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                             137 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 Active components: more breakthroughs on the way 1963
 2 4 p. 256-
1 p.
 artikel
2 Adaptive decision elements to improve the reliability of redundant systems 1963
 2 4 p. 266-
1 p.
 artikel
3 Advances in reliability prediction 1963
 2 4 p. 253-
1 p.
 artikel
4 AGREE-able experience 1963
 2 4 p. 264-
1 p.
 artikel
5 A masking jig for multiple film deposition 1963
 2 4 p. 270-271
2 p.
 artikel
6 Analysis of field effect transistors with arbitrary change distribution 1963
 2 4 p. 257-
1 p.
 artikel
7 An investigation of surface at a silicon/silicon oxide interface employing metal-oxide-silicon diodes 1963
 2 4 p. 257-
1 p.
 artikel
8 A note on silicon oxide film thickness 1963
 2 4 p. 258-
1 p.
 artikel
9 An oxide masking technique for use in the fabrication of micro-circuits and allied devices Murphy, C.S.
 1963
 2 4 p. 235-240
6 p.
 artikel
10 Assured reliability in soldered connections 1963
 2 4 p. 265-
1 p.
 artikel
11 A unified treatment of semiconductor boundary value problems 1963
 2 4 p. 258-
1 p.
 artikel
12 Bibliography on redundancy techniques 1963
 2 4 p. 247-251
5 p.
 artikel
13 Capacitance between thin film conductors deposited on a high dielectric constant substrate 1963
 2 4 p. 259-
1 p.
 artikel
14 Characteristics of PIN junctions produced by ion-drift techniques in silicon 1963
 2 4 p. 257-
1 p.
 artikel
15 Chemisorption and resistance changes in zirconium films formed by vapour condensation 1963
 2 4 p. 260-
1 p.
 artikel
16 Compatible techniques for integrated circuits 1963
 2 4 p. 258-
1 p.
 artikel
17 Component failures predicted by infra-red 1963
 2 4 p. 255-
1 p.
 artikel
18 Component reliability—a survey 1963
 2 4 p. 254-
1 p.
 artikel
19 Components that learn and how to use them 1963
 2 4 p. 263-
1 p.
 artikel
20 Computers in the front lines: micromodules make it possible 1963
 2 4 p. 267-
1 p.
 artikel
21 Crystallographic imperfections in epitaxially grown silicon 1963
 2 4 p. 267-
1 p.
 artikel
22 Data handling equipment (orbiting astro-observatory). Redundant design—its trade-offs and performance analysis 1963
 2 4 p. 253-
1 p.
 artikel
23 Designing diffused integrated circuit resistors 1963
 2 4 p. 258-
1 p.
 artikel
24 Designing molecular circuits for use in complex systems 1963
 2 4 p. 257-
1 p.
 artikel
25 Design of a system for deposition of compound thin films by evaporation from separate sources 1963
 2 4 p. 269-
1 p.
 artikel
26 Detection of surface conversion on germanium 1963
 2 4 p. 257-
1 p.
 artikel
27 Determining seal quality as a key to semiconductor device reliability 1963
 2 4 p. 265-
1 p.
 artikel
28 Diffusion length measurement by means of ionizing radiation 1963
 2 4 p. 258-
1 p.
 artikel
29 Double space charge injection in solids 1963
 2 4 p. 268-
1 p.
 artikel
30 Effectivity: its application to a long-lived space system 1963
 2 4 p. 264-
1 p.
 artikel
31 Effect of atmospheric exposure on stress in evaporated silicon monoxide films 1963
 2 4 p. 270-
1 p.
 artikel
32 Electron beam cutting techniques for electronic applications 1963
 2 4 p. 271-
1 p.
 artikel
33 Electronic microminiaturization 1963
 2 4 p. 256-
1 p.
 artikel
34 Elements of a practical reliability-engineering program 1963
 2 4 p. 253-
1 p.
 artikel
35 Elephantine electronics—a new circuit packaging problem 1963
 2 4 p. 267-
1 p.
 artikel
36 Estimation of life tests 1963
 2 4 p. 254-
1 p.
 artikel
37 Experimental neuristor gives nerve-like pulse propagation 1963
 2 4 p. 256-
1 p.
 artikel
38 Experiments on Ge-GaAs heterojunctions 1963
 2 4 p. 257-
1 p.
 artikel
39 Expressing capacitor reliability accurately 1963
 2 4 p. 255-
1 p.
 artikel
40 Fail safe in engineering 1963
 2 4 p. 263-
1 p.
 artikel
41 Fail-safe transistor logic 1963
 2 4 p. 255-
1 p.
 artikel
42 Failure analysts curb device faults 1963
 2 4 p. 255-
1 p.
 artikel
43 Formation of dielectric films by ultraviolet photolysis of several organic monomers 1963
 2 4 p. 260-
1 p.
 artikel
44 Future trends in professional component development 1963
 2 4 p. 258-
1 p.
 artikel
45 General usage assemblies for Navy electronic equipments 1963
 2 4 p. 255-
1 p.
 artikel
46 Graded p-n junctions in thin anodic oxide films of titanium 1963
 2 4 p. 269-
1 p.
