nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A Bayesian estimate of reliability in the Weibull distribution
|
Jayaram, Y.G. |
|
1974 |
13 |
1 |
p. 29-32 4 p. |
artikel |
2 |
A bilevel thin film hybrid circuit containing crossovers, resistors, capacitors, and integrated circuits
|
|
|
1974 |
13 |
1 |
p. 19- 1 p. |
artikel |
3 |
A broad-band thin-film lumped-element circulator for 1·7 GHz band
|
|
|
1974 |
13 |
1 |
p. 19- 1 p. |
artikel |
4 |
A critical review of human performance reliability predictive methods
|
|
|
1974 |
13 |
1 |
p. 9- 1 p. |
artikel |
5 |
A fast method for redundancy allocation
|
|
|
1974 |
13 |
1 |
p. 13- 1 p. |
artikel |
6 |
A method of redundancy allocation
|
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|
1974 |
13 |
1 |
p. 13- 1 p. |
artikel |
7 |
Analysis can take the heat off power semiconductors
|
|
|
1974 |
13 |
1 |
p. 15- 1 p. |
artikel |
8 |
Analytic study of a stand-by redundant equipment with switching and shelf life failures
|
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|
1974 |
13 |
1 |
p. 13- 1 p. |
artikel |
9 |
A new approach to high temperature crystal growth from the melt
|
|
|
1974 |
13 |
1 |
p. 18- 1 p. |
artikel |
10 |
A note on the statistics of reliability assessment
|
Lukis, L.W.F. |
|
1974 |
13 |
1 |
p. 51-54 4 p. |
artikel |
11 |
An SiO2-Ta2O5 thin film capacitor
|
|
|
1974 |
13 |
1 |
p. 20- 1 p. |
artikel |
12 |
An ultrasonic bond, monometallic, gold interconnection technique for integrated packages
|
|
|
1974 |
13 |
1 |
p. 15- 1 p. |
artikel |
13 |
Application of the optimal control model for the human operator to reliability assessment
|
|
|
1974 |
13 |
1 |
p. 11- 1 p. |
artikel |
14 |
A reliability model for stress vs strength problem
|
|
|
1974 |
13 |
1 |
p. 9- 1 p. |
artikel |
15 |
A review of new methods and attitudes in reliability engineering
|
|
|
1974 |
13 |
1 |
p. 9-10 2 p. |
artikel |
16 |
A simplified approach to hybrid thermal design
|
|
|
1974 |
13 |
1 |
p. 19- 1 p. |
artikel |
17 |
A study of metal-insulator transitions
|
|
|
1974 |
13 |
1 |
p. 16- 1 p. |
artikel |
18 |
A test for lateral nonuniformities in mos devices using only capacitanse curves
|
|
|
1974 |
13 |
1 |
p. 17- 1 p. |
artikel |
19 |
A thin-film high sheet resistivity material
|
|
|
1974 |
13 |
1 |
p. 18- 1 p. |
artikel |
20 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1974 |
13 |
1 |
p. 1-2 2 p. |
artikel |
21 |
Characteristics and origin of emitter-collector shorts, or “Pipes”, in Multi-emitter power transistors
|
|
|
1974 |
13 |
1 |
p. 10- 1 p. |
artikel |
22 |
Chopper-stabilized op amp combines MOS and bipolar elements on one chip
|
|
|
1974 |
13 |
1 |
p. 15- 1 p. |
artikel |
23 |
C-MOS teams with liquid crystals to make a reliable digital VOM
|
|
|
1974 |
13 |
1 |
p. 15- 1 p. |
artikel |
24 |
Cognitive reliability in manned systems
|
|
|
1974 |
13 |
1 |
p. 11- 1 p. |
artikel |
25 |
Comparison of models for redistribution of dopants in silicon during thermal oxidation
|
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|
1974 |
13 |
1 |
p. 16- 1 p. |
artikel |
26 |
