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                             187 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 A case study of C mmp, Cm∗, and C vmp: part I—Experiences with fault tolerance in multiprocessor systems 1979
19 3 p. 190-
1 p.
artikel
2 A cluster plus effective medium tight-binding study of SiOx systems 1979
19 3 p. 199-
1 p.
artikel
3 A common cause-failure availability model 1979
19 3 p. 188-
1 p.
artikel
4 A compact high power semiconductor laser array 1979
19 3 p. 202-
1 p.
artikel
5 A comprehensive review of the lognormal failure distribution with application to led reliability 1979
19 3 p. 187-
1 p.
artikel
6 Acoustic microscopy of ceramic capacitors 1979
19 3 p. 187-
1 p.
artikel
7 A field study of the electrical performance of separable connectors 1979
19 3 p. 186-187
2 p.
artikel
8 A laboratory model for system reliability analyzer Misra, K.B.
1979
19 3 p. 259-264
6 p.
artikel
9 Aluminum-silicon metallization by rate controlled dual EB-gun evaporation 1979
19 3 p. 193-
1 p.
artikel
10 Aluminum wire to thick-film connections for high-temperature operation 1979
19 3 p. 186-
1 p.
artikel
11 A microelectronic test pattern for analyzing automated wafer probing and probe card problems 1979
19 3 p. 193-
1 p.
artikel
12 A microprocessor-controlled phase-locked signal source 1979
19 3 p. 196-
1 p.
artikel
13 A multiprocessor concept for the parallel calculation of FFT 1979
19 3 p. 196-
1 p.
artikel
14 Analysis of intermittently used 2-unit redundant systems with a single repair facility Srinivasan, S.K.
1979
19 3 p. 247-252
6 p.
artikel
15 An evaluation of the voltage-current rating characteristics of miniature monolithic RF ceramic capacitors 1979
19 3 p. 200-
1 p.
artikel
16 A new method for reliability optimization 1979
19 3 p. 189-
1 p.
artikel
17 An experimental study of the indium antimonide thin film transistor 1979
19 3 p. 201-
1 p.
artikel
18 An introduction to assemblers and loaders for microprocessor systems 1979
19 3 p. 194-
1 p.
artikel
19 An investigation of the voltage sustained by epitaxial bipolar transistors in current mode second breakdown 1979
19 3 p. 198-
1 p.
artikel
20 Anisotropic phonon generation in GaAs epilayers and pn junctions 1979
19 3 p. 199-
1 p.
artikel
21 Anodic native oxides on GaAs 1979
19 3 p. 196-
1 p.
artikel
22 A pabx model using the 6800 MPU 1979
19 3 p. 194-
1 p.
artikel
23 A phenomenological study of a.c. gas panels fabricated with vacuum-deposited dielectric layers 1979
19 3 p. 201-
1 p.
artikel
24 A prognosis of the impending intercontinental LSI battle 1979
19 3 p. 191-
1 p.
artikel
25 A realistic approach to thick film resistor design 1979
19 3 p. 200-
1 p.
artikel
26 A self optimising central heating control System 1979
19 3 p. 193-194
2 p.
artikel
27 A simple analysis of CCDs driven by pn junctions 1979
19 3 p. 192-
1 p.
artikel
28 Assuring PCB shelf life solderability by air levelling 1979
19 3 p. 192-
1 p.
artikel
29 A two failure modes system with cold stand-by units 1979
19 3 p. 189-
1 p.
artikel
30 A two-unit redundant system Subramanian, R.
1979
19 3 p. 277-278
2 p.
artikel
31 Auger and radiative recombination of acceptor bound excitons in semiconductors 1979
19 3 p. 199-
1 p.
artikel
32 Automatic alignment for direct step and repeat printing on silicon 1979
19 3 p. 193-
1 p.
artikel
33 Availability of an (m, N) system with repair 1979
19 3 p. 188-189
2 p.
artikel
34 A van der Pauw resistor structure for determining mask superposition errors on semiconductor slices 1979
19 3 p. 191-192
2 p.
artikel
35 Binary transversal filter Bozic, S.M.
1979
19 3 p. 219-222
4 p.
artikel
36 Bit-slice parts approach ECL speeds with TTL power levels 1979
19 3 p. 195-
1 p.
artikel
37 Calendar of international conferences, symposia, lectures and meetings of interest 1979
19 3 p. 169-171
3 p.
