nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A computerized approach to simulating system effectiveness
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|
1972 |
11 |
2 |
p. 114- 1 p. |
artikel |
2 |
Active circuit trimming with abrasives
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1972 |
11 |
2 |
p. 117- 1 p. |
artikel |
3 |
Adjusting of tantalum thin-film resistors
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1972 |
11 |
2 |
p. 123- 1 p. |
artikel |
4 |
A major step in power hybrids
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1972 |
11 |
2 |
p. 118- 1 p. |
artikel |
5 |
An experimental verification of the electrostatic field gradient theory for diffused semiconductors
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1972 |
11 |
2 |
p. 120- 1 p. |
artikel |
6 |
An IC form, Hall-effect devices can take on many new applications
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1972 |
11 |
2 |
p. 119- 1 p. |
artikel |
7 |
An investigation of lateral diffusion in silicon
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1972 |
11 |
2 |
p. 119- 1 p. |
artikel |
8 |
Anomalous forward characteristics of a metal-thin epitaxial silicon junction
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1972 |
11 |
2 |
p. 122- 1 p. |
artikel |
9 |
Another self-aligning MOS process has interconnecting advantages
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1972 |
11 |
2 |
p. 118- 1 p. |
artikel |
10 |
A potentiometer network module
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1972 |
11 |
2 |
p. 122- 1 p. |
artikel |
11 |
A reliability report on low power TTL integrated circuits
|
Adams, J.D. |
|
1972 |
11 |
2 |
p. 171-175 5 p. |
artikel |
12 |
A review of plastic packaging for hybrid thick-film circuits
|
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1972 |
11 |
2 |
p. 117-118 2 p. |
artikel |
13 |
A system designer's lament: give us better digital ICs
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1972 |
11 |
2 |
p. 116- 1 p. |
artikel |
14 |
A thin-film transistor with an interlayer at the semiconductor-insulator interface
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1972 |
11 |
2 |
p. 123- 1 p. |
artikel |
15 |
Availability of priority standby redundant systems
|
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1972 |
11 |
2 |
p. 116- 1 p. |
artikel |
16 |
A versatile system for controlled electron-beam deposition of thin films
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1972 |
11 |
2 |
p. 125- 1 p. |
artikel |
17 |
Bayesian confidence limits for the reliability of mixed exponential and distribution-free cascade subsystems
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1972 |
11 |
2 |
p. 111- 1 p. |
artikel |
18 |
Beam-lead and wire thermocompression bonding
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1972 |
11 |
2 |
p. 117- 1 p. |
artikel |
19 |
Beam lead bonding to thick-film conductors
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1972 |
11 |
2 |
p. 123- 1 p. |
artikel |
20 |
Calendar of international conferences, symposia, lectures and meetings of interest
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1972 |
11 |
2 |
p. 99-101 3 p. |
artikel |
21 |
Calls for papers
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1972 |
11 |
2 |
p. 107-109 3 p. |
artikel |
22 |
C/MOS unites with silicon gate to yield micropower technology
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1972 |
11 |
2 |
p. 118- 1 p. |
artikel |
23 |
Consequence of microcrystallite model for some amorphous elemental semiconductors
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1972 |
11 |
2 |
p. 121- 1 p. |
artikel |
24 |
Control MOS/LSI yield by design
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1972 |
11 |
2 |
p. 118- 1 p. |
artikel |
25 |
Courses in microelectronics and reliability
|
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1972 |
11 |
2 |
p. 105-106 2 p. |
artikel |
26 |
Current transport in metal-semiconductor-metal (MSM) structures
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1972 |
11 |
2 |
p. 121- 1 p. |
artikel |
27 |
Decrease of FET threshold voltage due to boron depletion during thermal oxidation
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1972 |
11 |
2 |
p. 120- 1 p. |
artikel |
28 |
Design of adaptive procedures for fault detection and isolation
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1972 |
11 |
2 |
p. 115- 1 p. |
artikel |
29 |
Discrete renewal processes
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1972 |
11 |
2 |
p. 115- 1 p. |
artikel |
30 |
Dynamic testing of integrated circuits
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1972 |
11 |
2 |
p. 116- 1 p. |
artikel |
31 |
Effects of nuclear radiation on a high-reliability silicon power diode three-junction capacitance
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1972 |
11 |
2 |
p. 121- 1 p. |
artikel |
32 |
Effects of process variables on thick-film resistors
