| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A bibliography on semiconductor wafer preparation
|
|
|
1974
|
13 |
3 |
p. 163-
1 p.
|
artikel
|
| 2 |
Accurately trimming closed resistor loops
|
|
|
1974
|
13 |
3 |
p. 170-
1 p.
|
artikel
|
| 3 |
A high level fast limiting switch as a hybrid module
|
|
|
1974
|
13 |
3 |
p. 166-
1 p.
|
artikel
|
| 4 |
A hybrid module for the computerised monitering of electronic equipment
|
|
|
1974
|
13 |
3 |
p. 166-
1 p.
|
artikel
|
| 5 |
A measurement technique of time-dependent dielectric breakdown in MOS capacitors
|
Li, Seung P.
|
|
1974
|
13 |
3 |
p. 209-214
6 p.
|
artikel
|
| 6 |
A new gold metallization system
|
|
|
1974
|
13 |
3 |
p. 169-
1 p.
|
artikel
|
| 7 |
A new method for system reliability evaluation
|
|
|
1974
|
13 |
3 |
p. 163-
1 p.
|
artikel
|
| 8 |
A new method to determine the failure frequency of a complex system
|
|
|
1974
|
13 |
3 |
p. 163-
1 p.
|
artikel
|
| 9 |
Application of new methods and techniques for failure analysis
|
|
|
1974
|
13 |
3 |
p. 162-
1 p.
|
artikel
|
| 10 |
Arsenic determination in silicon by X-ray fluorescence
|
|
|
1974
|
13 |
3 |
p. 168-
1 p.
|
artikel
|
| 11 |
A thick film guidance unit for the rapier missile
|
|
|
1974
|
13 |
3 |
p. 166-
1 p.
|
artikel
|
| 12 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1974
|
13 |
3 |
p. 151-152
2 p.
|
artikel
|
| 13 |
Characterization of multiple deep level systems in semiconductor junctions by admittance measurements
|
|
|
1974
|
13 |
3 |
p. 167-
1 p.
|
artikel
|
| 14 |
Complex system reliability with general repair time distributions under head-of-line-repair-discipline
|
|
|
1974
|
13 |
3 |
p. 163-
1 p.
|
artikel
|
| 15 |
Conference report 20th Annual Reliability and Maintainability Symposium
|
Jacobs, R.M.
|
|
1974
|
13 |
3 |
p. 157-159
3 p.
|
artikel
|
| 16 |
Consumer electronics heading for a year of improvements, paced by monolithic ICs
|
|
|
1974
|
13 |
3 |
p. 166-
1 p.
|
artikel
|
| 17 |
Crystal diameter control in Czocbralski growth
|
|
|
1974
|
13 |
3 |
p. 168-
1 p.
|
artikel
|
| 18 |
Degradation of thick film conductor adhesion
|
|
|
1974
|
13 |
3 |
p. 170-
1 p.
|
artikel
|
| 19 |
Determination of the energy distribution of interface traps in MIS systems using non-steady-state techniques
|
|
|
1974
|
13 |
3 |
p. 168-
1 p.
|
artikel
|
| 20 |
Effects of ozone on the crosslinking of photoresists
|
|
|
1974
|
13 |
3 |
p. 164-
1 p.
|
artikel
|
| 21 |
Electrical activity of defects created in silicon single crystals during ion implantation
|
|
|
1974
|
13 |
3 |
p. 171-172
2 p.
|
artikel
|
| 22 |
Electromigration testing—A current problem
|
Braun, Leonard
|
|
1974
|
13 |
3 |
p. 215-228
14 p.
|
artikel
|
| 23 |
Emitter-follower logic pushes hipolar designs into LSI realm
|
|
|
1974
|
13 |
3 |
p. 165-166
2 p.
|
artikel
|
| 24 |
Etude et realisation en microelectronique hyperfrequence de melangours a faible bruit associes a des preamplificateurs a frequence intermediaire
|
|
|
1974
|
13 |
3 |
p. 170-
1 p.
|
artikel
|
| 25 |
Evaluation des differentes technologies MOS (MOS technologies evaluation)
|
|
|
1974
|
13 |
3 |
p. 165-
1 p.
|
artikel
|
| 26 |
Evaluation methods for the examination of thick film materials
|
|
|
1974
|
13 |
3 |
p. 171-
1 p.
|
artikel
|
| 27 |
Fabrication and some applications of large-area silicon field emission arrays
|
|
|
1974
|
13 |
3 |
p. 167-168
2 p.
