| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
A case study of C mmp, Cm∗, and C vmp: part I—Experiences with fault tolerance in multiprocessor systems
|
|
|
1979
|
19 |
3 |
p. 190-
1 p.
|
article
|
| 2 |
A cluster plus effective medium tight-binding study of SiOx systems
|
|
|
1979
|
19 |
3 |
p. 199-
1 p.
|
article
|
| 3 |
A common cause-failure availability model
|
|
|
1979
|
19 |
3 |
p. 188-
1 p.
|
article
|
| 4 |
A compact high power semiconductor laser array
|
|
|
1979
|
19 |
3 |
p. 202-
1 p.
|
article
|
| 5 |
A comprehensive review of the lognormal failure distribution with application to led reliability
|
|
|
1979
|
19 |
3 |
p. 187-
1 p.
|
article
|
| 6 |
Acoustic microscopy of ceramic capacitors
|
|
|
1979
|
19 |
3 |
p. 187-
1 p.
|
article
|
| 7 |
A field study of the electrical performance of separable connectors
|
|
|
1979
|
19 |
3 |
p. 186-187
2 p.
|
article
|
| 8 |
A laboratory model for system reliability analyzer
|
Misra, K.B.
|
|
1979
|
19 |
3 |
p. 259-264
6 p.
|
article
|
| 9 |
Aluminum-silicon metallization by rate controlled dual EB-gun evaporation
|
|
|
1979
|
19 |
3 |
p. 193-
1 p.
|
article
|
| 10 |
Aluminum wire to thick-film connections for high-temperature operation
|
|
|
1979
|
19 |
3 |
p. 186-
1 p.
|
article
|
| 11 |
A microelectronic test pattern for analyzing automated wafer probing and probe card problems
|
|
|
1979
|
19 |
3 |
p. 193-
1 p.
|
article
|
| 12 |
A microprocessor-controlled phase-locked signal source
|
|
|
1979
|
19 |
3 |
p. 196-
1 p.
|
article
|
| 13 |
A multiprocessor concept for the parallel calculation of FFT
|
|
|
1979
|
19 |
3 |
p. 196-
1 p.
|
article
|
| 14 |
Analysis of intermittently used 2-unit redundant systems with a single repair facility
|
Srinivasan, S.K.
|
|
1979
|
19 |
3 |
p. 247-252
6 p.
|
article
|
| 15 |
An evaluation of the voltage-current rating characteristics of miniature monolithic RF ceramic capacitors
|
|
|
1979
|
19 |
3 |
p. 200-
1 p.
|
article
|
| 16 |
A new method for reliability optimization
|
|
|
1979
|
19 |
3 |
p. 189-
1 p.
|
article
|
| 17 |
An experimental study of the indium antimonide thin film transistor
|
|
|
1979
|
19 |
3 |
p. 201-
1 p.
|
article
|
| 18 |
An introduction to assemblers and loaders for microprocessor systems
|
|
|
1979
|
19 |
3 |
p. 194-
1 p.
|
article
|
| 19 |
An investigation of the voltage sustained by epitaxial bipolar transistors in current mode second breakdown
|
|
|
1979
|
19 |
3 |
p. 198-
1 p.
|
article
|
| 20 |
Anisotropic phonon generation in GaAs epilayers and pn junctions
|
|
|
1979
|
19 |
3 |
p. 199-
1 p.
|
article
|
| 21 |
Anodic native oxides on GaAs
|
|
|
1979
|
19 |
3 |
p. 196-
1 p.
|
article
|
| 22 |
A pabx model using the 6800 MPU
|
|
|
1979
|
19 |
3 |
p. 194-
1 p.
|
article
|
| 23 |
A phenomenological study of a.c. gas panels fabricated with vacuum-deposited dielectric layers
|
|
|
1979
|
19 |
3 |
p. 201-
1 p.
|
article
|
| 24 |
A prognosis of the impending intercontinental LSI battle
|
|
|
1979
|
19 |
3 |
p. 191-
1 p.
|
article
|
| 25 |
A realistic approach to thick film resistor design
|
|
|
1979
|
19 |
3 |
p. 200-
1 p.
|
article
|
| 26 |
A self optimising central heating control System
|
|
|
1979
|
19 |
3 |
p. 193-194
2 p.