|
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1972 |
11 |
2 |
p. 122- 1 p. |
artikel |
33 |
Electron microprobe analysis of HgTe thin films
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1972 |
11 |
2 |
p. 122- 1 p. |
artikel |
34 |
Error data logger
|
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1972 |
11 |
2 |
p. 114- 1 p. |
artikel |
35 |
Evaluation of conditional failure density from hazard rate
|
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1972 |
11 |
2 |
p. 115- 1 p. |
artikel |
36 |
Excess surface currents in p-n junctions and bipolar transistors
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1972 |
11 |
2 |
p. 120- 1 p. |
artikel |
37 |
Failure analysis of memory organization for utilization in a self-repair memory system
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1972 |
11 |
2 |
p. 114-115 2 p. |
artikel |
38 |
Fault isolation computer methods
|
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1972 |
11 |
2 |
p. 115- 1 p. |
artikel |
39 |
Flatness and surface roughness of some common film substrate materials
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1972 |
11 |
2 |
p. 122-123 2 p. |
artikel |
40 |
Flip-chip solder terminals
|
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1972 |
11 |
2 |
p. 117- 1 p. |
artikel |
41 |
FRAM Failure rate appraisal machine An outline of its concept and application
|
Murphy, C.S. |
|
1972 |
11 |
2 |
p. 185-188 4 p. |
artikel |
42 |
GaAs junction field-effect transistor radiation study
|
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1972 |
11 |
2 |
p. 121-122 2 p. |
artikel |
43 |
Generalized reliability function for systems of arbitrary configurations
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1972 |
11 |
2 |
p. 114- 1 p. |
artikel |
44 |
Good masks, good yields
|
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1972 |
11 |
2 |
p. 117- 1 p. |
artikel |
45 |
High current transient induced junction shorts
|
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1972 |
11 |
2 |
p. 112- 1 p. |
artikel |
46 |
Highly reliable computing systems
|
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1972 |
11 |
2 |
p. 115- 1 p. |
artikel |
47 |
High stability co-sputtered Ta-50 at. % Al alloy film resistors
|
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1972 |
11 |
2 |
p. 123-124 2 p. |
artikel |
48 |
How small is small?
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1972 |
11 |
2 |
p. 116- 1 p. |
artikel |
49 |
ICs can simplify conversion between binary and b.c.d.
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1972 |
11 |
2 |
p. 118- 1 p. |
artikel |
50 |
In-house microelectronics—fostering a delicate fledgling
|
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1972 |
11 |
2 |
p. 116- 1 p. |
artikel |
51 |
Integrated high-speed logic circuits in NEC
|
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1972 |
11 |
2 |
p. 119- 1 p. |
artikel |
52 |
Integrierte Schaltungen für electronische uhren
|
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1972 |
11 |
2 |
p. 119- 1 p. |
artikel |
53 |
Interconnections with gold beam leads
|
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1972 |
11 |
2 |
p. 122- 1 p. |
artikel |
54 |
Interpretation of surface and bulk effects using the pulsed MIS capacitor
|
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1972 |
11 |
2 |
p. 119- 1 p. |
artikel |
55 |
Investigation of the possibility of laser beam micromachining of semiconductors and metals
|
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|
1972 |
11 |
2 |
p. 125- 1 p. |
artikel |
56 |
Irradiation defects and the electrical quality of ion implanted silicon
|
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1972 |
11 |
2 |
p. 124- 1 p. |
artikel |
57 |
Laser trimming of thick-film resistors
|
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|
1972 |
11 |
2 |
p. 124-125 2 p. |
artikel |
58 |
Letter to the editor
|
Boswell, D. |
|
1972 |
11 |
2 |
p. 97- 1 p. |
artikel |
59 |
Linear estimation of the parameters of the extreme-value distribution based on suitably chosen order statistics
|
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|
1972 |
11 |
2 |
p. 111-112 2 p. |
artikel |
60 |
Liquid cooling of microelectronic devices by free and forced convection
|
Baker, E. |
|
1972 |
11 |
2 |
p. 213-222 10 p. |
artikel |
61 |
Literature survey of some surface and subsurface processes affecting materials in thermionic diodes
|
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1972 |
11 |
2 |
p. 113- 1 p. |
artikel |
62 |
Low density tantalum thin-film capacitors with an aluminum underlay
|
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|
1972 |
11 |
2 |
p. 123- 1 p. |
artikel |
63 |
Lumped approximation to distributed RC notch networks for linear integrated circuits
|
Bozic, S.M. |
|
1972 |
11 |
2 |
p. 191-199 9 p. |
artikel |
64 |
Magnetic handling of beam lead integrated circuits
|
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|