|
artikel
|
| 28 |
Factors affecting the reliability of field instruments
|
Rowse, A.A.
|
|
1974
|
13 |
3 |
p. 175-179
5 p.
|
artikel
|
| 29 |
Fault detection in arbitrarity large finite cellular arrays
|
|
|
1974
|
13 |
3 |
p. 162-
1 p.
|
artikel
|
| 30 |
Five-year plan goal: improved mechanisms for IC reliability
|
|
|
1974
|
13 |
3 |
p. 162-
1 p.
|
artikel
|
| 31 |
Forced air cooling in high-density systems
|
|
|
1974
|
13 |
3 |
p. 162-
1 p.
|
artikel
|
| 32 |
Hybrid circuits—fluding their place
|
|
|
1974
|
13 |
3 |
p. 169-
1 p.
|
artikel
|
| 33 |
Hybrid circuits in 120 MBIT/S repeaters
|
|
|
1974
|
13 |
3 |
p. 166-
1 p.
|
artikel
|
| 34 |
Hybrid integrated oscillator for push-button dialing
|
|
|
1974
|
13 |
3 |
p. 165-
1 p.
|
artikel
|
| 35 |
Hybrid techniques for computer circuits—III. Signal interconnection networks for integrated circuit chips
|
|
|
1974
|
13 |
3 |
p. 164-
1 p.
|
artikel
|
| 36 |
Hybrid Techniques for computer circuits—I. Interconnection Hierarchy
|
|
|
1974
|
13 |
3 |
p. 164-
1 p.
|
artikel
|
| 37 |
Hybrid techniques for computer circuits—II. The thick film aspects of a high thermal dissipation interconnection system for use with integrated circuits
|
|
|
1974
|
13 |
3 |
p. 164-
1 p.
|
artikel
|
| 38 |
Hybrid thin-film technology for microwave integrated circuits
|
|
|
1974
|
13 |
3 |
p. 166-167
2 p.
|
artikel
|
| 39 |
IC timer makes economical automobile voltage regulator
|
|
|
1974
|
13 |
3 |
p. 166-
1 p.
|
artikel
|
| 40 |
Improved, glass-ceramic, thick film capacitors
|
|
|
1974
|
13 |
3 |
p. 171-
1 p.
|
artikel
|
| 41 |
Improved MOS technology using ion implantation
|
|
|
1974
|
13 |
3 |
p. 171-
1 p.
|
artikel
|
| 42 |
Improvement in adjustment failures of crossbar switches
|
|
|
1974
|
13 |
3 |
p. 163-
1 p.
|
artikel
|
| 43 |
Improvements of plasma spraying processes for hybrid microelectronics
|
|
|
1974
|
13 |
3 |
p. 171-
1 p.
|
artikel
|
| 44 |
Impurity profile in tin deped GaAs epitaxial layers
|
|
|
1974
|
13 |
3 |
p. 169-
1 p.
|
artikel
|
| 45 |
Indefinite admittance matrix of a five-layer thin-film integrated structure
|
Kamal, A.K.
|
|
1974
|
13 |
3 |
p. 229-232
4 p.
|
artikel
|
| 46 |
Influence of the load of the emitter-base transition on transistor parameters and integrated circuits
|
|
|
1974
|
13 |
3 |
p. 168-
1 p.
|
artikel
|
| 47 |
Insuring the reliability of heavy-current electrical equipment
|
|
|
1974
|
13 |
3 |
p. 163-
1 p.
|
artikel
|
| 48 |
Irradiation test and preselection of maverick diodes for the project symphonie satellite
|
|
|
1974
|
13 |
3 |
p. 161-
1 p.
|
artikel
|
| 49 |
Large thick-film multilayer substrates for dil-packages
|
|
|
1974
|
13 |
3 |
p. 164-165
2 p.
|
artikel
|
| 50 |
LOCMOS, a new complementary MOS technology
|
|
|
1974
|
13 |
3 |
p. 166-
1 p.
|
artikel
|
| 51 |
Logic's leap ahead creates new design tools for old and new applications
|
|
|
1974
|
13 |
3 |
p. 164-
1 p.
|
artikel
|
| 52 |
Low noise hybrid microwave amplifier and mixer using thick film techniques
|
|
|
1974
|
13 |
3 |
p. 166-
1 p.
|
artikel
|
| 53 |
Low temperature methods of attachment of active devices to thick film circuits
|
|
|
1974
|
13 |
3 |
p. 164-
1 p.
