| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A BICS-based strategy for mitigating the effects of single event transients on SAR converter
|
Gao, Jing
|
|
2019
|
100-101 |
C |
p. 45-56
|
artikel
|
| 2 |
A body built-in cell for detecting transient faults and dynamically biasing subcircuits of integrated systems
|
Ferreira de Paiva Leite, Thiago
|
|
2018
|
100-101 |
C |
p. 122-127
|
artikel
|
| 3 |
A brief overview of gate oxide defect properties and their relation to MOSFET instabilities and device and circuit time-dependent variability
|
Kaczer, B.
|
|
2018
|
100-101 |
C |
p. 186-194
|
artikel
|
| 4 |
A calculation method to estimate single event upset cross section
|
Wrobel, F.
|
|
2017
|
100-101 |
C |
p. 644-649
|
artikel
|
| 5 |
Accelerated aging for gate oxide of SiC MOSFETs under continuous switching conditions by applying advanced HTGB test
|
Hayashi, Shin-Ichiro
|
|
|
100-101 |
C |
p.
|
artikel
|
| 6 |
Accelerated aging test for gate-oxide degradation in SiC MOSFETs for condition monitoring
|
Hayashi, Shin-Ichiro
|
|
|
100-101 |
C |
p.
|
artikel
|
| 7 |
Accelerated Life Test of high luminosity blue LEDs
|
Nogueira, E.
|
|
2016
|
100-101 |
C |
p. 631-634
4 p.
|
artikel
|
| 8 |
Accelerated mechanical low cycle fatigue in isothermal solder interconnects
|
Marbut, Cody J.
|
|
|
100-101 |
C |
p.
|
artikel
|
| 9 |
Accelerative reliability tests for Sn3.0Ag0.5Cu solder joints under thermal cycling coupling with current stressing
|
Zhang, Shuai
|
|
|
100-101 |
C |
p.
|
artikel
|
| 10 |
Accumulative total ionizing dose (TID) and transient dose rate (TDR) effects on planar and vertical ferroelectric tunneling-field-effect-transistors (TFET)
|
Yan, Gangping
|
|
|
100-101 |
C |
p.
|
artikel
|
| 11 |
Accurate determination of the peak channel temperature by an electrical method combined with EL mapping technique in In0.17Al0.83N/GaN HEMTs
|
Chen, Leilei
|
|
|
100-101 |
C |
p.
|
artikel
|
| 12 |
Accurate lifetime prediction for channel hot carrier stress on sub-1nm equivalent oxide thickness HK/MG nMOSFET with thin titanium nitride capping layer
|
Luo, Weichun
|
|
2016
|
100-101 |
C |
p. 70-73
4 p.
|
artikel
|
| 13 |
Achieving microstructure refinement and superior mechanical performance of Sn-2.0Ag-0.5Cu-2.0Zn (SACZ) solder alloy with rotary magnetic field
|
Hammad, A.E.
|
|
|
100-101 |
C |
p.
|
artikel
|
| 14 |
A closed-loop voltage prognosis for lithium-ion batteries under dynamic loads using an improved equivalent circuit model
|
Yang, Jie
|
|
|
100-101 |
C |
p.
|
artikel
|
| 15 |
A cloud-based energy data mining information agent system based on big data analysis technology
|
Lin, Hsueh-Yuan
|
|
2019
|
100-101 |
C |
p. 66-78
|
artikel
|
| 16 |
A combined physicochemical-microstructural approach to predict the crack path at the topside interconnections in IGBT power devices
|
Shqair, M.
|
|
|
100-101 |
C |
p.
|
artikel
|
| 17 |
A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys
|
Dias, Marcelino
|
|
2018
|
100-101 |
C |
p. 150-158
|
artikel
|
| 18 |
A comparative analysis of printed circuit drying methods for the reliability of assembly process
|
Ciszewski, Piotr
|
|
|
100-101 |
C |
p.
|
artikel
|
| 19 |
A comparative study of lifetime reliability of planar MOSFET and FinFET due to BTI for the 16 nm CMOS technology node based on reaction-diffusion model
|
Mounir Mahmoud, Mohamed
|
|
2019
|
100-101 |
C |
p. 53-65
|
artikel
|
| 20 |
A comparative study of nanostructured Silicon-Nitride electrical properties for potential application in RF-MEMS capacitive switches
|
Birmpiliotis, D.
|
|
|
100-101 |
C |
p.
|
artikel
|
| 21 |
A comparative study of thermal fatigue life of Eutectic Sn-Bi, Hybrid Sn-Bi/SAC and SAC solder alloy BGAs
|
Cai, Chongyang
|
|
|
100-101 |
C |
p.
|
artikel
|
| 22 |
A comparative study on electrothermal characteristics of nanoscale multiple gate MOSFETs
|
Gu, Qi-Lin
|
|
2017
|
100-101 |
C |
p. 362-369
8 p.
|
artikel
|
| 23 |
A comparison of the effects of cobalt-60 γ ray irradiation on DPSA bipolar transistors at high and low injection levels
|
Zhang, Peijian
|
|
2017
|
100-101 |
C |
p. 86-90
5 p.
|
artikel
|
| 24 |
A comparison study on electromagnetic susceptibility of current reference circuits with scaling-down technologies and schemes
|
Wang, Zhian
|
|
|
100-101 |
C |
p.
|
artikel
|
| 25 |
A composite SystemC-UVM abstract optimal path selection verification architecture for complex designs
|
Sharma, Gaurav
|
|
|
100-101 |
C |
p.
|
artikel
|
| 26 |
A comprehensive framework for cell-aware diagnosis of customer returns
|
d'Hondt, P.
|
|
|
100-101 |
C |
p.
|
artikel
|
| 27 |
A comprehensive solution for electronic packages' reliability assessment with digital image correlation (DIC) method
|
Niu, Yuling
|
|
2018
|
100-101 |
C |
p. 81-88
|
artikel
|
| 28 |
A comprehensive solution for modeling moisture induced delamination in electronic packaging during solder reflow
|
Wang, Jing
|
|
|
100-101 |
C |
p.
|
artikel
|
| 29 |
A computational study of the effect of bond pad thickness on the polysilicon piezoresistivity due to wafer level probing
|
Mane, Sanjay Shrirang
|
|
|
100-101 |
C |
p.
|
artikel
|
| 30 |
A concise study of neutron irradiation effects on power MOSFETs and IGBTs
|
Baghaie Yazdi, M.
|
|
2016
|
100-101 |
C |
p. 74-78
5 p.
|
artikel
|
| 31 |
A cost-effective repair scheme for clustered TSV defects in 3D ICs
|
Maity, Dilip Kumar
|
|
|
100-101 |
C |
p.
|
artikel
|
| 32 |
A cost-efficient error-resilient approach to distributed arithmetic for signal processing
|
Lu, Yue
|
|
2019
|
100-101 |
C |
p. 16-21
|
artikel
|
| 33 |
Acoustic noise and vibration analysis of solid state drive induced by multi-layer ceramic capacitors
|
Kim, Hyunwoo
|
|
2018
|
100-101 |
C |
p. 136-145
|
artikel
|
| 34 |
A cross-layer aging-aware task scheduling approach for multiprocessor embedded systems
|
Karami, Masoomeh
|
|
2018
|
100-101 |
C |
p. 190-197
|
artikel
|
| 35 |
A cross layer approach for efficient thermal management in 3D stacked SoCs
|
Jung, Matthias
|
|
2016
|
100-101 |
C |
p. 43-47
5 p.
|
artikel
|
| 36 |
AC stress reliability study on a novel vertical MOS transistor for non-volatile memory technology
|
Locati, J.
|
|
|
100-101 |
C |
p.
|
artikel
|
| 37 |
Active defects in MOS devices on 4H-SiC: A critical review
|
Amini Moghadam, Hamid
|
|
2016
|
100-101 |
C |
p. 1-9
9 p.
|
artikel
|
| 38 |
Activity-aware prediction of Critical Paths Aging in FDSOI technologies
|
Kannan, Kalpana Senthamarai
|
|
|
100-101 |
C |
p.
|
artikel
|
| 39 |
A 2-D analytical threshold-voltage model for GeOI/GeON MOSFET with high-k gate dielectric
|
Ji, Feng
|
|
2016
|
100-101 |
C |
p. 24-33
10 p.
