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                             191 results found
no title author magazine year volume issue page(s) type
1 Accelerated versus real time aging tests 1980
 20 6 p. 905-
1 p.
 article
2 Achieving high reliability in sonar power supplies 1980
 20 6 p. 902-
1 p.
 article
3 A computational technique for maximum likelihood estimation with Weibull models 1980
 20 6 p. 906-
1 p.
 article
4 Advances in c.c.d. scanners with on-chip signal processing for electronic imaging 1980
 20 6 p. 912-
1 p.
 article
5 Advances in GaAs LSI/VLSI processing technology 1980
 20 6 p. 911-
1 p.
 article
6 Advances in wafer process control 1980
 20 6 p. 909-
1 p.
 article
7 A GaAs MESFET sample and hold switch 1980
 20 6 p. 910-
1 p.
 article
8 A generalized computer program for the estimation of the optimum number of trials for establishing a systems reliability 1980
 20 6 p. 902-
1 p.
 article
9 Age replacement policies for Weibull failure times 1980
 20 6 p. 900-
1 p.
 article
10 A guidebook for software reliability assessment 1980
 20 6 p. 900-
1 p.
 article
11 A high speed 64 × 4 bit 100K-compatible ECL-RAM with 6 NS access time 1980
 20 6 p. 908-
1 p.
 article
12 A high speed multiplier using subnanosecond bipolar VLSI technologies 1980
 20 6 p. 908-
1 p.
 article
13 Alloyed thick-film gold conductor for high reliability high-yield wire bonding 1980
 20 6 p. 916-
1 p.
 article
14 Aluminium alloy as an interconnecting material in the fabrication of integrated circuits 1980
 20 6 p. 911-
1 p.
 article
15 Aluminum-silicon OHMIC contact on “shallow” n + /p junctions 1980
 20 6 p. 913-
1 p.
 article
16 Analogue sampling ICs in data acquisition systems 1980
 20 6 p. 913-
1 p.
 article
17 An analysis of MIL-STD-471 test methods 1980
 20 6 p. 903-
1 p.
 article
18 A new air film technique for low contact handling of silicon wafers 1980
 20 6 p. 911-
1 p.
 article
19 A new ultra low power ULA and its application 1980
 20 6 p. 912-
1 p.
 article
20 An influence of the rate of epitaxial growth on physical properties of gallium nitride 1980
 20 6 p. 914-
1 p.
 article
21 An integrated circuit v.h.f. radio receiver 1980
 20 6 p. 912-
1 p.
 article
22 An investigation of the interface state density in metal-silieon nitride-silicon structures 1980
 20 6 p. 913-914
2 p.
 article
23 An investigation of the valley splitting in n-channel silicon (100) inversion layers 1980
 20 6 p. 913-
1 p.
 article
24 A 500-picosecond system design capability 1980
 20 6 p. 909-
1 p.
 article
25 A repairable system with N failure modes and one standby unit Yamashiro, Mitsuo
 1980
 20 6 p. 831-835
5 p.
 article
26 A review of microprocessor software 1980
 20 6 p. 912-
1 p.
 article
27 A study of PtSi formation 1980
 20 6 p. 917-
1 p.
 article
28 A study of three environmental reliability tests 1980
 20 6 p. 903-
1 p.
 article
29 A survey of corrosion failure mechanisms in microelectronic devices 1980
 20 6 p. 899-900
2 p.
 article
30 Asymptotic distribution of downtime for a cold-standby system 1980
 20 6 p. 900-
1 p.
 article
31 A ULA is more than silicon 1980
 20 6 p. 909-
1 p.
 article
32 Avalanche injection in MNOS gate controlled diodes 1980
 20 6 p. 914-
1 p.
 article
33 Behaviour of line contacts upon the effect of fault currents 1980
 20 6 p. 898-
1 p.
 article
34 16-bit microprocessor enters virtual memory domain 1980
 20 6 p. 912-
1 p.
 article
35 Built-in test for complex digital integrated circuits 1980
 20 6 p. 907-
1 p.
 article
36 Calendar of international conferences, symposia, lectures and meetings of interest 1980
 20 6 p. 769-770
2 p.
 article
37 Characterization of surface states in HCL-grown oxides using MOS transient currents 1980
 20 6 p. 914-
1 p.
 article
38 Charge injection from a surface depletion region—the Al2O3-silicon system 1980
 20 6 p. 914-
1 p.
