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                             118 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 A Bayesian approach to reliability: theory and simulation 1972
11 5 p. 409-
1 p.
artikel
2 A complete reliability program 1972
11 5 p. 410-
1 p.
artikel
3 A method for predicting the probability of effective maintenance 1972
11 5 p. 414-
1 p.
artikel
4 A moment method for the calculation of a confidence interval for the failure probability of a system 1972
11 5 p. 414-
1 p.
artikel
5 An automated integrated circuit layout design program of a systematic chip using building blocks 1972
11 5 p. 417-
1 p.
artikel
6 An essay on reliability, cost and modelling 1972
11 5 p. 410-
1 p.
artikel
7 A new gold-tin alloy composition for hermetic package sealing and attachment of hybrid parts 1972
11 5 p. 415-
1 p.
artikel
8 An investigation of carrier transport in thin silicon-on-sapphire films using MIS deep depletion Hall effect structures 1972
11 5 p. 420-
1 p.
artikel
9 A perspective on computer reliability 1972
11 5 p. 413-
1 p.
artikel
10 A practical analysis of the sedentary failure rate 1972
11 5 p. 413-
1 p.
artikel
11 A reliability cost-benefit analysis study 1972
11 5 p. 409-
1 p.
artikel
12 A simple equivalent circuit for the MNOST memory element 1972
11 5 p. 416-417
2 p.
artikel
13 Assembling large-array IC memories 1972
11 5 p. 416-
1 p.
artikel
14 A summary of thin-film technology 1972
11 5 p. 421-
1 p.
artikel
15 Automatically tuned filter uses IC operational amplifiers 1972
11 5 p. 417-
1 p.
artikel
16 Beam leads start to connect 1972
11 5 p. 415-
1 p.
artikel
17 Bipolar techniques approach MOS in density, cost and power drain, yet retain speed 1972
11 5 p. 418-
1 p.
artikel
18 Calendar of international conferences, symposia, lectures and meetings of interest 1972
11 5 p. 401-402
2 p.
artikel
19 Calls for papers 1972
11 5 p. 405-408
4 p.
artikel
20 Chip set makes a powerful processor 1972
11 5 p. 418-
1 p.
artikel
21 CMOS digital wristwatch features liquid crystal display 1972
11 5 p. 418-
1 p.
artikel
22 Collector coupling minimizes interconnections in chip 1972
11 5 p. 415-
1 p.
artikel
23 Colour decoder using integrated circuits 1972
11 5 p. 418-
1 p.
artikel
24 Components of the integrated TTL circuit 1972
11 5 p. 418-
1 p.
artikel
25 Computer-aided drawing equipment for integrated-circuit manufacture 1972
11 5 p. 415-
1 p.
artikel
26 Computer-aided evaluation of circuits and test structures 1972
11 5 p. 416-
1 p.
artikel
27 Computer simulation of the thermal environment of large-scale integrated circuits: computer time-saving techniques 1972
11 5 p. 414-
1 p.
artikel
28 Confidence calculations for Mil-Std-781 1972
11 5 p. 410-
1 p.
artikel
29 Coplamos keeps n-channels in line 1972
11 5 p. 417-
1 p.
artikel
30 Corrosive effects of solder flux on printed-circuit boards 1972
11 5 p. 412-
1 p.
artikel
31 Courses 1972
11 5 p. 403-404
2 p.
artikel
32 Data collection techniques 1972
11 5 p. 410-
1 p.
artikel
33 Density of states of superconductors with overlapping bands 1972
11 5 p. 420-
1 p.
artikel
34 Depletion layer formation, space-charge injection and current-voltage characteristics for the silicon p-n-p (n-p-n) structure 1972
11 5 p. 419-
1 p.
artikel
35 Determination of low energy barriers in metal-insulator-metal tunneling junctions 1972
11 5 p. 420-
1 p.
artikel
36 Determination of the doping structure of integrated bipolar transistorized circuits, evaluating electric data by means of a computer 1972
11 5 p. 419-
1 p.
artikel
37 Digital ICs offer new solutions for rough industrial problems 1972
11 5 p. 418-
1 p.
artikel
38 Digital testing costs can be cut 1972
11 5 p. 415-
1 p.
artikel
39 Do not be confused by IC switching time specifications 1972
11 5 p. 416-
1 p.
artikel
40 Economics of reliability for spacecraft computers 1972
11 5 p. 414-
1 p.
