| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Accelerated ageing of IMPATT diodes
|
Sinnadurai, F.N
|
|
1981
|
21 |
2 |
p. 209-219
11 p.
|
artikel
|
| 2 |
A complex two-unit parallel system
|
Subramanian, R
|
|
1981
|
21 |
2 |
p. 273-275
3 p.
|
artikel
|
| 3 |
A computer algorithm for the analysis of maintained standby redundant systems
|
Kumar, Ashok
|
|
1981
|
21 |
2 |
p. 175-182
8 p.
|
artikel
|
| 4 |
Adhesion of thin film circuits
|
|
|
1981
|
21 |
2 |
p. 287-
1 p.
|
artikel
|
| 5 |
Adsorption effects on ESR and conductance of rf sputtered a-Si films
|
|
|
1981
|
21 |
2 |
p. 288-
1 p.
|
artikel
|
| 6 |
An algebraic technique for reliability evaluation
|
|
|
1981
|
21 |
2 |
p. 278-
1 p.
|
artikel
|
| 7 |
An alternative fault-tree algebra
|
|
|
1981
|
21 |
2 |
p. 280-
1 p.
|
artikel
|
| 8 |
Analysis of a repairable redundant system with delayed replacement
|
Agarwal, Manju
|
|
1981
|
21 |
2 |
p. 165-171
7 p.
|
artikel
|
| 9 |
An approach to high speed laser trimming of thick film resistors
|
|
|
1981
|
21 |
2 |
p. 290-
1 p.
|
artikel
|
| 10 |
A new approach to the topological design of hybrid circuits
|
|
|
1981
|
21 |
2 |
p. 289-
1 p.
|
artikel
|
| 11 |
A new bad data detection and identification algorithm
|
|
|
1981
|
21 |
2 |
p. 279-
1 p.
|
artikel
|
| 12 |
A new band-reject filter configuration of three-layer thin-film exponential R-C-KR micro-system
|
Ahmed, Kamal U
|
|
1981
|
21 |
2 |
p. 241-242
2 p.
|
artikel
|
| 13 |
A new process for printing fine conductor lines and spaces on large area substrates
|
|
|
1981
|
21 |
2 |
p. 282-
1 p.
|
artikel
|
| 14 |
A new production technique: ion milling
|
|
|
1981
|
21 |
2 |
p. 289-
1 p.
|
artikel
|
| 15 |
An installed tape automated bonding unit
|
|
|
1981
|
21 |
2 |
p. 282-
1 p.
|
artikel
|
| 16 |
An integrated FM receiver
|
Kasperkovitz, D
|
|
1981
|
21 |
2 |
p. 183-189
7 p.
|
artikel
|
| 17 |
An introduction to the Navy Manufacturing Technology Program for Computerized Thick-Film Printing
|
|
|
1981
|
21 |
2 |
p. 288-
1 p.
|
artikel
|
| 18 |
Annealing of SiSiO2 interface states using Ar-ion-implant-damage-gettering
|
|
|
1981
|
21 |
2 |
p. 290-
1 p.
|
artikel
|
| 19 |
Application of conductive adhesives in microcircuits for “long-life” equipment
|
|
|
1981
|
21 |
2 |
p. 280-
1 p.
|
artikel
|
| 20 |
Application of microelectronics in optical precision instrument manufacture
|
|
|
1981
|
21 |
2 |
p. 283-
1 p.
|
artikel
|
| 21 |
A programmable pseudo-random noise generator
|
|
|
1981
|
21 |
2 |
p. 283-
1 p.
|
artikel
|
| 22 |
A rating criterion for film resistors
|
|
|
1981
|
21 |
2 |
p. 286-
1 p.
|
artikel
|
| 23 |
A reparable multistate device with arbitrarily distributed repair times
|
Chung, Who Kee
|
|
1981
|
21 |
2 |
p. 255-256
2 p.
|
artikel
|
| 24 |
A review of standby redundant systems
|
|
|
1981
|
21 |
2 |
p. 279-280
2 p.
|
artikel
|
| 25 |
A solution of the core-exciton issue for silicon and germanium
|
|
|
1981
|
21 |
2 |
p. 285-
1 p.
|
artikel
|
| 26 |
A thick-film hybrid laser target board
|
|
|
1981
|
21 |
2 |
p. 286-
1 p.