Complex system reliability with exponential repair time distributions under head-of-line-repair-discipline
|
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|
1974 |
13 |
1 |
p. 11- 1 p. |
artikel |
27 |
Complex system reliability with general repair time distributions under preemptive repeat repair discipline
|
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|
1974 |
13 |
1 |
p. 11- 1 p. |
artikel |
28 |
Complex system reliability with general repair time distributions under preemptive resume repair discipline
|
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|
1974 |
13 |
1 |
p. 13- 1 p. |
artikel |
29 |
Controlling heat transport during crystal pulling
|
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|
1974 |
13 |
1 |
p. 16- 1 p. |
artikel |
30 |
Correction to a paper by Srivastava, Garg and Govil
|
Kapur, P.K. |
|
1974 |
13 |
1 |
p. 57-58 2 p. |
artikel |
31 |
Courses
|
|
|
1974 |
13 |
1 |
p. 5-6 2 p. |
artikel |
32 |
Design of precision thin film resistive networks
|
Bredenkamp, G.L. |
|
1974 |
13 |
1 |
p. 49-50 2 p. |
artikel |
33 |
Determination of the capture cross-section of hole-trapping centres in SiO2
|
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|
1974 |
13 |
1 |
p. 17-18 2 p. |
artikel |
34 |
Development of generalized theory of floating-emitter potential based on studies of germanium and silicon transistors
|
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|
1974 |
13 |
1 |
p. 15- 1 p. |
artikel |
35 |
Digital-IC models for computer-aided design—1. TTL NAND gates
|
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|
1974 |
13 |
1 |
p. 14- 1 p. |
artikel |
36 |
Diodes for Hybrid Integrated Circuits
|
|
|
1974 |
13 |
1 |
p. 18- 1 p. |
artikel |
37 |
Distribution of time to non-availability of a reliability system
|
|
|
1974 |
13 |
1 |
p. 12- 1 p. |
artikel |
38 |
Drift of the breakdown voltage in highly doped planar junctions
|
|
|
1974 |
13 |
1 |
p. 16- 1 p. |
artikel |
39 |
Dynamic malfunction limits in high-speed TTL and ECL integrated digital gates
|
|
|
1974 |
13 |
1 |
p. 14- 1 p. |
artikel |
40 |
Editorial Board
|
|
|
1974 |
13 |
1 |
p. IFC- 1 p. |
artikel |
41 |
Effective recombination levels in N- and P-Type silicon irradiated by 4·5 MeV Electrons
|
|
|
1974 |
13 |
1 |
p. 17- 1 p. |
artikel |
42 |
Epoxy device bonding and die handling techniques for hybrid microcircuits
|
|
|
1974 |
13 |
1 |
p. 20- 1 p. |
artikel |
43 |
Erratum
|
|
|
1974 |
13 |
1 |
p. 59- 1 p. |
artikel |
44 |
Failure diagnosis using quadratic programming
|
|
|
1974 |
13 |
1 |
p. 13- 1 p. |
artikel |
45 |
Fault diagnosis using time domain measurements
|
|
|
1974 |
13 |
1 |
p. 12- 1 p. |
artikel |
46 |
High capacity liquid phase epitaxy apparatus utilizing thin melts
|
|
|
1974 |
13 |
1 |
p. 17- 1 p. |
artikel |
47 |
Human reliability in computer-based business information systems
|
|
|
1974 |
13 |
1 |
p. 12- 1 p. |
artikel |
48 |
Industry standardization of silicon substrates
|
|
|
1974 |
13 |
1 |
p. 13-14 2 p. |
artikel |
49 |
Integrated MOS distributed RC networks for frequency selective circuits
|
|
|
1974 |
13 |
1 |
p. 19-20 2 p. |
artikel |
50 |
Integrated multiplier simplifies wattmeter design