|
article
|
| 27 |
A simple analysis of CCDs driven by pn junctions
|
|
|
1979
|
19 |
3 |
p. 192-
1 p.
|
article
|
| 28 |
Assuring PCB shelf life solderability by air levelling
|
|
|
1979
|
19 |
3 |
p. 192-
1 p.
|
article
|
| 29 |
A two failure modes system with cold stand-by units
|
|
|
1979
|
19 |
3 |
p. 189-
1 p.
|
article
|
| 30 |
A two-unit redundant system
|
Subramanian, R.
|
|
1979
|
19 |
3 |
p. 277-278
2 p.
|
article
|
| 31 |
Auger and radiative recombination of acceptor bound excitons in semiconductors
|
|
|
1979
|
19 |
3 |
p. 199-
1 p.
|
article
|
| 32 |
Automatic alignment for direct step and repeat printing on silicon
|
|
|
1979
|
19 |
3 |
p. 193-
1 p.
|
article
|
| 33 |
Availability of an (m, N) system with repair
|
|
|
1979
|
19 |
3 |
p. 188-189
2 p.
|
article
|
| 34 |
A van der Pauw resistor structure for determining mask superposition errors on semiconductor slices
|
|
|
1979
|
19 |
3 |
p. 191-192
2 p.
|
article
|
| 35 |
Binary transversal filter
|
Bozic, S.M.
|
|
1979
|
19 |
3 |
p. 219-222
4 p.
|
article
|
| 36 |
Bit-slice parts approach ECL speeds with TTL power levels
|
|
|
1979
|
19 |
3 |
p. 195-
1 p.
|
article
|
| 37 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1979
|
19 |
3 |
p. 169-171
3 p.
|
article
|
| 38 |
Calibration of ion implantation systems
|
|
|
1979
|
19 |
3 |
p. 203-
1 p.
|
article
|
| 39 |
Capacitance and doping profiles of ion-implanted, buried-channel MOSFETS
|
|
|
1979
|
19 |
3 |
p. 202-203
2 p.
|
article
|
| 40 |
Carrier collection in a semiconductor quantum well
|
|
|
1979
|
19 |
3 |
p. 197-
1 p.
|
article
|
| 41 |
Characterisation of I2L gates
|
|
|
1979
|
19 |
3 |
p. 193-
1 p.
|
article
|
| 42 |
Characterisation of I2L gates
|
|
|
1979
|
19 |
3 |
p. 193-
1 p.
|
article
|
| 43 |
Characteristics and failure analysis of solid tantalum capacitors
|
|
|
1979
|
19 |
3 |
p. 186-
1 p.
|
article
|
| 44 |
Characteristics of an indium-tin oxide transparent conductor deposited from organometallic compositions
|
|
|
1979
|
19 |
3 |
p. 200-
1 p.
|
article
|
| 45 |
Chip checks and compares characters
|
|
|
1979
|
19 |
3 |
p. 196-
1 p.
|
article
|
| 46 |
Chip cuts parts count in error correction networks
|
|
|
1979
|
19 |
3 |
p. 195-
1 p.
|
article
|
| 47 |
Chip formats hard-sectored floppies
|
|
|
1979
|
19 |
3 |
p. 196-
1 p.
|
article
|
| 48 |
Chip-module package interfaces
|
|
|
1979
|
19 |
3 |
p. 192-
1 p.
|
article
|
| 49 |
C-MOS codec splits transmitting, receiving sections
|
|
|
1979
|
19 |
3 |
p. 195-
1 p.
|
article
|
| 50 |
Common market eyes VLSI effort
|
|
|
1979
|
19 |
3 |
p. 191-
1 p.
|
article
|
| 51 |
Compressing test patterns to fit into LSI testers
|
|
|
1979
|
19 |
3 |
p. 189-
1 p.
|
article
|
| 52 |
Computer analysis of punch-through in MOSFETs
|
|
|
1979
|
19 |
3 |
p. 199-
1 p.
|
article
|
| 53 |
Conduction properties of lightly doped, polycrystalline silicon
|
|
|
1979
|
19 |
3 |
p. 197-
1 p.
|
article
|
| 54 |
Contact noise in thick film resistors
|
|
|
1979
|
19 |
3 |
p. 200-
1 p.
|
article
|
| 55 |
Contact stress and wear study for type characters
|
|
|
1979
|
19 |
3 |
p. 188-
1 p.