artikel
38 Calibration of ion implantation systems 1979
19 3 p. 203-
1 p.
artikel
39 Capacitance and doping profiles of ion-implanted, buried-channel MOSFETS 1979
19 3 p. 202-203
2 p.
artikel
40 Carrier collection in a semiconductor quantum well 1979
19 3 p. 197-
1 p.
artikel
41 Characterisation of I2L gates 1979
19 3 p. 193-
1 p.
artikel
42 Characterisation of I2L gates 1979
19 3 p. 193-
1 p.
artikel
43 Characteristics and failure analysis of solid tantalum capacitors 1979
19 3 p. 186-
1 p.
artikel
44 Characteristics of an indium-tin oxide transparent conductor deposited from organometallic compositions 1979
19 3 p. 200-
1 p.
artikel
45 Chip checks and compares characters 1979
19 3 p. 196-
1 p.
artikel
46 Chip cuts parts count in error correction networks 1979
19 3 p. 195-
1 p.
artikel
47 Chip formats hard-sectored floppies 1979
19 3 p. 196-
1 p.
artikel
48 Chip-module package interfaces 1979
19 3 p. 192-
1 p.
artikel
49 C-MOS codec splits transmitting, receiving sections 1979
19 3 p. 195-
1 p.
artikel
50 Common market eyes VLSI effort 1979
19 3 p. 191-
1 p.
artikel
51 Compressing test patterns to fit into LSI testers 1979
19 3 p. 189-
1 p.
artikel
52 Computer analysis of punch-through in MOSFETs 1979
19 3 p. 199-
1 p.
artikel
53 Conduction properties of lightly doped, polycrystalline silicon 1979
19 3 p. 197-
1 p.
artikel
54 Contact noise in thick film resistors 1979
19 3 p. 200-
1 p.
artikel
55 Contact stress and wear study for type characters 1979
19 3 p. 188-
1 p.
artikel
56 Control of pre-trim variables in thick film resistor processing 1979
19 3 p. 200-
1 p.
artikel
57 Critical point for electron-hole droplets in strained Ge and Si 1979
19 3 p. 198-
1 p.
artikel
58 Cutting production costs with in-circuit test systems 1979
19 3 p. 196-
1 p.
artikel
59 Data acquisition—acquiring a little of the data 1979
19 3 p. 194-
1 p.
artikel
60 Dedicated logic analyzer minimizes setup problems 1979
19 3 p. 195-
1 p.
artikel
61 Derivation of minimum length fault tests for combinational circuits Rai, Suresh
1979
19 3 p. 275-276
2 p.
artikel
62 Design of wide band amplifiers using hybrid integrated techniques 1979
19 3 p. 200-
1 p.
artikel
63 Diffusion coefficient of hot electrons in GaAs 1979
19 3 p. 199-
1 p.
artikel
64 Diffusion processes in defective crystals and multistate diffusion 1979
19 3 p. 198-
1 p.
artikel
65 Digraphs and their applications in fault tree analysis Chopra, Y.C.
1979
19 3 p. 269-273
5 p.
artikel
66 Doctorial dissertation of interest on “The reliability of analogue electronic systems” Klaassen, K.B.
1979
19 3 p. 205-206
2 p.
artikel
67 Dry cells—Performance and life characteristics Bora, J.S.
1979
19 3 p. 281-285
5 p.
artikel
68 Dual-gate charge sensing in charge-coupled devices 1979
19 3 p. 196-
1 p.
artikel
69 E-beam projector takes giant steps towards practically 1979
19 3 p. 203-
1 p.
artikel
70 Effect of reactive gas dopants on the MgP surface in AC plasma display panels 1979
19 3 p. 201-
1 p.
artikel
71 Effects of annealing on localized states in amorphous Ge films 1979
19 3 p. 201-
1 p.
artikel
72 Effects of dislocations in silicon transistors with implanted emitters 1979
19 3 p. 202-
1 p.
artikel
73 Elastic and inelastic scattering of electrons by vibrating impurities in semiconductors 1979
19 3 p. 197-
1 p.
artikel
74 Electrical and optical characteristics of evaporable-glass-dielectric a.c. gas display panels 1979
19 3 p. 202-
1 p.
artikel
75 Electrical conduction in thin zinc rf sputtered films 1979
19 3 p. 201-
1 p.
