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                             105 results found
no title author magazine year volume issue page(s) type
1 A bonding-wire failure mode in plastic encaponlated integrated circuits 1973
12 6 p. 494-
1 p.
article
2 A current pulse screening test for metal step coverage 1973
12 6 p. 499-
1 p.
article
3 Analysis of electrical overstress failures 1973
12 6 p. 491-
1 p.
article
4 Analysis of integrated circuit failure modes and failure mechanisms derived from high temperature operating life tests 1973
12 6 p. 495-
1 p.
article
5 An elusive open-circuit failure mode in thin-film chip resistors 1973
12 6 p. 494-
1 p.
article
6 A new complementary bipolar transistor structure 1973
12 6 p. 500-
1 p.
article
7 A new static shift register with dynamic transfer 1973
12 6 p. 499-
1 p.
article
8 A see-saw IC logic astable oscillator 1973
12 6 p. 499-
1 p.
article
9 Auto-Auto Relay Set controlled by LSI Programmable Logic 1973
12 6 p. 499-
1 p.
article
10 Avalanche breakdown characteristics of alloyed silicon p-n junctions 1973
12 6 p. 492-
1 p.
article
11 Avalanche breakdown in polycrystalline silicon films 1973
12 6 p. 501-
1 p.
article
12 Avalanche breakdown voltage of diffused junctions in silicon 1973
12 6 p. 500-
1 p.
article
13 Bell Labs' new thin-film hybrid may be most complex ever built 1973
12 6 p. 502-
1 p.
article
14 Bonding degradation in the tantalum nitride-chromium-gold metallization system 1973
12 6 p. 493-
1 p.
article
15 Building reliability into reed switches 1973
12 6 p. 493-
1 p.
article
16 Calendar of International Conferences, Symposia, Lectures and Meetings of Interest 1973
12 6 p. 485-486
2 p.
article
17 Carrier heating effects in junctions at very low currents 1973
12 6 p. 500-
1 p.
article
18 Chopper circuit put on op-amp chip 1973
12 6 p. 499-
1 p.
article
19 Chopper-stabilized IC op amps achieve precision, speed, economy 1973
12 6 p. 499-
1 p.
article
20 C-MOS may help majority logic win designers' vote 1973
12 6 p. 498-
1 p.
article
21 Component linearity test improves reliability screening through measurement of third harmonic index 1973
12 6 p. 491-
1 p.
article
22 Computers help design reliable telephone systems Gambrill, L.M.
1973
12 6 p. 505-511
7 p.
article
23 Contact failures of crossbar switching system 1973
12 6 p. 496-497
2 p.
article
24 Determination of neutral region carrier concentrations in P-N junctions using quasi fermi levels 1973
12 6 p. 500-
1 p.
article
25 Discussion about the number of wiring layers for logic LSL 1973
12 6 p. 498-
1 p.
article
26 Dissolution rates and reliability effects of Au, Ag, Ni and Cu in lead base solders 1973
12 6 p. 493-
1 p.
article
27 Distributed mosfet amplifier using Microstrip 1973
12 6 p. 499-
1 p.
article
28 Effect of ionizing radiation on second breakdown 1973
12 6 p. 492-
1 p.
article
29 Electromigration studies on aluminium-copper stripes 1973
12 6 p. 492-
1 p.
article
30 Electron beam fabrication 1973
12 6 p. 502-
1 p.
article
31 Expected value and variance of failure time in redundant systems 1973
12 6 p. 496-
1 p.
article
32 Fabrication techniques and screening procedures for high reliability transferred electron diodes 1973
12 6 p. 496-
1 p.
article
33 Failure analysis applications of anger electron spectroscopy 1973
12 6 p. 491-492
2 p.
article
34 Failure analysis applications of the scanning electron microscope 1973
12 6 p. 492-
1 p.
article
35 Failure analysis of oxide defects 1973
12 6 p. 501-
1 p.
article
36 Failure analysis of surface inversion 1973
12 6 p. 501-
1 p.
article
37 Failure analysis of wire bonds 1973
12 6 p. 494-
1 p.
article
38 Failure analysis using the electron microprobe 1973
12 6 p. 492-
1 p.
article
39 Failure analysis using the ion microprobe 1973
12 6 p. 492-
1 p.
article
40 For the real cost of a design, factor in reliability 1973
12 6 p. 497-
1 p.
article
41 Further studies on the reliability of thin-film nickel-chromium resistors 1973
12 6 p. 494-
1 p.
article
42 Highly reliable mesh emitter transistor 1973
12 6 p. 493-
1 p.
article
43 High-reliability plastic package for integrated circuits 1973
12 6 p. 496-
1 p.
article
44 High speed positioning 1973
12 6 p. 498-
1 p.
article
45 Hybrids for microwave gear get boost from thick-film technology 1973
12 6 p. 502-
1 p.
article
46 Hybrid technology solves tough design problems 1973
12 6 p. 501-
1 p.
article
47 IBM reliability experience with hybrid microcircuits 1973
12 6 p. 496-
1 p.
article
48 ICs blow the whistle on faults 1973
12 6 p. 492-
1 p.
article
49 Improved reliability of electron devices through optimized of coverage of surface topography 1973
12 6 p. 502-
1 p.
article
50 Influence of surface treatment of silicon on the effective impurity charge density in surface states of MOS structures 1973
12 6 p. 500-
1 p.
article
51 Intermetallic characterization 1973
12 6 p. 498-499
2 p.
article
52 Investigation of radiation-induced defects in silicon p-n junctions 1973
12 6 p. 493-
1 p.
article
53 Japanese IC metallization method halled as reliability ‘breakthrough’ 1973
12 6 p. 497-498
2 p.
