nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A Bayesian approach to parameter and reliability estimation in the Poisson distribution
|
|
|
1972 |
11 |
6 |
p. 472- 1 p. |
artikel |
2 |
Accelerated life testing of thick-film resistors
|
|
|
1972 |
11 |
6 |
p. 484- 1 p. |
artikel |
3 |
Accurate IC logic delay measurements
|
|
|
1972 |
11 |
6 |
p. 482- 1 p. |
artikel |
4 |
A computer program for evaluation of system reliability
|
|
|
1972 |
11 |
6 |
p. 478- 1 p. |
artikel |
5 |
A design-sensitive maintainability-prediction technique
|
|
|
1972 |
11 |
6 |
p. 475- 1 p. |
artikel |
6 |
A 70 MHz static shift register with high integration density
|
Kasperkovitz, D. |
|
1972 |
11 |
6 |
p. 493-496 4 p. |
artikel |
7 |
Analogue-signal commutation using MOS ICs
|
|
|
1972 |
11 |
6 |
p. 482- 1 p. |
artikel |
8 |
Analysis of causes of failure in soldering
|
|
|
1972 |
11 |
6 |
p. 480- 1 p. |
artikel |
9 |
Application of MTBF guarantee program for RCA AVQ-3OX weather radar system on Boeing 747 jet-liners
|
|
|
1972 |
11 |
6 |
p. 478- 1 p. |
artikel |
10 |
A practical approach to quality control
|
G.W.A.D., |
|
1972 |
11 |
6 |
p. 487- 1 p. |
artikel |
11 |
A simple approach for constrained redundancy optimization problem
|
|
|
1972 |
11 |
6 |
p. 477- 1 p. |
artikel |
12 |
A simple cure for a form of window staining which occurs during the etching of silicon integrated circuits
|
Hines, R.E. |
|
1972 |
11 |
6 |
p. 537- 1 p. |
artikel |
13 |
A small instrument manufacturer's experience with medical instrument reliability
|
|
|
1972 |
11 |
6 |
p. 480-481 2 p. |
artikel |
14 |
Assessing missile system reliability
|
|
|
1972 |
11 |
6 |
p. 476- 1 p. |
artikel |
15 |
A systematic procedure for the generation of cost-minimized designs
|
|
|
1972 |
11 |
6 |
p. 477- 1 p. |
artikel |
16 |
A variational diagnosis method for stuck-faults in combinatorial networks
|
|
|
1972 |
11 |
6 |
p. 474- 1 p. |
artikel |
17 |
A versatile design giving both N-type and S-type of negative-resistances
|
Sharma, C.K. |
|
1972 |
11 |
6 |
p. 499-500 2 p. |
artikel |
18 |
Build an ON-OFF timer using inexpensive ICs
|
|
|
1972 |
11 |
6 |
p. 482- 1 p. |
artikel |
19 |
Calendar of International Conferences, Symposia, Lectures and Meetings of Interest
|
|
|
1972 |
11 |
6 |
p. 465-466 2 p. |
artikel |
20 |
Circuit model distribution with statistical dependence
|
|
|
1972 |
11 |
6 |
p. 479- 1 p. |
artikel |
21 |
Collector diffusion isolation packs many functions on a chip
|
|
|
1972 |
11 |
6 |
p. 483- 1 p. |
artikel |
22 |
Communications satellite systems reliability
|
|
|
1972 |
11 |
6 |
p. 474-475 2 p. |
artikel |
23 |
Complex mission worth optimization by redundancies
|
|
|
1972 |
11 |
6 |
p. 476- 1 p. |
artikel |
24 |
Computer-aided reliability analysis of complicated networks
|
|
|
1972 |
11 |
6 |
p. 479- 1 p. |
artikel |
25 |
Conference Report “Testing in Electronics”
|
G.W.A.D, |
|
1972 |
11 |
6 |
p. 489-492 4 p. |
artikel |
26 |
Control of film properties by r.f-sputtering techniques
|
|
|
1972 |
11 |
6 |
p. 484-485 2 p. |
artikel |
27 |
Current transport in metal semiconductor contacts—a unified approach
|
|
|
1972 |
11 |
6 |
p. 482- 1 p. |
artikel |
28 |
Design of highly reliable electronic transformer
|
|
|
1972 |
11 |
6 |
p. 473- 1 p. |
artikel |
29 |
Dielectric insulating method VM for manufacturing transistors and integrated circuits