|
artikel
|
| 40 |
Adaptive accelerated aging for 28nm HKMG technology
|
Patra, Devyani
|
|
2018
|
100-101 |
C |
p. 149-154
|
artikel
|
| 41 |
Adaptive and robust prediction for the remaining useful life of electrolytic capacitors
|
Qin, Qi
|
|
2018
|
100-101 |
C |
p. 64-74
|
artikel
|
| 42 |
Adaptive dc-link voltage control strategy to increase PV inverter lifetime
|
Callegari, J.M.S.
|
|
|
100-101 |
C |
p.
|
artikel
|
| 43 |
Adaptive simulation-based framework for error characterization of inexact circuits
|
Bonnot, Justine
|
|
2019
|
100-101 |
C |
p. 60-70
|
artikel
|
| 44 |
A 2D compact model for lightly doped DG MOSFETs (P-DGFETs) including negative bias temperature instability (NBTI) and short channel effects (SCEs)
|
Samy, Omnia
|
|
2016
|
100-101 |
C |
p. 82-88
|
artikel
|
| 45 |
A deep learning-based recognition method for degradation monitoring of ball screw with multi-sensor data fusion
|
Zhang, Li
|
|
2017
|
100-101 |
C |
p. 215-222
|
artikel
|
| 46 |
A defect-oriented test approach using on-Chip current sensors for resistive defects in FinFET SRAMs
|
Medeiros, G.C.
|
|
2018
|
100-101 |
C |
p. 355-359
|
artikel
|
| 47 |
A design and qualification of LED flip Chip-on-Board module with tunable color temperatures
|
Fan, Jiajie
|
|
2018
|
100-101 |
C |
p. 140-148
|
artikel
|
| 48 |
Adhesion of NCF to oxidized Si wafers after oxygen plasma treatment
|
Jang, Min-Seok
|
|
2017
|
100-101 |
C |
p. 220-226
7 p.
|
artikel
|
| 49 |
A 3D numerical study of humidity evolution and condensation risk on a printed circuit board (PCB) exposed to harsh ambient conditions
|
Shojaee Nasirabadi, Parizad
|
|
2018
|
100-101 |
C |
p. 39-49
|
artikel
|
| 50 |
A double snapback SCR ESD protection scheme for 28 nm CMOS process
|
Hu, Tao
|
|
2018
|
100-101 |
C |
p. 20-25
|
artikel
|
| 51 |
A 3-D thermal network model for the temperature monitoring of thermal grease as interface material
|
Zhang, Xiaotong
|
|
|
100-101 |
C |
p.
|
artikel
|
| 52 |
Advanced low damage manufacturing processes to fabricate SOI FinFETs and measurement of electrical properties
|
Kumar, Ashish
|
|
|
100-101 |
C |
p.
|
artikel
|
| 53 |
Advanced power cycler with intelligent monitoring strategy of IGBT module under test
|
Choi, U.M.
|
|
2017
|
100-101 |
C |
p. 522-526
|
artikel
|
| 54 |
Advanced thermal simulation of SiGe:C HBTs including back-end-of-line
|
d'Alessandro, Vincenzo
|
|
2016
|
100-101 |
C |
p. 38-45
|
artikel
|
| 55 |
Advancement in simulating moisture diffusion in electronic packages under dynamic thermal loading conditions
|
Wang, Jing
|
|
2017
|
100-101 |
C |
p. 42-53
12 p.
|
artikel
|
| 56 |
A dynamic partial reconfigurable system with combined task allocation method to improve the reliability of FPGA
|
Wang, Guohua
|
|
2018
|
100-101 |
C |
p. 14-24
|
artikel
|
| 57 |
A dynamic partial reconfiguration design flow for permanent faults mitigation in FPGAs
|
Martins, Victor Manuel Gonçalves
|
|
2018
|
100-101 |
C |
p. 50-63
|
artikel
|
| 58 |
A fast and flexible HW/SW co-processing framework for Time-of-Flight 3D imaging
|
Druml, Norbert
|
|
2018
|
100-101 |
C |
p. 64-76
|
artikel
|
| 59 |
A fast Binary Decision Diagram (BDD)-based reversible logic optimization engine driven by recent meta-heuristic reordering algorithms
|
Abdalhaq, Baker
|
|
|
100-101 |
C |
p.
|
artikel
|
| 60 |
A fast fault injection platform of multiple SEUs for SRAM-based FPGAs
|
Zhang, Rongsheng
|
|
2018
|
100-101 |
C |
p. 147-152
|
artikel
|
| 61 |
A fast simulation method for analysis of SEE in VLSI
|
Lu, Yufan
|
|
|
100-101 |
C |
p.
|
artikel
|
| 62 |
A fault detection strategy using the enhancement ensemble empirical mode decomposition and random decrement technique
|
Xiang, Jiawei
|
|
2017
|
100-101 |
C |
p. 317-326
|
artikel
|
| 63 |
A fault-tolerant control strategy for switched reluctance motor drive for electric vehicles under short-fault condition
|
Ma, Mingyao
|
|
2018
|
100-101 |
C |
p. 1221-1225
|
artikel
|
| 64 |
A fault-tolerant reconfiguration system based on pilot switch for grid-connected inverters
|
Zhao, Ziyi
|
|
|
100-101 |
C |
p.
|
artikel
|
| 65 |
A fault tolerant switched reluctance motor drive for electric vehicles under multi-switches open-fault conditions
|
Yang, Qingqing
|
|
|
100-101 |
C |
p.
|
artikel
|
| 66 |
A fully digital feedback control of gate driver for current balancing of parallel connected power devices
|
Tripathi, R.N.
|
|
2018
|
100-101 |
C |
p. 505-509
|
artikel
|
| 67 |
A fusion prognostics-based qualification test methodology for microelectronic products
|
Pecht, Michael
|
|
2016
|
100-101 |
C |
p. 320-324
5 p.
|
artikel
|
| 68 |
Ageing of glass passivated TRIAC devices under thermal and electrical stress
|
Buvat, Y.
|
|
|
100-101 |
C |
p.
|
artikel
|
| 69 |
A generalized degradation model based on Gaussian process
|
Wang, Zhihua
|
|
2018
|
100-101 |
C |
p. 207-214
|
artikel
|
| 70 |
Aging-aware scheduling and binding in high-level synthesis considering workload effects
|
Es'haghi, Siavash
|
|
|
100-101 |
C |
p.
|
artikel
|
| 71 |
Aging comparative analysis of high-performance FinFET and CMOS flip-flops
|
Taghipour, Shiva
|
|
2017
|
100-101 |
C |
p. 52-59
8 p.
|
artikel
|
| 72 |
Aging sensors for on-chip metallization of integrated LDMOS transistors under cyclic thermo-mechanical stress
|
Ritter, Matthias
|
|
2017
|
100-101 |
C |
p. 512-516
|
artikel
|
| 73 |
A high-efficiency threshold voltage distribution test method based on the reliability of 3D NAND flash memory
|
Wei, Debao
|
|
|
100-101 |
C |
p.
|
artikel
|
| 74 |
A high fault coverage test approach for communication channels in network on chip
|
Aghaei, Babak
|
|
2017
|
100-101 |
C |
p. 178-186
|
artikel
|
| 75 |
A highly reliable radiation hardened 8T SRAM cell design
|
Lv, Yinghuan
|
|
|
100-101 |
C |
p.
|
artikel
|
| 76 |
A highly reliable radiation tolerant 13T SRAM cell for deep space applications
|
Yekula, Ravi Teja
|
|
|
100-101 |
C |
p.
|
artikel
|
| 77 |
A humidity-induced novel failure mechanism in power semiconductor diodes
|
Leppänen, J.
|
|
|
100-101 |
C |
p.
|
artikel
|
| 78 |
A hybrid approach for UAV flight data estimation and prediction based on flight mode recognition
|
Wang, Benkuan
|
|
2018
|
100-101 |
C |
p. 253-262
|
artikel
|
| 79 |
A hybrid coding retransmitted chipless tag loaded by microstrip resonator
|
Ma, Zhonghua
|
|
2019
|
100-101 |
C |
p. 1-7
|
artikel
|
| 80 |
A hybrid frequency-time-domain approach to determine the vibration fatigue life of electronic devices
|
Schriefer, Thomas
|
|
2019
|
100-101 |
C |
p. 86-94
|
artikel
|
| 81 |
A hybrid prognostics approach for MEMS: From real measurements to remaining useful life estimation
|
Skima, H.
|
|
2016
|
100-101 |
C |
p. 79-88
10 p.