 article
39 Checking request policies for a one-unit system and their comparisons Yamada, Shigeru
 1980
 20 6 p. 859-874
16 p.
 article
40 Chip carrier packaging applications 1980
 20 6 p. 911-
1 p.
 article
41 Chips make fast math a snap for microprocessors 1980
 20 6 p. 912-
1 p.
 article
42 Circuit-board packaging considerations for optimum utilization of chip carriers 1980
 20 6 p. 911-
1 p.
 article
43 C-MOS multiplier speeds task for microprocessors 1980
 20 6 p. 912-
1 p.
 article
44 Common-cause failure analysis of a three-state device system 1980
 20 6 p. 904-905
2 p.
 article
45 Common cause failures—a dilemma in perspective 1980
 20 6 p. 903-
1 p.
 article
46 Computer aided design of LSI: an I2L case study 1980
 20 6 p. 909-
1 p.
 article
47 Computer-aided determination of tests for the detection and localisation of faults in electronic circuits and systems 1980
 20 6 p. 903-
1 p.
 article
48 Confidence intervals for comparing two life distributions 1980
 20 6 p. 901-902
2 p.
 article
49 Control chip handles error checking and character-hased protocols easily 1980
 20 6 p. 913-
1 p.
 article
50 Cost analyses for avionics acquisition 1980
 20 6 p. 903-
1 p.
 article
51 Cost effective semiconductor memory testing 1980
 20 6 p. 907-
1 p.
 article
52 Current aspects of CAD for integrated circuits 1980
 20 6 p. 908-
1 p.
 article
53 Custom ECL chips boost performance in smaller mainframes 1980
 20 6 p. 913-
1 p.
 article
54 Data needs for software reliability modelling 1980
 20 6 p. 906-
1 p.
 article
55 Decoding scheme smooths 18-bit converter's nonlinearity 1980
 20 6 p. 911-
1 p.
 article
56 Degradation of thermocompression bonds to Ti-Cu-Au and Ti-Cu thin films by thermal aging 1980
 20 6 p. 898-
1 p.
 article
57 Design aspects and reliability of a synchronizer made in MOS technology 1980
 20 6 p. 908-
1 p.
 article
58 Development of the thick-film capacitor and its application for hybrid circuit modules 1980
 20 6 p. 915-
1 p.
 article
59 Difficulties in fault-tree synthesis for process plant 1980
 20 6 p. 902-903
2 p.
 article
60 Digital filter analysis with personal computer Bozic, S.M.
 1980
 20 6 p. 836-845
10 p.
 article
61 Digital system diagnostics-design/evaluation 1980
 20 6 p. 905-
1 p.
 article
62 Digraphs and their applications in fault tree analysis 1980
 20 6 p. 904-
1 p.
 article
63 Distributed computer network takes charge in IC faeility 1980
 20 6 p. 913-
1 p.
 article
64 Draft DoD directive 5000.xx, Reliability and Maintainability 1980
 20 6 p. 897-
1 p.
 article
65 Effect of shunt capacitance on tapered distributed RC network characteristics Au, K.D.
 1980
 20 6 p. 847-852
6 p.
 article
66 Effect of switch failure on 2 redundant systems 1980
 20 6 p. 900-
1 p.
 article
67 Electromigration mechanism in aluminium conductors 1980
 20 6 p. 898-
1 p.
 article
68 Electrothermal effects in integrated circuits 1980
 20 6 p. 910-
1 p.
 article
69 Estimation of the guarantee time in an exponential failure model 1980
 20 6 p. 901-
1 p.
 article
70 Experimental characterization of most's scaled down to the 1 μm level Sunami, Hideo
 1980
 20 6 p. 803-822
20 p.
 article
71 Experimental investigation of mounting thermal resistance of flatpacks on circuit boards 1980
 20 6 p. 909-
1 p.
 article
72 Extension of high-temperature electronics 1980
 20 6 p. 916-
1 p.
 article
73 Fabrication of passive components for high-temperature instrumentation 1980
 20 6 p. 915-
1 p.
 article
74 Failure analysis on a 65 K MOS RAM with a new type of memory display 1980
 20 6 p. 904-
1 p.
 article
75 Fault-tolerant system optimization 1980
 20 6 p. 900-
1 p.
 article
76 Field maintenance organization analysis models 1980
 20 6 p. 900-
1 p.