|
artikel
|
| 27 |
Automatic control of large-scale integrated circuit fabrication processes—process control algorithms
|
|
|
1981
|
21 |
2 |
p. 282-283
2 p.
|
artikel
|
| 28 |
Availability analysis of a fault-tolerant computer system
|
|
|
1981
|
21 |
2 |
p. 279-
1 p.
|
artikel
|
| 29 |
4096 bit and larger bipolar static random access memories
|
|
|
1981
|
21 |
2 |
p. 283-
1 p.
|
artikel
|
| 30 |
Bonding-failure analysis with electron beam and nuclear scattering techniques
|
|
|
1981
|
21 |
2 |
p. 290-
1 p.
|
artikel
|
| 31 |
Bonding wire microelectronic interconnections
|
|
|
1981
|
21 |
2 |
p. 281-
1 p.
|
artikel
|
| 32 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1981
|
21 |
2 |
p. 145-146
2 p.
|
artikel
|
| 33 |
Chip controls floppy-disk drives
|
|
|
1981
|
21 |
2 |
p. 284-
1 p.
|
artikel
|
| 34 |
Chip detects errors in 25 ns
|
|
|
1981
|
21 |
2 |
p. 283-
1 p.
|
artikel
|
| 35 |
C-MOS microprocessor wakes itself up
|
|
|
1981
|
21 |
2 |
p. 283-
1 p.
|
artikel
|
| 36 |
C-MOS read-only memory mates with a host of processors
|
|
|
1981
|
21 |
2 |
p. 283-
1 p.
|
artikel
|
| 37 |
Cmos reliability: A useful case history to revise extrapolation effectiveness, length and slope of the learning curve
|
Brambilla, P
|
|
1981
|
21 |
2 |
p. 191-201
11 p.
|
artikel
|
| 38 |
Comparison of enameled steel substrate properties for thick film use
|
|
|
1981
|
21 |
2 |
p. 285-
1 p.
|
artikel
|
| 39 |
Comparison of Monte Carlo techniques for obtaining system-reliability confidence limits
|
|
|
1981
|
21 |
2 |
p. 279-
1 p.
|
artikel
|
| 40 |
Comparison of Thai's theory with experimental boron doping profiles in silicon, diffused from boron nitride sources
|
|
|
1981
|
21 |
2 |
p. 284-
1 p.
|
artikel
|
| 41 |
Component verification system
|
|
|
1981
|
21 |
2 |
p. 278-
1 p.
|
artikel
|
| 42 |
Computer aided design of adjustable thin film resistors
|
|
|
1981
|
21 |
2 |
p. 286-
1 p.
|
artikel
|
| 43 |
Computer controlled imaging system for automatic hybrid inspection
|
|
|
1981
|
21 |
2 |
p. 286-
1 p.
|
artikel
|
| 44 |
Concepts for calculating frequency of system failure
|
|
|
1981
|
21 |
2 |
p. 278-
1 p.
|
artikel
|
| 45 |
Copper thick film materials: a perspective
|
|
|
1981
|
21 |
2 |
p. 286-
1 p.
|
artikel
|
| 46 |
Critical temperatures for the observation of valley-splitting in Si-MOSFETS
|
|
|
1981
|
21 |
2 |
p. 285-
1 p.
|
artikel
|
| 47 |
Current noise of resin type and cermet type thick film resistors
|
|
|
1981
|
21 |
2 |
p. 287-
1 p.
|
artikel
|
| 48 |
D.C. sputtering process: its characterization and its problems when applied to tin-dioxide thin-films
|
|
|
1981
|
21 |
2 |
p. 289-
1 p.
|
artikel
|
| 49 |
Design and development of a 68-lead nonhermetic leaded chip carrier
|
|
|
1981
|
21 |
2 |
p. 287-
1 p.
|
artikel
|
| 50 |
Design and production of hybrid circuit artwork
|
|
|
1981
|
21 |
2 |
p. 289-
1 p.
|
artikel
|
| 51 |
Design limitations in large bipolar PROMs
|
|
|
1981
|
21 |
2 |
p. 281-
1 p.
|
artikel
|
| 52 |
Different chip interconnecting techniques
|
|
|
1981
|
21 |
2 |
p. 282-
1 p.
|
artikel
|
| 53 |
Diffusion of boron into silicon from doped oxide source
|
|
|
1981
|
21 |
2 |
p. 284-
1 p.