artikel
41 Effective testing of digital integrated circuits 1972
11 5 p. 415-
1 p.
artikel
42 Effects of base doping and width on the J-V characteristics of the n+-n-p+ structure 1972
11 5 p. 421-
1 p.
artikel
43 Electromigration in thin silver, copper, gold, indium, tin, lead and magnesium films 1972
11 5 p. 412-
1 p.
artikel
44 Enhancement of breakdown properties of overlay annular diodes by field shaping resistive films 1972
11 5 p. 412-
1 p.
artikel
45 Factory cleanliness for the manufacture of microelectronic devices 1972
11 5 p. 416-
1 p.
artikel
46 Failure mode control in plastic ICs 1972
11 5 p. 412-
1 p.
artikel
47 Failure modes, effects and criticality analyses 1972
11 5 p. 413-414
2 p.
artikel
48 Focus on CMOS 1972
11 5 p. 417-
1 p.
artikel
49 Functional digital ICs: devices to delight the systems man 1972
11 5 p. 418-
1 p.
artikel
50 Functional trimming gains economics for hybrid ICs 1972
11 5 p. 422-
1 p.
artikel
51 Gas incorporation in sputtered and evaporated gold films 1972
11 5 p. 421-422
2 p.
artikel
52 Hall effect of hot electrons in silicon 1972
11 5 p. 419-420
2 p.
artikel
53 High-frequency measurement of integrated circuit components 1972
11 5 p. 418-
1 p.
artikel
54 High negative bias sputtering: a revolution for thick films? 1972
11 5 p. 422-
1 p.
artikel
55 IC monostables can be economical 1972
11 5 p. 417-
1 p.
artikel
56 IC op amps simplify regulator design 1972
11 5 p. 418-
1 p.
artikel
57 Implanted depletion loads boost MOS array performance 1972
11 5 p. 416-
1 p.
artikel
58 Integrated arrays offer many advantages in o.c.r. systems 1972
11 5 p. 417-
1 p.
artikel
59 Interface states in Si-SiO2 interfaces 1972
11 5 p. 419-
1 p.
artikel
60 Ion impact sputtering for etching and micro-machining 1972
11 5 p. 418-
1 p.
artikel
61 IOTA, a new computer controlled thin-film thick-ness measurement tool 1972
11 5 p. 422-
1 p.
artikel
62 Is there a reliable screen for VHF power transistors? 1972
11 5 p. 411-
1 p.
artikel
63 Low-level currents in insulated gate field effect transistors 1972
11 5 p. 419-
1 p.
artikel
64 Low-power digital phase locked loop utilizes CMOS logic 1972
11 5 p. 418-
1 p.
artikel
65 Measuring reliability 1972
11 5 p. 409-
1 p.
artikel
66 Mechanical connectors for aluminium cables in investigation of degradation mechanisms in connector clamps and bolted terminations 1972
11 5 p. 411-
1 p.
artikel
67 MIL-STD-721 B Definitions of effectiveness terms for reliability, maintainability, human factors, and safety 1972
11 5 p. 429-433
5 p.
artikel
68 Minority carrier lifetime in highly doped Ge 1972
11 5 p. 419-
1 p.
artikel
69 MOS/LSI reliability prediction 1972
11 5 p. 411-
1 p.
artikel
70 NASA program decisions using reliability analysis 1972
11 5 p. 409-410
2 p.
artikel
71 Negative differential conductivity and current oscillations in lightly doped n-type silicon 1972
11 5 p. 419-
1 p.
artikel
72 New growth: silicon on sapphire 1972
11 5 p. 420-
1 p.
artikel
73 On analysing transitional processes in digital circuits by means of probability functions 1972
11 5 p. 415-
1 p.
artikel
74 On reliability prediction by pattern classification 1972
11 5 p. 414-
1 p.
artikel
75 Packaging with integrated circuits 1972
11 5 p. 416-
1 p.
artikel
76 Papers to be published in future issues 1972
11 5 p. 424-
1 p.
artikel
77 Penetrate the mystique of MOS specifications 1972
11 5 p. 414-415
2 p.
artikel
78 Planning optimum maintainability demonstrations 1972
11 5 p. 414-
1 p.
artikel
79 Potential distributions in surface p-n junctions 1972
11 5 p. 418-419
2 p.
artikel
80 Probleme schneller integrierter Schaltungen 1972
11 5 p. 416-
1 p.