|
artikel
|
| 82 |
A hybrid system-level prognostics approach with online RUL forecasting for electronics-rich systems with unknown degradation behaviors
|
Al-Mohamad, Ahmad
|
|
|
100-101 |
C |
p.
|
artikel
|
| 83 |
AlGaN/GaN Schottky barrier diodes on silicon substrates with various Fe doping concentrations in the buffer layers
|
Chiu, Hsien-Chin
|
|
2018
|
100-101 |
C |
p. 238-241
|
artikel
|
| 84 |
A library based on deep neural networks for modeling the degradation of FinFET SRAM performance metrics due to aging
|
Zhang, Rui
|
|
|
100-101 |
C |
p.
|
artikel
|
| 85 |
A lifetime assessment and prediction method for large area solder joints
|
Lederer, M.
|
|
|
100-101 |
C |
p.
|
artikel
|
| 86 |
A lightweight write-assist scheme for reduced RRAM variability and power
|
Aziza, H.
|
|
2018
|
100-101 |
C |
p. 6-10
|
artikel
|
| 87 |
A lithium-ion battery remaining useful life prediction method based on the incremental capacity analysis and Gaussian process regression
|
Pang, Xiaoqiong
|
|
|
100-101 |
C |
p.
|
artikel
|
| 88 |
A low cost fault-attack resilient AES for IoT applications
|
Sheikhpour, Saeideh
|
|
|
100-101 |
C |
p.
|
artikel
|
| 89 |
A low-level software-based fault tolerance approach to detect SEUs in GPUs' register files
|
Gonçalves, Marcio
|
|
2017
|
100-101 |
C |
p. 665-669
|
artikel
|
| 90 |
Alternative manufacturing process of 3-dimensional interconnect device using thermoforming process
|
Zulfiqar, S.
|
|
|
100-101 |
C |
p.
|
artikel
|
| 91 |
Amalgam illogical controller design using amended moth system for heat reduction in insulated gate bipolar transistor
|
Loganathan, P.
|
|
|
100-101 |
C |
p.
|
artikel
|
| 92 |
AM3D: An accurate crosstalk probability modeling to predict channel delay in 3D ICs
|
Shirmohammadi, Zahra
|
|
2019
|
100-101 |
C |
p.
|
artikel
|
| 93 |
A mechanistic model of damage evolution in lead free solder joints under combinations of vibration and thermal cycling with varying amplitudes
|
Borgesen, P.
|
|
2019
|
100-101 |
C |
p. 65-73
|
artikel
|
| 94 |
A memristor-based sensing and repair system for photovoltaic modules
|
Gnoli, Luca
|
|
|
100-101 |
C |
p.
|
artikel
|
| 95 |
A method for simulating the influence of grain boundaries and material interfaces on electromigration
|
Filipovic, Lado
|
|
2019
|
100-101 |
C |
p. 38-52
|
artikel
|
| 96 |
A methodology for projecting SiO2 thick gate oxide reliability on trench power MOSFETs and its application on MOSFETs VGS rating
|
Efthymiou, E.
|
|
2016
|
100-101 |
C |
p. 26-32
7 p.
|
artikel
|
| 97 |
A methodology to determine reliability issues in automotive SiC power modules combining 1D and 3D thermal simulations under driving cycle profiles
|
Matallana, A.
|
|
2019
|
100-101 |
C |
p.
|
artikel
|
| 98 |
A method to determine critical circuit blocks for electromigration based on temperature analysis
|
Nunes, R.O.
|
|
|
100-101 |
C |
p.
|
artikel
|
| 99 |
A method to extract lumped thermal networks of capacitors for reliability oriented design
|
Delmonte, N.
|
|
|
100-101 |
C |
p.
|
artikel
|
| 100 |
A method to improve the accuracy and efficiency for metallized-film capacitor's reliability assessment using joint simulation
|
Yin, Jinpeng
|
|
|
100-101 |
C |
p.
|
artikel
|
| 101 |
A method to improve the reliability of three-level inverter based on equivalent input disturbance and repetitive control combinations
|
Yang, Guoliang
|
|
|
100-101 |
C |
p.
|
artikel
|
| 102 |
A method to prevent hardware Trojans limiting access to layout resources
|
Supon, Tareq Muhammad
|
|
|
100-101 |
C |
p.
|
artikel
|
| 103 |
A method to protect Cuckoo filters from soft errors
|
Reviriego, P.
|
|
2017
|
100-101 |
C |
p. 85-89
5 p.
|
artikel
|
| 104 |
A method to recover critical bits under a double error in SEC-DED protected memories
|
Liu, Shanshan
|
|
2017
|
100-101 |
C |
p. 92-96
5 p.
|
artikel
|
| 105 |
A mission profile-based reliability analysis framework for photovoltaic DC-DC converters
|
Van De Sande, W.
|
|
|
100-101 |
C |
p.
|
artikel
|
| 106 |
A mixed-effects model of two-phase degradation process for reliability assessment and RUL prediction
|
Wang, Hongyu
|
|
|
100-101 |
C |
p.
|
artikel
|
| 107 |
A modified boost rectifier for elimination of circulating current in power factor correction applications
|
Venkitusamy, Karthikeyan
|
|
2017
|
100-101 |
C |
p. 29-35
7 p.
|
artikel
|
| 108 |
A modified two dimensional analytical model for short-channel fully depleted SOI MESFET's
|
Mohammadi, Hossein
|
|
2018
|
100-101 |
C |
p. 173-179
|
artikel
|
| 109 |
A multi-port thermal coupling model for multi-chip power modules suitable for circuit simulators
|
Wang, Z.X.
|
|
2018
|
100-101 |
C |
p. 519-523
|
artikel
|
| 110 |
A multiscale analytical correction technique for two-dimensional thermal models of AlGaN/GaN HEMTs
|
Azarifar, Mohammad
|
|
2017
|
100-101 |
C |
p. 82-87
6 p.
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| 660 |
Discovering and reducing defects in MIM capacitors
|
Roesch, William J.
|
|
2018
|
100-101 |
C |
p. 299-305
|
artikel
|
| 661 |
Discrete phase method particle simulation of ultra-fine package assembly with SAC305-TiO2 nano-reinforced lead free solder at different weighted percentages
|
Haslinda, M.S.
|
|
2017
|
100-101 |
C |
p. 336-351
16 p.
|
artikel
|
| 662 |
Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings
|
Ng, Fei Chong
|
|
2017
|
100-101 |
C |
p. 45-64
20 p.
|
artikel
|
| 663 |
Dislocation assisted diffusion: A mechanism for growth of intermetallic compounds in copper ball bonds
|
Gholamirad, Maryam
|
|
2018
|
100-101 |
C |
p. 210-217
|
artikel
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| 664 |
DLBF: A low overhead wear leveling algorithm for embedded systems with hybrid memory
|
Niu, Na
|
|
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100-101 |
C |
p.
|
artikel
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| 665 |
DMR+: An efficient alternative to TMR to protect registers in Xilinx FPGAs
|
Reviriego, P.
|
|
2016
|
100-101 |
C |
p. 314-318
5 p.
|
artikel
|
| 666 |
Double-node-upset aware SRAM bit-cell for aerospace applications
|
Prasad, Govind
|
|
|
100-101 |
C |
p.
|
artikel
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| 667 |
Double parallel barrier height behavior of Au/Poly (linoleic acid)-g-poly (methyl methacrylate) (PLiMMA)/n-Si structure
|
Gökçen, Muharrem
|
|
2019
|
100-101 |
C |
p. 132-136
|
artikel
|
| 668 |
Double tricrystal nucleation behavior in Pb-free BGA solder joints
|
Han, Jing
|
|
2019
|
100-101 |
C |
p. 1-9
|
artikel
|
| 669 |
Drain current model for double-gate tunnel field-effect transistor with hetero-gate-dielectric and source-pocket
|
Wang, Ping
|
|
2016
|
100-101 |
C |
p. 30-36
7 p.
|
artikel
|
| 670 |
Drain current model for short-channel triple gate junctionless nanowire transistors
|
Paz, B.C.
|
|
2016
|
100-101 |
C |
p. 1-10
10 p.
|
artikel
|
| 671 |
DRES: Data recovery for condition monitoring to enhance system reliability
|
Liu, Liansheng
|
|
2016
|
100-101 |
C |
p. 125-129
5 p.