 article
77 First uptime and disappointment time joint distribution of an intermittently used system Kapoor, K.R.
 1980
 20 6 p. 891-893
3 p.
 article
78 Fully automated integrated circuit wire bonding system 1980
 20 6 p. 910-
1 p.
 article
79 General failure model applied to preventive maintenance policies 1980
 20 6 p. 901-
1 p.
 article
80 Gold/chromium metallizations for electronics devices 1980
 20 6 p. 909-
1 p.
 article
81 Ground-hypotheses for beta distribution as Bayesian prior 1980
 20 6 p. 902-
1 p.
 article
82 Hardening RAMs against soft errors 1980
 20 6 p. 899-
1 p.
 article
83 Hardware and software: an analytical approach 1980
 20 6 p. 903-904
2 p.
 article
84 Hardware vs software reliability—A comparative study Soi, Inder M.
 1980
 20 6 p. 881-885
5 p.
 article
85 High density uncommitted arrays using an advanced CMOS technology 1980
 20 6 p. 910-
1 p.
 article
86 IBM multichip multilayer ceramic modules for LSI chips—design for performance and density 1980
 20 6 p. 910-
1 p.
 article
87 I. C. layout—the automatic approach 1980
 20 6 p. 907-908
2 p.
 article
88 Implementation constraints in self-checking integrated circuits 1980
 20 6 p. 904-
1 p.
 article
89 Influence of the substrate on the electrical properties of thick-film resistors 1980
 20 6 p. 916-
1 p.
 article
90 Integrated circuit characteristics at 260°C for aircraft engine-control applications 1980
 20 6 p. 912-
1 p.
 article
91 Intelligent memories and the silicon chip 1980
 20 6 p. 912-
1 p.
 article
92 INTELSAT system reliability 1980
 20 6 p. 906-
1 p.
 article
93 Interdiffusion processes and oxidation phenomena in NiCr/Au films 1980
 20 6 p. 915-916
2 p.
 article
94 Ion beams promise practical systems for submicrometer wafer lithography 1980
 20 6 p. 917-
1 p.
 article
95 Ionization assisted annealing of boron implanted silicon 1980
 20 6 p. 917-
1 p.
 article
96 Japanese make quality-control pitch 1980
 20 6 p. 897-
1 p.
 article
97 k-out-of-n:G system with simultaneous failure and three repair policies 1980
 20 6 p. 904-
1 p.
 article
98 L'aide à la maintenance des systèmes: le moniteur MOSTAM 1980
 20 6 p. 904-
1 p.
 article
99 Large scale digital hybrid microcircuits for new military systems 1980
 20 6 p. 916-
1 p.
 article
100 Large-scale integration latches onto the phone system 1980
 20 6 p. 907-
1 p.
 article
101 Loading effect and temperature dependence of etch rate of silicon materials in CF4 plasma 1980
 20 6 p. 911-
1 p.
 article
102 Log-rank vs x test for exponentiality 1980
 20 6 p. 902-
1 p.
 article
103 Mainframe builders making more ICs 1980
 20 6 p. 913-
1 p.
 article
104 Management benefits and burdens in regulatory legalisms 1980
 20 6 p. 897-
1 p.
 article
105 Maximum likelihood estimation of linear failure rate 1980
 20 6 p. 901-
1 p.
 article
106 Methods, equipment and materials for the wire contacting of semiconductor chips 1980
 20 6 p. 908-
1 p.
 article
107 Microelectronics—the revolution in consumer equipment 1980
 20 6 p. 906-
1 p.
 article
108 Minicomputer fills mainframe's shows 1980
 20 6 p. 913-
1 p.
 article
109 Model for failure rate curves 1980
 20 6 p. 900-
1 p.
 article
110 Molecular beam epitaxy 1980
 20 6 p. 917-
1 p.
 article
111 Multiple-drain MOS packs in very fast logic gates 1980
 20 6 p. 911-
1 p.
 article
112 Multi-state homogeneous Markov models in reliability analysis Bobbio, Andrea
 1980
 20 6 p. 875-880
6 p.
 article
113 No. 4 ESS—Reliability and maintainability experience 1980
 20 6 p. 903-
1 p.
 article
114 Observation of valley splitting in (111) n-type silicon inversion layers 1980
 20 6 p. 913-
1 p.
 article
115 Observed reliability of FLIR common modules and systems 1980
 20 6 p. 905-906
2 p.