artikel
76 Electrical properties of the MIS capacitor under illumination 1979
19 3 p. 195-
1 p.
artikel
77 Electron-hole droplet condensation in semiconductors; phase diagrams 1979
19 3 p. 199-
1 p.
artikel
78 Electronic troubleshooter 1979
19 3 p. 189-
1 p.
artikel
79 Enhancing ultrasonic bond development 1979
19 3 p. 192-
1 p.
artikel
80 Epoxies for component mounting in thick film hybrids 1979
19 3 p. 200-
1 p.
artikel
81 Equipment costs worry chip makers 1979
19 3 p. 191-
1 p.
artikel
82 Excess noise sources due to defects in forward biased junctions 1979
19 3 p. 188-
1 p.
artikel
83 Exponential excitation expansion: a new method of vibration testing 1979
19 3 p. 188-
1 p.
artikel
84 Failure analysis equipment and services 1979
19 3 p. 185-
1 p.
artikel
85 Fault-tolerant design of local ESS processors 1979
19 3 p. 190-
1 p.
artikel
86 Ferromagnetic resonance in strained and strain-free single crystal nickel films 1979
19 3 p. 200-
1 p.
artikel
87 1 f noise in metal films: the role of the substrate 1979
19 3 p. 201-
1 p.
artikel
88 Fracture strength of silicon wafers 1979
19 3 p. 192-
1 p.
artikel
89 FTMP—a highly reliable fault-tolerant multiprocessor for aircraft 1979
19 3 p. 190-
1 p.
artikel
90 Gang bonding to standard aluminized integrated circuits with bumped interconnect tape 1979
19 3 p. 193-
1 p.
artikel
91 High-reliability thermocompression bonding for hybrid applications 1979
19 3 p. 186-
1 p.
artikel
92 IC driver dimplifies gas-discharge bar-graph display 1979
19 3 p. 195-
1 p.
artikel
93 Improved analysis of pulsed C-t measurements on silicon MOS capacitors 1979
19 3 p. 196-
1 p.
artikel
94 Infrared high spatial-resolution determination of doping levels in p · n junctions 1979
19 3 p. 198-
1 p.
artikel
95 Integrated circuits in radio transceivers 1979
19 3 p. 194-
1 p.
artikel
96 Integrated circuits take the cams out of cameras 1979
19 3 p. 193-
1 p.
artikel
97 Integrated components for fiber optic data links in industrial applications 1979
19 3 p. 194-
1 p.
artikel
98 Integrated display components. Review of the international status and trends 1979
19 3 p. 190-191
2 p.
artikel
99 Intermittently used redundant system 1979
19 3 p. 189-
1 p.
artikel
100 64-K dynamic RAM needs only one 5-volt supply to outstrip 16-K parts 1979
19 3 p. 195-
1 p.
artikel
101 Laser drilling of vias in dielectric for high density multi-layer thick film circuits 1979
19 3 p. 202-
1 p.
artikel
102 LSI boards give testers fits 1979
19 3 p. 195-
1 p.
artikel
103 LSI-board testing bedevils users 1979
19 3 p. 189-
1 p.
artikel
104 LSI chip provides 600-gate array in semi-custom setup 1979
19 3 p. 195-
1 p.
artikel
105 LSI PC assembly testing using parallel pin electronics 1979
19 3 p. 196-
1 p.
artikel
106 Magnetic field dependence of the valley splitting in n-type inverted silicon MOSFET surfaces 1979
19 3 p. 198-
1 p.
artikel
107 Measurement of minority carrier lifetime and diffusion length in silicon epitaxial layers by means of the photo-current technique 1979
19 3 p. 197-
1 p.
artikel
108 Measurement of the lattice constant of Si-Ge heteroepitaxial layers grown on a silicon substrate 1979
19 3 p. 198-
1 p.
artikel
109 Mechanism of wear by ribbon and paper 1979
19 3 p. 188-
1 p.
artikel
110 Mehr zuverlassigkeit bei hochspannungskaskaden für farbfernseher 1979
19 3 p. 187-
1 p.
artikel
111 Metal-n-type semiconductor ohmic contact with a shallow N+ surface layer 1979
19 3 p. 197-
1 p.
artikel
112 Microcomputers do on-chip a-d conversion 1979
19 3 p. 191-
1 p.
artikel
113 Microelectronic realization of digital systems by microprogrammed memories 1979
19 3 p. 195-
1 p.