1972 |
11 |
2 |
p. 118- 1 p. |
artikel |
65 |
Maintainability application to system effectiveness quantification
|
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|
1972 |
11 |
2 |
p. 115- 1 p. |
artikel |
66 |
Mathematical models: uses and limitations
|
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1972 |
11 |
2 |
p. 111- 1 p. |
artikel |
67 |
Mean times of interest in Markovian systems
|
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1972 |
11 |
2 |
p. 111- 1 p. |
artikel |
68 |
Measurement of charge carrier mobility in inhomogeneous semiconductor
|
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|
1972 |
11 |
2 |
p. 120- 1 p. |
artikel |
69 |
Measurements on high frequency transmission characteristic of metallization patterns in monolithic ICs
|
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|
1972 |
11 |
2 |
p. 120- 1 p. |
artikel |
70 |
Method of characterizing gallium arsenide crystals
|
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1972 |
11 |
2 |
p. 113- 1 p. |
artikel |
71 |
Microélectronique Analogique
|
G.W.A.D, |
|
1972 |
11 |
2 |
p. 127- 1 p. |
artikel |
72 |
Microwave lines and elements in stripline technique
|
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1972 |
11 |
2 |
p. 117- 1 p. |
artikel |
73 |
Minimizing life test costs
|
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1972 |
11 |
2 |
p. 111- 1 p. |
artikel |
74 |
Mixing of two renewal processes and its applications to reliability theory
|
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1972 |
11 |
2 |
p. 114- 1 p. |
artikel |
75 |
Monolithic level shifter lets MOS, TTL share same network
|
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1972 |
11 |
2 |
p. 119- 1 p. |
artikel |
76 |
Monte Carlo simulation of the nucleation of thin films
|
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1972 |
11 |
2 |
p. 123- 1 p. |
artikel |
77 |
Mössbauer effect and lattice parameter for silicon doped with antimony
|
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1972 |
11 |
2 |
p. 120- 1 p. |
artikel |
78 |
New aspects of failure mechanism in germanium tunnel diodes
|
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1972 |
11 |
2 |
p. 113- 1 p. |
artikel |
79 |
New test target helps microphotographers find limits of photographic systems
|
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1972 |
11 |
2 |
p. 118- 1 p. |
artikel |
80 |
Non-equilibrium effects of metal-oxide-semiconductor tunnel currents
|
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1972 |
11 |
2 |
p. 121- 1 p. |
artikel |
81 |
Notice
|
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1972 |
11 |
2 |
p. 103- 1 p. |
artikel |
82 |
Optimal design for system reliability and maintainability
|
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1972 |
11 |
2 |
p. 114- 1 p. |
artikel |
83 |
Optimum reliability route in communication net-works
|
Srivastava, S.S. |
|
1972 |
11 |
2 |
p. 147-150 4 p. |
artikel |
84 |
Performance and reliability aspects of current trends in t.t.1
|
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1972 |
11 |
2 |
p. 113- 1 p. |
artikel |
85 |
Probability of error considerations for certain M-ary block codes with bit-by-bit decisions
|
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1972 |
11 |
2 |
p. 116- 1 p. |
artikel |
86 |
Problems of failure on various capacitors in operation field
|
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1972 |
11 |
2 |
p. 112- 1 p. |
artikel |
87 |
Reliability and switching technique of integrated switching circuit with complementary MOSFET transistors
|
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|
1972 |
11 |
2 |
p. 115- 1 p. |
artikel |
88 |
Reliability assessment Myths and misuse of statistics
|
Lukis, L.W.F. |
|
1972 |
11 |
2 |
p. 177-184 8 p. |
artikel |
89 |
Reliability considerations in design trade studies
|
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|
1972 |
11 |
2 |
p. 115- 1 p. |
artikel |
90 |
Reliability modeling Tool of the system analyst
|
Malec, H.A. |
|
1972 |
11 |
2 |
p. 159-169 11 p. |
artikel |
91 |
Reliability of special redundant systems considering exchange time and repair time
|
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1972 |
11 |
2 |
p. 115-116 2 p. |
artikel |
92 |
Resistivity measurements on germanium crystals by the spreading resistance technique
|
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1972 |
11 |
2 |
p. 119-120 2 p. |
artikel |
93 |
Results of a computer prediction of after-radiation reliability
|
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|
1972 |
11 |
2 |
p. 112- 1 p. |
artikel |
94 |
Review of electronic techniques Radio components Reliability of thin-film resistors
|
Malinin, V.V. |
|
1972 |
11 |
2 |
p. 201-212 12 p. |
artikel |
95 |
RF sputtering of zinc sulphide
|
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|
1972 |
11 |
2 |
p. 121- 1 p. |
artikel |
96 |
Safety—intrinsic or invulnerable?
