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                             129 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 A comparison of the strength of alumina substrates for different separation techniques 1973
12 2 p. 93-
1 p.
artikel
2 Active filters get more of the action 1973
12 2 p. 91-
1 p.
artikel
3 Advances in dichlorosilane epitaxial technology 1973
12 2 p. 98-
1 p.
artikel
4 Aluminum interconnections and beam leads on polyimide-coated copper substrates 1973
12 2 p. 94-
1 p.
artikel
5 A method for computing complex system reliability 1973
12 2 p. 90-
1 p.
artikel
6 An all-bipolar image sensor 1973
12 2 p. 95-
1 p.
artikel
7 An empirical Bayes approach to reliability 1973
12 2 p. 85-
1 p.
artikel
8 A new a.c. sputtering technique for the deposition of thin films 1973
12 2 p. 99-
1 p.
artikel
9 A new method of manufacturing multilayer circuit boards 1973
12 2 p. 96-
1 p.
artikel
10 An experimental model of the microelectronic ultrasonic wire bonding mechanism 1973
12 2 p. 92-
1 p.
artikel
11 An improved sputter-etching process 1973
12 2 p. 175-
1 p.
artikel
12 A procedure for the evaluation and failure analysis of MOS memory circuits using the scanning electron microscope in potential contrast mode 1973
12 2 p. 88-
1 p.
artikel
13 A proposal concerned with electronic component parts field reliability prediction method 1973
12 2 p. 84-
1 p.
artikel
14 A prototype assembly facility for CerDip packaging 1973
12 2 p. 92-
1 p.
artikel
15 A recommendation for ceramic over plastic IC packages for 1972 real-time commercial computer systems 1973
12 2 p. 93-
1 p.
artikel
16 A reliability model for stress vs strength problem Yadav, R.P.S.
1973
12 2 p. 119-123
5 p.
artikel
17 A statistical model for electromigration induced failure in thin-film conductors 1973
12 2 p. 89-
1 p.
artikel
18 A stochastic approach for the anodic-oxidation process for fine adjustment of the thin-film resistors 1973
12 2 p. 98-99
2 p.
artikel
19 A tester for MOS integrated circuits 1973
12 2 p. 86-
1 p.
artikel
20 A theoretical investigation on the generation current in silicon p-n junctions under reverse bias 1973
12 2 p. 98-
1 p.
artikel
21 Avalanche breakdown in silicon diffused junctions 1973
12 2 p. 86-
1 p.
artikel
22 A yield calculation method for LSI arrays considering a defect distribution towards a wafer radius 1973
12 2 p. 87-
1 p.
artikel
23 Bayesian decision analysis of the hazard rate for a two-parameter Weibull process 1973
12 2 p. 86-
1 p.
artikel
24 B-747 component reliability program 1973
12 2 p. 89-
1 p.
artikel
25 Calendar of international conferences, symposia, lectures and meetings of interest 1973
12 2 p. 75-76
2 p.
artikel
26 CDI integrated circuits: the best of MOS and bipolars 1973
12 2 p. 91-
1 p.
artikel
27 Chemicals for semiconductor processing 1973
12 2 p. 93-
1 p.
artikel
28 Classification of reliability tests 1973
12 2 p. 85-86
2 p.
artikel
29 Compatibility and testing of electronic components G.W.A.D.,
1973
12 2 p. 103-104
2 p.
artikel
30 Complementary MOS circuits in process control instrumentation 1973
12 2 p. 92-
1 p.
artikel
31 Complex system reliability with exponential repair time distributions under head-of-line-repair-discipline Gupta, P.P.
1973
12 2 p. 151-158
8 p.
artikel
32 Complex system reliability with general repair time distributions under preemptive repeat repair discipline Gupta, P.P.
1973
12 2 p. 145-150
6 p.
artikel
33 Component data for statistical circuit analysis 1973
12 2 p. 88-
1 p.
artikel
34 Computer program for designing optimal networks with MOS gates 1973
12 2 p. 91-
1 p.
artikel
35 Conductance associated with interface states in MOS tunnel structures 1973
12 2 p. 97-98
2 p.
artikel
36 Courses 1973
12 2 p. 79-81
3 p.
artikel
37 Current and future uses of vacuum deposition 1973
12 2 p. 101-
1 p.
artikel
38 Custom-designed MOS arrays for use in digital systems 1973
12 2 p. 92-
1 p.
artikel
39 Debugging computer programs. A survey with special emphasis on ALGOL 1973
12 2 p. 89-
1 p.
artikel
40 Degradation of MNOS memory transistor characteristics and failure mechanism model 1973
12 2 p. 87-
1 p.
artikel
41 Description and use of the dynamic memory TMS 4062 1973
12 2 p. 96-
1 p.
artikel
42 Designing a television line flywheel generator using a phase-locked loop integrated circuit 1973
12 2 p. 94-95
2 p.
artikel
43 Designing with high power hybrid control circuits 1973
12 2 p. 100-
1 p.