artikel
114 Microprocessor makes alphanumeric display smart 1979
19 3 p. 196-
1 p.
artikel
115 Microprocessors for high accuracy component measurement 1979
19 3 p. 194-195
2 p.
artikel
116 Missile makers eagerly await LSI 1979
19 3 p. 195-
1 p.
artikel
117 New substrate causes a stir 1979
19 3 p. 201-
1 p.
artikel
118 Nondestructive bond pull in high-reliability applications 1979
19 3 p. 186-
1 p.
artikel
119 Nondestructive examination of multilayer capacitors by neutron radiography 1979
19 3 p. 187-
1 p.
artikel
120 Non uniform recombination in thin silicon-on-sapphire films 1979
19 3 p. 201-202
2 p.
artikel
121 Nuclear power station safety 1979
19 3 p. 188-
1 p.
artikel
122 Nucleation of electron-hole droplets swirl defects in silicon 1979
19 3 p. 197-
1 p.
artikel
123 Numerical analysis of electric semiconductor structures 1979
19 3 p. 199-
1 p.
artikel
124 Observations of dislocations and junction irregularities in bipolar transistors using the E.B.I.C. mode of the scanning electron microscope 1979
19 3 p. 199-
1 p.
artikel
125 On a two unit standby redundant system with imperfect switchover 1979
19 3 p. 189-
1 p.
artikel
126 On reliability of a computer network Soi, Inder M.
1979
19 3 p. 237-241
5 p.
artikel
127 Optimum inspection-ordering policies with salvage cost 1979
19 3 p. 189-
1 p.
artikel
128 Output probability expression for general combinational networks 1979
19 3 p. 188-
1 p.
artikel
129 Oxygen content and oxide barrier thickness in granular aluminium films 1979
19 3 p. 201-
1 p.
artikel
130 Partitioning of modular equipment for fault isolation 1979
19 3 p. 189-
1 p.
artikel
131 Photocurrents in silicon nitride films 1979
19 3 p. 201-
1 p.
artikel
132 Piezoresistance effect in Pb0,82Sn0.18Te films 1979
19 3 p. 201-
1 p.
artikel
133 64-pin QUIP keeps microprocessor chips cool and accessible 1979
19 3 p. 196-
1 p.
artikel
134 Pluribus—an operational fault-tolerant multiprocessor 1979
19 3 p. 190-
1 p.
artikel
135 Problems in reliability and maintainability (RAM) delivery systems Reiche, H.
1979
19 3 p. 183-184
2 p.
artikel
136 Procurement specification requirements for protection against electromigration failures in aluminium metallizations Sim, S.P.
1979
19 3 p. 207-218
12 p.
artikel
137 Product liability—Progress toward a solution 1979
19 3 p. 185-
1 p.
artikel
138 Publications, notices, calls for papers, etc. 1979
19 3 p. 173-181
9 p.
artikel
139 Random percolation in metal—Ge mixtures 1979
19 3 p. 198-
1 p.
artikel
140 Recombination at deep-traps 1979
19 3 p. 198-
1 p.
artikel
141 Recombination enhanced defect reactions 1979
19 3 p. 198-199
2 p.
artikel
142 Recombination level selection criteria for lifetime reduction in integrated circuits 1979
19 3 p. 191-
1 p.
artikel
143 Reliability analysis of systems composed of elements with three states Ksir, B.
1979
19 3 p. 229-231
3 p.
artikel
144 Reliability evaluation and failure analysis for multilayer ceramic chip capacitors 1979
19 3 p. 185-
1 p.
artikel
145 Reliability of plastic encapsulated semiconductor devices and integrated circuits 1979
19 3 p. 186-
1 p.
artikel
146 Repairable systems with one standby unit Elsayed, E.A.
1979
19 3 p. 243-245
3 p.
artikel
147 Scanning photocurrent microscopy: A new technique to study inhomogeneously distributed recombination centers in semiconductors 1979
19 3 p. 198-
1 p.
artikel
148 Second-generation microcontrollers take on dedicated-function tasks 1979
19 3 p. 191-
1 p.
artikel
149 Short-term and long-term performance of electrolytic capacitors 1979
19 3 p. 187-
1 p.
artikel
150 SIFT: design and analysis of a fault-tolerant computer for aircraft control 1979
19 3 p. 190-
1 p.
artikel
151 Silicon growers try to cut cost/watt 1979
19 3 p. 195-
1 p.