|
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1972 |
11 |
2 |
p. 112- 1 p. |
artikel |
97 |
Setting up a cost-effective screening program for ICs
|
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1972 |
11 |
2 |
p. 112-113 2 p. |
artikel |
98 |
Solder-circuitry separation problems associated with plated printed circuit boards
|
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1972 |
11 |
2 |
p. 113- 1 p. |
artikel |
99 |
Some problems of the theory of forward biased p-n junction
|
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1972 |
11 |
2 |
p. 120-121 2 p. |
artikel |
100 |
Space-charge recombination in a forward-biased diffused p-n junction
|
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1972 |
11 |
2 |
p. 121- 1 p. |
artikel |
101 |
Speech coder as a special integrated circuit
|
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1972 |
11 |
2 |
p. 119- 1 p. |
artikel |
102 |
Stresses and strains in a plate bonded to a substrate: semiconductor devices
|
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1972 |
11 |
2 |
p. 118- 1 p. |
artikel |
103 |
Study of the validity of electronic parts stress models
|
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1972 |
11 |
2 |
p. 113- 1 p. |
artikel |
104 |
Tantalum thin-film circuits for space flight applications
|
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1972 |
11 |
2 |
p. 124- 1 p. |
artikel |
105 |
The A-6 channel bank: putting new technologies to work
|
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|
1972 |
11 |
2 |
p. 118-119 2 p. |
artikel |
106 |
The computation of yield and drift reliability of electronic circuits
|
Jensen, F. |
|
1972 |
11 |
2 |
p. 139-145 7 p. |
artikel |
107 |
The correlation method for computer-aided statistical analysis
|
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1972 |
11 |
2 |
p. 112- 1 p. |
artikel |
108 |
The effectivity of screening hybrid microcircuits per MIL-STD-883
|
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1972 |
11 |
2 |
p. 117- 1 p. |
artikel |
109 |
The effect of the substrate on MOST and MOS-IC: mainly on the DC characteristics
|
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|
1972 |
11 |
2 |
p. 117- 1 p. |
artikel |
110 |
The failure physics approach to IC reliability
|
Farrow, R.H. |
|
1972 |
11 |
2 |
p. 151-157 7 p. |
artikel |
111 |
The package-lead interface in hybrid arrays
|
|
|
1972 |
11 |
2 |
p. 124- 1 p. |
artikel |
112 |
The quality assurance of semiconductor devices
|
Durso, J. |
|
1972 |
11 |
2 |
p. 129-137 9 p. |
artikel |
113 |
Thick-film filter for television signals
|
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|
1972 |
11 |
2 |
p. 122- 1 p. |
artikel |
114 |
Thin-film thermistors
|
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|
1972 |
11 |
2 |
p. 124- 1 p. |
artikel |
115 |
Three-dimensional planar Coax packaging for microelectronic computer systems
|
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|
1972 |
11 |
2 |
p. 116- 1 p. |
artikel |
116 |
What price reliability?
|
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1972 |
11 |
2 |
p. 112- 1 p. |
artikel |
117 |
Will MOS stimulate a new computer generation?
|
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|
1972 |
11 |
2 |
p. 116- 1 p. |
artikel |
118 |
Wire-bond electrical connections: Testing, fabrication and degradation. A bibliography 1957–1971
|
G.W.A.D., |
|
1972 |
11 |
2 |
p. 127- 1 p. |
artikel |