artikel
44 Determination of the relative nitrogen doping level of tantalum nitride resistor film by means of the Seebeck effect 1973
12 2 p. 99-
1 p.
artikel
45 Direct current conductivity in amorphous semiconductors 1973
12 2 p. 96-
1 p.
artikel
46 Discharge sputtering 1973
12 2 p. 100-101
2 p.
artikel
47 Discussing complementary MOS 1973
12 2 p. 91-
1 p.
artikel
48 Electromigration in gold-silver alloys 1973
12 2 p. 93-
1 p.
artikel
49 Electron trapping levels in silicon dioxide thermally grown on silicon 1973
12 2 p. 97-
1 p.
artikel
50 Environmental factors governing field reliability of plastic transistors and integrated circuits 1973
12 2 p. 88-
1 p.
artikel
51 Epitaxial growth of silicon from SiH4 in the temperature range 800–1150°C 1973
12 2 p. 96-
1 p.
artikel
52 Estimating substrate area and density for hybrid microcircuits 1973
12 2 p. 99-100
2 p.
artikel
53 Estimating the reliability of electronic tubes with the aid of truncated life tests 1973
12 2 p. 86-
1 p.
artikel
54 Failure characteristics of thin-film capacitors 1973
12 2 p. 87-
1 p.
artikel
55 Focus on comparator ICs 1973
12 2 p. 95-
1 p.
artikel
56 Good things come in small packages 1973
12 2 p. 86-
1 p.
artikel
57 Higher packing density and lower power with complementary MOS 1973
12 2 p. 91-
1 p.
artikel
58 Hybrid circuits—where should the split be? 1973
12 2 p. 99-
1 p.
artikel
59 IC device integrates inductors: coil-less radio and TV coming 1973
12 2 p. 95-
1 p.
artikel
60 Inclusion of minority charge carriers in the solution of Poisson's equation for a metal semiconductor contact in thermal equilibrium 1973
12 2 p. 96-97
2 p.
artikel
61 Influence of surface energies on line resolution in screen printing 1973
12 2 p. 92-
1 p.
artikel
62 Instrument for thickness measurement of transparent thin films on silicon substrates 1973
12 2 p. 99-
1 p.
artikel
63 Integrated MOS distributed RC networks for frequency selective circuits Bozic, S.M.
1973
12 2 p. 139-144
6 p.
artikel
64 Items of interest Gianelle, W.H.
1973
12 2 p. 73-
1 p.
artikel
65 Laser beam controls crystal growth 1973
12 2 p. 179-180
2 p.
artikel
66 Lasers in chemical vapour deposition 1973
12 2 p. 177-IN6
nvt p.
artikel
67 LEED and Auger electron spectroscopic observations of the substrate surface during sputtering and vacuum vapour deposition 1973
12 2 p. 101-
1 p.
artikel
68 Limitations in microelectronics—II. Bipolar technology 1973
12 2 p. 86-
1 p.
artikel
69 Liquid immersion cooling of small electronic devices Baker, E.
1973
12 2 p. 163-173
11 p.
artikel
70 Low concentration diffusion in silicon under sealed tube conditions 1973
12 2 p. 97-
1 p.
artikel
71 Low-power bipolar technique begets low-power LSI logic 1973
12 2 p. 91-
1 p.
artikel
72 Microcircuit reliability bibliography 1973
12 2 p. 90-
1 p.
artikel
73 MNOS memory devices 1973
12 2 p. 95-96
2 p.
artikel
74 MOS custom design meets digital-system requirements 1973
12 2 p. 91-
1 p.
artikel
75 MOS C-V techniques for IC process control 1973
12 2 p. 93-
1 p.
artikel
76 MOS/LSI launches the low-cost processor 1973
12 2 p. 95-
1 p.
artikel
77 Nickel-chromium resistor failure modes and their identification Keenan, W.F.
1973
12 2 p. 125-126
2 p.
artikel
78 Non-contact printing and automatic alignment of chromium mask patterns on silicon slices 1973
12 2 p. 92-
1 p.
artikel
79 Non-repairable items 1973
12 2 p. 85-
1 p.
artikel
80 Notice 1973
12 2 p. 77-
1 p.
artikel
81 Notices and calls for papers 1973
12 2 p. 83-
1 p.
artikel
82 On-line integrated circuit design system using graphic display 1973
12 2 p. 92-
1 p.
artikel
83 On sputtered thin-films of chrome, nitrided chrome and nickel-chromium Abita, J.L.
1973
12 2 p. 111-117
7 p.
artikel
84 Operational adjustment of thick-film circuits 1973
12 2 p. 100-
1 p.
artikel
85 Operational behaviour of a complex system with two out of M failed components Varma, G.K.
1973
12 2 p. 107-110
4 p.
artikel
86 Optical isolators: outlook is bright 1973
12 2 p. 86-
1 p.
artikel
87 Papers to be published in future issues 1973
12 2 p. 105-
1 p.