|
article
|
| 56 |
Control of pre-trim variables in thick film resistor processing
|
|
|
1979
|
19 |
3 |
p. 200-
1 p.
|
article
|
| 57 |
Critical point for electron-hole droplets in strained Ge and Si
|
|
|
1979
|
19 |
3 |
p. 198-
1 p.
|
article
|
| 58 |
Cutting production costs with in-circuit test systems
|
|
|
1979
|
19 |
3 |
p. 196-
1 p.
|
article
|
| 59 |
Data acquisition—acquiring a little of the data
|
|
|
1979
|
19 |
3 |
p. 194-
1 p.
|
article
|
| 60 |
Dedicated logic analyzer minimizes setup problems
|
|
|
1979
|
19 |
3 |
p. 195-
1 p.
|
article
|
| 61 |
Derivation of minimum length fault tests for combinational circuits
|
Rai, Suresh
|
|
1979
|
19 |
3 |
p. 275-276
2 p.
|
article
|
| 62 |
Design of wide band amplifiers using hybrid integrated techniques
|
|
|
1979
|
19 |
3 |
p. 200-
1 p.
|
article
|
| 63 |
Diffusion coefficient of hot electrons in GaAs
|
|
|
1979
|
19 |
3 |
p. 199-
1 p.
|
article
|
| 64 |
Diffusion processes in defective crystals and multistate diffusion
|
|
|
1979
|
19 |
3 |
p. 198-
1 p.
|
article
|
| 65 |
Digraphs and their applications in fault tree analysis
|
Chopra, Y.C.
|
|
1979
|
19 |
3 |
p. 269-273
5 p.
|
article
|
| 66 |
Doctorial dissertation of interest on “The reliability of analogue electronic systems”
|
Klaassen, K.B.
|
|
1979
|
19 |
3 |
p. 205-206
2 p.
|
article
|
| 67 |
Dry cells—Performance and life characteristics
|
Bora, J.S.
|
|
1979
|
19 |
3 |
p. 281-285
5 p.
|
article
|
| 68 |
Dual-gate charge sensing in charge-coupled devices
|
|
|
1979
|
19 |
3 |
p. 196-
1 p.
|
article
|
| 69 |
E-beam projector takes giant steps towards practically
|
|
|
1979
|
19 |
3 |
p. 203-
1 p.
|
article
|
| 70 |
Effect of reactive gas dopants on the MgP surface in AC plasma display panels
|
|
|
1979
|
19 |
3 |
p. 201-
1 p.
|
article
|
| 71 |
Effects of annealing on localized states in amorphous Ge films
|
|
|
1979
|
19 |
3 |
p. 201-
1 p.
|
article
|
| 72 |
Effects of dislocations in silicon transistors with implanted emitters
|
|
|
1979
|
19 |
3 |
p. 202-
1 p.
|
article
|
| 73 |
Elastic and inelastic scattering of electrons by vibrating impurities in semiconductors
|
|
|
1979
|
19 |
3 |
p. 197-
1 p.
|
article
|
| 74 |
Electrical and optical characteristics of evaporable-glass-dielectric a.c. gas display panels
|
|
|
1979
|
19 |
3 |
p. 202-
1 p.
|
article
|
| 75 |
Electrical conduction in thin zinc rf sputtered films
|
|
|
1979
|
19 |
3 |
p. 201-
1 p.
|
article
|
| 76 |
Electrical properties of the MIS capacitor under illumination
|
|
|
1979
|
19 |
3 |
p. 195-
1 p.
|
article
|
| 77 |
Electron-hole droplet condensation in semiconductors; phase diagrams
|
|
|
1979
|
19 |
3 |
p. 199-
1 p.
|
article
|
| 78 |
Electronic troubleshooter
|
|
|
1979
|
19 |
3 |
p. 189-
1 p.
|
article
|
| 79 |
Enhancing ultrasonic bond development
|
|
|
1979
|
19 |
3 |
p. 192-
1 p.
|
article
|
| 80 |
Epoxies for component mounting in thick film hybrids
|
|
|
1979
|
19 |
3 |
p. 200-
1 p.
|
article
|
| 81 |
Equipment costs worry chip makers
|
|
|
1979
|
19 |
3 |
p. 191-
1 p.