|
|
|
1972 |
11 |
6 |
p. 480- 1 p. |
artikel |
30 |
Don't let avoidable reed-relay pitfalls cripple your equipment designs
|
|
|
1972 |
11 |
6 |
p. 472- 1 p. |
artikel |
31 |
Double failure and other related problems in standby redundancy
|
|
|
1972 |
11 |
6 |
p. 477- 1 p. |
artikel |
32 |
Effect of band structure on the voltage-current characteristics of metal-insulator-metal tunnel junctions
|
|
|
1972 |
11 |
6 |
p. 483- 1 p. |
artikel |
33 |
Electrically-conductive epoxies—today's bonding material for microelectronics
|
|
|
1972 |
11 |
6 |
p. 480- 1 p. |
artikel |
34 |
Electron-beam fabrication
|
|
|
1972 |
11 |
6 |
p. 485- 1 p. |
artikel |
35 |
Electronic components quality assessment: recent developments
|
|
|
1972 |
11 |
6 |
p. 472- 1 p. |
artikel |
36 |
Empirical Bayes estimation in the Weibull distribution
|
|
|
1972 |
11 |
6 |
p. 471- 1 p. |
artikel |
37 |
Estimation of the parameters of the Weibull distribution from multicensored samples
|
|
|
1972 |
11 |
6 |
p. 471-472 2 p. |
artikel |
38 |
Fault diagnosis in FET modules
|
|
|
1972 |
11 |
6 |
p. 472- 1 p. |
artikel |
39 |
Fault identification in electronic circuits with the aid of bilinear transformations
|
|
|
1972 |
11 |
6 |
p. 479- 1 p. |
artikel |
40 |
Fault investigation of some silicon integrated circuits
|
|
|
1972 |
11 |
6 |
p. 472-473 2 p. |
artikel |
41 |
Field-effects in polycrystalline-silicon films
|
|
|
1972 |
11 |
6 |
p. 484- 1 p. |
artikel |
42 |
Film deposition by molecular-beam techniques
|
|
|
1972 |
11 |
6 |
p. 485- 1 p. |
artikel |
43 |
Fundamental limitations in microelectronics. 1. MOS technology
|
|
|
1972 |
11 |
6 |
p. 479- 1 p. |
artikel |
44 |
Graphical analysis of accelerated life test data with inverse power law model
|
|
|
1972 |
11 |
6 |
p. 477- 1 p. |
artikel |
45 |
Homogeneity test for two negative binomial populations
|
|
|
1972 |
11 |
6 |
p. 471- 1 p. |
artikel |
46 |
Human reliability in production process of communications satellite
|
|
|
1972 |
11 |
6 |
p. 478- 1 p. |
artikel |
47 |
Hybrid assembly time reduced with purpose-designed chips
|
|
|
1972 |
11 |
6 |
p. 485- 1 p. |
artikel |
48 |
IC components in LSI quality assurance
|
|
|
1972 |
11 |
6 |
p. 473- 1 p. |
artikel |
49 |
IC multiplexer puts zip into digital switching matrix
|
|
|
1972 |
11 |
6 |
p. 482- 1 p. |
artikel |
50 |
Impurity scattering of warm holes in germanium and silicon
|
|
|
1972 |
11 |
6 |
p. 482- 1 p. |
artikel |
51 |
Influence of recombinations in the base contact and on the base surface upon static and dynamic characteristics of the p-n junction
|
|
|
1972 |
11 |
6 |
p. 483- 1 p. |
artikel |
52 |
Interconnection failure model and its stress analysis in multilayered printed wiring board
|
|
|
1972 |
11 |
6 |
p. 473- 1 p. |
artikel |
53 |
Ion-beam techniques for device fabrication
|
|
|
1972 |
11 |
6 |
p. 485- 1 p. |
artikel |
54 |
Ion implantation coming of age
|
|
|
1972 |
11 |
6 |
p. 485- 1 p. |
artikel |
55 |
Ion implantation in semiconductor device technology
|
|
|
1972 |
11 |
6 |
p. 485- 1 p. |
artikel |
56 |
La détection et la localisation des pannes dans les circuits logiques: principes généraux
|
|
|
1972 |
11 |
6 |
p. 478- 1 p. |
artikel |
57 |
Laser adjustment of thick-film resistors
|
|
|
1972 |
11 |
6 |
p. 485- 1 p. |
artikel |
58 |
Letter to the editor
|
Sandle, (Miss) P.J. |
|
1972 |
11 |
6 |
p. 463- 1 p. |