|
artikel
|
| 54 |
Manufacture of Al-Si Schottky contacts for Schottky FET
|
|
|
1974
|
13 |
3 |
p. 168-
1 p.
|
artikel
|
| 55 |
Mass spectrometric analysis of the sputter gas atmosphere without pressure reduction system
|
|
|
1974
|
13 |
3 |
p. 170-
1 p.
|
artikel
|
| 56 |
Microcircuit thermal design simplified by the superposition principle
|
|
|
1974
|
13 |
3 |
p. 164-
1 p.
|
artikel
|
| 57 |
Microelectronics: a new dimension of electronics
|
|
|
1974
|
13 |
3 |
p. 163-
1 p.
|
artikel
|
| 58 |
Microelectronics in data processing systems
|
|
|
1974
|
13 |
3 |
p. 165-
1 p.
|
artikel
|
| 59 |
Minis and mini peripherals will lean more on LSI, and software will be easier to use
|
|
|
1974
|
13 |
3 |
p. 166-
1 p.
|
artikel
|
| 60 |
Modern techniques for resistor reliability testing
|
|
|
1974
|
13 |
3 |
p. 161-162
2 p.
|
artikel
|
| 61 |
Monolithic voltage-ratio-circuit performance limits
|
|
|
1974
|
13 |
3 |
p. 164-
1 p.
|
artikel
|
| 62 |
Morphology and thickness of GaP layers and composition of Ga1−xAlxAs layers grown by liquid phase epitaxy
|
|
|
1974
|
13 |
3 |
p. 167-
1 p.
|
artikel
|
| 63 |
No. 1 ESS Processers: How dependable have they been
|
|
|
1974
|
13 |
3 |
p. 162-
1 p.
|
artikel
|
| 64 |
Notices and calls for papers
|
|
|
1974
|
13 |
3 |
p. 153-155
3 p.
|
artikel
|
| 65 |
Odd parity donor levels of germanium in a magnetic field
|
|
|
1974
|
13 |
3 |
p. 169-
1 p.
|
artikel
|
| 66 |
Off time distributions in an alternating renewal process with reliability applications
|
Nakagawa, T.
|
|
1974
|
13 |
3 |
p. 181-184
4 p.
|
artikel
|
| 67 |
On crystallization by temperature-gradient reversal
|
|
|
1974
|
13 |
3 |
p. 167-
1 p.
|
artikel
|
| 68 |
On prediction problems in reliability
|
|
|
1974
|
13 |
3 |
p. 161-
1 p.
|
artikel
|
| 69 |
Papers to be published in future issues
|
|
|
1974
|
13 |
3 |
p. 173-
1 p.
|
artikel
|
| 70 |
Principles of thick film materials formulation
|
|
|
1974
|
13 |
3 |
p. 171-
1 p.
|
artikel
|
| 71 |
Quality control for a guaranteed product
|
Bishop, W.B.
|
|
1974
|
13 |
3 |
p. 185-194
10 p.
|
artikel
|
| 72 |
Quenched-in centers in silicon P + N junctions
|
|
|
1974
|
13 |
3 |
p. 167-
1 p.
|
artikel
|
| 73 |
Reduce system noise with CMOS circuits
|
|
|
1974
|
13 |
3 |
p. 165-
1 p.
|
artikel
|
| 74 |
Reliability analysis for a two-unit redundant system with repair
|
|
|
1974
|
13 |
3 |
p. 162-
1 p.
|
artikel
|
| 75 |
Reliability optimization with integer constraint coefficients
|
|
|
1974
|
13 |
3 |
p. 163-
1 p.
|
artikel
|
| 76 |
Reliability prediction and growth studies—How accurate and useful?
|
Prasad, P.S.K.
|
|
1974
|
13 |
3 |
p. 195-202
8 p.
|
artikel
|
| 77 |
Screens for screen printing of electronic circuits
|
Dubey, G.C.
|
|
1974
|
13 |
3 |
p. 203-207
5 p.
|
artikel
|
| 78 |
Semiconductor memories
|
|
|
1974
|
13 |
3 |
p. 165-
1 p.
|
artikel
|
| 79 |
Shubnikov—de Haas oscillations in p-type inversion layers on n-type silicon
|
|
|
1974
|
13 |
3 |
p. 169-
1 p.
|
artikel
|
| 80 |
Silver transfer through thick film insulants
|
|
|
1974
|
13 |
3 |
p. 162-
1 p.
|
artikel
|
| 81 |
Simplified n-channel process achieves high performance
|
|
|
1974
|
13 |
3 |
p. 171-
1 p.