|
artikel
|
| 672 |
Drop-shock reliability improvement of embedded chip resistor packages through via structure modification
|
Park, Se-Hoon
|
|
2016
|
100-101 |
C |
p. 194-200
7 p.
|
artikel
|
| 673 |
3-D thermal models calibration by parametric dynamic compact thermal models
|
Codecasa, Lorenzo
|
|
2017
|
100-101 |
C |
p. 371-379
9 p.
|
artikel
|
| 674 |
Dual-axis rotary platform with UAV image recognition and tracking
|
Sheu, Bor-Horng
|
|
2019
|
100-101 |
C |
p. 8-17
|
artikel
|
| 675 |
Dual-Core Lockstep enhanced with redundant multithread support and control-flow error detection
|
Peña-Fernández, M.
|
|
|
100-101 |
C |
p.
|
artikel
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| 676 |
Dual-resonance concurrent oscillator
|
Jang, Sheng-Lyang
|
|
2018
|
100-101 |
C |
p. 208-215
|
artikel
|
| 677 |
Durability evaluation of hexagonal WO3 electrode for lithium ion secondary batteries
|
Sasaki, Akito
|
|
2017
|
100-101 |
C |
p. 86-90
5 p.
|
artikel
|
| 678 |
Dynamic characterization of SiC and GaN devices with BTI stresses
|
Ortiz Gonzalez, J.
|
|
|
100-101 |
C |
p.
|
artikel
|
| 679 |
Dynamic EFI and circuit analysis case studies on integrated circuit buried via void defects
|
Thor, M.H.
|
|
|
100-101 |
C |
p.
|
artikel
|
| 680 |
Dynamic heavy ions SEE testing of NanoXplore radiation hardened SRAM-based FPGA: Reliability-performance analysis
|
Oliveira, A.
|
|
|
100-101 |
C |
p.
|
artikel
|
| 681 |
Dynamic optical beam induced current variation mapping: A fault isolation technique
|
Thor, M.H.
|
|
|
100-101 |
C |
p.
|
artikel
|
| 682 |
Dynamic pull-in and pull-out analysis of viscoelastic nanoplates under electrostatic and Casimir forces via sinusoidal shear deformation theory
|
Shokravi, M.
|
|
2017
|
100-101 |
C |
p. 17-28
12 p.
|
artikel
|
| 683 |
Dynamic resistance variation mapping technique for defect isolation
|
Thor, M.H.
|
|
|
100-101 |
C |
p.
|
artikel
|
| 684 |
Early degradation of high power packaged LEDs under humid conditions and its recovery — Myth of reliability rejuvenation
|
Singh, Preetpal
|
|
2016
|
100-101 |
C |
p. 145-153
9 p.
|
artikel
|
| 685 |
Early detection and prediction of HKMG SRAM HTOL performance by WLR PBTI tests
|
Chien, Wei-Ting Kary
|
|
2016
|
100-101 |
C |
p. 185-188
4 p.
|
artikel
|
| 686 |
Early detection of photovoltaic system inverter faults
|
Omaña, Martin
|
|
|
100-101 |
C |
p.
|
artikel
|
| 687 |
Early life field failures in modern automotive electronics – An overview; root causes and precautions
|
Jacob, P.
|
|
2016
|
100-101 |
C |
p. 79-83
5 p.
|
artikel
|
| 688 |
Early SEU sensitivity assessment for collaborative hardening techniques: A case study of OPTOS processing architecture
|
Martín-Ortega, Alberto
|
|
2019
|
100-101 |
C |
p. 36-47
|
artikel
|
| 689 |
Economical design of H-bridge multilevel inverter drive controlled by modified fast algorithm
|
Mohammed, Jamal Abdul-Kareem
|
|
2016
|
100-101 |
C |
p. 89-97
9 p.
|
artikel
|
| 690 |
Editorial
|
Ersland, Peter
|
|
2017
|
100-101 |
C |
p. 1-
1 p.
|
artikel
|
| 691 |
Editorial
|
Asenov, Asen
|
|
2016
|
100-101 |
C |
p. 1-2
2 p.
|
artikel
|
| 692 |
Editorial
|
Ciappa, Mauro
|
|
2018
|
100-101 |
C |
p. 1
|
artikel
|
| 693 |
Editorial
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|
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2018
|
100-101 |
C |
p. iii
|
artikel
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| 694 |
Editorial Board
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|
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2016
|
100-101 |
C |
p. IFC-
1 p.
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artikel
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| 695 |
Editorial Board
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|
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2016
|
100-101 |
C |
p. IFC-
1 p.
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artikel
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| 696 |
Editorial Board
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2016
|
100-101 |
C |
p. IFC-
1 p.
|
artikel
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| 697 |
Editorial Board
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2016
|
100-101 |
C |
p. IFC-
1 p.
|
artikel
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| 698 |
Editorial Board
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|
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2016
|
100-101 |
C |
p. IFC-
1 p.
|
artikel
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| 699 |
Editorial Board
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|
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2017
|
100-101 |
C |
p. IFC-
1 p.
|
artikel
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| 700 |
Editorial Board
|
|
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2017
|
100-101 |
C |
p. IFC-
1 p.
|
artikel
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| 701 |
Editorial Board
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|
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2016
|
100-101 |
C |
p. IFC-
1 p.
|
artikel
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| 702 |
Editorial Board
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|
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2016
|
100-101 |
C |
p. IFC-
1 p.
|
artikel
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| 703 |
Editorial Board
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2017
|
100-101 |
C |
p. IFC-
1 p.
|
artikel
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| 704 |
Editorial Board
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2017
|
100-101 |
C |
p. IFC-
1 p.
|
artikel
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| 705 |
Editorial Board
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|
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2017
|
100-101 |
C |
p. IFC-
1 p.
|
artikel
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| 706 |
Editorial Board
|
|
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2016
|
100-101 |
C |
p. IFC-
1 p.
|
artikel
|
| 707 |
Editorial Board
|
|
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2017
|
100-101 |
C |
p. IFC-
1 p.
|
artikel
|
| 708 |
Editorial Board
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|
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2016
|
100-101 |
C |
p. IFC-
1 p.
|
artikel
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| 709 |
Editorial Board
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|
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2016
|
100-101 |
C |
p. IFC-
1 p.
|
artikel
|
| 710 |
Editorial Board
|
|
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2019
|
100-101 |
C |
p. ii
|
artikel
|
| 711 |
Editorial Board
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2018
|
100-101 |
C |
p. ii
|
artikel
|
| 712 |
Editorial Board
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2018
|
100-101 |
C |
p. ii
|
artikel
|
| 713 |
Editorial Board
|
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2018
|
100-101 |
C |
p. ii
|
artikel
|
| 714 |
Editorial Board
|
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2019
|
100-101 |
C |
p. ii
|
artikel
|
| 715 |
Editorial Board
|
|
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2019
|
100-101 |
C |
p. ii
|
artikel
|
| 716 |
Editorial Board
|
|
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2018
|
100-101 |
C |
p. ii
|
artikel
|
| 717 |
Editorial Board
|
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2019
|
100-101 |
C |
p. ii
|
artikel
|
| 718 |
Editorial Board
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2019
|
100-101 |
C |
p. ii
|
artikel
|
| 719 |
Editorial Board
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2019
|
100-101 |
C |
p. ii
|
artikel
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| 720 |
Editorial Board
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2019
|
100-101 |
C |
p. ii
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artikel
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| 721 |
Editorial Board
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2019
|
100-101 |
C |
p.
|
artikel
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| 722 |
Editorial Board
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2019
|
100-101 |
C |
p. ii
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artikel
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| 723 |
Editorial Board
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2016
|
100-101 |
C |
p. IFC-
1 p.
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artikel
|
| 724 |
Editorial Board
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2018
|
100-101 |
C |
p. ii
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artikel
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| 725 |
Editorial Board
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2018
|
100-101 |
C |
p. ii
|
artikel
|
| 726 |
Editorial Board
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2017
|
100-101 |
C |
p. IFC
|
artikel
|
| 727 |
Editorial Board
|
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2018
|
100-101 |
C |
p. ii
|
artikel
|
| 728 |
Editorial Board
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2018
|
100-101 |
C |
p. ii
|
artikel
|
| 729 |
Editorial Board
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2017
|
100-101 |
C |
p. IFC-
1 p.
|
artikel
|
| 730 |
Editorial board
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|
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2016
|
100-101 |
C |
p. IFC
|
artikel
|
| 731 |
Editorial Board
|
|
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2018
|
100-101 |
C |
p. ii
|
artikel
|
| 732 |
Editorial Board
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2017
|
100-101 |
C |
p. IFC
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artikel
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| 733 |
Editorial Board
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100-101 |
C |
p.