|
article
|
| 82 |
Excess noise sources due to defects in forward biased junctions
|
|
|
1979
|
19 |
3 |
p. 188-
1 p.
|
article
|
| 83 |
Exponential excitation expansion: a new method of vibration testing
|
|
|
1979
|
19 |
3 |
p. 188-
1 p.
|
article
|
| 84 |
Failure analysis equipment and services
|
|
|
1979
|
19 |
3 |
p. 185-
1 p.
|
article
|
| 85 |
Fault-tolerant design of local ESS processors
|
|
|
1979
|
19 |
3 |
p. 190-
1 p.
|
article
|
| 86 |
Ferromagnetic resonance in strained and strain-free single crystal nickel films
|
|
|
1979
|
19 |
3 |
p. 200-
1 p.
|
article
|
| 87 |
1 f noise in metal films: the role of the substrate
|
|
|
1979
|
19 |
3 |
p. 201-
1 p.
|
article
|
| 88 |
Fracture strength of silicon wafers
|
|
|
1979
|
19 |
3 |
p. 192-
1 p.
|
article
|
| 89 |
FTMP—a highly reliable fault-tolerant multiprocessor for aircraft
|
|
|
1979
|
19 |
3 |
p. 190-
1 p.
|
article
|
| 90 |
Gang bonding to standard aluminized integrated circuits with bumped interconnect tape
|
|
|
1979
|
19 |
3 |
p. 193-
1 p.
|
article
|
| 91 |
High-reliability thermocompression bonding for hybrid applications
|
|
|
1979
|
19 |
3 |
p. 186-
1 p.
|
article
|
| 92 |
IC driver dimplifies gas-discharge bar-graph display
|
|
|
1979
|
19 |
3 |
p. 195-
1 p.
|
article
|
| 93 |
Improved analysis of pulsed C-t measurements on silicon MOS capacitors
|
|
|
1979
|
19 |
3 |
p. 196-
1 p.
|
article
|
| 94 |
Infrared high spatial-resolution determination of doping levels in p · n junctions
|
|
|
1979
|
19 |
3 |
p. 198-
1 p.
|
article
|
| 95 |
Integrated circuits in radio transceivers
|
|
|
1979
|
19 |
3 |
p. 194-
1 p.
|
article
|
| 96 |
Integrated circuits take the cams out of cameras
|
|
|
1979
|
19 |
3 |
p. 193-
1 p.
|
article
|
| 97 |
Integrated components for fiber optic data links in industrial applications
|
|
|
1979
|
19 |
3 |
p. 194-
1 p.
|
article
|
| 98 |
Integrated display components. Review of the international status and trends
|
|
|
1979
|
19 |
3 |
p. 190-191
2 p.
|
article
|
| 99 |
Intermittently used redundant system
|
|
|
1979
|
19 |
3 |
p. 189-
1 p.
|
article
|
| 100 |
64-K dynamic RAM needs only one 5-volt supply to outstrip 16-K parts
|
|
|
1979
|
19 |
3 |
p. 195-
1 p.
|
article
|
| 101 |
Laser drilling of vias in dielectric for high density multi-layer thick film circuits
|
|
|
1979
|
19 |
3 |
p. 202-
1 p.
|
article
|
| 102 |
LSI boards give testers fits
|
|
|
1979
|
19 |
3 |
p. 195-
1 p.
|
article
|
| 103 |
LSI-board testing bedevils users
|
|
|
1979
|
19 |
3 |
p. 189-
1 p.
|
article
|
| 104 |
LSI chip provides 600-gate array in semi-custom setup
|
|
|
1979
|
19 |
3 |
p. 195-
1 p.
|
article
|
| 105 |
LSI PC assembly testing using parallel pin electronics
|
|
|
1979
|
19 |
3 |
p. 196-
1 p.
|
article
|
| 106 |
Magnetic field dependence of the valley splitting in n-type inverted silicon MOSFET surfaces
|
|
|
1979
|
19 |
3 |
p. 198-
1 p.
|
article
|
| 107 |
Measurement of minority carrier lifetime and diffusion length in silicon epitaxial layers by means of the photo-current technique
|
|
|
1979
|
19 |
3 |
p. 197-
1 p.
|
article
|
| 108 |
Measurement of the lattice constant of Si-Ge heteroepitaxial layers grown on a silicon substrate
|
|
|
1979
|
19 |
3 |
p. 198-
1 p.