artikel |
59 |
Low temperature migration of silicon through metal films. Importance of silicon-metal interface
|
|
|
1972 |
11 |
6 |
p. 483- 1 p. |
artikel |
60 |
LSI interconnection techniques. Fabricating a high resolution hybrid array
|
|
|
1972 |
11 |
6 |
p. 480- 1 p. |
artikel |
61 |
Maximum likelihood estimation of the parameters of the Weibull distribution by modified quasilinearization
|
|
|
1972 |
11 |
6 |
p. 472- 1 p. |
artikel |
62 |
MOS buffer memories offer econemies
|
|
|
1972 |
11 |
6 |
p. 482- 1 p. |
artikel |
63 |
MOS integrated circuit reliability
|
|
|
1972 |
11 |
6 |
p. 474- 1 p. |
artikel |
64 |
Mounting of components to printed wiring boards
|
|
|
1972 |
11 |
6 |
p. 473- 1 p. |
artikel |
65 |
MTBF prediction techniques—A comparative analysis
|
|
|
1972 |
11 |
6 |
p. 475-476 2 p. |
artikel |
66 |
N-channel goes to work with TTL
|
|
|
1972 |
11 |
6 |
p. 482- 1 p. |
artikel |
67 |
Notices and calls for papers
|
|
|
1972 |
11 |
6 |
p. 467-469 3 p. |
artikel |
68 |
On a two-unit standby-redundant system with imperfect switchover
|
|
|
1972 |
11 |
6 |
p. 477- 1 p. |
artikel |
69 |
On the origin of strongly conducting states in thin insulator films
|
|
|
1972 |
11 |
6 |
p. 484- 1 p. |
artikel |
70 |
Papers to be published in future issues
|
|
|
1972 |
11 |
6 |
p. 488- 1 p. |
artikel |
71 |
Plastic cavity packages for MOS LSI fill a very present need—but for how long?
|
|
|
1972 |
11 |
6 |
p. 480- 1 p. |
artikel |
72 |
Principles and problems of microelectronics
|
|
|
1972 |
11 |
6 |
p. 480- 1 p. |
artikel |
73 |
Processing of emulsion photomasks for semiconductor applications
|
|
|
1972 |
11 |
6 |
p. 480- 1 p. |
artikel |
74 |
Properties and appearance of abnormal defects in evaporated chromium films
|
|
|
1972 |
11 |
6 |
p. 473- 1 p. |
artikel |
75 |
Quantitative analysis of software reliability
|
|
|
1972 |
11 |
6 |
p. 475- 1 p. |
artikel |
76 |
Quantitative system analysis
|
|
|
1972 |
11 |
6 |
p. 475- 1 p. |
artikel |
77 |
Radiation effects on microelectronic components and circuits, Part 1
|
|
|
1972 |
11 |
6 |
p. 479-480 2 p. |
artikel |
78 |
Reduction of the base/collector capacitance in high-speed logic IC transistors by collector profiling
|
|
|
1972 |
11 |
6 |
p. 483-484 2 p. |
artikel |
79 |
Reliability activities for Bell System transmission systems
|
|
|
1972 |
11 |
6 |
p. 481- 1 p. |
artikel |
80 |
Reliability analysis of a two-unit standby-redundant system with preventive maintenance
|
|
|
1972 |
11 |
6 |
p. 477- 1 p. |
artikel |
81 |
Reliability assurance for home appliances: (2nd) Reliability analyzing system in field data
|
|
|
1972 |
11 |
6 |
p. 478- 1 p. |
artikel |
82 |
Reliability assurance for home appliances: (1st) The reliability program for the development of new products
|
|
|
1972 |
11 |
6 |
p. 478- 1 p. |
artikel |
83 |
Reliability control of environmental test chambers: pitfalls for reliable operation and design
|
|
|
1972 |
11 |
6 |
p. 472- 1 p. |
artikel |
84 |
Reliability decisions under uncertainty
|
|
|
1972 |
11 |
6 |
p. 475- 1 p. |
artikel |
85 |
Reliability engineering
|
G.W.A.D., |
|
1972 |
11 |
6 |
p. 487- 1 p. |
artikel |
86 |
Reliability evaluation of a heart assist system
|
|
|
1972 |
11 |
6 |
p. 481- 1 p. |
artikel |
87 |
Reliability management program in aircraft maintenance system, agreements between manufacturer and air lines
|
|
|
1972 |