|
artikel
|
| 82 |
Surface electric properties of Al-Si3N4-Si structures
|
|
|
1974
|
13 |
3 |
p. 168-169
2 p.
|
artikel
|
| 83 |
Surface properties of electron-hole droplets in semiconductors
|
|
|
1974
|
13 |
3 |
p. 169-
1 p.
|
artikel
|
| 84 |
Tantalum thin film technology
|
|
|
1974
|
13 |
3 |
p. 170-
1 p.
|
artikel
|
| 85 |
Techniques of laser trimming
|
|
|
1974
|
13 |
3 |
p. 171-
1 p.
|
artikel
|
| 86 |
Technological and economic aspects of hybrid circuit production
|
|
|
1974
|
13 |
3 |
p. 170-
1 p.
|
artikel
|
| 87 |
The assessment of connector reliability
|
|
|
1974
|
13 |
3 |
p. 161-
1 p.
|
artikel
|
| 88 |
The designer's need for information on the reliability of Hybrids
|
|
|
1974
|
13 |
3 |
p. 162-
1 p.
|
artikel
|
| 89 |
The effect of condensation heat of gate electrode metal upon stability and dielectric strength of MOS structures
|
|
|
1974
|
13 |
3 |
p. 169-
1 p.
|
artikel
|
| 90 |
The effect of some process and material variables on the properties of thick film microwave transmission lines
|
|
|
1974
|
13 |
3 |
p. 171-
1 p.
|
artikel
|
| 91 |
The feasibility of ultrasonic welding flip chips to thick film conductors
|
|
|
1974
|
13 |
3 |
p. 165-
1 p.
|
artikel
|
| 92 |
Theory of transient emission current in MOS devices and the direct determination interface trap parameters
|
|
|
1974
|
13 |
3 |
p. 168-
1 p.
|
artikel
|
| 93 |
The production and reliability problems of very small screen printed resistors
|
|
|
1974
|
13 |
3 |
p. 162-
1 p.
|
artikel
|
| 94 |
The radio frequency properties of thick film components
|
|
|
1974
|
13 |
3 |
p. 170-171
2 p.
|
artikel
|
| 95 |
The reliability of coherent structures—a parametric approach
|
|
|
1974
|
13 |
3 |
p. 163-
1 p.
|
artikel
|
| 96 |
Thermal considerations in hybrid forms of construction
|
|
|
1974
|
13 |
3 |
p. 164-
1 p.
|
artikel
|
| 97 |
Thick film circuits
|
|
|
1974
|
13 |
3 |
p. 170-
1 p.
|
artikel
|
| 98 |
Thick film hybrid circuits
|
|
|
1974
|
13 |
3 |
p. 170-
1 p.
|
artikel
|
| 99 |
Thick film oscillators in the 150–200 MHz range with thermostatic control
|
|
|
1974
|
13 |
3 |
p. 166-
1 p.
|
artikel
|
| 100 |
Thickfilm technique for hybrid integrated microwave circuits
|
|
|
1974
|
13 |
3 |
p. 170-
1 p.
|
artikel
|
| 101 |
Thin GaAs layers grown by liquid phase epitaxy
|
|
|
1974
|
13 |
3 |
p. 169-
1 p.
|
artikel
|
| 102 |
Tuneable thick film circuits at ultra high frequencies
|
|
|
1974
|
13 |
3 |
p. 166-
1 p.
|
artikel
|
| 103 |
Twelve-bit microprocessor nears minicomputer's performance level
|
|
|
1974
|
13 |
3 |
p. 165-
1 p.
|
artikel
|
| 104 |
Ultra-pure water; a new utility
|
|
|
1974
|
13 |
3 |
p. 165-
1 p.
|
artikel
|
| 105 |
Valence band state densities of tetrahedrally coordinated amorphous semiconductors
|
|
|
1974
|
13 |
3 |
p. 169-
1 p.
|
artikel
|
| 106 |
Vapour-phase epitaxy of III–V pseudo-binary compounds
|
|
|
1974
|
13 |
3 |
p. 167-
1 p.
|
artikel
|
| 107 |
Which IC timer to buy?
|
|
|
1974
|
13 |
3 |
p. 165-
1 p.
|
artikel
|
| 108 |
Why go thick film?
|
|
|
1974
|
13 |
3 |
p. 169-170
2 p.
|
artikel
|
| 109 |
ZrB2—A new thin film resistor material for hybrid microwave technology
|
|
|
1974
|
13 |
3 |
p. 171-
1 p.
|
artikel
|
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