|
article
|
| 109 |
Mechanism of wear by ribbon and paper
|
|
|
1979
|
19 |
3 |
p. 188-
1 p.
|
article
|
| 110 |
Mehr zuverlassigkeit bei hochspannungskaskaden für farbfernseher
|
|
|
1979
|
19 |
3 |
p. 187-
1 p.
|
article
|
| 111 |
Metal-n-type semiconductor ohmic contact with a shallow N+ surface layer
|
|
|
1979
|
19 |
3 |
p. 197-
1 p.
|
article
|
| 112 |
Microcomputers do on-chip a-d conversion
|
|
|
1979
|
19 |
3 |
p. 191-
1 p.
|
article
|
| 113 |
Microelectronic realization of digital systems by microprogrammed memories
|
|
|
1979
|
19 |
3 |
p. 195-
1 p.
|
article
|
| 114 |
Microprocessor makes alphanumeric display smart
|
|
|
1979
|
19 |
3 |
p. 196-
1 p.
|
article
|
| 115 |
Microprocessors for high accuracy component measurement
|
|
|
1979
|
19 |
3 |
p. 194-195
2 p.
|
article
|
| 116 |
Missile makers eagerly await LSI
|
|
|
1979
|
19 |
3 |
p. 195-
1 p.
|
article
|
| 117 |
New substrate causes a stir
|
|
|
1979
|
19 |
3 |
p. 201-
1 p.
|
article
|
| 118 |
Nondestructive bond pull in high-reliability applications
|
|
|
1979
|
19 |
3 |
p. 186-
1 p.
|
article
|
| 119 |
Nondestructive examination of multilayer capacitors by neutron radiography
|
|
|
1979
|
19 |
3 |
p. 187-
1 p.
|
article
|
| 120 |
Non uniform recombination in thin silicon-on-sapphire films
|
|
|
1979
|
19 |
3 |
p. 201-202
2 p.
|
article
|
| 121 |
Nuclear power station safety
|
|
|
1979
|
19 |
3 |
p. 188-
1 p.
|
article
|
| 122 |
Nucleation of electron-hole droplets swirl defects in silicon
|
|
|
1979
|
19 |
3 |
p. 197-
1 p.
|
article
|
| 123 |
Numerical analysis of electric semiconductor structures
|
|
|
1979
|
19 |
3 |
p. 199-
1 p.
|
article
|
| 124 |
Observations of dislocations and junction irregularities in bipolar transistors using the E.B.I.C. mode of the scanning electron microscope
|
|
|
1979
|
19 |
3 |
p. 199-
1 p.
|
article
|
| 125 |
On a two unit standby redundant system with imperfect switchover
|
|
|
1979
|
19 |
3 |
p. 189-
1 p.
|
article
|
| 126 |
On reliability of a computer network
|
Soi, Inder M.
|
|
1979
|
19 |
3 |
p. 237-241
5 p.
|
article
|
| 127 |
Optimum inspection-ordering policies with salvage cost
|
|
|
1979
|
19 |
3 |
p. 189-
1 p.
|
article
|
| 128 |
Output probability expression for general combinational networks
|
|
|
1979
|
19 |
3 |
p. 188-
1 p.
|
article
|
| 129 |
Oxygen content and oxide barrier thickness in granular aluminium films
|
|
|
1979
|
19 |
3 |
p. 201-
1 p.
|
article
|
| 130 |
Partitioning of modular equipment for fault isolation
|
|
|
1979
|
19 |
3 |
p. 189-
1 p.
|
article
|
| 131 |
Photocurrents in silicon nitride films
|
|
|
1979
|
19 |
3 |
p. 201-
1 p.
|
article
|
| 132 |
Piezoresistance effect in Pb0,82Sn0.18Te films
|
|
|
1979
|
19 |
3 |
p. 201-
1 p.
|
article
|
| 133 |
64-pin QUIP keeps microprocessor chips cool and accessible
|
|
|
1979
|
19 |
3 |
p. 196-
1 p.
|
article
|
| 134 |
Pluribus—an operational fault-tolerant multiprocessor
|
|
|
1979
|
19 |
3 |
p. 190-
1 p.
|
article
|
| 135 |
Problems in reliability and maintainability (RAM) delivery systems
|
Reiche, H.