|
artikel
|
| 54 |
Economical failure analysis for microprocessors
|
|
|
1981
|
21 |
2 |
p. 280-
1 p.
|
artikel
|
| 55 |
Effect of the Model Uniform Product Liability Act in Quality Assurance
|
Jacobs, Richard M
|
|
1981
|
21 |
2 |
p. 263-268
6 p.
|
artikel
|
| 56 |
Electrical testing for process evaluations
|
Wada, Yasuo
|
|
1981
|
21 |
2 |
p. 159-163
5 p.
|
artikel
|
| 57 |
Electrical transport in thick film resistors
|
|
|
1981
|
21 |
2 |
p. 288-
1 p.
|
artikel
|
| 58 |
Electric measurement of impurity concentration in p-type epitaxially grown and ion-implanted base regions
|
|
|
1981
|
21 |
2 |
p. 291-
1 p.
|
artikel
|
| 59 |
Electron-beam resists for lift-off processing with potential application to Josephson integrated circuits
|
|
|
1981
|
21 |
2 |
p. 291-
1 p.
|
artikel
|
| 60 |
Errors in life prediction due to temperature inaccuracies
|
Stanley, I.W
|
|
1981
|
21 |
2 |
p. 173-174
2 p.
|
artikel
|
| 61 |
Fabrication of thick film circuits on cofired ceramic substrates
|
|
|
1981
|
21 |
2 |
p. 286-
1 p.
|
artikel
|
| 62 |
Final-state effects in the excitation spectra of deep impurities in semiconductors
|
|
|
1981
|
21 |
2 |
p. 284-
1 p.
|
artikel
|
| 63 |
Foil circuits
|
|
|
1981
|
21 |
2 |
p. 281-
1 p.
|
artikel
|
| 64 |
Functional trimming of thick-film active filters for consumer and industrial applications
|
|
|
1981
|
21 |
2 |
p. 285-
1 p.
|
artikel
|
| 65 |
GaAs FET failure mechanisms due to high humidity and ionic contamination
|
|
|
1981
|
21 |
2 |
p. 277-
1 p.
|
artikel
|
| 66 |
GaAs LSI chips aim at supplanting fastest silicon ICs
|
|
|
1981
|
21 |
2 |
p. 283-
1 p.
|
artikel
|
| 67 |
Gate arrays—a special report
|
|
|
1981
|
21 |
2 |
p. 284-
1 p.
|
artikel
|
| 68 |
Generalized theory of electrical conductivity and current noise for discontinuous metal films over a wide range of temperatures
|
|
|
1981
|
21 |
2 |
p. 288-289
2 p.
|
artikel
|
| 69 |
Hardware approach for generating spanning trees in reliability studies
|
Bansal, V.K
|
|
1981
|
21 |
2 |
p. 243-253
11 p.
|
artikel
|
| 70 |
Hazard modification techniques for repair and multiple operating conditions
|
|
|
1981
|
21 |
2 |
p. 279-
1 p.
|
artikel
|
| 71 |
Heat transfer correlations for use in naturally cooled enclosures with high-power integrated circuits
|
|
|
1981
|
21 |
2 |
p. 282-
1 p.
|
artikel
|
| 72 |
Heat transfer of modified silicon surfaces
|
|
|
1981
|
21 |
2 |
p. 284-
1 p.
|
artikel
|
| 73 |
Human error considerations in determining the optimum test interval for periodically inspected standby systems
|
|
|
1981
|
21 |
2 |
p. 279-
1 p.
|
artikel
|
| 74 |
Hybrid integrated circuit manufacturing process as controlled by shop information systems
|
|
|
1981
|
21 |
2 |
p. 287-288
2 p.
|
artikel
|
| 75 |
Hybrids with TAB—at the threshold of production
|
|
|
1981
|
21 |
2 |
p. 286-
1 p.
|
artikel
|
| 76 |
IC alignment and layout considerations
|
|
|
1981
|
21 |
2 |
p. 282-
1 p.
|
artikel
|
| 77 |
Influence of evaporation-deposition geometry on conductive thin films
|
|
|
1981
|
21 |
2 |
p. 288-
1 p.
|
artikel
|
| 78 |
Integrated bandsplit filter system for a dual-tone-multifrequency receiver
|
|
|
1981
|
21 |
2 |
p. 283-
1 p.
