| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Achieving microstructure refinement and superior mechanical performance of Sn-2.0Ag-0.5Cu-2.0Zn (SACZ) solder alloy with rotary magnetic field
|
Hammad, A.E.
|
|
|
113 |
C |
p.
|
artikel
|
| 2 |
Analytical model for total ionizing dose-induced excess base current in PNP BJTs
|
Li, L.
|
|
|
113 |
C |
p.
|
artikel
|
| 3 |
Bending reliability of Ni–MWCNT composite solder with a differential structure
|
Lee, Choong-Jae
|
|
|
113 |
C |
p.
|
artikel
|
| 4 |
Bias stress instability of LTPS TFTs on flexible substrate with activation annealing temperature
|
Kim, Soonkon
|
|
|
113 |
C |
p.
|
artikel
|
| 5 |
Correlation between OCVD carrier lifetime vs temperature measurements and reverse recovery behavior of the body diode of SiC power MOSFETs
|
Sapienza, S.
|
|
|
113 |
C |
p.
|
artikel
|
| 6 |
Editorial Board
|
|
|
|
113 |
C |
p.
|
artikel
|
| 7 |
Effect of surface potential distribution on corrosion behavior of Cu/Al interface in Cu wire bonding applications
|
Mokhtari, Omid
|
|
|
113 |
C |
p.
|
artikel
|
| 8 |
Effects of TID radiation on P+ ion-implanted HVNMOS devices
|
Zhiqiang, Xiao
|
|
|
113 |
C |
p.
|
artikel
|
| 9 |
Extended symbol correction algorithm for group testing based non-binary error correction codes of minimum distance d q < 5
|
Garcia-Herrero, F.
|
|
|
113 |
C |
p.
|
artikel
|
| 10 |
Lifetime performance index of electronic products
|
Chen, Kuen-Suan
|
|
|
113 |
C |
p.
|
artikel
|
| 11 |
Mechanistic study of copper wire-bonding failures on packaging devices in acidic chloride environments
|
Ross, Nick
|
|
|
113 |
C |
p.
|
artikel
|
| 12 |
Performance and reliability of Al2O3 nanoparticles doped multicomponent Sn-3.0Ag-0.5Cu-Ni-Ge solder alloy
|
Tikale, Sanjay
|
|
|
113 |
C |
p.
|
artikel
|
| 13 |
Temperature dependence of bipolar junction transistor current-voltage characteristics after low dose rate irradiation
|
Privat, A.
|
|
|
113 |
C |
p.
|
artikel
|
| 14 |
The interfacial reaction and microstructure of Co/In/Cu sputtering target assembly after soldering
|
Liu, Zhi-Quan
|
|
|
113 |
C |
p.
|
artikel
|
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