article
54 Laplace transforms for the two-unit cold-standby redundant system 1973
12 6 p. 497-
1 p.
article
55 Maintenance, replacement and reliability G.W.A.D.,
1973
12 6 p. 503-
1 p.
article
56 Median-time-to-failure (MTF) of microwave power transistors under RF conditions 1973
12 6 p. 496-
1 p.
article
57 Microwave integrated circuits using thick- and thin-film technologies 1973
12 6 p. 501-502
2 p.
article
58 Minicomputer controls evaluation of epitaxial deposition for ICs 1973
12 6 p. 498-
1 p.
article
59 MOS/LSI failure analysis techniques 1973
12 6 p. 494-
1 p.
article
60 Multivariate analysis techniques applied to equipment testing Wilburn Jr., J.B.
1973
12 6 p. 535-538
4 p.
article
61 Noncontact testing of interconnections in film integrated circuits using an electron beam 1973
12 6 p. 502-
1 p.
article
62 Notice 1973
12 6 p. 487-
1 p.
article
63 Notices and calls for papers 1973
12 6 p. 489-
1 p.
article
64 On measuring the mechanical properties of aluminum metallization and their relationship to reliability problems 1973
12 6 p. 493-494
2 p.
article
65 Operational performance of computing systems 1973
12 6 p. 496-
1 p.
article
66 Optimixing serpentime resistor geometry 1973
12 6 p. 497-
1 p.
article
67 Papers to be published in future issues 1973
12 6 p. 504-
1 p.
article
68 Photo-composition and LSI 1973
12 6 p. 498-
1 p.
article
69 Photomask array placement on slices in LSI processing Tasch Jr., A.F.
1973
12 6 p. 539-545
7 p.
article
70 Photoresists part 2—Negative resist systems 1973
12 6 p. 498-
1 p.
article
71 Photoresists part 3—Positive resist systems 1973
12 6 p. 498-
1 p.
article
72 Power-system reliability calculations G.W.A.D.,
1973
12 6 p. 503-
1 p.
article
73 Projection mask alignment—A production technique 1973
12 6 p. 498-
1 p.
article
74 Properties of iron oxide films for photomask applications 1973
12 6 p. 498-
1 p.
article
75 Qualitatsprufung und Fehleranalysen an Banelementen 1973
12 6 p. 492-493
2 p.
article
76 Reliability analysis of a nuclear reactor fuel charging system 1973
12 6 p. 496-
1 p.
article
77 Reliability analysis of a system with dependent units Gopalan, M.N.
1973
12 6 p. 547-
1 p.
article
78 Reliability improvement by redundancy in electronics systems 3A quantitative comparisen of redundancy schemes 1973
12 6 p. 497-
1 p.
article
79 Reliability improvements in electron bombarded semiconductor power devices 1973
12 6 p. 495-
1 p.
article
80 Reliability improvements of plastic semiconductors using gold metallization 1973
12 6 p. 495-
1 p.
article
81 Reliability of conductors and crossovers for film integrated circuits 1973
12 6 p. 495-
1 p.
article
82 Series equivalent circuit representation of SiO2-Si interface and oxide trap states 1973
12 6 p. 500-
1 p.
article
83 Simulation of a complex microelectronic module containing analogue and digital elements 1973
12 6 p. 497-
1 p.
article
84 Small-signal characteristics of semiconductor punch-through injection and transit-time diedes 1973
12 6 p. 500-
1 p.
article
85 Some preliminary studies of the structure of ion bornbarded thin films 1973
12 6 p. 502-
1 p.
article
86 Special Report—Semiconductor memories are taking over data-storage applications 1973
12 6 p. 499-
1 p.
article
87 Stability of thick-film resistors under high electromagnetic stress 1973
12 6 p. 502-
1 p.
article
88 Temperature-humidity acceleration of metal-electrolysis failure in semiconductor devices 1973
12 6 p. 495-
1 p.
article
89 The effect of retarding field on the base transport characteristics of planar transistors 1973
12 6 p. 501-
1 p.
article
90 The problems of reliability growth and demonstration with military electronics Green, J.E.
1973
12 6 p. 513-520
8 p.
article
91 The reliability of failure rates Van Diest, H.G.
1973
12 6 p. 521-524
4 p.
article
92 The reliability of independent exponential series systems—A bayesian approach. Technical report 1973
12 6 p. 496-
1 p.
article
93 Thermal behavior of thick-film 1973
12 6 p. 501-
1 p.
article
94 Thermal study of circuit card assembly Watson, D.
1973
12 6 p. 531-534
4 p.
article
95 The solid tantalum capacitor—A “solid” contributor to reliability 1973
12 6 p. 494-
1 p.
article
96 Thick film pastes for multilayer use 1973
12 6 p. 501-
1 p.
article
97 To-5 discoloration and bondability 1973
12 6 p. 493-
1 p.
article
98 Torque and thermal cycling as methods of testing reliability of reflow-soldered chip-to-substrate joints 1973
12 6 p. 494-495
2 p.
article
99 Transistor base-emitter junction protection improves reliability 1973
12 6 p. 492-
1 p.
article
100 Unconventional uses for IC timers can be found everywhere. Build anything from car tachometers to program controllers with these simple devices 1973
12 6 p. 499-
1 p.
article
101 Unusual filter concept promises high-Q, low-frequency IC device 1973
12 6 p. 497-
1 p.
article
102 Use of a pulse laser technique in failure analysis 1973
12 6 p. 492-
1 p.
article
103 Who wants reliable plastic semiconductors 1973
12 6 p. 495-496
2 p.
article
104 Why specifications—What do they assure 1973
12 6 p. 491-
1 p.
article
105 Wire-bond reliability in hybrid microcircuits 1973
12 6 p. 495-
1 p.
article
                             105 results found
 
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