 article
116 On a basic equation of reliability theory 1980
 20 6 p. 905-
1 p.
 article
117 On human reliability trends in digital communication systems Soi, Inder M.
 1980
 20 6 p. 823-830
8 p.
 article
118 On reliability of a computer network 1980
 20 6 p. 905-
1 p.
 article
119 On the decision to replace a unit early or late—A graphical solution Bergman, Bo
 1980
 20 6 p. 895-896
2 p.
 article
120 On the mobility of polycrystalline semiconductors 1980
 20 6 p. 913-
1 p.
 article
121 On the specification of repair time requirements 1980
 20 6 p. 902-
1 p.
 article
122 Optical end-point detection for the plasma etching of aluminum 1980
 20 6 p. 911-
1 p.
 article
123 Optimization of maintained systems 1980
 20 6 p. 902-
1 p.
 article
124 Optimization system reliability via redundancy and/or design considerations 1980
 20 6 p. 901-
1 p.
 article
125 Optimum preventive maintenance policies for a 2-unit redundant system with repair and post-repair Sinha, S.M.
 1980
 20 6 p. 887-890
4 p.
 article
126 Paraconductivity of Ge-covered tin films 1980
 20 6 p. 914-
1 p.
 article
127 Path enumeration using flow graphs 1980
 20 6 p. 905-
1 p.
 article
128 Performance/availability model of shared resource multiprocessors 1980
 20 6 p. 901-
1 p.
 article
129 Performance of the porcelain-metal substrate at microwaves 1980
 20 6 p. 915-
1 p.
 article
130 Photoexcitation effects during laser trimming of thin-film resistors on silicon 1980
 20 6 p. 917-
1 p.
 article
131 Piezoresistance tensor coefficients of phosphorus implanted silicon thin films 1980
 20 6 p. 917-
1 p.
 article
132 Plasma deposited polycrystalline silicon films 1980
 20 6 p. 911-912
2 p.
 article
133 Plasma etching for SiO2 profile control 1980
 20 6 p. 911-
1 p.
 article
134 Polysilicon self-aligned technology—A new approach for bipolar LSIs 1980
 20 6 p. 910-911
2 p.
 article
135 Preliminary evaluation of DIP/socket connection reliability 1980
 20 6 p. 897-898
2 p.
 article
136 Preoxidation gettering of oxidation-induced stacking faults in silicon by the phosphorus diffusion process 1980
 20 6 p. 914-
1 p.
 article
137 Probability plots for life test data based on optimum spacing method 1980
 20 6 p. 901-
1 p.
 article
138 Procurement specification requirements for protection against electromigration failures in aluminium metallizations 1980
 20 6 p. 899-
1 p.
 article
139 Product liability prevention—an engineer's viewpoint 1980
 20 6 p. 897-
1 p.
 article
140 Products liability: defective conditions 1980
 20 6 p. 897-
1 p.
 article
141 Programmable components: the shape of VLSI to come 1980
 20 6 p. 907-
1 p.
 article
142 Properties of plasma enhanced CVD silicon nitride: measurements and interpretations 1980
 20 6 p. 914-
1 p.
 article
143 Publications, notices, calls forpapers, etc. 1980
 20 6 p. 771-786
16 p.
 article
144 Quantitative comparison of electronic component/solder joint stress relief in encapsulated assemblies 1980
 20 6 p. 907-
1 p.
 article
145 Realization of frequency dependent negative resistance Salawu, R.I.
 1980
 20 6 p. 853-857
5 p.
 article
146 Real-time monitoring of semiconductor process uniformity 1980
 20 6 p. 899-
1 p.
 article
147 Reliability assurance programs to meet regulatory requirements in the electric power and process industries 1980
 20 6 p. 905-
1 p.
 article
148 Reliability bounds for decomposable multi-component systems 1980
 20 6 p. 902-
1 p.
 article
149 Reliability design and quality assurance system for solid tantalum capacitor 1980
 20 6 p. 898-
1 p.
 article
150 Reliability evaluation of a flow network 1980
 20 6 p. 901-
1 p.
 article
151 Reliability improvement of multiterminal networks 1980
 20 6 p. 900-901
2 p.
 article
152 Reliability problems with the store switching circuit U 253 1980
 20 6 p. 903-
1 p.
 article
153 Reliability study of high-power microwave GaAs MESFETs 1980
 20 6 p. 898-
1 p.