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artikel
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| 734 |
Editorial Board
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100-101 |
C |
p.
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artikel
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| 735 |
Editorial Board
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100-101 |
C |
p.
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artikel
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| 736 |
Editorial Board
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100-101 |
C |
p.
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artikel
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| 737 |
Editorial Board
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100-101 |
C |
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artikel
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| 738 |
Editorial Board
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100-101 |
C |
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artikel
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| 739 |
Editorial Board
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100-101 |
C |
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artikel
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| 740 |
Editorial Board
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100-101 |
C |
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artikel
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| 741 |
Editorial Board
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100-101 |
C |
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artikel
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| 742 |
Editorial Board
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100-101 |
C |
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artikel
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| 743 |
Editorial Board
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100-101 |
C |
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artikel
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| 744 |
Editorial Board
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100-101 |
C |
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artikel
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| 745 |
Editorial Board
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100-101 |
C |
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artikel
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| 746 |
Editorial Board
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100-101 |
C |
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artikel
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| 747 |
Editorial Board
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100-101 |
C |
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artikel
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| 748 |
Editorial Board
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100-101 |
C |
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artikel
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| 749 |
Editorial Board
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100-101 |
C |
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artikel
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| 750 |
Editorial Board
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100-101 |
C |
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artikel
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| 751 |
Editorial Board
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100-101 |
C |
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artikel
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| 752 |
Editorial Board
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100-101 |
C |
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artikel
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| 753 |
Editorial Board
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100-101 |
C |
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artikel
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| 754 |
Editorial Board
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100-101 |
C |
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artikel
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| 755 |
Editorial Board
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100-101 |
C |
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artikel
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| 756 |
Editorial Board
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100-101 |
C |
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artikel
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| 757 |
Editorial Board
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100-101 |
C |
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artikel
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| 758 |
Editorial Board
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100-101 |
C |
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artikel
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| 759 |
Editorial Board
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100-101 |
C |
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artikel
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| 760 |
Editorial Board
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100-101 |
C |
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artikel
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| 761 |
Editorial Board
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100-101 |
C |
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artikel
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| 762 |
Editorial Board
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100-101 |
C |
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artikel
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| 763 |
Editorial Board
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100-101 |
C |
p.
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artikel
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| 764 |
Editorial Board
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|
100-101 |
C |
p.
|
artikel
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| 765 |
Editorial: ESREF 2016
|
Petzold, Matthias
|
|
2016
|
100-101 |
C |
p. 1-
1 p.
|
artikel
|
| 766 |
Editorial: IEDMS 2016
|
Liu, Chuan-Hsi
|
|
2018
|
100-101 |
C |
p. 207
|
artikel
|
| 767 |
Editorial: IPFA 2018
|
Chin, Jiann Min
|
|
2019
|
100-101 |
C |
p.
|
artikel
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| 768 |
Editorial of 31st European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2020)
|
Papaioannou, George
|
|
|
100-101 |
C |
p.
|
artikel
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| 769 |
Effective and combined stressors from multi-dimensional mission profiles for semiconductor reliability
|
Hirler, A.
|
|
|
100-101 |
C |
p.
|
artikel
|
| 770 |
Effective decapsulation of copper wire-bonded microelectronic devices for reliability assessment
|
Manoharan, Subramani
|
|
2018
|
100-101 |
C |
p. 197-207
|
artikel
|
| 771 |
Effectiveness of a hardware-based approach to detect resistive-open defects in SRAM cells under process variations
|
Gomez, A.F.
|
|
2016
|
100-101 |
C |
p. 150-158
|
artikel
|
| 772 |
Effective (Pd,Ni)Sn4 diffusion barrier to suppress brittle fracture at Sn-58Bi-xAg solder joint with Ni(P)/Pd(P)/Au metallization pad
|
Kim, Jungsoo
|
|
|
100-101 |
C |
p.
|
artikel
|
| 773 |
Effective scan chain failure analysis method
|
Auvray, Etienne
|
|
2017
|
100-101 |
C |
p. 201-213
|
artikel
|
| 774 |
Effective work-function control technique applicable to p-type FinFET high-k/metal gate devices
|
Yamaguchi, Shimpei
|
|
2017
|
100-101 |
C |
p. 80-84
5 p.
|
artikel
|
| 775 |
Effect of aging on mechanical properties of high temperature Pb-rich solder joints
|
Khatibi, G.
|
|
2018
|
100-101 |
C |
p. 1-11
|
artikel
|
| 776 |
Effect of aging time and loading rate on fracture behavior of Cu/Sn-0.7Cu solder joints
|
Sharma, Ved Prakash
|
|
|
100-101 |
C |
p.
|
artikel
|
| 777 |
Effect of alternating current (AC) stressing on the microstructure and mechanical properties of low-silver content solder interconnect
|
Zhu, Ze
|
|
2019
|
100-101 |
C |
p. 12-19
|
artikel
|
| 778 |
Effect of body bias and temperature on low-frequency noise in 40-nm nMOSFETs
|
Chiu, Hsien-Chin
|
|
2017
|
100-101 |
C |
p. 267-271
5 p.
|
artikel
|
| 779 |
Effect of cell size reduction on the threshold voltage of UMOSFETs
|
Baba, Yoshiro
|
|
|
100-101 |
C |
p.
|
artikel
|
| 780 |
Effect of Co content on the microstructure, spreadability, conductivity and corrosion resistance of Sn-0.7Cu alloy
|
Fan, Jianglei
|
|
|
100-101 |
C |
p.
|
artikel
|
| 781 |
Effect of contact-etch-stop-layer and Si1-xGex channel mechanical properties on nano-scaled short channel NMOSFETs with dummy gate arrays
|
Lee, Chang-Chun
|
|
2018
|
100-101 |
C |
p. 230-234
|
artikel
|
| 782 |
Effect of copper over-pad metallization on reliability of aluminum wire bonds
|
Kawashiro, Fumiyoshi
|
|
2019
|
100-101 |
C |
p. 168-176
|
artikel
|
| 783 |
Effect of critical properties of epoxy molding compound on warpage prediction: A critical review
|
Phansalkar, Sukrut Prashant
|
|
|
100-101 |
C |
p.
|
artikel
|
| 784 |
Effect of DC/AC stress on the reliability of cell capacitor in DRAM
|
Kim, Gang-Jun
|
|
2018
|
100-101 |
C |
p. 179-182
|
artikel
|
| 785 |
Effect of electrification and chlorination on the microstructure and electrical properties of fine Al wires
|
Wu, Bo-Ding
|
|
|
100-101 |
C |
p.
|
artikel
|
| 786 |
Effect of electron radiation on small-signal parameters of NMOS devices at mm-wave frequencies
|
Habeenzu, Brilliant
|
|
|
100-101 |
C |
p.
|
artikel
|
| 787 |
Effect of ENEPIG metallization for solid-state gold-gold diffusion bonds
|
Pun, Kelvin P.L.
|
|
2017
|
100-101 |
C |
p. 339-348
10 p.
|
artikel
|
| 788 |
Effect of fin shape of tapered FinFETs on the device performance in 5-nm node CMOS technology
|
Kurniawan, Erry Dwi
|
|
2018
|
100-101 |
C |
p. 254-259
|
artikel
|
| 789 |
Effect of H/Ar treatment on ZnO:B transparent conducting oxide for flexible a-Si:H/μc-Si:H photovoltaic modules under damp heat stress
|
Jeong, Jae-Seong
|
|
2016
|
100-101 |
C |
p. 640-645
6 p.
|
artikel
|
| 790 |
Effect of HfSiON thickness on electron trap distributions of HfSiON/SiO2 nMOSFET under PBTI
|
Roh, Giyoun
|
|
|
100-101 |
C |
p.
|
artikel
|
| 791 |
Effect of high- and low-side blocking on short-circuit characteristics of SiC MOSFET
|
Bai, Kun
|
|
|
100-101 |
C |
p.
