|
22 |
6 |
p. 1188-
1 p.
|
artikel
|
| 141 |
Studies on the percentage variation of resistance of polymer thick film (PTF) resistors
|
|
|
1982
|
22 |
6 |
p. 1194-
1 p.
|
artikel
|
| 142 |
Surface treatments and bondability of copper thick film circuits
|
|
|
1982
|
22 |
6 |
p. 1196-1197
2 p.
|
artikel
|
| 143 |
Teachable work station brings order to VLSI chip design
|
|
|
1982
|
22 |
6 |
p. 1193-
1 p.
|
artikel
|
| 144 |
Technology of electronic grade solder pastes
|
|
|
1982
|
22 |
6 |
p. 1191-
1 p.
|
artikel
|
| 145 |
Temperature accelerated estimation of MNOS memory reliability
|
|
|
1982
|
22 |
6 |
p. 1186-
1 p.
|
artikel
|
| 146 |
Tester takes on VLSI with 264-K vectors behind its pins
|
|
|
1982
|
22 |
6 |
p. 1191-
1 p.
|
artikel
|
| 147 |
Test strategy enhances, speeds the development of a micro-processor
|
|
|
1982
|
22 |
6 |
p. 1187-
1 p.
|
artikel
|
| 148 |
The effect of high speed laser trimming on accuracy and stability of thick film resistors
|
|
|
1982
|
22 |
6 |
p. 1198-
1 p.
|
artikel
|
| 149 |
The influence of air-abrasive trimming on the current noise of thick film resistors
|
|
|
1982
|
22 |
6 |
p. 1194-
1 p.
|
artikel
|
| 150 |
The influence of boron induced and oxidation induced defects on bipolar transistor slice yield
|
|
|
1982
|
22 |
6 |
p. 1193-
1 p.
|
artikel
|
| 151 |
The influence of the area of a thin film capacitor on the breakdown voltage
|
|
|
1982
|
22 |
6 |
p. 1195-
1 p.
|
artikel
|
| 152 |
The software integrity of a computer system installed in a royal naval frigate
|
Hart, G.
|
|
1982
|
22 |
6 |
p. 1061-1066
6 p.
|
artikel
|
| 153 |
The STIC technology—a monolithic approach for combining tantalum and silicon technologies
|
|
|
1982
|
22 |
6 |
p. 1194-
1 p.
|
artikel
|
| 154 |
Thick film capacitor materials of the powder-glass binary systems and their dielectric properties
|
|
|
1982
|
22 |
6 |
p. 1193-
1 p.
|
artikel
|
| 155 |
Thick film circuits: present state and future development
|
|
|
1982
|
22 |
6 |
p. 1194-
1 p.
|
artikel
|
| 156 |
Thick-film laser trimming principles, techniques and recommendations
|
|
|
1982
|
22 |
6 |
p. 1199-
1 p.
|
artikel
|
| 157 |
Thick film temperature compensating circuit for semi-conductor strain gauges
|
|
|
1982
|
22 |
6 |
p. 1195-
1 p.
|
artikel
|
| 158 |
Unified availability modeling: a redundant system with mechanical, electrical, software, human and common-cause failure
|
|
|
1982
|
22 |
6 |
p. 1186-
1 p.
|
artikel
|
| 159 |
Use of a fault tree with delayed inputs
|
|
|
1982
|
22 |
6 |
p. 1184-
1 p.
|
artikel
|
| 160 |
Use of Q-GERT network simulation in reliability analysis
|
|
|
1982
|
22 |
6 |
p. 1188-1189
2 p.
|
artikel
|
| 161 |
VHSIC—a new generation of integrated circuits?
|
|
|
1982
|
22 |
6 |
p. 1189-
1 p.
|
artikel
|
| 162 |
Wafer annealing systems
|
|
|
1982
|
22 |
6 |
p. 1192-
1 p.
|
artikel
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