11 |
6 |
p. 478- 1 p. |
artikel |
88 |
Reliability modelling
|
|
|
1972 |
11 |
6 |
p. 471- 1 p. |
artikel |
89 |
Reliability of all transistorized color television sets
|
|
|
1972 |
11 |
6 |
p. 481- 1 p. |
artikel |
90 |
Reliability of MO SIC
|
|
|
1972 |
11 |
6 |
p. 473- 1 p. |
artikel |
91 |
Reliability of redundant systems with dependent failures
|
|
|
1972 |
11 |
6 |
p. 478-479 2 p. |
artikel |
92 |
Reliability of solid electrolyte capacitors
|
|
|
1972 |
11 |
6 |
p. 474- 1 p. |
artikel |
93 |
Reliability of some modularly redundant systems
|
|
|
1972 |
11 |
6 |
p. 479- 1 p. |
artikel |
94 |
Reliability of the global NASCOM network
|
|
|
1972 |
11 |
6 |
p. 481- 1 p. |
artikel |
95 |
Reliability prediction studies of degradation-prone systems
|
|
|
1972 |
11 |
6 |
p. 475- 1 p. |
artikel |
96 |
Reliability problems related to plastic encapsulation of integrated circuits
|
|
|
1972 |
11 |
6 |
p. 473- 1 p. |
artikel |
97 |
Reliability test of microdelaylines for satellite use
|
|
|
1972 |
11 |
6 |
p. 474- 1 p. |
artikel |
98 |
Research of a test sequence to detect defects in sequential logic circuits
|
|
|
1972 |
11 |
6 |
p. 477-478 2 p. |
artikel |
99 |
Resonance characteristics of semiconductor mechanical components
|
Vedernikov, V.V. |
|
1972 |
11 |
6 |
p. 525-536 12 p. |
artikel |
100 |
Silicon nitride improvement of reliability of mass produced transistors
|
|
|
1972 |
11 |
6 |
p. 472- 1 p. |
artikel |
101 |
Simple IC meter amplifier circuit measures 100 nAmp, full-scale
|
|
|
1972 |
11 |
6 |
p. 481- 1 p. |
artikel |
102 |
Software reliability engineering
|
|
|
1972 |
11 |
6 |
p. 476- 1 p. |
artikel |
103 |
Space-time distribution of excess carriers and their space charge in doped semiconductors
|
|
|
1972 |
11 |
6 |
p. 483- 1 p. |
artikel |
104 |
Sputtered Au-Ta-O cermet for thin-film resistors. A preliminary study
|
|
|
1972 |
11 |
6 |
p. 484- 1 p. |
artikel |
105 |
Statistical test plans for maintainability demonstration
|
|
|
1972 |
11 |
6 |
p. 476-477 2 p. |
artikel |
106 |
Surface passivation of semiconductors
|
|
|
1972 |
11 |
6 |
p. 483- 1 p. |
artikel |
107 |
The capacitances of aniso-type heterojunctions with continuously varying energy band gap and electron affinity in the transition region
|
|
|
1972 |
11 |
6 |
p. 484- 1 p. |
artikel |
108 |
The generation of artwork for integrated circuits
|
|
|
1972 |
11 |
6 |
p. 480- 1 p. |
artikel |
109 |
The influence of sputtering and transport mechanisms on target etching and thin-film growth in r.f. systems, Parts 1 and 2
|
|
|
1972 |
11 |
6 |
p. 484- 1 p. |
artikel |
110 |
The reliability engineer in the health care system
|
|
|
1972 |
11 |
6 |
p. 481- 1 p. |
artikel |
111 |
The reliability of multiplexed systems
|
|
|
1972 |
11 |
6 |
p. 474- 1 p. |
artikel |
112 |
The reliability program of the airborne computer CK37
|
|
|
1972 |
11 |
6 |
p. 481- 1 p. |
artikel |
113 |
Thermally stimulated current measurements applied to silver-doped silicon
|
|
|
1972 |
11 |
6 |
p. 482-483 2 p. |
artikel |
114 |
Thick film capacitor with a rutilium dielectric
|
Borek, Romuald |
|
1972 |
11 |
6 |
p. 511-516 6 p. |
artikel |
115 |
To test or not to test — What is it worth?
|
Lewis, N. |
|
1972 |
11 |
6 |
p. 505-509 5 p. |
artikel |
116 |
Truncated sequential life tests: Conditional probabilities and test time
|
|
|
1972 |
11 |
6 |
p. 476- 1 p. |
artikel |