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Effect of high current pulses on solder interfacial reaction and interconnect reliability
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Effect of HTRB lifetest on AlGaN/GaN HEMTs under different voltages and temperatures stresses
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Effect of indentation depth and strain rate on mechanical properties of Sn0.3Ag0.7Cu
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Effect of indium content and carrier distribution on the efficiency and reliability of InGaN/GaN-based multi quantum well light emitting diode
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Effect of interface traps for ultra-thin high-k gate dielectric based MIS devices on the capacitance-voltage characteristics
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Effect of intermetallic compound thickness on mechanical fatigue properties of copper pillar micro-bumps
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Effect of Joule heating on the reliability of solder joints under power cycling conditions
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Effect of lanthanum silicate interface layer on the electrical characteristics of 4H-SiC metal-oxide-semiconductor capacitors
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Effect of micromorphology on corrosion and mechanical properties of SAC305 lead-free solders
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Effect of microwave annealing on SOI MOSFETs: Post-metal annealing with low thermal budget
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Effect of mounting fixture on the drop reliability of solid state drive
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Effect of nano-Al2O3 reinforcement on the microstructure and reliability of Sn–3.0Ag–0.5Cu solder joints
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Effect of negative potential on the extent of PID degradation in photovoltaic power plant in a real operation mode
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Effect of 805nm on reliability of 735/805/850-nm LED involved near-infrared spectroscopy biomedical device
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Effect of normal forces on fretting corrosion of tin-coated electrical contacts
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7 p.
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Effect of OFF-state stress on reliability of nMOSFET in SWD circuits of DRAM
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Kim, Jongkyun
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Effect of oxide-trapped charge on the anomalous drain avalanche hot carrier degradation of a SiO2 dielectric nMOSFET
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Effect of oxygen vacancy in tungsten oxide on the photocatalytic activity for decomposition of organic materials in the gas phase
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Effect of PCB cracks on thermal cycling reliability of passive microelectronic components with single-grained solder joints
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Akbari, Saeed
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| 814 |
Effect of plasma treatment on adhesion strength and moisture absorption characteristics between epoxy molding compound/silicon chip (EMC/chip) interface
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Oh, Gyung-Hwan
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2019
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Effect of polyol synthesis on sintering of microsized Ag particles
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Effect of potting materials on LED bulb's driver temperature
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Nguyen, Nam
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Effect of power cycling tests on traps under the gate of Al2O3/AlGaN/GaN normally-ON devices
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Elharizi, M.
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2018
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p. 671-676
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Effect of protons located at different region in SiO2 layer on GLPNP transistors degradation
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Effect of pulse-reverse plating on copper: Thermal mechanical properties and microstructure relationship
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2019
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Effect of roughness on electrical contact performance of electronic components
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Liu, Xin-long
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10 p.
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| 821 |
Effect of selectively passivated layer on foldable low temperature polycrystalline silicon thin film transistor characteristics under dynamic mechanical stress
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Lee, Sang Myung
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2017
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Effect of shear and tensile-dominant cyclic loading on failure in SnAgCu solder
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Effect of short circuit aging on safe operating area of SiC MOSFET
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Nguyen, Tien Anh
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Effect of short-circuit degradation on the remaining useful lifetime of SiC MOSFETs and its failure analysis
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Effect of short-circuit stress on the degradation of the SiO2 dielectric in SiC power MOSFETs
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Reigosa, Paula Diaz
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2018
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Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches
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Ng, Fei Chong
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2018
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Effect of solder joint size and composition on liquid-assisted healing
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Effect of solder material thickness on Power MOSFET reliability by Electro-thermo-Mechanical Simulations
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Effect of solder resist dissolution on the joint reliability of ENIG surface and Sn–Ag–Cu solder
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Lee, Hyunju
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2018
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p. 75-80
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Effect of surface potential distribution on corrosion behavior of Cu/Al interface in Cu wire bonding applications
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Effect of temperature and humidity conditioning on copper leadframe/mold compound interfacial delamination
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Effect of temperature and humidity on moisture diffusion in an epoxy moulding compound material
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Effect of thermal and vibrational combined ageing on QFN terminal pads solder reliability
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Effect of thermocapillary action in the underfill encapsulation of multi-stack ball grid array
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18 p.
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Effect of thermo-mechanical ageing on materials and interface properties in flexible microelectronic devices
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Effect of TID electronradiation on SiGe BiCMOS LNAs at V-band
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Effect of TiO2 additions on Sn-0.7Cu-0.05Ni lead-free composite solder
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10 p.
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Effect of TLP rise time on ESD failure modes of collector-base junction of SiGe heterojunction bipolar transistors
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Effect of type of thermo-mechanical excursion on growth of interfacial intermetallic compounds in Cu/Sn-Ag-Cu solder joints
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Ghosh, Rituparna
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2017
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8 p.
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Effect of voids on thermomechanical cracking in lead-free Sn3Ag0.5Cu interconnections of power modules
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Effect of voids on thermo-mechanical reliability of chip resistor solder joints: Experiment, modelling and simulation
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| 842 |
Effects of acrylic adhesives property and optimized bonding parameters on Sn58Bi solder joint morphology for flex-on-board assembly
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Zhang, Shuye
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9 p.
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| 843 |
Effects of Ag addition and Ag3Sn formation on the mechanical reliability of Ni/Sn solder joints
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Chu, Kunmo
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2017
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| 844 |
Effects of ageing on the conducted immunity of a voltage reference: Experimental study and modelling approach
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Hairoud-Airieau, S.
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2017
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Effects of alloying elements in high reliability copper wire bond material for high temperature applications
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Effects of anisotropy on the reliability of TSV microstructure
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Effects of bismuth additions on mechanical property and microstructure of SAC-Bi solder joint under current stressing
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Hu, Siou-Han
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Effects of combined NO and forming gas annealing on interfacial properties and oxide reliability of 4H-SiC MOS structures
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Peng, Zhaoyang
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2016
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5 p.
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| 849 |
Effects of dimension parameters and defect on TSV thermal behavior for 3D IC packaging
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Pan, Yuanxing
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6 p.
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Effects of drain quiescent voltage on the ageing of AlGaN/GaN HEMT devices in pulsed RF mode
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4 p.
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| 851 |
Effects of electric field and bias voltage on corrosion behavior of tin under a thin electrolyte layer
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Huang, Hualiang
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2017
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12 p.
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Effects of electrode materials on the device performances and instabilities in amorphous InGaZnO thin film transistors
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Effects of finger dimension on low-frequency noise and optoelectronic properties of Ge metal-semiconductor-metal photodetectors with interdigitated Pt finger electrodes
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Zumuukhorol, Munkhsaikhan
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2017
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6 p.
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Effects of forward gate bias stressing on the leakage current of AlGaN/GaN high electron mobility transistors
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Effects of Ga alloying on microstructure and comprehensive performances of Sn–9Zn–2Bi alloys for the microelectronics industry
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Effects of gamma radiation on suspended silicon nanogauges bridge used for MEMS transduction
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Effects of HPEM stress on GaAs low-noise amplifier from circuit to component scale
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Effects of interfacial bonding strength on the formation of conductive anodic filament in polyphenylene oxide/glass fiber laminates
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Effects of isothermal storage on grain structure of Cu/Sn/Cu microbump interconnects for 3D stacking
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Panchenko, Iuliana
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Effects of multi-cracks and thermal-mechanical coupled load on the TSV reliability
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Effects of nooks configuration on hydrothermal performance of zigzag channels for nanofluid-cooled microelectronic heat sink
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13 p.
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Effects of oxidation on reliability of screen-printed silver circuits for radio frequency applications
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Kim, Dae Up
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5 p.
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Effects of power cycling test condition and test strategy on lifetime estimation of power modules in power electronic systems
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Effects of rare earth Ce addition on the microstructure and shear property of Cu/In-50Ag/Cu composite solder joint
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Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor
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Effects of salt spray test on lead-free solder alloy
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6 p.
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Effects of silver nano-particles and nano-wires on properties of electrically conductive adhesives
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Effects of SiO2 film thickness and operating temperature on thermally-induced failures in through-silicon-via structures
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Effects of solder degradation on the die temperature measurement via internal gate resistance
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Effects of stair case gate bias stress in IGZO/Al2O3 flexible TFTs
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Effects of stress-loading test methods on the degradation of light-emitting diode modules
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Cai, Miao
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5 p.
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Effects of sulfur addition on the wettability and corrosion resistance of Sn-0.7Cu lead-free solder
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Huang, Huizhen
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Effects of temperature and span amplitude on fretting corrosion behavior of tin-plated electrical contacts
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8 p.