 artikel
47 Graphic sampling plans for consumer acceptance of electronic components 1963
 2 4 p. 265-
1 p.
 artikel
48 High-power dynamic life tests of transistors 1963
 2 4 p. 265-
1 p.
 artikel
49 High-reliability computers using duplex redundancy 1963
 2 4 p. 265-266
2 p.
 artikel
50 High speed integrated circuits with load-compensated diode-transistor logic 1963
 2 4 p. 267-
1 p.
 artikel
51 How to design micromodules 1963
 2 4 p. 256-
1 p.
 artikel
52 How to evaluate resistor performance 1963
 2 4 p. 255-
1 p.
 artikel
53 I.F. Amplifier tunes from 15–60 Mc/s using a solid circuit filter Price, T.E.
 1963
 2 4 p. 245-246
2 p.
 artikel
54 Improved reliability in wideband feedback transistor amplifiers 1963
 2 4 p. 255-
1 p.
 artikel
55 Integrally fabricated resistors and their performance 1963
 2 4 p. 269-270
2 p.
 artikel
56 Junction capacitance switches 1963
 2 4 p. 258-
1 p.
 artikel
57 Junction formation in silicon by positive ion bombardment 1963
 2 4 p. 268-269
2 p.
 artikel
58 Latest thing in thin films—automatic deposition control 1963
 2 4 p. 259-
1 p.
 artikel
59 Low-level redundancy as a means of improving digital computer reliability 1963
 2 4 p. 266-
1 p.
 artikel
60 Magnetic properties of thin films evaporated in ultra-high vacuum 1963
 2 4 p. 261-
1 p.
 artikel
61 Magnetization of uniaxial cylindrical thin films 1963
 2 4 p. 259-
1 p.
 artikel
62 Magnetoresistance in thin evaporated gadolinium films 1963
 2 4 p. 259-
1 p.
 artikel
63 Mechanical stresses in silicon oxide films 1963
 2 4 p. 260-261
2 p.
 artikel
64 Metal oxide film resistors 1963
 2 4 p. 254-
1 p.
 artikel
65 Microcircuits go aloft 1963
 2 4 p. 256-
1 p.
 artikel
66 Microcircuit technology and applications 1963
 2 4 p. 259-
1 p.
 artikel
67 Microelectronics '62 1963
 2 4 p. 256-
1 p.
 artikel
68 Microelectronics—First steps to an agreed terminology Dummer, G.W.A.
 1963
 2 4 p. 273-274
2 p.
 artikel
69 Microminiaturization at MWT 1963
 2 4 p. 256-
1 p.
 artikel
70 Microminiaturized thin-film diode matrices 1963
 2 4 p. 270-
1 p.
 artikel
71 Micro-module technique: a modern construction method for communication engineering 1963
 2 4 p. 257-
1 p.
 artikel
72 Molten metal etches for the orientation of semiconductors by optical techniques 1963
 2 4 p. 257-
1 p.
 artikel
73 New approaches to electronic self-repair 1963
 2 4 p. 266-
1 p.
 artikel
74 New charts speed thin-film resistor design 1963
 2 4 p. 269-
1 p.
 artikel
75 New microwave techniques in surface recombination and lifetime studies 1963
 2 4 p. 258-
1 p.
 artikel
76 Notes on operational experiences with the Ural-1 computer 1963
 2 4 p. 266-
1 p.
 artikel
77 On multiplication and avalanche breakdown in exponentially retrograded silicon P-N junctions 1963
 2 4 p. 258-
1 p.
 artikel
78 On the electronic conduction of α-SiC crystals between 300 and 1500°K 1963
 2 4 p. 268-
1 p.
 artikel
79 Operating characteristic curves for reliability measurement 1963
 2 4 p. 264-
1 p.
 artikel
80 Optical soldering promotes automated packaging 1963
 2 4 p. 256-
1 p.
 artikel
81 Parasitics in integrated circuits 1963
 2 4 p. 268-
1 p.
 artikel
82 Physics of failure 1963
 2 4 p. 265-
1 p.
 artikel
83 Potential failure detected by RF noise 1963
 2 4 p. 263-
1 p.
 artikel
84 Practical procedure and results of reliability tests of transistors 1963
 2 4 p. 254-
1 p.
 artikel
85 Preparation and evaluation of thin film circuit functions 1963
 2 4 p. 259-
1 p.
 artikel
86 Preparation of evaporated silicon films 1963
 2 4 p. 270-
1 p.
 artikel
87 Printed circuits. Their contribution to reliable realisations their potentialities in miniaturisation 1963
 2 4 p. 271-
1 p.
 artikel
88 Production, general properties and gas absorption of oxide films produced by electron beam evaporation 1963
 2 4 p. 260-
1 p.
 artikel
89 Progress with extremely small electronic circuits 1963
 2 4 p. 267-
1 p.
 artikel
90 Redundancy and the detection of first failures 1963
 2 4 p. 266-
1 p.
 artikel
91 Reliability: 1962 1963
 2 4 p. 254-
1 p.
 artikel
92 Reliability and confidence criteria in structural design 1963
 2 4 p. 264-
1 p.