|
|
1979
|
19 |
3 |
p. 183-184
2 p.
|
article
|
| 136 |
Procurement specification requirements for protection against electromigration failures in aluminium metallizations
|
Sim, S.P.
|
|
1979
|
19 |
3 |
p. 207-218
12 p.
|
article
|
| 137 |
Product liability—Progress toward a solution
|
|
|
1979
|
19 |
3 |
p. 185-
1 p.
|
article
|
| 138 |
Publications, notices, calls for papers, etc.
|
|
|
1979
|
19 |
3 |
p. 173-181
9 p.
|
article
|
| 139 |
Random percolation in metal—Ge mixtures
|
|
|
1979
|
19 |
3 |
p. 198-
1 p.
|
article
|
| 140 |
Recombination at deep-traps
|
|
|
1979
|
19 |
3 |
p. 198-
1 p.
|
article
|
| 141 |
Recombination enhanced defect reactions
|
|
|
1979
|
19 |
3 |
p. 198-199
2 p.
|
article
|
| 142 |
Recombination level selection criteria for lifetime reduction in integrated circuits
|
|
|
1979
|
19 |
3 |
p. 191-
1 p.
|
article
|
| 143 |
Reliability analysis of systems composed of elements with three states
|
Ksir, B.
|
|
1979
|
19 |
3 |
p. 229-231
3 p.
|
article
|
| 144 |
Reliability evaluation and failure analysis for multilayer ceramic chip capacitors
|
|
|
1979
|
19 |
3 |
p. 185-
1 p.
|
article
|
| 145 |
Reliability of plastic encapsulated semiconductor devices and integrated circuits
|
|
|
1979
|
19 |
3 |
p. 186-
1 p.
|
article
|
| 146 |
Repairable systems with one standby unit
|
Elsayed, E.A.
|
|
1979
|
19 |
3 |
p. 243-245
3 p.
|
article
|
| 147 |
Scanning photocurrent microscopy: A new technique to study inhomogeneously distributed recombination centers in semiconductors
|
|
|
1979
|
19 |
3 |
p. 198-
1 p.
|
article
|
| 148 |
Second-generation microcontrollers take on dedicated-function tasks
|
|
|
1979
|
19 |
3 |
p. 191-
1 p.
|
article
|
| 149 |
Short-term and long-term performance of electrolytic capacitors
|
|
|
1979
|
19 |
3 |
p. 187-
1 p.
|
article
|
| 150 |
SIFT: design and analysis of a fault-tolerant computer for aircraft control
|
|
|
1979
|
19 |
3 |
p. 190-
1 p.
|
article
|
| 151 |
Silicon growers try to cut cost/watt
|
|
|
1979
|
19 |
3 |
p. 195-
1 p.
|
article
|
| 152 |
Simulation of RL impedances suitable for micro-miniaturization
|
Rathore, T.S.
|
|
1979
|
19 |
3 |
p. 233-235
3 p.
|
article
|
| 153 |
State of the art in semiconductor materials and processing for microcircuit reliab.
|
|
|
1979
|
19 |
3 |
p. 185-
1 p.
|
article
|
| 154 |
Step-stress accelerated life testing of diodes
|
Bora, J.S.
|
|
1979
|
19 |
3 |
p. 279-280
2 p.
|
article
|
| 155 |
Stochastic analysis of temperature spikes contribution towards the damage in a component exposed to nuclear radiation environment
|
|
|
1979
|
19 |
3 |
p. 187-188
2 p.
|
article
|
| 156 |
Stochastic behaviour of a 1-server 2-unit hot standby system
|
|
|
1979
|
19 |
3 |
p. 189-
1 p.
|
article
|
| 157 |
Stochastic behaviour of a 2-unit system with 1-server subject to delayed maintenance
|
|
|
1979
|
19 |
3 |
p. 189-
1 p.
|
article
|
| 158 |
Studies of the use of microcellular structures
|
|
|
1979
|
19 |
3 |
p. 196-
1 p.
|
article
|
| 159 |
Symbolic reliability evaluation of reducible networks
|
Misra, R.B.
|
|
1979
|
19 |
3 |
p. 253-257
5 p.
|
article
|
| 160 |
Tackling the very large-scale problems of VLSI: a special report
|
|
|
1979
|
19 |
3 |
p. 191-
1 p.