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Effects of the compositional ratios of sputtering target on the device performance and instability in amorphous InGaZnO thin film transistors
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Park, Hee Pyung
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2018
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Effects of thermal aging on Cu nanoparticle/Bi-Sn solder hybrid bonding
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Effects of thermal annealing on the charge localization characteristics of HfO2/Au/HfO2 stack
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Effects of thermal neutron radiation on a hardware-implemented machine learning algorithm
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Effects of TID radiation on P+ ion-implanted HVNMOS devices
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Effects of total ionizing dose on single event effect sensitivity of FRAMs
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Effects of twin grain boundaries on the subgrain rotation of the solder joint during thermal shock
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8 p.
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Effects of voltage stress on the single event upset (SEU) response of 65nm flip flop
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Efficiency droop in green InGaN/GaN light emitting diodes: Degradation mechanisms and initial characteristics
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Efficient reliability evaluation methodologies for combinational circuits
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Efficient state of health estimation of Li-ion battery under several ageing types for aeronautic applications
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Zhang, Yuan Ci
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E-field induced keep-out zone determination method of through-silicon vias for 3-D ICs
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ELDRS in SiGe transistors for room and low-temperature irradiation
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Electrical analysis on implantation-related defect by nanoprobing methodology
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Electrical and cyclic bending properties of screen-printed conductive patterns containing different ratios of silver microparticles and silver microflakes
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Electrical and thermal failure modes of 600V p-gate GaN HEMTs
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Electrical characteristics of a-IGZO transistors along the in-plane axis during outward bending
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Electrical characterization and reliability of submicron SOI CMOS technology in the extended temperature range (to 300°C)
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Electrical characterization of epoxy-based molding compounds for next generation HV ICs in presence of moisture
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Electrical characterization of SiC MOS capacitors: A critical review
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Electrical conduction mechanisms in the temperature-dependent current-voltage characteristics of poly(3-hexylthiophene)/n-type Si devices
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Electrical duality design for the radon-222 decay chain
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Electrically induced physical damage (EIPD) cases study: From electrical overstress (EOS) to product defects
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Electrical, optical characterization and degradation of Cu(InGa)Se2 devices with fluorine-doped tin oxide back contact
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Electrical overstress effect characterization on Power MOS Trenchfet and correlation with time dependent dielectric breakdown
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Mazza, B.
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Electrical properties of carbon nanotube via interconnects for 30nm linewidth and beyond
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Vyas, Anshul A.
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2016
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p. 35-42
8 p.
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Electrical properties of SiNx films with embedded CNTs for MEMS capacitive switches
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2017
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p. 614-618
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Electrochemical corrosion and electrochemical migration of 64Sn-35Bi-1Ag solder doping with xGe on printed circuit boards
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Hua, L.
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2017
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p. 27-36
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| 902 |
Electrochemical studies of Pd-doped Cu and Pd-doped Cu-Al intermetallics for understanding corrosion behavior in wire-bonding packages
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Wu, Yuelin
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p. 355-361
7 p.
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Electromagnetic susceptibility characterization of double SOI device
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Li, B.
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p. 168-171
4 p.
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Electromechanical reliability of a flexible metal-grid transparent electrode prepared by electrohydrodynamic (EHD) jet printing
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Yang, Sang Min
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9 p.
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Electromigration in solder joints: A cross-sectioned model system for real-time observation
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Electron-beam-induced current (EBIC) imaging technique to quicken polysilicon defect localization in MOSFETs
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Zheng, Shijun
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p.
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Electronic module for the thermal monitoring of a Li-ion battery cell through the electrochemical impedance estimation
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Ranieri, Marco
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p. 410-415
6 p.
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Electronics reliability assessment of future power fusion machines: Neutron interaction analysis in bulk silicon
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p.
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Electron trapping effects in SiC Schottky diodes: Review and comment
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p.
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Electroplated Ni-P film for power devices without cracks induced by high temperature heating
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p.
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Electrostatic discharge robustness of amorphous indium-gallium-zinc-oxide thin-film transistors
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Electro-thermal coupling and performance estimation of LEDs at system level
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Meng, Haotian
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Electro thermal modeling of the power diode using Pspice
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Hanini, Wasma
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p. 82-91
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artikel
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| 914 |
Electro-thermal simulation of current sharing in silicon and silicon carbide power modules under short circuit condition of types I and II
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Suzuki, Hiroshi
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p. 12-16
5 p.
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Elemental characterisation of sub 20nm structures in devices using new SEM-EDS technology
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Sagar, J.T.
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2016
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p. 367-369
3 p.
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EMA remaining useful life prediction with weighted bagging GPR algorithm
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Zhang, Yujie
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2017
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p. 253-263
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artikel
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Embedding a feedforward controller into the IGBT gate driver for turn-on transient improvement
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Ghorbani, Hamidreza
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2018
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100-101 |
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p. 230-240
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artikel
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| 918 |
Embed SRAM IDDOFF fail root cause identification by combination of device analysis and localized circuit analysis
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Chen, C.Q.
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2017
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p. 261-266
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| 919 |
Empirical derivation of upper and lower bounds of NBTI aging for embedded cores
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Chen, Yukai
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2018
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C |
p. 294-305
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| 920 |
Emulation-based fault analysis on RFID tags for robustness and security evaluation
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Mezzah, Ibrahim
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2017
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p. 115-125
11 p.
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Enabling robust automotive electronic components in advanced CMOS nodes
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Huard, V.
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2017
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p. 13-24
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End of life and acceleration modelling for power diodes under high temperature reverse bias stress
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Schilling, O.
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p. 458-463
6 p.
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Energetic deposition, measurement and simulation of graphitic contacts to 6H-SiC
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Tran, Hiep
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2017
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p. 82-85
4 p.
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Energy based modeling for temperature cycling induced tin silver copper solder interconnect fatigue life
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Chen, Deng Yun
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Energy-Delay-FIT Product to compare processors and algorithm implementations
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Fratin, V.
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2018
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p. 112-120
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Engineering application research on reliability prediction of the combined DC-DC power supply
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He, Yuchen
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p.
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Enhanced architectures for soft error detection and correction in combinational and sequential circuits
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Krstić, Miloš
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2016
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p. 212-220
9 p.
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Enhanced Cu pillar design to reduce thermomechanical stress induced during flip chip assembly
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Lofrano, Melina
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2018
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p. 97-105
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artikel
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Enhanced multiple-error resilient carry look-ahead adders through new customized fault-tolerant voters
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Valinataj, Mojtaba
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2019
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p. 7-20
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Enhanced thermal characterization method of microscale heatsink structures
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Takács, G.
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2016
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C |
p. 21-28
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| 931 |
Enhancement of light-emitting diode reliability using silicone microsphere in encapsulant
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Jang, Inseok
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2016
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p. 94-98
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Enhancing die level static fault isolation on power gated devices
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Nagalingam, D.
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p.
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Enhancing reliability of photovoltaic power electronic converters under dynamic irradiance conditions
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Jacobo Tapia, Renato
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p.
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Enhancing the ductility and mechanical behavior of Sn-1.0Ag-0.5Cu lead-free solder by adding trace amount of elements Ni and Sb
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Hammad, A.E.
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2018
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p. 133-141
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artikel
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| 935 |
Enhancing the microstructure and tensile creep resistance of Sn-3.0Ag-0.5Cu solder alloy by reinforcing nano-sized ZnO particles
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Hammad, A.E.
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2017
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C |
p. 187-194
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Enlarged tensile strain at edge of flexible substrate due to anticlastic curvature
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Jo, Woosung
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Ensure an original and safe “fail-to-open” mode in planar and trench power SiC MOSFET devices in extreme short-circuit operation
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Boige, F.
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2018
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C |
p. 598-603
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Ensuring the reliability of power electronic devices with regard to terrestrial cosmic radiation
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Soelkner, Gerald
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2016
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12 p.
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Envelop tracking based embedded current measurement for monitoring of IGBT and power converter system
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Bat-Ochir, Bat-Otgon
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2018
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C |
p. 500-504
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| 940 |
Equivalent circuits for electromigration
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Najm, Farid N.
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p.
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| 941 |
Erosion defect formation in Ni-gate AlGaN/GaN high electron mobility transistors
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Whiting, P.G.
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2017
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p. 32-40
9 p.
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Error sensitivity study of FFT architectures implemented in FPGA
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García-Astudillo, L.A.
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ESD-failure of E-mode GaN HEMTs: Role of device geometry and charge trapping
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Canato, E.