|
|
|
1974 |
13 |
1 |
p. 15- 1 p. |
artikel |
51 |
Large IC chip impact analysis and handling protection
|
|
|
1974 |
13 |
1 |
p. 14-15 2 p. |
artikel |
52 |
Laser trimming of thick-film resistors
|
|
|
1974 |
13 |
1 |
p. 20- 1 p. |
artikel |
53 |
Lead frame bonding
|
|
|
1974 |
13 |
1 |
p. 15- 1 p. |
artikel |
54 |
Liquid immersion cooling of small electronic devices
|
|
|
1974 |
13 |
1 |
p. 14- 1 p. |
artikel |
55 |
Localized and nonlocalized impurity states in amorphous germanium
|
|
|
1974 |
13 |
1 |
p. 18- 1 p. |
artikel |
56 |
Metallurgical behaviour of gold wire thermal compression bonding
|
|
|
1974 |
13 |
1 |
p. 15- 1 p. |
artikel |
57 |
Microdefects in dislocaion-free silicon and germanium crystals
|
|
|
1974 |
13 |
1 |
p. 10-11 2 p. |
artikel |
58 |
Molecular beam epitaxy
|
|
|
1974 |
13 |
1 |
p. 16- 1 p. |
artikel |
59 |
MOS threshold shifting by ion implantation
|
|
|
1974 |
13 |
1 |
p. 20- 1 p. |
artikel |
60 |
Nickel-chromium resistor failure modes and their identification
|
|
|
1974 |
13 |
1 |
p. 18- 1 p. |
artikel |
61 |
Non-polarized memory-switching characteristics of ZnTe thin films
|
|
|
1974 |
13 |
1 |
p. 19- 1 p. |
artikel |
62 |
Note to “Failure modes of integrated circuits and their relationship to reliability”
|
Kemény, A.P. |
|
1974 |
13 |
1 |
p. 55- 1 p. |
artikel |
63 |
Notice
|
|
|
1974 |
13 |
1 |
p. 3- 1 p. |
artikel |
64 |
Notices and calls for papers
|
|
|
1974 |
13 |
1 |
p. 7- 1 p. |
artikel |
65 |
On sputtered thin-films of chrome, nitrided chrome and nickel-chromium
|
|
|
1974 |
13 |
1 |
p. 19- 1 p. |
artikel |
66 |
Operational behaviour of a complex system with two out of M failed components
|
|
|
1974 |
13 |
1 |
p. 12- 1 p. |
artikel |
67 |
Operational behaviour of a stand-by redundant system with scheduled maintenance
|
|
|
1974 |
13 |
1 |
p. 12- 1 p. |
artikel |
68 |
Papers to be published in future issues
|
|
|
1974 |
13 |
1 |
p. 21- 1 p. |
artikel |
69 |
Plastic power ICs need skillful thermal design
|
|
|
1974 |
13 |
1 |
p. 15- 1 p. |
artikel |
70 |
Prediction of operator performance for sonar maintenance
|
|
|
1974 |
13 |
1 |
p. 11- 1 p. |
artikel |
71 |
Processing and performance of tantalum nitride thin film resistor networks with ±50 ppm/°C TCR
|
|
|
1974 |
13 |
1 |
p. 18-19 2 p. |
artikel |
72 |
Pulse burnout of microwave mixer diodes
|
|
|
1974 |
13 |
1 |
p. 10- 1 p. |
artikel |
73 |
Quality and the Courts
|
|
|
1974 |
13 |
1 |
p. 9- 1 p. |
artikel |
74 |
Quantification of Man-Machine system reliability in process control
|
|
|
1974 |
13 |
1 |
p. 12- 1 p. |
artikel |
75 |
Recent advances in negative and positive photoresist technology
|
|
|
1974 |
13 |
1 |
p. 14- 1 p. |
artikel |
76 |
Redundancy allocations in a system with many stages
|
|
|
1974 |
13 |
1 |
p. 13- 1 p. |
artikel |
77 |
Relating factory test failure results to field reliability, required field maintenance, and to total life cycle costs
|
|
|
1974 |
13 |
1 |
p. 9- 1 p. |
artikel |
78 |
Reliability block diagram analysis
|
Staley, J.E. |
|
1974 |
13 |
1 |
p. 33-47 15 p. |
artikel |
79 |
Reliability of a quasi-redundant electronic system with “standby” in the main unit