|
article
|
| 161 |
Techmology update
|
|
|
1979
|
19 |
3 |
p. 191-
1 p.
|
article
|
| 162 |
The breakdown voltage of planar Schottky diodes
|
|
|
1979
|
19 |
3 |
p. 188-
1 p.
|
article
|
| 163 |
The decision to replace a unit early or late in an age replacement problem
|
Nakagawa, T.
|
|
1979
|
19 |
3 |
p. 265-267
3 p.
|
article
|
| 164 |
The design of a solid state trip system for nuclear power plants
|
|
|
1979
|
19 |
3 |
p. 189-190
2 p.
|
article
|
| 165 |
The design of microcomputer systems
|
|
|
1979
|
19 |
3 |
p. 194-
1 p.
|
article
|
| 166 |
The dopant density and temperature dependence of hole mobility and resistivity in boron doped silicon
|
|
|
1979
|
19 |
3 |
p. 197-
1 p.
|
article
|
| 167 |
The kinetics of open tube phosphorus diffusion in silicon
|
|
|
1979
|
19 |
3 |
p. 193-
1 p.
|
article
|
| 168 |
The microelectronic wire bond pull test—How to use it, how to abuse it
|
|
|
1979
|
19 |
3 |
p. 185-186
2 p.
|
article
|
| 169 |
The microprocessor in video editing
|
|
|
1979
|
19 |
3 |
p. 195-
1 p.
|
article
|
| 170 |
The phonon-mediated intervalley electron-electron interaction in silicon
|
|
|
1979
|
19 |
3 |
p. 197-
1 p.
|
article
|
| 171 |
The practice of quality control
|
|
|
1979
|
19 |
3 |
p. 185-
1 p.
|
article
|
| 172 |
The preparation, structure and properties of Pb0.82Sn0.18Te films obtained by modified hot-wall evaporation technique
|
|
|
1979
|
19 |
3 |
p. 200-
1 p.
|
article
|
| 173 |
The reliability of electronic devices in storage environments
|
|
|
1979
|
19 |
3 |
p. 187-
1 p.
|
article
|
| 174 |
The reliability of plastic microcircuits in moist environments
|
|
|
1979
|
19 |
3 |
p. 187-
1 p.
|
article
|
| 175 |
The use of a four-point probe for profiling sub-micron layers
|
|
|
1979
|
19 |
3 |
p. 196-197
2 p.
|
article
|
| 176 |
The use of VLSI in the design of teletext receivers
|
|
|
1979
|
19 |
3 |
p. 195-
1 p.
|
article
|
| 177 |
Thick film distributed notch filters
|
|
|
1979
|
19 |
3 |
p. 200-
1 p.
|
article
|
| 178 |
Thinning method for electron microscopy transparent silicon and germanium foils
|
|
|
1979
|
19 |
3 |
p. 202-
1 p.
|
article
|
| 179 |
Time dependence of ion-migration effects in NiCr resistor films
|
|
|
1979
|
19 |
3 |
p. 199-
1 p.
|
article
|
| 180 |
Transient damage resulting in failure of a component exposed to ionizing radiation environment
|
Yadav, R.P.S.
|
|
1979
|
19 |
3 |
p. 223-227
5 p.
|
article
|
| 181 |
Ultra-high vacuum systems for surface research
|
|
|
1979
|
19 |
3 |
p. 201-
1 p.
|
article
|
| 182 |
Use of ion implantation in future GaAs technology
|
|
|
1979
|
19 |
3 |
p. 203-
1 p.
|
article
|
| 183 |
VCNR type characteristic in thin film amorphous Te-Ge-As-Si films
|
|
|
1979
|
19 |
3 |
p. 202-
1 p.
|
article
|
| 184 |
Vector-scan E beam aims for wafers as well as masks
|
|
|
1979
|
19 |
3 |
p. 202-
1 p.
|
article
|
| 185 |
Wafer scale integration—some approaches to the interconnection problem
|
|
|
1979
|
19 |
3 |
p. 192-
1 p.
|
article
|
| 186 |
Work-hardening of ferrite head surfaces by wear with flexible recording media
|
|
|
1979
|
19 |
3 |
p. 188-
1 p.
|
article
|
| 187 |
X-ray lithography breaks the VLSI cost barrier
|
|
|
1979
|
19 |
3 |
p. 193-
1 p.
|
article
|
Journal description