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p.
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ESD protection for negative charge pump (CP) using CP internal switches
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Srivastava, Ankit
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2016
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p. 59-63
5 p.
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| 945 |
ESD protection structure with reduced capacitance and overshoot voltage for high speed interface applications
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Dong, Aihua
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2017
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p. 201-205
5 p.
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| 946 |
ESD tests on 850nm GaAs-based VCSELs
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Vanzi, M.
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2016
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p. 617-622
6 p.
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artikel
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| 947 |
ESR and capacitance monitoring of a dc-link capacitor used in a three-phase PWM inverter with a front-end diode rectifier
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Hasegawa, K.
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2018
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100-101 |
C |
p. 433-437
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| 948 |
ESREF 2019 General Chair
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Nolhier, Nicolas
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Estimating dynamic power consumption for memristor-based CiM architecture
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Traiola, Marcello
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2018
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p. 241-248
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artikel
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| 950 |
Estimating the SEU failure rate of designs implemented in FPGAs in presence of MCUs
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Villalta, Igor
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2017
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p. 85-92
8 p.
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Estimating the Single-Event Upset sensitivity of a memory array using simulation
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Raine, Mélanie
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2017
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p. 349-354
6 p.
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Evaluating IGBT temperature evolution during short circuit operations using a TSEP-based method
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Ceccarelli, L.
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p.
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Evaluating reliability through soft error triggered exceptions at ARM Cortex-A9 microprocessor
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Aviles, Pablo M.
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p.
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Evaluating softcore GPU in SRAM-based FPGA under radiation-induced effects
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Braga, Giani
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p.
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Evaluating the material properties of underfill for a reliable 3D TSV integration package using numerical analysis
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Yoon, Hyungseok
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2017
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p. 41-50
10 p.
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Evaluating the moisture resistance of Y3Al5O12: Ce3+ phosphor used in high power white LED packaging
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Yuan, Weiyi
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p.
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Evaluating the reliability of a GPU pipeline to SEU and the impacts of software-based and hardware-based fault tolerance techniques
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Gonçalves, Marcio
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2018
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C |
p. 931-935
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Evaluating the soft error sensitivity of a GPU-based SoC for matrix multiplication
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León, Germán
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Evaluation and modeling of adhesion layer in shock-protection structure for MEMS accelerometer
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Yamane, Daisuke
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2016
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p. 78-84
7 p.
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Evaluation based on performance and failure of PV system in 10 years field-aged 1 MW PV power plant
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Oh, Wonwook
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p.
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Evaluation of effective stress times and stress levels from mission profiles for semiconductor reliability
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Hirler, A.
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2017
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C |
p. 38-41
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Evaluation of health and safety of mechanically fatigued rechargeable lithium polymer batteries for flexible electronics applications
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Kim, J.Y.
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p.
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Evaluation of heavy-ion impact in bulk and FDSOI devices under ZTC condition
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Calienes, W.E.
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2017
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C |
p. 655-659
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| 964 |
Evaluation of hybrid bonding technology of single-micron pitch with planar structure for 3D interconnection
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Ohyama, Masaki
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2016
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p. 134-139
6 p.
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Evaluation of ISO 26262 and IEC 61508 metrics for transient faults of a multi-processor system-on-chip through radiation testing
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Ballan, Oscar
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p.
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Evaluation of potential-induced degradation in crystalline Si solar cells using Na fault injection
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Oh, Wonwook
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2016
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p. 646-649
4 p.
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Evaluation of radiation-induced soft error in majority voters designed in 7nm FinFET technology
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de Aguiar, Y.Q.
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2017
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p. 660-664
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Evaluation of screen printed silver trace performance and long-term reliability against environmental stress on a low surface energy substrate
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Mikkonen, Riikka
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2018
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p. 54-65
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Evaluation of SiC MOSFET power modules under unclamped inductive switching test environment
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Nawaz, Muhammad
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2016
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p. 97-103
7 p.
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Evaluation of the corrosion performance of Cu–Al intermetallic compounds and the effect of Pd addition
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Lim, Adeline B.Y.
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2016
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p. 155-161
7 p.
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Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective
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Rajaguru, P.
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2017
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p. 77-85
9 p.
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Evaluation of the relationship between stress and lifetime of Pb-free solder joints subjected to vibration load using a generalized local stress approach
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Thambi, J.
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Evaluation of thermal conductivity for sintered silver considering aging effect with microstructure based model
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Qin, Fei
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Evaluation of thermomechanical fatigue lifetime of BGA lead-free solder joints and impact of isothermal aging
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Roumanille, Pierre
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Evaluation of variability using Schmitt trigger on full adders layout
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Moraes, L.B.
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2018
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p. 116-121
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Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line
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Ključar, Luka
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2016
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p. 93-100
8 p.
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Evidence for causality between GaN RF HEMT degradation and the EC-0.57eV trap in GaN
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Arehart, A.R.
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2016
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p. 45-48
4 p.
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Evolution of C-V and I-V characteristics for a commercial 600 V GaN GIT power device under repetitive short-circuit tests
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Fu, J.Z.
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2018
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p. 652-655
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Evolution of microstructure of Lead free cu/Sn solders and copper oxide phase precipitation in Cu3Sn intermetallic during thermal cycling
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Bettahi, Yousra
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2019
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p. 20-26
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| 980 |
Evolution study of the ElectroMagnetic Interference for RF LDMOS in series chopper application after thermal accelerated tests
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Belaïd, M.A.
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2016
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5 p.
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Experimental analysis of Sn-3.0Ag-0.5Cu solder joint board-level drop/vibration impact failure models after thermal/isothermal cycling
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Gu, Jian
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2018
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C |
p. 29-36
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| 982 |
Experimental analysis of the electromagnetic instruction skip fault model and consequences for software countermeasures
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Dutertre, Jean-Max
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| 983 |
Experimental analysis on estimating junction temperature and service life of high power LED array
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A., Rammohan
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Experimental and modeling studies of automotive-qualified OLEDs under electrical stress
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Güney, Arda
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Experimental and modeling study on viscosity of encapsulant for electronic packaging
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Shan, Xiuyang
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2018
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p. 42-46
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Experimental and numerical investigation of circular minichannel heat sinks with various hydraulic diameter for electronic cooling application
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Ghasemi, Seyed Ebrahim
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2017
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p. 97-105
9 p.
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Experimental and numerical investigation of flow and thermal effects on flexible printed circuit board
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Lim, C.H.
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2017
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13 p.
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Experimental and numerical study of 3D stacked dies under forced air cooling and water immersion cooling
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Qiu, Delong
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2017
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10 p.
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Experimental and simulation study of the correlation between displacement damage and incident proton energy for GaAs devices
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Yu, Qingkui
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2018
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p. 952-956
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Experimental and simulative study of warpage behavior for fan-out wafer-level packaging
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van Dijk, Marius
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Experimental characterization of critical high-electric field spots in power semiconductors by planar and scanning collimated alpha sources
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Ciappa, Mauro
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2018
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100-101 |
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p. 476-481
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| 992 |
Experimental characterization of rolled annealed copper film used in flexible printed circuit boards: Identification of the elastic-plastic and low-cycle fatigue behaviors
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Girard, Gautier
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p.
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Experimental characterization of the predictive thermal behaviour model of a surface-mounted soft magnetic composite inductor
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Monier-Vinard, Eric
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2016
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p. 54-63
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| 994 |
Experimental determination of critical adhesion energies with the Advanced Button Shear Test
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Pflügler, Nadine
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2019
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p. 177-185
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Experimental determination of fatigue behavior of lead free solder joints in microelectronic packaging subjected to isothermal aging
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Mustafa, Muhannad
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2016
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p. 136-147
12 p.
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| 996 |
Experimental Evaluation of Circuit-Based Modeling of the NBTI Effects in Double-Gate FinFETs
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Jankovic, Nebojsa D.
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2016
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p. 26-29
4 p.
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Experimental identification and prioritization of design and process parameters on hole fill in mini wave soldering
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Seidel, Reinhardt
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Experimental identification of LED compact thermal model element values
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Janicki, Marcin
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2018
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p. 20-26
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Experimental identification of thermal induced warpage in polymer–metal composite films
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Li, Heng
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2016
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p. 141-147
7 p.
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Experimental investigation of a Peltier cells cooling system for a Switch-Mode Power Supply
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Casano, G.
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2017
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7 p.
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artikel
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