|
artikel
|
| 79 |
Ion implantation of sulfur and silicon in GaAs
|
|
|
1981
|
21 |
2 |
p. 290-
1 p.
|
artikel
|
| 80 |
ISSCC opens era of ultra LSI
|
|
|
1981
|
21 |
2 |
p. 280-
1 p.
|
artikel
|
| 81 |
64-K static RAM surrounds n-MOS cells with C-MOS circuits
|
|
|
1981
|
21 |
2 |
p. 283-
1 p.
|
artikel
|
| 82 |
Laser projection printing
|
|
|
1981
|
21 |
2 |
p. 289-
1 p.
|
artikel
|
| 83 |
Limits to the size of semiconductor devices
|
|
|
1981
|
21 |
2 |
p. 280-
1 p.
|
artikel
|
| 84 |
Local and quasi-local vibrational modes of Si in Ge
|
|
|
1981
|
21 |
2 |
p. 285-
1 p.
|
artikel
|
| 85 |
Low-field time-dependent dielectric integrity
|
|
|
1981
|
21 |
2 |
p. 278-
1 p.
|
artikel
|
| 86 |
Macro generation algorithms for LSI custom chip design
|
|
|
1981
|
21 |
2 |
p. 282-
1 p.
|
artikel
|
| 87 |
Microelectronics takes to the road in a big way: a special report
|
|
|
1981
|
21 |
2 |
p. 280-
1 p.
|
artikel
|
| 88 |
Microprocessor and LSI microcircuit reliability-prediction model
|
|
|
1981
|
21 |
2 |
p. 280-
1 p.
|
artikel
|
| 89 |
Modeling the repairability function by the first passage time distribution of Brownian motion
|
Sherif, Yosef S
|
|
1981
|
21 |
2 |
p. 257-258
2 p.
|
artikel
|
| 90 |
Network reliability evaluation of three-state devices using transformation technique
|
Gadani, J.P
|
|
1981
|
21 |
2 |
p. 231-234
4 p.
|
artikel
|
| 91 |
New applications open up for silicon sensors: a special report
|
|
|
1981
|
21 |
2 |
p. 280-
1 p.
|
artikel
|
| 92 |
Noise in phosphorus-implanted buried channel MOS transistors
|
|
|
1981
|
21 |
2 |
p. 290-
1 p.
|
artikel
|
| 93 |
Noise measurement analysis of NPN transistors after gamma irradiation—An investigation for reliability
|
Khobare, S.K
|
|
1981
|
21 |
2 |
p. 221-224
4 p.
|
artikel
|
| 94 |
Numerical analysis of the resistance of interference-fit pin connections
|
|
|
1981
|
21 |
2 |
p. 282-
1 p.
|
artikel
|
| 95 |
On trends in automatic testing of analog circuits
|
Soi, Inder M
|
|
1981
|
21 |
2 |
p. 151-157
7 p.
|
artikel
|
| 96 |
Operational availability of a multi-component sequential system with imperfect switching and opportunistic repair under preemptive resume repair policy
|
|
|
1981
|
21 |
2 |
p. 279-
1 p.
|
artikel
|
| 97 |
Optical lithography in the 1-μm limit
|
|
|
1981
|
21 |
2 |
p. 283-
1 p.
|
artikel
|
| 98 |
Optimization of thick film resistors for low drift
|
|
|
1981
|
21 |
2 |
p. 289-
1 p.
|
artikel
|
| 99 |
Pattern partitioning for enhanced proximity-effect corrections in electron-beam lithography
|
|
|
1981
|
21 |
2 |
p. 289-
1 p.
|
artikel
|
| 100 |
Planar plasma etching of polycrystalline silicon
|
|
|
1981
|
21 |
2 |
p. 281-
1 p.
|
artikel
|
| 101 |
Plasma sprayed resistors
|
|
|
1981
|
21 |
2 |
p. 285-286
2 p.
|
artikel
|
| 102 |
Precision thick film active RC filters
|
|
|
1981
|
21 |
2 |
p. 289-
1 p.
|
artikel
|
| 103 |
Preparation and properties of thick film resistors containing cadmium glasses and cadmium oxide
|
|
|
1981
|
21 |
2 |
p. 288-
1 p.
|
artikel
|
| 104 |
Procedure for weighting failure rates in Markov reliability models for automation systems
|
|
|
1981
|
21 |
2 |
p. 280-
1 p.