|
|
|
1974 |
13 |
1 |
p. 12-13 2 p. |
artikel |
80 |
Reliability of some redundant systems with repair
|
|
|
1974 |
13 |
1 |
p. 11- 1 p. |
artikel |
81 |
Reliability optimization of a system by zero-one programming
|
|
|
1974 |
13 |
1 |
p. 12- 1 p. |
artikel |
82 |
Reliability studies on the 2-Level Al/SiO2/Al system
|
|
|
1974 |
13 |
1 |
p. 10- 1 p. |
artikel |
83 |
Resin attachment of semiconductor dice on to film circuits
|
|
|
1974 |
13 |
1 |
p. 19- 1 p. |
artikel |
84 |
Sawing alumina substrates with a CO2 laser
|
|
|
1974 |
13 |
1 |
p. 20- 1 p. |
artikel |
85 |
Scanning electron microscope analysis of surface defects on alumina ceramic substrates
|
|
|
1974 |
13 |
1 |
p. 10- 1 p. |
artikel |
86 |
Sense amplifier design is key to 1-transistor cell in 4096-bit RAM
|
|
|
1974 |
13 |
1 |
p. 15- 1 p. |
artikel |
87 |
Single-layer packaging slashes ceramin-DIP costs in half
|
|
|
1974 |
13 |
1 |
p. 14- 1 p. |
artikel |
88 |
Stand-by redundancy complex system's reliability
|
|
|
1974 |
13 |
1 |
p. 13- 1 p. |
artikel |
89 |
Stochastic behaviour of an intermittently working electronic equipment with imperfect switching
|
|
|
1974 |
13 |
1 |
p. 11- 1 p. |
artikel |
90 |
The accelerated ageing of plastic encapsulated semiconductor devices in environments containing a high vapour pressure of water
|
Sinnadurai, F.N. |
|
1974 |
13 |
1 |
p. 23-27 5 p. |
artikel |
91 |
The assesment of connector reliability
|
|
|
1974 |
13 |
1 |
p. 10- 1 p. |
artikel |
92 |
The current trend in CMOS technology
|
|
|
1974 |
13 |
1 |
p. 14- 1 p. |
artikel |
93 |
The growth of GaP single crystals by liquid encapsulated Czochralski pulling
|
|
|
1974 |
13 |
1 |
p. 17- 1 p. |
artikel |
94 |
The growth of silver and copper single crystals on silicon and the selective removal of silicon by electrochemical displacement
|
|
|
1974 |
13 |
1 |
p. 17- 1 p. |
artikel |
95 |
The influence of structural damage on the electronic properties of amorphous germanium
|
|
|
1974 |
13 |
1 |
p. 18- 1 p. |
artikel |
96 |
The load life characteristics of thick-film resistors
|
|
|
1974 |
13 |
1 |
p. 18- 1 p. |
artikel |
97 |
The performance of gyrator and leapfrog inductorless filters, using integrated circuits
|
|
|
1974 |
13 |
1 |
p. 16- 1 p. |
artikel |
98 |
Thermal capture of electrons and holes at zinc centers in silicon
|
|
|
1974 |
13 |
1 |
p. 16-17 2 p. |
artikel |
99 |
The robustness of reliability predictions for series systems of identical components
|
|
|
1974 |
13 |
1 |
p. 11- 1 p. |
artikel |
100 |
The thermal demands of electronic design
|
|
|
1974 |
13 |
1 |
p. 14- 1 p. |
artikel |
101 |
Three-dimensional impurity profile of an epitaxial layer
|
|
|
1974 |
13 |
1 |
p. 16- 1 p. |
artikel |
102 |
Utilization of reliability measurements in bayesian inference: Models and human performance
|
|
|
1974 |
13 |
1 |
p. 11-12 2 p. |
artikel |
103 |
Verfahren zur Elimination von Gehauseeinflussen bei Vierpolmessungen an Integrierten Schaltungen
|
|
|
1974 |
13 |
1 |
p. 15-16 2 p. |
artikel |
104 |
Yield optimization of integrated circuits
|
|
|
1974 |
13 |
1 |
p. 14- 1 p. |
artikel |