artikel
81 Problems of large-scale integration (Part 1) 1972
11 5 p. 416-
1 p.
artikel
82 Producing prototype thin-film hybrids 1972
11 5 p. 422-
1 p.
artikel
83 Properties of hafnium dioxide thin-film capacitors 1972
11 5 p. 421-
1 p.
artikel
84 Pumping speed of cryosorption pumps in the pressure 10−6 to 10−3 torr 1972
11 5 p. 422-
1 p.
artikel
85 Rapid photomask measurement using video scanning time intervals 1972
11 5 p. 416-
1 p.
artikel
86 Recombination dependent characteristics of silicon p+-n-n+ epitaxial diodes 1972
11 5 p. 420-
1 p.
artikel
87 Reed switch circuit hazards and their mitigation 1972
11 5 p. 411-
1 p.
artikel
88 Relationship of MOS circuit properties to LSI testing 1972
11 5 p. 414-
1 p.
artikel
89 Reliability and ESP 1972
11 5 p. 410-
1 p.
artikel
90 Reliability definitions Reiche, H.
1972
11 5 p. 425-427
3 p.
artikel
91 Reliability definitions Dummer, G.W.A.
1972
11 5 p. 399-
1 p.
artikel
92 Reliability measurements for third-generation computer systems 1972
11 5 p. 413-
1 p.
artikel
93 Reliability of ceramic capacitors 1972
11 5 p. 411-
1 p.
artikel
94 Reliability terms and definitions based on the conceptual relationship between reliability and quality Brewer, R.
1972
11 5 p. 435-461
27 p.
artikel
95 Reliability test of MOS/LSI-memory for the improvement of the fabrication techniques 1972
11 5 p. 413-
1 p.
artikel
96 Reliable interconnections for Army avionics 1972
11 5 p. 412-
1 p.
artikel
97 Rheology of pastes in thick-film printing 1972
11 5 p. 422-
1 p.
artikel
98 SAMNOS technology 1972
11 5 p. 417-
1 p.
artikel
99 Semiconductors, characterization: kinetics of one energy-level recombination centers and surface states 1972
11 5 p. 421-
1 p.
artikel
100 Semiconductor surface contamination investigated by radioactive tracer techniques, Part I 1972
11 5 p. 411-
1 p.
artikel
101 Silicon-on-sapphire: a technology comes of age 1972
11 5 p. 419-
1 p.
artikel
102 Specific contact resistance of ohmic contacts to gallium arsenide 1972
11 5 p. 420-
1 p.
artikel
103 Stable germanium dioxide films on germanium 1972
11 5 p. 419-
1 p.
artikel
104 Standard parts and custom design merge in four-chip processor kit 1972
11 5 p. 416-
1 p.
artikel
105 Super-integrated memory shares functions on diffused islands 1972
11 5 p. 415-
1 p.
artikel
106 System considerations in dynamic MOS RAM's 1972
11 5 p. 418-
1 p.
artikel
107 Tantalum-glass cermet thin-film resistors 1972
11 5 p. 422-
1 p.
artikel
108 Test cost minimization for reliability assessment 1972
11 5 p. 410-411
2 p.
artikel
109 Testing in electronics G.W.A.D.,
1972
11 5 p. 423-
1 p.
artikel
110 The combination of silicon nitride and aluminum anodization for semiconductor device passivation 1972
11 5 p. 417-
1 p.
artikel
111 The design of interactive graphic aids to mask layout 1972
11 5 p. 415-
1 p.
artikel
112 The dielectric constant and plasma frequency of p-type Ge-like semiconductors 1972
11 5 p. 420-
1 p.
artikel
113 The influence of phase boundary reactions on the diffusion during double conversions in solid state 1972
11 5 p. 420-421
2 p.
artikel
114 The operation and performance of an r.f. diode sputtering system in relation to its use as a research facility 1972
11 5 p. 421-
1 p.
artikel
115 The reliability engineer and the interactive terminal 1972
11 5 p. 413-
1 p.
artikel
116 Thermal cycling ratings of power transistors 1972
11 5 p. 411-412
2 p.
artikel
117 The TTL circuits D120C and D140C 1972
11 5 p. 417-
1 p.
artikel
118 Weibull, Bayes and Entropy 1972
11 5 p. 410-
1 p.
artikel
                             118 gevonden resultaten
 
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