|
artikel
|
| 105 |
Properties of nickel films prepared by r.f. sputtering and interdiffusion analysis of Ta2NNi films
|
|
|
1981
|
21 |
2 |
p. 285-
1 p.
|
artikel
|
| 106 |
Protection system reliability modeling: unreadiness probability and mean duration of undetected faults
|
|
|
1981
|
21 |
2 |
p. 279-
1 p.
|
artikel
|
| 107 |
Proximity correction enhancements for 1-μm dense circuits
|
|
|
1981
|
21 |
2 |
p. 289-290
2 p.
|
artikel
|
| 108 |
Publications, notices, calls for papers, etc.
|
|
|
1981
|
21 |
2 |
p. 147-149
3 p.
|
artikel
|
| 109 |
QA aspects of silicon-on-sapphire and gallium arsenide integrated circuit devices
|
|
|
1981
|
21 |
2 |
p. 277-
1 p.
|
artikel
|
| 110 |
Quality and reliability in hybrid circuits
|
|
|
1981
|
21 |
2 |
p. 289-
1 p.
|
artikel
|
| 111 |
Quality and reliability of avionic equipment
|
|
|
1981
|
21 |
2 |
p. 278-
1 p.
|
artikel
|
| 112 |
Quantum well model of hydrogenated amorphous silicon
|
|
|
1981
|
21 |
2 |
p. 284-
1 p.
|
artikel
|
| 113 |
Quasistatic and nonequilibrium phenomena in m.o.s. structures under the influence of a constant gate-current bias
|
|
|
1981
|
21 |
2 |
p. 283-284
2 p.
|
artikel
|
| 114 |
Reactive ion etching in chlorinated plasmas
|
|
|
1981
|
21 |
2 |
p. 290-
1 p.
|
artikel
|
| 115 |
Reactive sputter etching and its applications
|
|
|
1981
|
21 |
2 |
p. 282-
1 p.
|
artikel
|
| 116 |
Registration mark detection for electron-beam lithography—EL1 system
|
|
|
1981
|
21 |
2 |
p. 290-291
2 p.
|
artikel
|
| 117 |
Reliability evaluation and prediction for discrete semiconductors
|
|
|
1981
|
21 |
2 |
p. 277-278
2 p.
|
artikel
|
| 118 |
Reliability modeling of TMR computer systems with repair and common mode failures
|
Singh, C
|
|
1981
|
21 |
2 |
p. 259-262
4 p.
|
artikel
|
| 119 |
Reliability of all possible series-parallel redundant structures of M.I.I.D. units with two failure modes
|
|
|
1981
|
21 |
2 |
p. 278-
1 p.
|
artikel
|
| 120 |
Reliability of a stand-by system with common-cause failures and scheduled maintenance
|
Govil, A.K
|
|
1981
|
21 |
2 |
p. 269-271
3 p.
|
artikel
|
| 121 |
Resistivity changes of heavily-boron-doped CVD-prepared polycrystalline silicon caused by thermal annealing
|
|
|
1981
|
21 |
2 |
p. 284-
1 p.
|
artikel
|
| 122 |
Resolution of the gold wire grain growth failure mechanism in plastic encapsulated microelectronic devices
|
|
|
1981
|
21 |
2 |
p. 281-
1 p.
|
artikel
|
| 123 |
Roundup: 16-K byte-wide RAMs abound
|
|
|
1981
|
21 |
2 |
p. 283-
1 p.
|
artikel
|
| 124 |
Semiconductor instability failure mechanisms review
|
|
|
1981
|
21 |
2 |
p. 277-
1 p.
|
artikel
|
| 125 |
Sequence test method for reliability evaluation of semiconductor devices
|
Candade, Vittal S
|
|
1981
|
21 |
2 |
p. 225-229
5 p.
|
artikel
|
| 126 |
Silicone resin and elastomer protection of hybrid circuits
|
|
|
1981
|
21 |
2 |
p. 289-
1 p.
|
artikel
|
| 127 |
Software reliability of programs with network structure
|
Suri, P.K
|
|
1981
|
21 |
2 |
p. 203-207
5 p.
|
artikel
|
| 128 |
State of the art in thin film transistor: a review of the used insulator-semiconductor combinations
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1981
|
21 |
2 |
p. 286-
1 p.