artikel
88 Physical and electrical properties of thin-film barium titanate prepared by r.f. sputtering on silicon substrates 1973
12 2 p. 100-
1 p.
artikel
89 Physical problems of small structures in electronics 1973
12 2 p. 91-
1 p.
artikel
90 Potentials and direct current in Si-(20–40 Å)SiO2—metal structures 1973
12 2 p. 98-
1 p.
artikel
91 Preparation of tantalum-titanium alloy thin films 1973
12 2 p. 100-
1 p.
artikel
92 Purple plague and gold purity 1973
12 2 p. 88-
1 p.
artikel
93 Quantitative aspects of reliability in process-control systems 1973
12 2 p. 89-90
2 p.
artikel
94 Reliability aspects of plastic encapsulated integrated circuits 1973
12 2 p. 88-
1 p.
artikel
95 Reliability comparisons 1973
12 2 p. 85-
1 p.
artikel
96 Reliability of microwave mixer diodes 1973
12 2 p. 86-87
2 p.
artikel
97 Reliability optimization of a series-parallel system 1973
12 2 p. 90-
1 p.
artikel
98 Reliability program of ISS (ionosphere sounding satellite) 1973
12 2 p. 89-
1 p.
artikel
99 Reliability technology G.W.A.D.,
1973
12 2 p. 103-
1 p.
artikel
100 Selecting inputs to test digital circuits on complex IC boards 1973
12 2 p. 86-
1 p.
artikel
101 Silicon on sapphire substrates overcome MOS limitations 1973
12 2 p. 94-
1 p.
artikel
102 Single crystal oxide substrates 1973
12 2 p. 94-
1 p.
artikel
103 Special report: consumer gear benefits from IC design trade-offs 1973
12 2 p. 91-
1 p.
artikel
104 Structure and electrical characteristics of epitaxial palladium silicide contacts on single crystal silicon and diffused p-n diodes 1973
12 2 p. 96-
1 p.
artikel
105 Survey of circuitry for wristwatches 1973
12 2 p. 94-
1 p.
artikel
106 Synthesis of fault diagnosable logical circuits 1973
12 2 p. 90-
1 p.
artikel
107 Synthèse des différentes technologies de réalisation de couches minces diélectriques. Caractéristiques dès dépots 1973
12 2 p. 98-
1 p.
artikel
108 Systematic computer-aided multidimensional modeling of integrated bipolar devices 1973
12 2 p. 95-
1 p.
artikel
109 System design with MOS dynamic shift registers 1973
12 2 p. 92-
1 p.
artikel
110 Ten-bit digital-to-analog converter with thin-film ladder network 1973
12 2 p. 99-
1 p.
artikel
111 Testing for faults in cellular logic arrays (1 January 1970–1976 January 1972) 1973
12 2 p. 89-
1 p.
artikel
112 The diffusion of boron in the Si-SiO2 system 1973
12 2 p. 98-
1 p.
artikel
113 The element approach to the design of complex MOST integrated circuits 1973
12 2 p. 91-
1 p.
artikel
114 The IC plastic package: a simple method of predicting package performance 1973
12 2 p. 93-
1 p.
artikel
115 The life and times of the Enfield Microelectronics Centre 1973
12 2 p. 90-
1 p.
artikel
116 Theory of dynamic charge and capacitance characteristics in MIS systems containing discrete surface traps 1973
12 2 p. 96-
1 p.
artikel
117 The performance of gyrator and leapfrog inductorless filters, using integrated circuits Roberts, G.M.
1973
12 2 p. 159-161
3 p.
artikel
118 The quality assurance of semiconductor devices 1973
12 2 p. 88-
1 p.
artikel
119 The reliability of the TO-92 plastic transistor 1973
12 2 p. 88-89
2 p.
artikel
120 Thermal chip evaluation of IC packaging 1973
12 2 p. 94-
1 p.
artikel
121 Thermally-stimulated current from the gold acceptor trapping level in silicon 1973
12 2 p. 97-
1 p.
artikel
122 The use of a diamond heat sink for a high reliability impatt diode 1973
12 2 p. 87-
1 p.
artikel
123 Thick-film microcircuits—guide lines for custom design 1973
12 2 p. 100-
1 p.
artikel
124 Thick-film technique promises switches at a fraction of a cent 1973
12 2 p. 99-
1 p.
artikel
125 Use of lead dioxide counterelectrodes in thin-film capacitors: the TLM compacitor 1973
12 2 p. 100-
1 p.
artikel
126 Vapor-phase growth of several 111-V compound semiconductors 1973
12 2 p. 96-
1 p.
artikel
127 V-ATE memory scores a new high in combining speed and bit density 1973
12 2 p. 91-
1 p.
artikel
128 Wafer probe yield improvement 1973
12 2 p. 93-
1 p.
artikel
129 Yield degradation of integrated circuits due to spot defects 1973
12 2 p. 88-
1 p.
artikel
                             129 gevonden resultaten
 
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