 article
154 Reliable Multiwire circuits with small gauge wires 1980
 20 6 p. 908-
1 p.
 article
155 Repairable systems with one standby unit 1980
 20 6 p. 905-
1 p.
 article
156 Research and development of IC technology in Japan 1980
 20 6 p. 906-
1 p.
 article
157 Reversible breakdown voltage collapse in silicon gate-controlled diodes 1980
 20 6 p. 899-
1 p.
 article
158 Semi-empirical APW calculation of the band structure of silicon 1980
 20 6 p. 914-
1 p.
 article
159 Sequential destruction method for Monte Carlo evaluation of system reliability 1980
 20 6 p. 901-
1 p.
 article
160 Simple process propels bipolar PROMs to 16-K density and beyond 1980
 20 6 p. 912-
1 p.
 article
161 Simulation comparisons of point estimation methods in the 2-parameter Weibull distribution 1980
 20 6 p. 905-
1 p.
 article
162 Soft errors in VLSI: present and future 1980
 20 6 p. 907-
1 p.
 article
163 Software and hardware R & M: What are the differences 1980
 20 6 p. 904-
1 p.
 article
164 Some aspects of reliable software packages 1980
 20 6 p. 905-
1 p.
 article
165 Some facts about environmental stress screening 1980
 20 6 p. 903-
1 p.
 article
166 Some fundamental properties of aluminum-aluminum electrical contacts 1980
 20 6 p. 899-
1 p.
 article
167 TCR control of Ni/Cr resistors 1980
 20 6 p. 915-
1 p.
 article
168 Technical and practical considerations of incorporating microprocessors in OEM products—a management view 1980
 20 6 p. 913-
1 p.
 article
169 The BCML circuit and packaging system 1980
 20 6 p. 911-
1 p.
 article
170 The decision to replace a unit early or late in an age replacement problem 1980
 20 6 p. 904-
1 p.
 article
171 The effect of alpha-particle-induced soft errors on memory systems with error correction 1980
 20 6 p. 905-
1 p.
 article
172 The effects of phosphorus diffusion cooling rate on I2L gain 1980
 20 6 p. 914-
1 p.
 article
173 The fail-safe feature of the Lapp & Powers fault tree 1980
 20 6 p. 906-
1 p.
 article
174 The failure rate function estimated from parameter drift measurements Møltoft, Jørgen
 1980
 20 6 p. 787-802
16 p.
 article
175 The MOM 400 single-chip microcomputer 1980
 20 6 p. 908-
1 p.
 article
176 The performance of plastic-encapsulated CMOS microcircuits in a humid environment 1980
 20 6 p. 909-
1 p.
 article
177 The promotion of VLSI and microlithography in Germany 1980
 20 6 p. 907-
1 p.
 article
178 The responsibility of the consumer. The pendulum has swung too far 1980
 20 6 p. 897-
1 p.
 article
179 Thermal studies of a plastic dual-in-line package 1980
 20 6 p. 909-
1 p.
 article
180 The role of hybrids in LSI systems 1980
 20 6 p. 915-
1 p.
 article
181 The steady-state distribution of signal charge in charge-coupled devices 1980
 20 6 p. 912-
1 p.
 article
182 The use of an industrial X-ray source for electronic component radiation effects work 1980
 20 6 p. 899-
1 p.
 article
183 Thick-film fine pattern formation by a photolithographic process 1980
 20 6 p. 915-
1 p.
 article
184 Thin layer high-voltage devices (resurf devices) 1980
 20 6 p. 917-
1 p.
 article
185 Transient damage resulting in failure of a component exposed to ionizing radiation environment 1980
 20 6 p. 900-
1 p.
 article
186 Two-chip radio link pilots toys and models 1980
 20 6 p. 913-
1 p.
 article
187 Ultrasonic in-line inspection technique for contact materials 1980
 20 6 p. 899-
1 p.
 article
188 Universal logic gates for custom-design I.C. requiremeats 1980
 20 6 p. 910-
1 p.
 article
189 VLSI—directions and impact 1980
 20 6 p. 907-
1 p.
 article
190 VLSI/LSI circuit functions: their challenges, rewards and problems 1980
 20 6 p. 906-
1 p.
 article
191 VLSI with a vengeneance 1980
 20 6 p. 906-
1 p.
 article
                             191 results found
 
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