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artikel
|
| 129 |
Status of copper thick film hybrids
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1981
|
21 |
2 |
p. 286-287
2 p.
|
artikel
|
| 130 |
Stencil screens for fine-line printing
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1981
|
21 |
2 |
p. 287-
1 p.
|
artikel
|
| 131 |
Strain sensitivity in thick-film resistors
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1981
|
21 |
2 |
p. 288-
1 p.
|
artikel
|
| 132 |
Stress distributions around an interference-fit pin connection in a plated through hole
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1981
|
21 |
2 |
p. 282-
1 p.
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artikel
|
| 133 |
Substrate influence on the structure of thin films
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1981
|
21 |
2 |
p. 285-
1 p.
|
artikel
|
| 134 |
Synthesis and number of all series-parallel structures with n components
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1981
|
21 |
2 |
p. 278-
1 p.
|
artikel
|
| 135 |
System effectiveness models: an annotated bibliography
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|
|
1981
|
21 |
2 |
p. 279-
1 p.
|
artikel
|
| 136 |
Tape automated bonding meets VLSI challenge
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|
|
1981
|
21 |
2 |
p. 281-
1 p.
|
artikel
|
| 137 |
Techniques for ultra-fine pattern generation
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|
|
1981
|
21 |
2 |
p. 281-
1 p.
|
artikel
|
| 138 |
The influence of VLSI circuitry on the progress of microlithographic equipment
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|
1981
|
21 |
2 |
p. 283-
1 p.
|
artikel
|
| 139 |
The longitudinal diffusion coefficient and the mobility of hot electrons in silicon
|
|
|
1981
|
21 |
2 |
p. 284-
1 p.
|
artikel
|
| 140 |
The measurement of deep centers in float zone silicon by photovoltage spectroscopy
|
|
|
1981
|
21 |
2 |
p. 284-285
2 p.
|
artikel
|
| 141 |
Theoretical considerations regarding pulsed CO2 laser annealing of silicon
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|
|
1981
|
21 |
2 |
p. 289-
1 p.
|
artikel
|
| 142 |
The rf diode co-deposition of refractory metal silicides
|
|
|
1981
|
21 |
2 |
p. 285-
1 p.
|
artikel
|
| 143 |
Thermal management techniques keep semiconductors cool
|
|
|
1981
|
21 |
2 |
p. 281-
1 p.
|
artikel
|
| 144 |
The solution of two-dimensional heat conduction problems for predicting operating temperature and power handling capabilities of hybrid circuits
|
|
|
1981
|
21 |
2 |
p. 287-
1 p.
|
artikel
|
| 145 |
Thick-film circuits for high-reliability applications
|
|
|
1981
|
21 |
2 |
p. 288-
1 p.
|
artikel
|
| 146 |
Thick film thermal print heads
|
|
|
1981
|
21 |
2 |
p. 285-
1 p.
|
artikel
|
| 147 |
Thin film with surface disorder in the average t-matrix approximation
|
|
|
1981
|
21 |
2 |
p. 287-
1 p.
|
artikel
|
| 148 |
Tough control tasks take 16 bits
|
|
|
1981
|
21 |
2 |
p. 283-
1 p.
|
artikel
|
| 149 |
Training quality control technicians
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|
|
1981
|
21 |
2 |
p. 277-
1 p.
|
artikel
|
| 150 |
Two-port subnetworks of exponential distributed parameter Z-Y-KZ and Y-Z-KY micro-circuits with similar transfer functions
|
Ahmed, Kamal U
|
|
1981
|
21 |
2 |
p. 235-239
5 p.
|
artikel
|
| 151 |
Ultrasonic ball/wedge bonding of aluminium wires
|
|
|
1981
|
21 |
2 |
p. 281-
1 p.
|
artikel
|
| 152 |
Unsoldering p.c.b's without damage
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|
|
1981
|
21 |
2 |
p. 278-
1 p.
|
artikel
|
| 153 |
VLSI spurs self-testing
|
|
|
1981
|
21 |
2 |
p. 283-
1 p.
|
artikel
|
| 154 |
Voltage breakdown testing of relays in the 100-V range
|
|
|
1981
|
21 |
2 |
p. 278-
1 p.
|
artikel
|
| 155 |
Yanks borrow Japanese keys to quality
|
|
|
1981
|
21 |
2 |
p. 277-
1 p.
|
artikel
|
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