artikel
152 Simulation of RL impedances suitable for micro-miniaturization Rathore, T.S.
1979
19 3 p. 233-235
3 p.
artikel
153 State of the art in semiconductor materials and processing for microcircuit reliab. 1979
19 3 p. 185-
1 p.
artikel
154 Step-stress accelerated life testing of diodes Bora, J.S.
1979
19 3 p. 279-280
2 p.
artikel
155 Stochastic analysis of temperature spikes contribution towards the damage in a component exposed to nuclear radiation environment 1979
19 3 p. 187-188
2 p.
artikel
156 Stochastic behaviour of a 1-server 2-unit hot standby system 1979
19 3 p. 189-
1 p.
artikel
157 Stochastic behaviour of a 2-unit system with 1-server subject to delayed maintenance 1979
19 3 p. 189-
1 p.
artikel
158 Studies of the use of microcellular structures 1979
19 3 p. 196-
1 p.
artikel
159 Symbolic reliability evaluation of reducible networks Misra, R.B.
1979
19 3 p. 253-257
5 p.
artikel
160 Tackling the very large-scale problems of VLSI: a special report 1979
19 3 p. 191-
1 p.
artikel
161 Techmology update 1979
19 3 p. 191-
1 p.
artikel
162 The breakdown voltage of planar Schottky diodes 1979
19 3 p. 188-
1 p.
artikel
163 The decision to replace a unit early or late in an age replacement problem Nakagawa, T.
1979
19 3 p. 265-267
3 p.
artikel
164 The design of a solid state trip system for nuclear power plants 1979
19 3 p. 189-190
2 p.
artikel
165 The design of microcomputer systems 1979
19 3 p. 194-
1 p.
artikel
166 The dopant density and temperature dependence of hole mobility and resistivity in boron doped silicon 1979
19 3 p. 197-
1 p.
artikel
167 The kinetics of open tube phosphorus diffusion in silicon 1979
19 3 p. 193-
1 p.
artikel
168 The microelectronic wire bond pull test—How to use it, how to abuse it 1979
19 3 p. 185-186
2 p.
artikel
169 The microprocessor in video editing 1979
19 3 p. 195-
1 p.
artikel
170 The phonon-mediated intervalley electron-electron interaction in silicon 1979
19 3 p. 197-
1 p.
artikel
171 The practice of quality control 1979
19 3 p. 185-
1 p.
artikel
172 The preparation, structure and properties of Pb0.82Sn0.18Te films obtained by modified hot-wall evaporation technique 1979
19 3 p. 200-
1 p.
artikel
173 The reliability of electronic devices in storage environments 1979
19 3 p. 187-
1 p.
artikel
174 The reliability of plastic microcircuits in moist environments 1979
19 3 p. 187-
1 p.
artikel
175 The use of a four-point probe for profiling sub-micron layers 1979
19 3 p. 196-197
2 p.
artikel
176 The use of VLSI in the design of teletext receivers 1979
19 3 p. 195-
1 p.
artikel
177 Thick film distributed notch filters 1979
19 3 p. 200-
1 p.
artikel
178 Thinning method for electron microscopy transparent silicon and germanium foils 1979
19 3 p. 202-
1 p.
artikel
179 Time dependence of ion-migration effects in NiCr resistor films 1979
19 3 p. 199-
1 p.
artikel
180 Transient damage resulting in failure of a component exposed to ionizing radiation environment Yadav, R.P.S.
1979
19 3 p. 223-227
5 p.
artikel
181 Ultra-high vacuum systems for surface research 1979
19 3 p. 201-
1 p.
artikel
182 Use of ion implantation in future GaAs technology 1979
19 3 p. 203-
1 p.
artikel
183 VCNR type characteristic in thin film amorphous Te-Ge-As-Si films 1979
19 3 p. 202-
1 p.
artikel
184 Vector-scan E beam aims for wafers as well as masks 1979
19 3 p. 202-
1 p.
artikel
185 Wafer scale integration—some approaches to the interconnection problem 1979
19 3 p. 192-
1 p.
artikel
186 Work-hardening of ferrite head surfaces by wear with flexible recording media 1979
19 3 p. 188-
1 p.
artikel
187 X-ray lithography breaks the VLSI cost barrier 1979
19 3 p. 193-
1 p.
artikel
                             187 gevonden resultaten
 
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