 artikel
93 Reliability Bulletin No. 2: Reliability program guide for the management of firms contracting for electronic products with the Armed Services 1963
 2 4 p. 263-
1 p.
 artikel
94 Reliability demonstration 1963
 2 4 p. 263-
1 p.
 artikel
95 “Reliability” engineering 1963
 2 4 p. 264-
1 p.
 artikel
96 Reliability of aerospace electrical equipment—how much does it cost? 1963
 2 4 p. 264-
1 p.
 artikel
97 Reliability of a system in which spare parts deteriorate in storage 1963
 2 4 p. 263-
1 p.
 artikel
98 Reliability of the Field-effect transistor 1963
 2 4 p. 265-
1 p.
 artikel
99 Reliability prediction for repairable redundant systems 1963
 2 4 p. 253-
1 p.
 artikel
100 Reliability: The designer's dilemma 1963
 2 4 p. 253-
1 p.
 artikel
101 Reliability through controlled environments and microminiaturization 1963
 2 4 p. 264-
1 p.
 artikel
102 Reliability through redundancy in electro-mechanical devices 1963
 2 4 p. 254-
1 p.
 artikel
103 Semiconductor surface phenomena, their causes and effects 1963
 2 4 p. 267-
1 p.
 artikel
104 Some aspects of test equipment reliability 1963
 2 4 p. 264-
1 p.
 artikel
105 Some factors controlling gross leakage current in sputtered tantalum-film capacitors 1963
 2 4 p. 270-
1 p.
 artikel
106 Some factors influencing reliability in analogue circuits for precision radar applications 1963
 2 4 p. 254-
1 p.
 artikel
107 Some physical properties of sputtered PbO2 films 1963
 2 4 p. 259-
1 p.
 artikel
108 Sputtered components in thin-film circuits 1963
 2 4 p. 269-
1 p.
 artikel
109 Sputtered dielectric capacitors 1963
 2 4 p. 270-
1 p.
 artikel
110 Statistical circuit analysis based on part test data 1963
 2 4 p. 255-
1 p.
 artikel
111 Straight line plotting of reliability functions 1963
 2 4 p. 253-
1 p.
 artikel
112 “Stress analysis” of switching-circuit reliability 1963
 2 4 p. 266-
1 p.
 artikel
113 Temperature coefficient of resistance of the high pressure phases of Si, Ge and some III–V and II–VI compounds 1963
 2 4 p. 268-
1 p.
 artikel
114 Testing and analysis for marginal design 1963
 2 4 p. 263-
1 p.
 artikel
115 Testing electronic equipment for power frequency noise 1963
 2 4 p. 254-
1 p.
 artikel
116 The etching processes in germanium pn-Junctions 1963
 2 4 p. 268-
1 p.
 artikel
117 The history and progress of the vacuum deposition processes 1963
 2 4 p. 270-
1 p.
 artikel
118 The importance of secondary effects when measuring thin film anisotropy fields (HK ) 1963
 2 4 p. 259-
1 p.
 artikel
119 The influence of temperature on the Kerr effects in gadolinium thin films 1963
 2 4 p. 270-
1 p.
 artikel
120 The mechanism of anodic oxidation 1963
 2 4 p. 260-
1 p.
 artikel
121 The reliability of communications equipment and the demands from the component parts resulting from it 1963
 2 4 p. 253-
1 p.
 artikel
122 The reliability of repairable complex systems, Part B: the dissimilar machine case 1963
 2 4 p. 266-
1 p.
 artikel
123 Thermal environmental control techniques applied to electronic equipment 1963
 2 4 p. 263-
1 p.
 artikel
124 Thermal oxidation of silicon 1963
 2 4 p. 257-
1 p.
 artikel
125 Thermocompression bonding to thin film microcircuits 1963
 2 4 p. 259-
1 p.
 artikel
126 Thermoelectric cooling 1963
 2 4 p. 271-
1 p.
 artikel
127 The Statistor—a new field effect semiconductor device 1963
 2 4 p. 267-
1 p.
 artikel
128 The technique of solid state circuits 1963
 2 4 p. 268-
1 p.
 artikel
129 The Weibull distribution—with tables 1963
 2 4 p. 253-
1 p.
 artikel
130 Thin-film production performed continuously 1963
 2 4 p. 269-
1 p.
 artikel
131 Third internat. symposium on quantum electronics 1963
 2 4 p. 271-
1 p.
 artikel
132 Two collectors better than one 1963
 2 4 p. 267-
1 p.
 artikel
133 Undamaged germanium surfaces of high optical quality 1963
 2 4 p. 257-
1 p.
 artikel
134 Use of failure statistics in design 1963
 2 4 p. 264-
1 p.
 artikel
135 Vacuum deposited circuits use field effect 1963
 2 4 p. 269-
1 p.
 artikel
136 Vacuum deposition of ductile metallic films Brunner, W.F.
 1963
 2 4 p. 241-242
2 p.
 artikel
137 Worst-case design of low-level circuitry 1963
 2 4 p. 256-
1 p.
 artikel
                             137 gevonden resultaten
 
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